JP7116690B2 - 放熱部材およびその製造方法 - Google Patents

放熱部材およびその製造方法 Download PDF

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Publication number
JP7116690B2
JP7116690B2 JP2019013765A JP2019013765A JP7116690B2 JP 7116690 B2 JP7116690 B2 JP 7116690B2 JP 2019013765 A JP2019013765 A JP 2019013765A JP 2019013765 A JP2019013765 A JP 2019013765A JP 7116690 B2 JP7116690 B2 JP 7116690B2
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Japan
Prior art keywords
heat dissipating
dissipating member
heat
main surface
silicon carbide
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JP2019013765A
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English (en)
Japanese (ja)
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JP2020123639A5 (enExample
JP2020123639A (ja
Inventor
寛朗 太田
大助 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
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Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Priority to JP2019013765A priority Critical patent/JP7116690B2/ja
Priority to US17/425,541 priority patent/US12069837B2/en
Priority to PCT/JP2020/003090 priority patent/WO2020158775A1/ja
Priority to CN202080006007.8A priority patent/CN112997300B/zh
Priority to EP20747772.0A priority patent/EP3920214B1/en
Publication of JP2020123639A publication Critical patent/JP2020123639A/ja
Publication of JP2020123639A5 publication Critical patent/JP2020123639A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
    • B28B3/02—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein a ram exerts pressure on the material in a moulding space; Ram heads of special form
    • B28B3/025—Hot pressing, e.g. of ceramic materials
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
    • C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
    • C04B35/575—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide obtained by pressure sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
    • C04B41/4523—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application applied from the molten state ; Thermal spraying, e.g. plasma spraying
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/515—Other specific metals
    • C04B41/5155—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C04B41/90—Coating or impregnation for obtaining at least two superposed coatings having different compositions at least one coating being a metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3418—Silicon oxide, silicic acids or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3817—Carbides
    • C04B2235/3826—Silicon carbides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Structural Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2019013765A 2019-01-30 2019-01-30 放熱部材およびその製造方法 Active JP7116690B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019013765A JP7116690B2 (ja) 2019-01-30 2019-01-30 放熱部材およびその製造方法
US17/425,541 US12069837B2 (en) 2019-01-30 2020-01-29 Heat dissipation member and method of manufacturing the same
PCT/JP2020/003090 WO2020158775A1 (ja) 2019-01-30 2020-01-29 放熱部材およびその製造方法
CN202080006007.8A CN112997300B (zh) 2019-01-30 2020-01-29 散热构件及其制造方法
EP20747772.0A EP3920214B1 (en) 2019-01-30 2020-01-29 Heat-dissipating member and manufacturing method for same

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Application Number Priority Date Filing Date Title
JP2019013765A JP7116690B2 (ja) 2019-01-30 2019-01-30 放熱部材およびその製造方法

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JP2019105349A Division JP6591114B1 (ja) 2019-06-05 2019-06-05 放熱部材およびその製造方法

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JP2020123639A JP2020123639A (ja) 2020-08-13
JP2020123639A5 JP2020123639A5 (enExample) 2022-03-01
JP7116690B2 true JP7116690B2 (ja) 2022-08-10

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US (1) US12069837B2 (enExample)
EP (1) EP3920214B1 (enExample)
JP (1) JP7116690B2 (enExample)
CN (1) CN112997300B (enExample)
WO (1) WO2020158775A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12306455B2 (en) 2021-10-05 2025-05-20 Raytheon Company Multiaxial thermal dissipation and structurally-compliant device
US12236571B2 (en) 2021-10-05 2025-02-25 Raytheon Company Integrated Dewar assembly with compliant endcap cooling
EP4411810A4 (en) * 2021-10-06 2025-02-12 Denka Company Limited Heat dissipation member
CN114851352B (zh) * 2022-05-23 2023-11-28 松山湖材料实验室 电阻加热元件及其制造方法
CN120752754A (zh) * 2023-02-27 2025-10-03 电化株式会社 陶瓷板、包装体、陶瓷板的制造方法、模块及电气电子产品

