JP7149061B2 - 無電解パラジウムめっき液 - Google Patents

無電解パラジウムめっき液 Download PDF

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Publication number
JP7149061B2
JP7149061B2 JP2017195651A JP2017195651A JP7149061B2 JP 7149061 B2 JP7149061 B2 JP 7149061B2 JP 2017195651 A JP2017195651 A JP 2017195651A JP 2017195651 A JP2017195651 A JP 2017195651A JP 7149061 B2 JP7149061 B2 JP 7149061B2
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JP
Japan
Prior art keywords
electroless
plating
plating film
compound
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017195651A
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English (en)
Japanese (ja)
Other versions
JP2019070172A (ja
Inventor
剛志 前田
克久 田邉
真輔 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C.UYEMURA&CO.,LTD.
Original Assignee
C.UYEMURA&CO.,LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017195651A priority Critical patent/JP7149061B2/ja
Application filed by C.UYEMURA&CO.,LTD. filed Critical C.UYEMURA&CO.,LTD.
Priority to EP18864662.4A priority patent/EP3693495A4/de
Priority to PCT/JP2018/036970 priority patent/WO2019069964A1/ja
Priority to CN201880064756.9A priority patent/CN111164236A/zh
Priority to US16/753,417 priority patent/US20200248312A1/en
Priority to KR1020207011967A priority patent/KR20200062265A/ko
Priority to TW107135158A priority patent/TWI829653B/zh
Publication of JP2019070172A publication Critical patent/JP2019070172A/ja
Application granted granted Critical
Publication of JP7149061B2 publication Critical patent/JP7149061B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2017195651A 2017-10-06 2017-10-06 無電解パラジウムめっき液 Active JP7149061B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017195651A JP7149061B2 (ja) 2017-10-06 2017-10-06 無電解パラジウムめっき液
PCT/JP2018/036970 WO2019069964A1 (ja) 2017-10-06 2018-10-03 無電解パラジウムめっき液、及び無電解パラジウムめっき皮膜
CN201880064756.9A CN111164236A (zh) 2017-10-06 2018-10-03 化学镀钯液及化学镀钯膜
US16/753,417 US20200248312A1 (en) 2017-10-06 2018-10-03 Electroless palladium plating solution, and electroless palladium plated coating
EP18864662.4A EP3693495A4 (de) 2017-10-06 2018-10-03 Lösung zur stromlosen abscheidung von palladium und beschichtung mit stromloser palladiumabscheidung
KR1020207011967A KR20200062265A (ko) 2017-10-06 2018-10-03 무전해 팔라듐 도금액 및 무전해 팔라듐 도금 피막
TW107135158A TWI829653B (zh) 2017-10-06 2018-10-05 無電解鈀鍍敷液及無電解鈀鍍敷被膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017195651A JP7149061B2 (ja) 2017-10-06 2017-10-06 無電解パラジウムめっき液

Publications (2)

Publication Number Publication Date
JP2019070172A JP2019070172A (ja) 2019-05-09
JP7149061B2 true JP7149061B2 (ja) 2022-10-06

Family

ID=65994683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017195651A Active JP7149061B2 (ja) 2017-10-06 2017-10-06 無電解パラジウムめっき液

Country Status (7)

Country Link
US (1) US20200248312A1 (de)
EP (1) EP3693495A4 (de)
JP (1) JP7149061B2 (de)
KR (1) KR20200062265A (de)
CN (1) CN111164236A (de)
TW (1) TWI829653B (de)
WO (1) WO2019069964A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6572376B1 (ja) * 2018-11-30 2019-09-11 上村工業株式会社 無電解めっき浴
CN117966140B (zh) * 2024-01-31 2024-07-05 珠海斯美特电子材料有限公司 一种化学镀钯溶液及其应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256866A (ja) 1999-03-10 2000-09-19 Hideo Honma 無電解ニッケルめっき浴
JP2007009305A (ja) 2005-07-04 2007-01-18 Japan Pure Chemical Co Ltd 無電解パラジウムめっき液及びそれを用いて形成された３層めっき被膜端子
JP2007098563A (ja) 2005-09-07 2007-04-19 Central Res Inst Of Electric Power Ind ナノ構造体およびその製造方法
JP2011225927A (ja) 2010-04-19 2011-11-10 Okuno Chemical Industries Co Ltd 無電解パラジウムめっき又は無電解パラジウム合金めっきの前処理用活性化液

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3418143A (en) * 1967-08-15 1968-12-24 Burroughs Corp Bath for the electroless deposition of palladium
WO1987005338A1 (en) * 1986-03-04 1987-09-11 Ishihara Chemical Co., Ltd. Palladium-base electroless plating solution
JP3204035B2 (ja) * 1995-03-30 2001-09-04 上村工業株式会社 無電解パラジウムめっき液及びめっき方法
JP4596553B2 (ja) 2005-07-20 2010-12-08 Ｊｘ日鉱日石金属株式会社 無電解パラジウムめっき液
JP4511623B1 (ja) * 2009-05-08 2010-07-28 小島化学薬品株式会社 無電解パラジウムめっき液
EP2581470B1 (de) * 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Stromlose palladiumplattierungsbadzusammensetzung
TWI479048B (zh) * 2011-10-24 2015-04-01 Kojima Chemicals Co Ltd 無電解鈀敷液
US20140072706A1 (en) * 2012-09-11 2014-03-13 Ernest Long Direct Electroless Palladium Plating on Copper
CN106480437B (zh) * 2015-08-31 2019-01-11 比亚迪股份有限公司 一种离子钯还原液、制备方法及一种非金属化学镀的方法
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
JP6635304B2 (ja) 2016-04-18 2020-01-22 株式会社オートネットワーク技術研究所 リレー装置及び車載システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256866A (ja) 1999-03-10 2000-09-19 Hideo Honma 無電解ニッケルめっき浴
JP2007009305A (ja) 2005-07-04 2007-01-18 Japan Pure Chemical Co Ltd 無電解パラジウムめっき液及びそれを用いて形成された３層めっき被膜端子
JP2007098563A (ja) 2005-09-07 2007-04-19 Central Res Inst Of Electric Power Ind ナノ構造体およびその製造方法
JP2011225927A (ja) 2010-04-19 2011-11-10 Okuno Chemical Industries Co Ltd 無電解パラジウムめっき又は無電解パラジウム合金めっきの前処理用活性化液

Also Published As

Publication number Publication date
TW201925531A (zh) 2019-07-01
JP2019070172A (ja) 2019-05-09
EP3693495A1 (de) 2020-08-12
US20200248312A1 (en) 2020-08-06
WO2019069964A1 (ja) 2019-04-11
CN111164236A (zh) 2020-05-15
KR20200062265A (ko) 2020-06-03
TWI829653B (zh) 2024-01-21
EP3693495A4 (de) 2021-09-29

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