CN110799833A - 对晶片保持设备上的电镀的远程检测 - Google Patents
对晶片保持设备上的电镀的远程检测 Download PDFInfo
- Publication number
- CN110799833A CN110799833A CN201880043013.3A CN201880043013A CN110799833A CN 110799833 A CN110799833 A CN 110799833A CN 201880043013 A CN201880043013 A CN 201880043013A CN 110799833 A CN110799833 A CN 110799833A
- Authority
- CN
- China
- Prior art keywords
- sensor
- plating
- cup
- target area
- electroplating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Automation & Control Theory (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/638,131 | 2017-06-29 | ||
| US15/638,131 US10416092B2 (en) | 2013-02-15 | 2017-06-29 | Remote detection of plating on wafer holding apparatus |
| PCT/US2018/039827 WO2019006009A1 (en) | 2017-06-29 | 2018-06-27 | REMOTE DETECTION OF VENEER ON WAFER SUPPORT APPARATUS |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110799833A true CN110799833A (zh) | 2020-02-14 |
Family
ID=64741927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880043013.3A Pending CN110799833A (zh) | 2017-06-29 | 2018-06-27 | 对晶片保持设备上的电镀的远程检测 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7145893B2 (enExample) |
| KR (1) | KR102654656B1 (enExample) |
| CN (1) | CN110799833A (enExample) |
| TW (1) | TW201920946A (enExample) |
| WO (1) | WO2019006009A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109463A1 (zh) * | 2021-12-14 | 2023-06-22 | 盛美半导体设备(上海)股份有限公司 | 一种电镀腔漏镀预警方法及系统 |
| CN119487387A (zh) * | 2024-03-28 | 2025-02-18 | 株式会社荏原制作所 | 检测装置以及检测方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7100571B2 (ja) * | 2018-12-13 | 2022-07-13 | 株式会社荏原製作所 | めっき可能な基板の枚数を予測する予測モデルを構築する方法、不具合を引き起こす構成部材を予想するための選択モデルを構築する方法、およびめっき可能な基板の枚数を予測する方法 |
| WO2021221872A1 (en) * | 2020-04-30 | 2021-11-04 | Lam Research Corporation | Lipseal edge exclusion engineering to maintain material integrity at wafer edge |
| KR20250041087A (ko) * | 2022-08-26 | 2025-03-25 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 상태 측정 장치, 도금 장치, 및 기판 상태 측정 방법 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05271989A (ja) * | 1992-03-26 | 1993-10-19 | Nippon Steel Corp | 電解処理設備の鋼帯用エッジマスクの設定方法 |
| US6071387A (en) * | 1997-10-30 | 2000-06-06 | Ohba; Kazuo | Automatic plating method and apparatus thereof |
| CN2504283Y (zh) * | 2001-10-31 | 2002-08-07 | 宝山钢铁股份有限公司 | 水平电镀槽用边缘罩自动跟踪带钢装置 |
| US6491978B1 (en) * | 2000-07-10 | 2002-12-10 | Applied Materials, Inc. | Deposition of CVD layers for copper metallization using novel metal organic chemical vapor deposition (MOCVD) precursors |
| CN2655200Y (zh) * | 2003-06-20 | 2004-11-10 | 陈仁甫 | 机电数码和激光监控系统 |
| US20100259747A1 (en) * | 2007-10-26 | 2010-10-14 | Arkray, Inc. | Sample detector and measurement device equipped with the same |
| CN103434647A (zh) * | 2013-09-11 | 2013-12-11 | 中国民航大学 | 一种能够消除环境干扰的飞机残冰监测装置 |
| US20140230855A1 (en) * | 2013-02-15 | 2014-08-21 | Novellus Systems, Inc. | Detection of plating on wafer holding apparatus |
| CN205501444U (zh) * | 2016-02-22 | 2016-08-24 | 东莞市希锐自动化科技股份有限公司 | 自动滚镀线 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3937206B2 (ja) | 1999-09-14 | 2007-06-27 | エスアイアイ・ナノテクノロジー株式会社 | 位置制御装置 |
| JP4453840B2 (ja) * | 2006-02-03 | 2010-04-21 | Ｔｄｋ株式会社 | 電極組立体およびめっき装置 |
| US7894037B2 (en) | 2007-07-30 | 2011-02-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20120261254A1 (en) * | 2011-04-15 | 2012-10-18 | Reid Jonathan D | Method and apparatus for filling interconnect structures |
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- 2018-06-27 KR KR1020207002536A patent/KR102654656B1/ko active Active
- 2018-06-27 WO PCT/US2018/039827 patent/WO2019006009A1/en not_active Ceased
- 2018-06-27 TW TW107122044A patent/TW201920946A/zh unknown
- 2018-06-27 JP JP2019570905A patent/JP7145893B2/ja active Active
- 2018-06-27 CN CN201880043013.3A patent/CN110799833A/zh active Pending
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| WO2023109463A1 (zh) * | 2021-12-14 | 2023-06-22 | 盛美半导体设备(上海)股份有限公司 | 一种电镀腔漏镀预警方法及系统 |
| CN119487387A (zh) * | 2024-03-28 | 2025-02-18 | 株式会社荏原制作所 | 检测装置以及检测方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7145893B2 (ja) | 2022-10-03 |
| WO2019006009A1 (en) | 2019-01-03 |
| KR102654656B1 (ko) | 2024-04-05 |
| KR20200014440A (ko) | 2020-02-10 |
| JP2020526660A (ja) | 2020-08-31 |
| TW201920946A (zh) | 2019-06-01 |
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