JP7121506B2 - 探索装置、探索方法及びプラズマ処理装置 - Google Patents

探索装置、探索方法及びプラズマ処理装置 Download PDF

Info

Publication number
JP7121506B2
JP7121506B2 JP2018046238A JP2018046238A JP7121506B2 JP 7121506 B2 JP7121506 B2 JP 7121506B2 JP 2018046238 A JP2018046238 A JP 2018046238A JP 2018046238 A JP2018046238 A JP 2018046238A JP 7121506 B2 JP7121506 B2 JP 7121506B2
Authority
JP
Japan
Prior art keywords
parameter value
output parameter
processing
target output
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018046238A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019159864A (ja
JP2019159864A5 (https=
Inventor
裕 奥山
健史 大森
優 栗原
百科 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Priority to JP2018046238A priority Critical patent/JP7121506B2/ja
Priority to KR1020180150325A priority patent/KR102113096B1/ko
Priority to CN201811578970.4A priority patent/CN110276470B/zh
Priority to TW108103411A priority patent/TWI719398B/zh
Priority to US16/284,879 priority patent/US11657059B2/en
Publication of JP2019159864A publication Critical patent/JP2019159864A/ja
Publication of JP2019159864A5 publication Critical patent/JP2019159864A5/ja
Priority to US17/241,826 priority patent/US11907235B2/en
Application granted granted Critical
Publication of JP7121506B2 publication Critical patent/JP7121506B2/ja
Priority to US18/124,112 priority patent/US20230222131A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/20—Information retrieval; Database structures therefor; File system structures therefor of structured data, e.g. relational data
    • G06F16/24—Querying
    • G06F16/245—Query processing
    • G06F16/2458—Special types of queries, e.g. statistical queries, fuzzy queries or distributed queries
    • G06F16/2462—Approximate or statistical queries
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/90—Details of database functions independent of the retrieved data types
    • G06F16/903—Querying
    • G06F16/90335—Query processing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F16/00—Information retrieval; Database structures therefor; File system structures therefor
    • G06F16/90—Details of database functions independent of the retrieved data types
    • G06F16/95—Retrieval from the web
    • G06F16/953—Querying, e.g. by the use of web search engines
    • G06F16/9535—Search customisation based on user profiles and personalisation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
    • G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
    • G06F3/04883—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures for inputting data by handwriting, e.g. gesture or text
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/10—Machine learning using kernel methods, e.g. support vector machines [SVM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0499—Feedforward networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N5/00—Computing arrangements using knowledge-based models
    • G06N5/04—Inference or reasoning models
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/327—Arrangements for generating the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • Health & Medical Sciences (AREA)
  • Mathematical Physics (AREA)
  • Computational Linguistics (AREA)
  • Computing Systems (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Databases & Information Systems (AREA)
  • General Health & Medical Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Business, Economics & Management (AREA)
  • Probability & Statistics with Applications (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Human Resources & Organizations (AREA)
  • Strategic Management (AREA)
  • Economics (AREA)
  • Fuzzy Systems (AREA)
  • General Business, Economics & Management (AREA)
  • Marketing (AREA)
  • Tourism & Hospitality (AREA)
  • Human Computer Interaction (AREA)
  • Primary Health Care (AREA)
  • Manufacturing & Machinery (AREA)
  • Development Economics (AREA)
  • Game Theory and Decision Science (AREA)
  • Entrepreneurship & Innovation (AREA)
JP2018046238A 2018-03-13 2018-03-14 探索装置、探索方法及びプラズマ処理装置 Active JP7121506B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018046238A JP7121506B2 (ja) 2018-03-14 2018-03-14 探索装置、探索方法及びプラズマ処理装置
KR1020180150325A KR102113096B1 (ko) 2018-03-14 2018-11-29 탐색 장치, 탐색 방법 및 플라스마 처리 장치
CN201811578970.4A CN110276470B (zh) 2018-03-14 2018-12-21 探索装置、探索方法以及等离子处理装置
TW108103411A TWI719398B (zh) 2018-03-14 2019-01-30 探索裝置、探索方法及電漿處理裝置
US16/284,879 US11657059B2 (en) 2018-03-14 2019-02-25 Search device, searching method, and plasma processing apparatus
US17/241,826 US11907235B2 (en) 2018-03-14 2021-04-27 Plasma processing apparatus including predictive control
US18/124,112 US20230222131A1 (en) 2018-03-13 2023-03-21 Search device, searching method, and plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018046238A JP7121506B2 (ja) 2018-03-14 2018-03-14 探索装置、探索方法及びプラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2019159864A JP2019159864A (ja) 2019-09-19
JP2019159864A5 JP2019159864A5 (https=) 2020-12-10
JP7121506B2 true JP7121506B2 (ja) 2022-08-18

