JP7116923B2 - センサ - Google Patents
センサ Download PDFInfo
- Publication number
- JP7116923B2 JP7116923B2 JP2019038686A JP2019038686A JP7116923B2 JP 7116923 B2 JP7116923 B2 JP 7116923B2 JP 2019038686 A JP2019038686 A JP 2019038686A JP 2019038686 A JP2019038686 A JP 2019038686A JP 7116923 B2 JP7116923 B2 JP 7116923B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal lid
- sensor
- lid
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 claims description 144
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 230000003287 optical effect Effects 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Sustainable Development (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Electroluminescent Light Sources (AREA)
Description
センサ素子と電気的に接続された回路基板(40)を収容し、開口部(15)と前記開口部(15)を画成する縁部(11)とが設けられた金属筐体(10)と、
前記開口部(15)を覆うよう、前記縁部(11)に接着された金属蓋(20)と、を備え、
前記縁部(11)及び前記金属蓋(20)の少なくともいずれかに凹部(14)が1つ以上設けられ、当該凹部(14)内に充填された接着剤(50)のうち前記凹部(14)の開口端の領域に位置する部分によって、前記縁部(11)に前記金属蓋(20)が接着されている、
センサ(1)。
Claims (5)
- センサ素子と電気的に接続された回路基板を収容し、開口部と前記開口部を画成する縁部とが設けられた金属筐体と、
前記開口部を覆うよう、前記縁部に接着された金属蓋と、を備え、
前記縁部及び前記金属蓋の少なくともいずれかに凹部が1つ以上設けられ、当該凹部内に充填された接着剤のうち前記凹部の開口端の領域に位置する部分によって、前記縁部に前記金属蓋が接着されており、
前記縁部は、前記金属蓋の外周と接触する部分を含む第1縁部と、前記金属蓋との接着部分を含む第2縁部とを有する、
センサ。 - 前記凹部は、柱状の穴である、
請求項1に記載のセンサ。 - 前記凹部における前記縁部と前記金属蓋との接着面の総面積が、前記縁部と前記金属蓋の重なる領域の面積の半分以下である、
請求項1または2に記載のセンサ。 - 前記回路基板は、有機ELディスプレイの制御回路を有する、
請求項1から3のいずれか一項に記載のセンサ。 - 前記回路基板は、レーザの制御回路を有する、
請求項1から4のいずれか一項に記載のセンサ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019038686A JP7116923B2 (ja) | 2019-03-04 | 2019-03-04 | センサ |
US17/432,940 US11832499B2 (en) | 2019-03-04 | 2020-02-26 | Sensor |
CN202080013325.7A CN113424285A (zh) | 2019-03-04 | 2020-02-26 | 传感器 |
EP20766614.0A EP3937201A4 (en) | 2019-03-04 | 2020-02-26 | SENSOR |
KR1020217025102A KR102683401B1 (ko) | 2019-03-04 | 2020-02-26 | 센서 |
PCT/JP2020/007689 WO2020179573A1 (ja) | 2019-03-04 | 2020-02-26 | センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019038686A JP7116923B2 (ja) | 2019-03-04 | 2019-03-04 | センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020144992A JP2020144992A (ja) | 2020-09-10 |
JP7116923B2 true JP7116923B2 (ja) | 2022-08-12 |
Family
ID=72338659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019038686A Active JP7116923B2 (ja) | 2019-03-04 | 2019-03-04 | センサ |
Country Status (6)
Country | Link |
---|---|
US (1) | US11832499B2 (ja) |
EP (1) | EP3937201A4 (ja) |
JP (1) | JP7116923B2 (ja) |
KR (1) | KR102683401B1 (ja) |
CN (1) | CN113424285A (ja) |
WO (1) | WO2020179573A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006524910A (ja) | 2003-03-21 | 2006-11-02 | タイコ エレクトロニクス プレテマ ゲゼルシャフト ミット ベシュレンクテル ハフツンク ウント コンパニー ケーゲー | 構造ユニット、及び構造ユニットの製造方法 |
