JP7118731B2 - 光導波路搭載基板、光送受信装置 - Google Patents

光導波路搭載基板、光送受信装置 Download PDF

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Publication number
JP7118731B2
JP7118731B2 JP2018095993A JP2018095993A JP7118731B2 JP 7118731 B2 JP7118731 B2 JP 7118731B2 JP 2018095993 A JP2018095993 A JP 2018095993A JP 2018095993 A JP2018095993 A JP 2018095993A JP 7118731 B2 JP7118731 B2 JP 7118731B2
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Japan
Prior art keywords
layer
optical waveguide
opening
clad layer
angle
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JP2018095993A
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English (en)
Japanese (ja)
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JP2019200373A (ja
JP2019200373A5 (https=
Inventor
賢司 柳沢
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2018095993A priority Critical patent/JP7118731B2/ja
Priority to US16/411,656 priority patent/US10935719B2/en
Publication of JP2019200373A publication Critical patent/JP2019200373A/ja
Priority to US17/155,289 priority patent/US11378763B2/en
Publication of JP2019200373A5 publication Critical patent/JP2019200373A5/ja
Application granted granted Critical
Publication of JP7118731B2 publication Critical patent/JP7118731B2/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12176—Etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12178—Epitaxial growth
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • G02B6/02295—Microstructured optical fibre
    • G02B6/02314—Plurality of longitudinal structures extending along optical fibre axis, e.g. holes
    • G02B6/02342—Plurality of longitudinal structures extending along optical fibre axis, e.g. holes characterised by cladding features, i.e. light confining region
    • G02B6/02361—Longitudinal structures forming multiple layers around the core, e.g. arranged in multiple rings with each ring having longitudinal elements at substantially the same radial distance from the core, having rotational symmetry about the fibre axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • G02B6/036—Optical fibres with cladding with or without a coating core or cladding comprising multiple layers
    • G02B6/03616—Optical fibres characterised both by the number of different refractive index layers around the central core segment, i.e. around the innermost high index core layer, and their relative refractive index difference
    • G02B6/03638—Optical fibres characterised both by the number of different refractive index layers around the central core segment, i.e. around the innermost high index core layer, and their relative refractive index difference having 3 layers only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
JP2018095993A 2018-05-18 2018-05-18 光導波路搭載基板、光送受信装置 Active JP7118731B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018095993A JP7118731B2 (ja) 2018-05-18 2018-05-18 光導波路搭載基板、光送受信装置
US16/411,656 US10935719B2 (en) 2018-05-18 2019-05-14 Optical waveguide having support member, optical waveguide mounting substrate and optical transceiver
US17/155,289 US11378763B2 (en) 2018-05-18 2021-01-22 Optical waveguide having support member, optical waveguide mounting substrate and optical transceiver

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018095993A JP7118731B2 (ja) 2018-05-18 2018-05-18 光導波路搭載基板、光送受信装置

Publications (3)

Publication Number Publication Date
JP2019200373A JP2019200373A (ja) 2019-11-21
JP2019200373A5 JP2019200373A5 (https=) 2021-04-01
JP7118731B2 true JP7118731B2 (ja) 2022-08-16

Family

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Family Applications (1)

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JP2018095993A Active JP7118731B2 (ja) 2018-05-18 2018-05-18 光導波路搭載基板、光送受信装置

Country Status (2)

Country Link
US (2) US10935719B2 (https=)
JP (1) JP7118731B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021106378A1 (ja) * 2019-11-28 2021-06-03 京セラ株式会社 光学素子搭載モジュール
JP7358224B2 (ja) * 2019-12-09 2023-10-10 新光電気工業株式会社 光モジュール及びその製造方法
CN116195207A (zh) * 2020-08-28 2023-05-30 艾维森纳科技有限公司 微led互连件与ic的混合集成

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003294965A (ja) 2002-04-04 2003-10-15 Hitachi Chem Co Ltd 光導波路デバイス、その製造方法及び基板
JP2006330067A (ja) 2005-05-23 2006-12-07 Hitachi Cable Ltd 直角曲げ導波路及びその製造方法
WO2007139155A1 (ja) 2006-05-30 2007-12-06 Sumitomo Bakelite Co., Ltd. 光素子実装用基板、光回路基板及び光素子実装基板
JP2008281923A (ja) 2007-05-14 2008-11-20 Shinko Electric Ind Co Ltd 光電気混載基板
JP2009251034A (ja) 2008-04-01 2009-10-29 Shinko Electric Ind Co Ltd 光導波路の製造方法、光導波路及び光送受信装置
JP2010139562A (ja) 2008-12-09 2010-06-24 Shinko Electric Ind Co Ltd 光導波路、光導波路搭載基板及び光送受信装置
JP2012113180A (ja) 2010-11-26 2012-06-14 Shinko Electric Ind Co Ltd 光導波路及びその製造方法と光導波路装置
JP2016126039A (ja) 2014-12-26 2016-07-11 新光電気工業株式会社 光導波路装置の製造方法及びレーザ加工装置
US20170146741A1 (en) 2015-11-20 2017-05-25 International Business Machines Corporation Optical device with precoated underfill

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000227524A (ja) * 1999-02-05 2000-08-15 Sony Corp 光導波装置および光送受信装置、ならびにそれらの製造方法
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same
TWI239798B (en) * 1999-05-28 2005-09-11 Toppan Printing Co Ltd Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate
JP4447428B2 (ja) * 2004-10-19 2010-04-07 新光電気工業株式会社 光導波路の製造方法
JP2006330066A (ja) * 2005-05-23 2006-12-07 Hitachi Cable Ltd 光反射面及びその形成方法
JP4704322B2 (ja) * 2006-11-30 2011-06-15 新光電気工業株式会社 光電気混載基板の製造方法
KR100975052B1 (ko) * 2008-09-29 2010-08-11 주식회사 와이텔포토닉스 광모듈 및 그 제조방법
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
US10168495B1 (en) * 2017-06-28 2019-01-01 Kyocera Corporation Optical waveguide and optical circuit board

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003294965A (ja) 2002-04-04 2003-10-15 Hitachi Chem Co Ltd 光導波路デバイス、その製造方法及び基板
JP2006330067A (ja) 2005-05-23 2006-12-07 Hitachi Cable Ltd 直角曲げ導波路及びその製造方法
WO2007139155A1 (ja) 2006-05-30 2007-12-06 Sumitomo Bakelite Co., Ltd. 光素子実装用基板、光回路基板及び光素子実装基板
JP2008281923A (ja) 2007-05-14 2008-11-20 Shinko Electric Ind Co Ltd 光電気混載基板
JP2009251034A (ja) 2008-04-01 2009-10-29 Shinko Electric Ind Co Ltd 光導波路の製造方法、光導波路及び光送受信装置
JP2010139562A (ja) 2008-12-09 2010-06-24 Shinko Electric Ind Co Ltd 光導波路、光導波路搭載基板及び光送受信装置
JP2012113180A (ja) 2010-11-26 2012-06-14 Shinko Electric Ind Co Ltd 光導波路及びその製造方法と光導波路装置
JP2016126039A (ja) 2014-12-26 2016-07-11 新光電気工業株式会社 光導波路装置の製造方法及びレーザ加工装置
US20170146741A1 (en) 2015-11-20 2017-05-25 International Business Machines Corporation Optical device with precoated underfill

Also Published As

Publication number Publication date
JP2019200373A (ja) 2019-11-21
US10935719B2 (en) 2021-03-02
US20190353842A1 (en) 2019-11-21
US11378763B2 (en) 2022-07-05
US20210141151A1 (en) 2021-05-13

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