Family

ID=67904060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018046238A Active JP7121506B2 (ja) 2018-03-13 2018-03-14 探索装置、探索方法及びプラズマ処理装置

Country Status (5)

Country Link
US (3) US11657059B2 (https=)
JP (1) JP7121506B2 (https=)
KR (1) KR102113096B1 (https=)
CN (1) CN110276470B (https=)
TW (1) TWI719398B (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7121506B2 (ja) 2018-03-14 2022-08-18 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置
JP7137943B2 (ja) 2018-03-20 2022-09-15 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置
US20220309198A1 (en) * 2019-09-05 2022-09-29 Tokyo Institute Of Technology Sample Preparation Evaluation System, Sample Preparation Evaluation Method and Computer Readable Medium
WO2021094881A1 (ja) * 2019-11-15 2021-05-20 株式会社半導体エネルギー研究所 半導体素子の特性予測システム
CN113287123B (zh) * 2019-12-03 2024-12-31 株式会社日立高新技术 搜索装置、搜索程序以及等离子处理装置
JP7429116B2 (ja) * 2019-12-20 2024-02-07 旭化成株式会社 装置、方法およびプログラム
CN110969255B (zh) * 2019-12-26 2023-08-25 王超 一种基于量子原理的人工智能自主学习系统及方法
JP7542417B2 (ja) * 2019-12-27 2024-08-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、基板処理システム、及び学習用データの生成方法
JP7358251B2 (ja) * 2020-01-17 2023-10-10 株式会社荏原製作所 めっき支援システム、めっき支援装置、めっき支援プログラムおよびめっき実施条件決定方法
JP7376405B2 (ja) * 2020-03-26 2023-11-08 株式会社日立製作所 最適化処理装置、最適化処理方法及び最適化処理プログラム
JP7413131B2 (ja) * 2020-04-08 2024-01-15 株式会社日立製作所 材料特性予測方法、材料特性予測装置
WO2021206076A1 (ja) * 2020-04-10 2021-10-14 国立大学法人筑波大学 計測信号処理装置、計測信号処理方法およびプログラム
JP7424909B2 (ja) 2020-05-18 2024-01-30 株式会社日立製作所 処理条件探索装置および処理条件探索方法
US11449026B2 (en) * 2020-05-27 2022-09-20 Applied Materials, Inc. Variable loop control feature
CN112309918B (zh) * 2020-10-30 2023-09-22 上海华力微电子有限公司 Vt-bs模型的先进工艺控制方法、系统及半导体设备
JP7485302B2 (ja) * 2020-12-02 2024-05-16 三菱電機株式会社 信頼性評価装置
CN116670597A (zh) * 2020-12-28 2023-08-29 东京毅力科创株式会社 管理装置、预测方法和预测程序
JP7632968B2 (ja) * 2021-02-04 2025-02-19 東京エレクトロン株式会社 情報処理装置、プログラム及びプロセス条件探索方法
WO2022172353A1 (ja) * 2021-02-10 2022-08-18 株式会社日立ハイテク 輪郭線解析装置、処理条件決定システム、形状推定システム、半導体装置製造システム、探索装置およびそれらに用いるデータ構造
US12450520B2 (en) * 2021-03-01 2025-10-21 Hitachi High-Tech Corporation Experiment point recommendation device, experiment point recommendation method, and semiconductor device manufacturing device
TW202242958A (zh) * 2021-03-02 2022-11-01 日商東京威力科創股份有限公司 資料收集系統、資料收集裝置、資料收集方法及資料收集程式
CN112986275A (zh) * 2021-03-17 2021-06-18 哈尔滨工程大学 一种胚芽米胚芽完整度在线检测系统
JP7661763B2 (ja) * 2021-04-20 2025-04-15 株式会社大林組 学習データ作成システム、学習データ作成方法及び学習データ作成プログラム
US12222690B2 (en) * 2021-07-08 2025-02-11 Hitachi High-Tech Corporation Process recipe search apparatus, etching recipe search method and semiconductor device manufacturing system
WO2023281681A1 (ja) * 2021-07-08 2023-01-12 三菱電機株式会社 加工条件探索装置および加工条件探索方法
JP7698502B2 (ja) * 2021-07-29 2025-06-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
US12300464B2 (en) * 2021-10-25 2025-05-13 Advanced Energy Industries, Inc. Robust tensorized shaped setpoint waveform streaming control
JP2023157281A (ja) * 2022-04-14 2023-10-26 株式会社アルバック 制御装置、成膜装置、成膜方法及びプログラム
JP7632978B2 (ja) * 2022-05-11 2025-02-19 東京エレクトロン株式会社 エッチング処理装置、エッチング処理システム、解析装置、エッチング処理方法及び解析プログラム
US20240070349A1 (en) * 2022-08-30 2024-02-29 Dassault Systèmes Americas Corp. System and Method for Energy Storage Device Generative Design
CN116224792A (zh) * 2023-02-27 2023-06-06 苏州汉霄等离子体科技有限公司 提高等离子体制粉系统控制精度的方法、装置及设备
JP2024136166A (ja) * 2023-03-23 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 情報処理装置、基板処理装置および処理条件決定方法
CN120937117A (zh) * 2023-03-24 2025-11-11 株式会社斯库林集团 学习装置、信息处理装置、基板处理装置、学习方法以及处理条件决定方法
CN116646231A (zh) * 2023-06-06 2023-08-25 北京屹唐半导体科技股份有限公司 反应腔室及氧化设备
TWI903376B (zh) * 2024-02-02 2025-11-01 弘琦貿易有限公司 以人工智慧驅動的無線潤滑器之遠端控制系統