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246515A (ja) 2001-02-20 2002-08-30 Mitsubishi Electric Corp 半導体装置
WO2015053316A1 (ja) 2013-10-10 2015-04-16 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板及びその製造方法
WO2018012616A1 (ja) 2016-07-14 2018-01-18 株式会社 東芝 セラミックス回路基板および半導体モジュール
WO2018105297A1 (ja) 2016-12-06 2018-06-14 住友電気工業株式会社 複合部材、放熱部材、半導体装置、及び複合部材の製造方法
WO2018163864A1 (ja) 2017-03-07 2018-09-13 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板
WO2019026836A1 (ja) 2017-08-04 2019-02-07 デンカ株式会社 パワーモジュール
JP6591114B1 (ja) 2019-06-05 2019-10-16 デンカ株式会社 放熱部材およびその製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS468358B1 (enExample) 1967-01-27 1971-03-02
JP3468358B2 (ja) 1998-11-12 2003-11-17 電気化学工業株式会社 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品
JP4267947B2 (ja) * 2003-03-19 2009-05-27 日本碍子株式会社 ハニカム構造体
JP3907620B2 (ja) 2003-11-14 2007-04-18 電気化学工業株式会社 セラミックス回路基板一体型アルミニウム−炭化珪素質複合体及びその製造方法
CN101361184B (zh) 2006-01-13 2011-04-13 电气化学工业株式会社 铝-碳化硅复合体和使用该复合体的散热零件
JP4996600B2 (ja) * 2006-04-26 2012-08-08 電気化学工業株式会社 アルミニウム−炭化珪素質複合体及びそれを用いた放熱部品
JP4864593B2 (ja) 2006-08-08 2012-02-01 電気化学工業株式会社 アルミニウム−炭化珪素質複合体の製造方法
US8092624B2 (en) * 2006-12-07 2012-01-10 Ngk Insulators, Ltd. Bonding material composition and method for manufacturing the same, and joined body and method for manufacturing the same
JP2010227755A (ja) * 2009-03-26 2010-10-14 Ngk Insulators Ltd セラミックハニカム構造体
WO2012071353A1 (en) * 2010-11-22 2012-05-31 Saint-Gobain Ceramics & Plastics, Inc. Infiltrated silicon carbide bodies and methods of making
CN105981162A (zh) 2014-02-03 2016-09-28 电化株式会社 碳化硅质复合体及其制造方法以及使用该复合体的散热零件
WO2016017689A1 (ja) 2014-07-31 2016-02-04 電気化学工業株式会社 アルミニウム‐炭化珪素質複合体及びその製造方法
CN106796920B (zh) 2014-08-06 2019-09-24 电化株式会社 散热部件及其制造方法
JP6646116B2 (ja) 2018-08-09 2020-02-14 株式会社カプコン 映像音声処理プログラム及びゲーム装置
JP7199988B2 (ja) * 2019-02-08 2023-01-06 日本碍子株式会社 ハニカム構造体の製造方法
FR3094039B1 (fr) * 2019-03-21 2021-03-19 Faurecia Systemes Dechappement Organe de chauffage durable pour dispositif de purification des gaz d’échappement d’un véhicule

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246515A (ja) 2001-02-20 2002-08-30 Mitsubishi Electric Corp 半導体装置
WO2015053316A1 (ja) 2013-10-10 2015-04-16 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板及びその製造方法
WO2018012616A1 (ja) 2016-07-14 2018-01-18 株式会社 東芝 セラミックス回路基板および半導体モジュール
WO2018105297A1 (ja) 2016-12-06 2018-06-14 住友電気工業株式会社 複合部材、放熱部材、半導体装置、及び複合部材の製造方法
WO2018163864A1 (ja) 2017-03-07 2018-09-13 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板
WO2019026836A1 (ja) 2017-08-04 2019-02-07 デンカ株式会社 パワーモジュール
JP6591114B1 (ja) 2019-06-05 2019-10-16 デンカ株式会社 放熱部材およびその製造方法

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CN112997300B (zh) 2023-03-24
EP3920214B1 (en) 2024-08-07
US20220369499A1 (en) 2022-11-17
EP3920214A1 (en) 2021-12-08
CN112997300A (zh) 2021-06-18
EP3920214A4 (en) 2022-03-23
US12069837B2 (en) 2024-08-20
JP2020123639A (ja) 2020-08-13
WO2020158775A1 (ja) 2020-08-06

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