KR102654656B1 - 웨이퍼 홀딩 장치 상의 도금의 리모트 검출 - Google Patents
웨이퍼 홀딩 장치 상의 도금의 리모트 검출 Download PDFInfo
- Publication number
- KR102654656B1 KR102654656B1 KR1020207002536A KR20207002536A KR102654656B1 KR 102654656 B1 KR102654656 B1 KR 102654656B1 KR 1020207002536 A KR1020207002536 A KR 1020207002536A KR 20207002536 A KR20207002536 A KR 20207002536A KR 102654656 B1 KR102654656 B1 KR 102654656B1
- Authority
- KR
- South Korea
- Prior art keywords
- sensor
- plating
- cup
- target area
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Automation & Control Theory (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/638,131 | 2017-06-29 | ||
| US15/638,131 US10416092B2 (en) | 2013-02-15 | 2017-06-29 | Remote detection of plating on wafer holding apparatus |
| PCT/US2018/039827 WO2019006009A1 (en) | 2017-06-29 | 2018-06-27 | REMOTE DETECTION OF VENEER ON WAFER SUPPORT APPARATUS |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200014440A KR20200014440A (ko) | 2020-02-10 |
| KR102654656B1 true KR102654656B1 (ko) | 2024-04-05 |
Family
ID=64741927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207002536A Active KR102654656B1 (ko) | 2017-06-29 | 2018-06-27 | 웨이퍼 홀딩 장치 상의 도금의 리모트 검출 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7145893B2 (enExample) |
| KR (1) | KR102654656B1 (enExample) |
| CN (1) | CN110799833A (enExample) |
| TW (1) | TW201920946A (enExample) |
| WO (1) | WO2019006009A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7100571B2 (ja) * | 2018-12-13 | 2022-07-13 | 株式会社荏原製作所 | めっき可能な基板の枚数を予測する予測モデルを構築する方法、不具合を引き起こす構成部材を予想するための選択モデルを構築する方法、およびめっき可能な基板の枚数を予測する方法 |
| WO2021221872A1 (en) * | 2020-04-30 | 2021-11-04 | Lam Research Corporation | Lipseal edge exclusion engineering to maintain material integrity at wafer edge |
| CN116263515A (zh) * | 2021-12-14 | 2023-06-16 | 盛美半导体设备(上海)股份有限公司 | 一种电镀腔漏镀预警方法及系统 |
| KR20250041087A (ko) * | 2022-08-26 | 2025-03-25 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 상태 측정 장치, 도금 장치, 및 기판 상태 측정 방법 |
| WO2025203470A1 (ja) * | 2024-03-28 | 2025-10-02 | 株式会社荏原製作所 | 検出装置及び検出方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3937206B2 (ja) | 1999-09-14 | 2007-06-27 | エスアイアイ・ナノテクノロジー株式会社 | 位置制御装置 |
| US20090033889A1 (en) | 2007-07-30 | 2009-02-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20120261254A1 (en) * | 2011-04-15 | 2012-10-18 | Reid Jonathan D | Method and apparatus for filling interconnect structures |
| US20130256146A1 (en) * | 2012-03-30 | 2013-10-03 | Lee Peng Chua | Cleaning electroplating substrate holders using reverse current deplating |
| JP2014196555A (ja) * | 2013-02-15 | 2014-10-16 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | ウェハ保持装置上のメッキの検知 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05271989A (ja) * | 1992-03-26 | 1993-10-19 | Nippon Steel Corp | 電解処理設備の鋼帯用エッジマスクの設定方法 |
| TW373034B (en) * | 1997-10-30 | 1999-11-01 | Kazuo Ohba | Automatic plating method and apparatus thereof |
| US6491978B1 (en) * | 2000-07-10 | 2002-12-10 | Applied Materials, Inc. | Deposition of CVD layers for copper metallization using novel metal organic chemical vapor deposition (MOCVD) precursors |
| CN2504283Y (zh) * | 2001-10-31 | 2002-08-07 | 宝山钢铁股份有限公司 | 水平电镀槽用边缘罩自动跟踪带钢装置 |
| CN2655200Y (zh) * | 2003-06-20 | 2004-11-10 | 陈仁甫 | 机电数码和激光监控系统 |
| JP4453840B2 (ja) * | 2006-02-03 | 2010-04-21 | Ｔｄｋ株式会社 | 電極組立体およびめっき装置 |
| WO2009054516A1 (ja) * | 2007-10-26 | 2009-04-30 | Arkray, Inc. | 試料検知装置およびこれを備えた測定装置 |
| US20110217848A1 (en) * | 2010-03-03 | 2011-09-08 | Bergman Eric J | Photoresist removing processor and methods |
| US9228270B2 (en) * | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
| CN103434647A (zh) * | 2013-09-11 | 2013-12-11 | 中国民航大学 | 一种能够消除环境干扰的飞机残冰监测装置 |
| CN205501444U (zh) * | 2016-02-22 | 2016-08-24 | 东莞市希锐自动化科技股份有限公司 | 自动滚镀线 |
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2018
- 2018-06-27 KR KR1020207002536A patent/KR102654656B1/ko active Active
- 2018-06-27 WO PCT/US2018/039827 patent/WO2019006009A1/en not_active Ceased
- 2018-06-27 TW TW107122044A patent/TW201920946A/zh unknown
- 2018-06-27 JP JP2019570905A patent/JP7145893B2/ja active Active
- 2018-06-27 CN CN201880043013.3A patent/CN110799833A/zh active Pending
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| JP3937206B2 (ja) | 1999-09-14 | 2007-06-27 | エスアイアイ・ナノテクノロジー株式会社 | 位置制御装置 |
| US20090033889A1 (en) | 2007-07-30 | 2009-02-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20120261254A1 (en) * | 2011-04-15 | 2012-10-18 | Reid Jonathan D | Method and apparatus for filling interconnect structures |
| US20130256146A1 (en) * | 2012-03-30 | 2013-10-03 | Lee Peng Chua | Cleaning electroplating substrate holders using reverse current deplating |
| JP2014196555A (ja) * | 2013-02-15 | 2014-10-16 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | ウェハ保持装置上のメッキの検知 |
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| Publication number | Publication date |
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| JP7145893B2 (ja) | 2022-10-03 |
| CN110799833A (zh) | 2020-02-14 |
| WO2019006009A1 (en) | 2019-01-03 |
| KR20200014440A (ko) | 2020-02-10 |
| JP2020526660A (ja) | 2020-08-31 |
| TW201920946A (zh) | 2019-06-01 |
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