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004326200A (ja) 2003-04-21 2004-11-18 Mitsubishi Heavy Ind Ltd 自動機械、機械の自動運転システム、及び、機械の自動運転方法
JP2013518449A (ja) 2010-01-29 2013-05-20 東京エレクトロン株式会社 半導体製造ツールを自己学習及び自己改善するための方法及びシステム

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920002268A (ko) 1990-07-17 1992-02-28 유끼노리 가까즈 인텔리젠트가공장치
JPH1074188A (ja) * 1996-05-23 1998-03-17 Hitachi Ltd データ学習装置およびプラント制御装置
JPH10301979A (ja) 1997-04-30 1998-11-13 Oki Electric Ind Co Ltd モデルパラメータ抽出方法およびモデルパラメータ抽出装置
JP3086794B2 (ja) 1997-09-19 2000-09-11 豊田工機株式会社 数値制御研削盤
SE9801175D0 (sv) * 1998-04-03 1998-04-03 Innotek Ab Metod och apparat för optimering av mekanisk ventilation med utgångspunkt från simulering av ventilatonsprocessen efter studium av andningsorganens fysiologi
JP4215454B2 (ja) 2001-07-12 2009-01-28 株式会社日立製作所 試料の凹凸判定方法、及び荷電粒子線装置
JP3404532B2 (ja) * 2001-07-27 2003-05-12 独立行政法人産業技術総合研究所 最適フィッティングパラメータ決定方法および装置、並びに最適フィッティングパラメータ決定プログラム
US6941301B2 (en) 2002-01-18 2005-09-06 Pavilion Technologies, Inc. Pre-processing input data with outlier values for a support vector machine
AU2003290932A1 (en) * 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
JP4573783B2 (ja) * 2006-03-08 2010-11-04 株式会社日立製作所 プラントの制御装置と制御方法及び火力発電プラントとその制御方法
US20080279434A1 (en) 2007-05-11 2008-11-13 William Cassill Method and system for automated modeling
JP4427074B2 (ja) * 2007-06-07 2010-03-03 株式会社日立製作所 プラントの制御装置
US8190543B2 (en) 2008-03-08 2012-05-29 Tokyo Electron Limited Autonomous biologically based learning tool
JP5751045B2 (ja) 2010-08-31 2015-07-22 富士電機株式会社 プラントの運転条件最適化システム、プラントの運転条件最適化方法、プラントの運転条件最適化プログラム
US9342793B2 (en) * 2010-08-31 2016-05-17 Red Hat, Inc. Training a self-learning network using interpolated input sets based on a target output
US8828259B2 (en) * 2011-07-07 2014-09-09 Lam Research Corporation Methods for automatically determining capacitor values and systems thereof
US9509977B2 (en) * 2012-03-28 2016-11-29 Olympus Corporation Image processing system and microscope system including the same
TWI549007B (zh) * 2013-02-07 2016-09-11 先知科技股份有限公司 製程參數的搜尋與分析方法及其電腦程式產品
US9396443B2 (en) 2013-12-05 2016-07-19 Tokyo Electron Limited System and method for learning and/or optimizing manufacturing processes
JP6101650B2 (ja) 2014-02-27 2017-03-22 日本電信電話株式会社 システムパラメタ学習装置、情報処理装置、方法、及びプログラム
CN105321120A (zh) * 2014-06-30 2016-02-10 中国农业科学院农业资源与农业区划研究所 同化蒸散发和叶面积指数的区域土壤水分监测方法
US9679743B2 (en) * 2015-02-23 2017-06-13 Hitachi High-Tech Science Corporation Sample processing evaluation apparatus
CN104657777B (zh) * 2015-03-16 2017-06-16 长春工业大学 基于混沌小波神经网络的车用电线挤塑工艺参数优化方法
US9711327B2 (en) * 2015-07-16 2017-07-18 Applied Materials Israel, Ltd. Method and system for optimizing configurable parameters of inspection tools
JP2017102619A (ja) 2015-11-30 2017-06-08 オムロン株式会社 制御パラメータ調整装置、制御パラメータ調整方法、制御パラメータ調整プログラム
JP6650786B2 (ja) 2016-03-03 2020-02-19 三菱日立パワーシステムズ株式会社 制御パラメータ自動調整装置、制御パラメータ自動調整方法、及び制御パラメータ自動調整装置ネットワーク
JP6778666B2 (ja) 2017-08-24 2020-11-04 株式会社日立製作所 探索装置及び探索方法
JP6883787B2 (ja) 2017-09-06 2021-06-09 パナソニックＩｐマネジメント株式会社 学習装置、学習方法、学習プログラム、推定装置、推定方法、及び推定プログラム
JP6974712B2 (ja) 2017-10-24 2021-12-01 富士通株式会社 探索方法、探索装置および探索プログラム
JP7121506B2 (ja) 2018-03-14 2022-08-18 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置
JP7137943B2 (ja) 2018-03-20 2022-09-15 株式会社日立ハイテク 探索装置、探索方法及びプラズマ処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004326200A (ja) 2003-04-21 2004-11-18 Mitsubishi Heavy Ind Ltd 自動機械、機械の自動運転システム、及び、機械の自動運転方法
JP2013518449A (ja) 2010-01-29 2013-05-20 東京エレクトロン株式会社 半導体製造ツールを自己学習及び自己改善するための方法及びシステム

