JP7145893B2 - ウエハ保持装置上におけるめっきの遠隔検知 - Google Patents

ウエハ保持装置上におけるめっきの遠隔検知 Download PDF

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Publication number
JP7145893B2
JP7145893B2 JP2019570905A JP2019570905A JP7145893B2 JP 7145893 B2 JP7145893 B2 JP 7145893B2 JP 2019570905 A JP2019570905 A JP 2019570905A JP 2019570905 A JP2019570905 A JP 2019570905A JP 7145893 B2 JP7145893 B2 JP 7145893B2
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sensor
plating
cup
electroplating apparatus
target area
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Japanese (ja)
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JP2020526660A5 (enExample
JP2020526660A (ja
Inventor
アロラ・ラジャン
ヘール・ジャレド
マルケッティ・ジェイソン・ダニエル
メイヤー・スティーブン・ティー．
ジブリダ・ジェームズ・アール．
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Lam Research Corp
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Lam Research Corp
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Priority claimed from US15/638,131 external-priority patent/US10416092B2/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2019570905A 2017-06-29 2018-06-27 ウエハ保持装置上におけるめっきの遠隔検知 Active JP7145893B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/638,131 2017-06-29
US15/638,131 US10416092B2 (en) 2013-02-15 2017-06-29 Remote detection of plating on wafer holding apparatus
PCT/US2018/039827 WO2019006009A1 (en) 2017-06-29 2018-06-27 REMOTE DETECTION OF VENEER ON WAFER SUPPORT APPARATUS

Publications (3)

Publication Number Publication Date
JP2020526660A JP2020526660A (ja) 2020-08-31
JP2020526660A5 JP2020526660A5 (enExample) 2021-05-27
JP7145893B2 true JP7145893B2 (ja) 2022-10-03

Family

ID=64741927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019570905A Active JP7145893B2 (ja) 2017-06-29 2018-06-27 ウエハ保持装置上におけるめっきの遠隔検知

Country Status (5)

Country Link
JP (1) JP7145893B2 (enExample)
KR (1) KR102654656B1 (enExample)
CN (1) CN110799833A (enExample)
TW (1) TW201920946A (enExample)
WO (1) WO2019006009A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7100571B2 (ja) * 2018-12-13 2022-07-13 株式会社荏原製作所 めっき可能な基板の枚数を予測する予測モデルを構築する方法、不具合を引き起こす構成部材を予想するための選択モデルを構築する方法、およびめっき可能な基板の枚数を予測する方法
WO2021221872A1 (en) * 2020-04-30 2021-11-04 Lam Research Corporation Lipseal edge exclusion engineering to maintain material integrity at wafer edge
CN116263515A (zh) * 2021-12-14 2023-06-16 盛美半导体设备(上海)股份有限公司 一种电镀腔漏镀预警方法及系统
KR20250041087A (ko) * 2022-08-26 2025-03-25 가부시키가이샤 에바라 세이사꾸쇼 기판 상태 측정 장치, 도금 장치, 및 기판 상태 측정 방법
WO2025203470A1 (ja) * 2024-03-28 2025-10-02 株式会社荏原製作所 検出装置及び検出方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014196555A (ja) 2013-02-15 2014-10-16 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ ウェハ保持装置上のメッキの検知

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JPH05271989A (ja) * 1992-03-26 1993-10-19 Nippon Steel Corp 電解処理設備の鋼帯用エッジマスクの設定方法
TW373034B (en) * 1997-10-30 1999-11-01 Kazuo Ohba Automatic plating method and apparatus thereof
JP3937206B2 (ja) 1999-09-14 2007-06-27 エスアイアイ・ナノテクノロジー株式会社 位置制御装置
US6491978B1 (en) * 2000-07-10 2002-12-10 Applied Materials, Inc. Deposition of CVD layers for copper metallization using novel metal organic chemical vapor deposition (MOCVD) precursors
CN2504283Y (zh) * 2001-10-31 2002-08-07 宝山钢铁股份有限公司 水平电镀槽用边缘罩自动跟踪带钢装置
CN2655200Y (zh) * 2003-06-20 2004-11-10 陈仁甫 机电数码和激光监控系统
JP4453840B2 (ja) * 2006-02-03 2010-04-21 Ｔｄｋ株式会社 電極組立体およびめっき装置
US7894037B2 (en) 2007-07-30 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2009054516A1 (ja) * 2007-10-26 2009-04-30 Arkray, Inc. 試料検知装置およびこれを備えた測定装置
US20120261254A1 (en) * 2011-04-15 2012-10-18 Reid Jonathan D Method and apparatus for filling interconnect structures
US20110217848A1 (en) * 2010-03-03 2011-09-08 Bergman Eric J Photoresist removing processor and methods
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
KR102092416B1 (ko) * 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝
CN103434647A (zh) * 2013-09-11 2013-12-11 中国民航大学 一种能够消除环境干扰的飞机残冰监测装置
CN205501444U (zh) * 2016-02-22 2016-08-24 东莞市希锐自动化科技股份有限公司 自动滚镀线

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2014196555A (ja) 2013-02-15 2014-10-16 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ ウェハ保持装置上のメッキの検知

Also Published As

Publication number Publication date
CN110799833A (zh) 2020-02-14
WO2019006009A1 (en) 2019-01-03
KR102654656B1 (ko) 2024-04-05
KR20200014440A (ko) 2020-02-10
JP2020526660A (ja) 2020-08-31
TW201920946A (zh) 2019-06-01

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