JP7129375B2 - 半導体加工用テープ - Google Patents

半導体加工用テープ Download PDF

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Publication number
JP7129375B2
JP7129375B2 JP2019081611A JP2019081611A JP7129375B2 JP 7129375 B2 JP7129375 B2 JP 7129375B2 JP 2019081611 A JP2019081611 A JP 2019081611A JP 2019081611 A JP2019081611 A JP 2019081611A JP 7129375 B2 JP7129375 B2 JP 7129375B2
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Japan
Prior art keywords
adhesive layer
tape
wafer
semiconductor processing
adhesive
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Active
Application number
JP2019081611A
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English (en)
Japanese (ja)
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JP2019176159A5 (pt
JP2019176159A (ja
Inventor
透 佐野
晃 仙台
浩介 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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Publication of JP2019176159A publication Critical patent/JP2019176159A/ja
Publication of JP2019176159A5 publication Critical patent/JP2019176159A5/ja
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Publication of JP7129375B2 publication Critical patent/JP7129375B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2019081611A 2018-03-28 2019-04-23 半導体加工用テープ Active JP7129375B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018061062 2018-03-28
JP2018061062 2018-03-28

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018538797A Division JP6535138B1 (ja) 2018-03-28 2018-07-18 半導体加工用テープ

Publications (3)

Publication Number Publication Date
JP2019176159A JP2019176159A (ja) 2019-10-10
JP2019176159A5 JP2019176159A5 (pt) 2021-03-25
JP7129375B2 true JP7129375B2 (ja) 2022-09-01

Family

ID=68059692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019081611A Active JP7129375B2 (ja) 2018-03-28 2019-04-23 半導体加工用テープ

Country Status (7)

Country Link
JP (1) JP7129375B2 (pt)
KR (1) KR102112771B1 (pt)
CN (1) CN110546736B (pt)
BR (1) BR112019019520B1 (pt)
SG (1) SG11201906507PA (pt)
TW (1) TWI694508B (pt)
WO (1) WO2019187186A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021079955A1 (ja) * 2019-10-23 2021-04-29 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シートおよび保護膜付き小片の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119992A (ja) 1997-02-10 2004-04-15 Lintec Corp チップ体製造用粘着シート
JP2011216508A (ja) 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2012174945A (ja) 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The 半導体ウエハの加工方法
JP2014157964A (ja) 2013-02-18 2014-08-28 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2521459B2 (ja) * 1987-02-23 1996-08-07 日東電工株式会社 半導体チツプの製造方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
WO2004090962A1 (ja) * 2003-04-08 2004-10-21 Teijin Dupont Films Japan Limited 半導体ウェハ加工用ベースフィルム
JP4754278B2 (ja) 2005-06-23 2011-08-24 リンテック株式会社 チップ体の製造方法
JP5801584B2 (ja) * 2011-03-29 2015-10-28 リンテック株式会社 ダイシングテープおよびチップ状部品の製造方法
KR101903312B1 (ko) * 2012-12-26 2018-10-01 히타치가세이가부시끼가이샤 익스팬드 방법, 반도체 장치의 제조방법, 및 반도체 장치
JP6021263B2 (ja) * 2013-01-29 2016-11-09 日東電工株式会社 粘着テープ
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2016152957A1 (ja) 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
JP2017147293A (ja) * 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP6429824B2 (ja) * 2016-03-31 2018-11-28 古河電気工業株式会社 電子デバイスパッケージ用テープ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119992A (ja) 1997-02-10 2004-04-15 Lintec Corp チップ体製造用粘着シート
JP2011216508A (ja) 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP2012174945A (ja) 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The 半導体ウエハの加工方法
JP2014157964A (ja) 2013-02-18 2014-08-28 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法

Also Published As

Publication number Publication date
JP2019176159A (ja) 2019-10-10
CN110546736A (zh) 2019-12-06
TWI694508B (zh) 2020-05-21
BR112019019520A2 (pt) 2020-06-09
CN110546736B (zh) 2020-10-16
KR102112771B1 (ko) 2020-05-19
TW201942963A (zh) 2019-11-01
BR112019019520B1 (pt) 2021-03-16
KR20190113748A (ko) 2019-10-08
SG11201906507PA (en) 2019-11-28
WO2019187186A1 (ja) 2019-10-03

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