Also Published As

Publication number Publication date
TW201939364A (zh) 2019-10-01
JP2019159864A (ja) 2019-09-19
KR20190108473A (ko) 2019-09-24
US20210263922A1 (en) 2021-08-26
TWI719398B (zh) 2021-02-21
KR102113096B1 (ko) 2020-05-20
US20190286632A1 (en) 2019-09-19
US11907235B2 (en) 2024-02-20
CN110276470A (zh) 2019-09-24
US20230222131A1 (en) 2023-07-13
US11657059B2 (en) 2023-05-23
CN110276470B (zh) 2023-04-18

Similar Documents

Publication Publication Date Title
JP7121506B2 (ja) 探索装置、探索方法及びプラズマ処理装置
JP7655426B2 (ja) 半導体製造装置の管理システム及びその方法
US20260079478A1 (en) Performance predictors for semiconductor-manufacturing processes
JP7137943B2 (ja) 探索装置、探索方法及びプラズマ処理装置
US10254641B2 (en) Layout pattern proximity correction through fast edge placement error prediction
JP7148644B2 (ja) 探索装置、探索プログラム及びプラズマ処理装置
CN100476733C (zh) 用于工具上半导体仿真的系统和方法
CN1860487B (zh) 使用第一原理仿真分析半导体处理工具执行的处理的系统和方法
TWI672599B (zh) 探索裝置及探索方法
TWI774919B (zh) 資訊處理裝置、程式、製程處理執行裝置及資訊處理系統
CN110832400A (zh) 通过边缘位置误差预测设计布局图案邻近校正
JP2019040984A (ja) 探索装置及び探索方法
CN117950370A (zh) 信息处理装置和信息处理方法
Sawlani et al. Perspectives on artificial intelligence for plasma-assisted manufacturing in semiconductor industry
JP6754878B2 (ja) 探索装置および探索方法
US20230369032A1 (en) Etching processing apparatus, etching processing system, analysis apparatus, etching processing method, and storage medium

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201021

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201021

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20211027

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211116

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20220114

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220310

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220712

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220805

R150 Certificate of patent or registration of utility model

Ref document number: 7121506

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150