TWI768068B - 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體 - Google Patents

導電性粒子、導電性粒子之製造方法、導電材料及連接構造體 Download PDF

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Publication number
TWI768068B
TWI768068B TW107121465A TW107121465A TWI768068B TW I768068 B TWI768068 B TW I768068B TW 107121465 A TW107121465 A TW 107121465A TW 107121465 A TW107121465 A TW 107121465A TW I768068 B TWI768068 B TW I768068B
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TW
Taiwan
Prior art keywords
electroconductive
particle
conductive
particles
conductive portion
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TW107121465A
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English (en)
Chinese (zh)
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TW201905142A (zh
Inventor
大秦嘉代
真原茂雄
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日商積水化學工業股份有限公司
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Publication of TW201905142A publication Critical patent/TW201905142A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW107121465A 2017-06-22 2018-06-22 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體 TWI768068B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-122388 2017-06-22
JP2017122388 2017-06-22

Publications (2)

Publication Number Publication Date
TW201905142A TW201905142A (zh) 2019-02-01
TWI768068B true TWI768068B (zh) 2022-06-21

Family

ID=64735985

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107121465A TWI768068B (zh) 2017-06-22 2018-06-22 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體

Country Status (5)

Country Link
JP (2) JP7132122B2 (ko)
KR (2) KR20220016999A (ko)
CN (2) CN115458206A (ko)
TW (1) TWI768068B (ko)
WO (1) WO2018235909A1 (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201125661A (en) * 2009-08-06 2011-08-01 Hitachi Chemical Co Ltd Conductive fine particles and anisotropic conductive material
TW201542831A (zh) * 2014-02-26 2015-11-16 Hitachi Metals Ltd 導電性顆粒、導電性粉體、導電性高分子組成物及各向異性導電片
JP2016006764A (ja) * 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5619675B2 (ja) 2010-08-16 2014-11-05 株式会社日本触媒 導電性微粒子および異方性導電材料
JP6155651B2 (ja) * 2012-01-11 2017-07-05 日立化成株式会社 導電粒子、絶縁被覆導電粒子及び異方導電性接着剤
JP6357347B2 (ja) * 2013-05-14 2018-07-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN105210157B (zh) * 2013-09-12 2017-05-31 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP6684052B2 (ja) * 2014-06-11 2020-04-22 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6641164B2 (ja) * 2014-12-04 2020-02-05 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201125661A (en) * 2009-08-06 2011-08-01 Hitachi Chemical Co Ltd Conductive fine particles and anisotropic conductive material
TW201542831A (zh) * 2014-02-26 2015-11-16 Hitachi Metals Ltd 導電性顆粒、導電性粉體、導電性高分子組成物及各向異性導電片
JP2016006764A (ja) * 2014-05-27 2016-01-14 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
KR102356887B1 (ko) 2022-02-03
CN110603612B (zh) 2022-08-30
TW201905142A (zh) 2019-02-01
CN115458206A (zh) 2022-12-09
KR20200021440A (ko) 2020-02-28
JP2022008631A (ja) 2022-01-13
KR20220016999A (ko) 2022-02-10
JP7288487B2 (ja) 2023-06-07
JPWO2018235909A1 (ja) 2020-04-16
WO2018235909A1 (ja) 2018-12-27
JP7132122B2 (ja) 2022-09-06
CN110603612A (zh) 2019-12-20

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