JP7132122B2 - 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 - Google Patents
導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 Download PDFInfo
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- JP7132122B2 JP7132122B2 JP2018535199A JP2018535199A JP7132122B2 JP 7132122 B2 JP7132122 B2 JP 7132122B2 JP 2018535199 A JP2018535199 A JP 2018535199A JP 2018535199 A JP2018535199 A JP 2018535199A JP 7132122 B2 JP7132122 B2 JP 7132122B2
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- conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021159162A JP7288487B2 (ja) | 2017-06-22 | 2021-09-29 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017122388 | 2017-06-22 | ||
JP2017122388 | 2017-06-22 | ||
PCT/JP2018/023660 WO2018235909A1 (ja) | 2017-06-22 | 2018-06-21 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021159162A Division JP7288487B2 (ja) | 2017-06-22 | 2021-09-29 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018235909A1 JPWO2018235909A1 (ja) | 2020-04-16 |
JP7132122B2 true JP7132122B2 (ja) | 2022-09-06 |
Family
ID=64735985
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2018535199A Active JP7132122B2 (ja) | 2017-06-22 | 2018-06-21 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
JP2021159162A Active JP7288487B2 (ja) | 2017-06-22 | 2021-09-29 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021159162A Active JP7288487B2 (ja) | 2017-06-22 | 2021-09-29 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7132122B2 (ko) |
KR (2) | KR20220016999A (ko) |
CN (2) | CN110603612B (ko) |
TW (1) | TWI768068B (ko) |
WO (1) | WO2018235909A1 (ko) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011175951A (ja) | 2009-08-06 | 2011-09-08 | Hitachi Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
JP2014132542A (ja) | 2012-01-11 | 2014-07-17 | Hitachi Chemical Co Ltd | 導電粒子、絶縁被覆導電粒子及び異方導電性接着剤 |
JP2014241280A (ja) | 2013-05-14 | 2014-12-25 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP2015160958A (ja) | 2014-02-26 | 2015-09-07 | 日立金属株式会社 | 導電性粒子、導電性粉体、導電性高分子組成物および異方性導電シート |
JP2016006764A (ja) | 2014-05-27 | 2016-01-14 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP2016015312A (ja) | 2014-06-11 | 2016-01-28 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5619675B2 (ja) | 2010-08-16 | 2014-11-05 | 株式会社日本触媒 | 導電性微粒子および異方性導電材料 |
JP5719483B1 (ja) * | 2013-09-12 | 2015-05-20 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP6641164B2 (ja) * | 2014-12-04 | 2020-02-05 | 積水化学工業株式会社 | 基材粒子、導電性粒子、導電材料及び接続構造体 |
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2018
- 2018-06-21 JP JP2018535199A patent/JP7132122B2/ja active Active
- 2018-06-21 KR KR1020227002664A patent/KR20220016999A/ko not_active Application Discontinuation
- 2018-06-21 CN CN201880030129.3A patent/CN110603612B/zh active Active
- 2018-06-21 KR KR1020197017103A patent/KR102356887B1/ko active IP Right Grant
- 2018-06-21 CN CN202210997623.5A patent/CN115458206A/zh active Pending
- 2018-06-21 WO PCT/JP2018/023660 patent/WO2018235909A1/ja active Application Filing
- 2018-06-22 TW TW107121465A patent/TWI768068B/zh active
-
2021
- 2021-09-29 JP JP2021159162A patent/JP7288487B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011175951A (ja) | 2009-08-06 | 2011-09-08 | Hitachi Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
JP2014132542A (ja) | 2012-01-11 | 2014-07-17 | Hitachi Chemical Co Ltd | 導電粒子、絶縁被覆導電粒子及び異方導電性接着剤 |
JP2014241280A (ja) | 2013-05-14 | 2014-12-25 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP2015160958A (ja) | 2014-02-26 | 2015-09-07 | 日立金属株式会社 | 導電性粒子、導電性粉体、導電性高分子組成物および異方性導電シート |
JP2016006764A (ja) | 2014-05-27 | 2016-01-14 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP2016015312A (ja) | 2014-06-11 | 2016-01-28 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2018235909A1 (ja) | 2020-04-16 |
JP2022008631A (ja) | 2022-01-13 |
CN110603612A (zh) | 2019-12-20 |
WO2018235909A1 (ja) | 2018-12-27 |
TWI768068B (zh) | 2022-06-21 |
TW201905142A (zh) | 2019-02-01 |
CN110603612B (zh) | 2022-08-30 |
KR20220016999A (ko) | 2022-02-10 |
JP7288487B2 (ja) | 2023-06-07 |
KR102356887B1 (ko) | 2022-02-03 |
CN115458206A (zh) | 2022-12-09 |
KR20200021440A (ko) | 2020-02-28 |
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