JP2010272561A (ja) | 2009-05-19 | 2010-12-02 | Hitachi Kokusai Electric Inc | 防水構造 |
JP2017157487A (ja) | 2016-03-03 | 2017-09-07 | オムロン株式会社 | センサ機器 |
JP2018152227A (ja) | 2017-03-13 | 2018-09-27 | オムロン株式会社 | センサ機器 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2845400B2 (de) | 1978-10-18 | 1981-04-30 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit reliefartiger Oberfläche |
JPS5597989U (ja) * | 1978-12-28 | 1980-07-08 | ||
JPS6394626U (ja) | 1986-12-12 | 1988-06-18 | ||
JPH04159799A (ja) * | 1990-10-23 | 1992-06-02 | Nec Corp | 混成集積回路 |
US7123440B2 (en) * | 2003-09-29 | 2006-10-17 | Hitachi Global Storage Technologies Netherlands B.V. | Hermetically sealed electronics arrangement and approach |
JP2007035536A (ja) * | 2005-07-29 | 2007-02-08 | Rohm Co Ltd | フラットパネルディスプレイ |
JP4929659B2 (ja) * | 2005-09-26 | 2012-05-09 | 株式会社ジェイテクト | 電子制御装置 |
JP4924143B2 (ja) * | 2007-03-28 | 2012-04-25 | マツダ株式会社 | 金属製ワークの接合方法 |
JP2009246032A (ja) * | 2008-03-28 | 2009-10-22 | Panasonic Corp | 半導体装置 |
JP5005654B2 (ja) * | 2008-10-27 | 2012-08-22 | 株式会社ケーヒン | 電子回路基板の収容ケース |
US8305763B2 (en) * | 2008-10-27 | 2012-11-06 | Keihin Corporation | Housing case for electronic circuit board |
JP5350311B2 (ja) * | 2010-04-01 | 2013-11-27 | 日立オートモティブシステムズ株式会社 | 車載用電子機器 |
KR20160076857A (ko) * | 2014-12-23 | 2016-07-01 | 엘지전자 주식회사 | 이동 단말기 및 그의 컨텐츠 제어방법 |
JP6939344B2 (ja) * | 2017-09-28 | 2021-09-22 | セイコーエプソン株式会社 | 原子発振器およびシステム |
-
2019
- 2019-03-04 JP JP2019038686A patent/JP7116923B2/ja active Active
-
2020
- 2020-02-26 EP EP20766614.0A patent/EP3937201A4/en active Pending
- 2020-02-26 CN CN202080013325.7A patent/CN113424285A/zh active Pending
- 2020-02-26 KR KR1020217025102A patent/KR102683401B1/ko active IP Right Grant
- 2020-02-26 WO PCT/JP2020/007689 patent/WO2020179573A1/ja unknown
- 2020-02-26 US US17/432,940 patent/US11832499B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006524910A (ja) | 2003-03-21 | 2006-11-02 | タイコ エレクトロニクス プレテマ ゲゼルシャフト ミット ベシュレンクテル ハフツンク ウント コンパニー ケーゲー | 構造ユニット、及び構造ユニットの製造方法 |
JP2010272561A (ja) | 2009-05-19 | 2010-12-02 | Hitachi Kokusai Electric Inc | 防水構造 |
JP2017157487A (ja) | 2016-03-03 | 2017-09-07 | オムロン株式会社 | センサ機器 |
JP2018152227A (ja) | 2017-03-13 | 2018-09-27 | オムロン株式会社 | センサ機器 |
Also Published As
Publication number | Publication date |
---|---|
EP3937201A4 (en) | 2022-11-30 |
EP3937201A1 (en) | 2022-01-12 |
KR102683401B1 (ko) | 2024-07-08 |
WO2020179573A1 (ja) | 2020-09-10 |
US20220173175A1 (en) | 2022-06-02 |
JP2020144992A (ja) | 2020-09-10 |
US11832499B2 (en) | 2023-11-28 |
KR20210111835A (ko) | 2021-09-13 |
CN113424285A (zh) | 2021-09-21 |
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