JP6447542B2 - センサ機器およびその製造方法 - Google Patents
センサ機器およびその製造方法 Download PDFInfo
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- JP6447542B2 JP6447542B2 JP2016041599A JP2016041599A JP6447542B2 JP 6447542 B2 JP6447542 B2 JP 6447542B2 JP 2016041599 A JP2016041599 A JP 2016041599A JP 2016041599 A JP2016041599 A JP 2016041599A JP 6447542 B2 JP6447542 B2 JP 6447542B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 238000003466 welding Methods 0.000 claims description 21
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000004308 accommodation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0271—Housings; Attachments or accessories for photometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/26—Seam welding of rectilinear seams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
- B23K33/004—Filling of continuous seams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H35/00—Switches operated by change of a physical condition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/12—Vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Manufacture Of Switches (AREA)
Description
Claims (4)
- 開口部が設けられた本体ケースと、
前記開口部を覆うように前記本体ケースに対して組付けられた本体カバーとを備え、
前記本体カバーは、前記開口部の周縁に位置する部分の前記本体ケースに重なる重なり領域をその外周部に有し、
前記本体カバーの前記重なり領域と、当該重なり領域に重なる部分の前記本体ケースとの境界部のうち、前記本体カバーの端面から内側に距離を隔てた部分に、前記開口部を取り囲むように、前記本体ケースと前記本体カバーとをレーザ溶接で接合する溶接部が設けられることにより、前記本体カバーが、前記本体ケースに対して固定され、
前記開口部の周縁に位置する部分の前記本体ケースに段差部が設けられ、
前記段差部に前記本体カバーが嵌め込まれ、
前記開口部の開口面の法線方向に沿って見た場合に、前記段差部の外形が、前記本体カバーの外形よりも大きい多角形であり、
外形が多角形である前記段差部の隣接する2辺において、前記段差部の端面が、前記本体カバーの端面に当接している、センサ機器。 - 前記溶接部が、さらに、前記本体カバーの前記重なり領域と、当該重なり領域に重なる部分の前記本体ケースとの境界部のうち、前記開口部から外側に距離を隔てた部分に設けられている、請求項1に記載のセンサ機器。
- 本体ケースに設けられた開口部を覆うとともに、前記開口部の周縁に位置する部分の前記本体ケースにその外周部が重なるように、本体カバーを前記本体ケースに対して配置する工程と、
前記開口部の周縁に位置する部分の前記本体ケースに重なる前記本体カバーの重なり領域と、当該重なり領域に重なる部分の前記本体ケースとの境界部のうち、前記本体カバーの端面から内側に距離を隔てた部分に、前記開口部に沿ってレーザ光を走査させつつ照射することにより、前記開口部を取り囲むように、前記本体ケースと前記本体カバーとをレーザ溶接で接合する溶接部を設け、これにより前記本体カバーを前記本体ケースに対して固定する工程とを備え、
前記本体カバーを前記本体ケースに対して配置する工程において、前記開口部の周縁に位置する部分に設けられた前記本体ケースの段差部に、前記本体カバーを嵌め込むとともに、前記開口部の開口面の法線方向に沿って見た場合に、外形が前記本体カバーの外形よりも大きい多角形である前記段差部の隣接する2辺において、前記本体カバーの端面を前記段差部の端面に当接させることにより、前記本体カバーの前記本体ケースに対する位置決めを行なう、センサ機器の製造方法。 - 前記本体カバーを前記本体ケースに対して固定する工程において、前記本体カバーの前記重なり領域と、当該重なり領域に重なる部分の前記本体ケースとの境界部のうち、前記開口部から外側に距離を隔てた部分に、前記レーザ光を走査させつつ照射する、請求項3に記載のセンサ機器の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016041599A JP6447542B2 (ja) | 2016-03-03 | 2016-03-03 | センサ機器およびその製造方法 |
EP16206553.6A EP3213860A1 (en) | 2016-03-03 | 2016-12-23 | Sensor device with body case and cover being laser welded; method of producing a corresponding sensor device |
US15/391,141 US10309826B2 (en) | 2016-03-03 | 2016-12-27 | Sensor device and method of producing the same |
CN201611242212.6A CN107155276B (zh) | 2016-03-03 | 2016-12-28 | 传感设备及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016041599A JP6447542B2 (ja) | 2016-03-03 | 2016-03-03 | センサ機器およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017157486A JP2017157486A (ja) | 2017-09-07 |
JP6447542B2 true JP6447542B2 (ja) | 2019-01-09 |
Family
ID=57590418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016041599A Active JP6447542B2 (ja) | 2016-03-03 | 2016-03-03 | センサ機器およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10309826B2 (ja) |
EP (1) | EP3213860A1 (ja) |
JP (1) | JP6447542B2 (ja) |
CN (1) | CN107155276B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017157760A (ja) * | 2016-03-03 | 2017-09-07 | オムロン株式会社 | 光学電子機器 |
JP6860857B2 (ja) * | 2018-03-15 | 2021-04-21 | オムロン株式会社 | 光電センサ |
JP6991462B2 (ja) | 2018-03-15 | 2022-01-12 | オムロン株式会社 | 小型光電センサ |
EP3715765B1 (en) * | 2019-03-27 | 2021-11-10 | Robert Bosch GmbH | Enclosure for an optoelectronic sensor and lidar sensor |
JP7511815B2 (ja) | 2021-03-11 | 2024-07-08 | オムロン株式会社 | 光センサ |
DE102022109731A1 (de) * | 2022-04-22 | 2023-10-26 | HELLA GmbH & Co. KGaA | Gehäuse für eine Fahrzeugvorrichtung sowie Verfahren zum Herstellen eines Gehäuses |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995026869A1 (de) * | 1994-03-31 | 1995-10-12 | Marquardt Gmbh | Werkstück aus kunststoff und herstellverfahren für ein derartiges werkstück |
US5879416A (en) * | 1995-03-13 | 1999-03-09 | Nippondenso Co., Ltd. | Method of manufacturing battery having polygonal case |
JP2009170133A (ja) * | 2008-01-11 | 2009-07-30 | Omron Corp | センサの生産方法および光電センサ |
JP2011216372A (ja) * | 2010-03-31 | 2011-10-27 | Panasonic Electric Works Sunx Co Ltd | 多光軸光電センサ及び多光軸光電センサの製造方法 |
CN102316689B (zh) | 2011-05-17 | 2014-08-06 | 泰德兴精密电子(昆山)有限公司 | 一种应用于电子产品中上下外壳焊接结构 |
CN102928650A (zh) | 2012-11-22 | 2013-02-13 | 哈尔滨工业大学 | 气密性封装的光学电流传感器 |
-
2016
- 2016-03-03 JP JP2016041599A patent/JP6447542B2/ja active Active
- 2016-12-23 EP EP16206553.6A patent/EP3213860A1/en not_active Withdrawn
- 2016-12-27 US US15/391,141 patent/US10309826B2/en active Active
- 2016-12-28 CN CN201611242212.6A patent/CN107155276B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US10309826B2 (en) | 2019-06-04 |
US20170254698A1 (en) | 2017-09-07 |
EP3213860A1 (en) | 2017-09-06 |
CN107155276B (zh) | 2019-12-27 |
CN107155276A (zh) | 2017-09-12 |
JP2017157486A (ja) | 2017-09-07 |
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