JP7110073B2 - 集積回路及びそれを備えた電子回路 - Google Patents
集積回路及びそれを備えた電子回路 Download PDFInfo
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- JP7110073B2 JP7110073B2 JP2018220601A JP2018220601A JP7110073B2 JP 7110073 B2 JP7110073 B2 JP 7110073B2 JP 2018220601 A JP2018220601 A JP 2018220601A JP 2018220601 A JP2018220601 A JP 2018220601A JP 7110073 B2 JP7110073 B2 JP 7110073B2
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Description
[第1の実施形態]
図1は、第1の実施形態に係る電子回路の模式図である。電子回路1は、集積回路2と、回路基板3とを有する。
第2の実施形態を説明する。図7は、第2の実施形態の電子回路の模式図である。第2の実施形態の電子回路1では、第2のグランドピン263と隣接していた第1のグランドピン262が削除されている。また、第2のグランドピン263は、抵抗Rを介してグランドプレーン32に接続されている。
図9は、第3の実施形態に係る電子回路の模式図である。ここで、図9において、図1と共通の構成については、図1と同様の参照符号を付すことで適宜に説明を省略する。
Claims (9)
- 集積回路であって、
内部回路と、前記内部回路に接続された複数のパッドとを有するチップと、
前記複数のパッドのうちの第1のパッドに接続されるとともに、前記集積回路の外部に設けられた電源に接続される第1のピンと、
前記複数のパッドのうちの第2のパッドに接続されるとともに、前記集積回路の外部に設けられたグランドと接続される第2のピンと、
前記複数のパッドのうちの第3のパッドを介して前記集積回路の内部で前記第2のピンに接続されるとともに、前記集積回路の外部で前記第2のピンと絶縁された第3のピンと、
を具備する集積回路。 - 前記第2のピンと、前記第3のピンとは隣接して配置されている請求項1に記載の集積回路。
- 前記第1のピンと前記第3のピンとの間には、コンデンサが接続される請求項1に記載の集積回路。
- 前記第1のパッドと前記第1のピン、前記第2のパッドと前記第2のピン、前記第3のパッドと前記第3のピンは、それぞれ、ボンディングワイヤを介して接続されている請求項1に記載の集積回路。
- 集積回路であって、
内部回路と、前記内部回路に接続された複数のパッドとを有するチップと、
前記複数のパッドのうちの第1のパッドに接続されるとともに、前記集積回路の外部に設けられた電源に接続される第1のピンと、
前記チップが搭載され、前記複数のパッドのうちの第2のパッドに接続される金属部分を有する板と、
前記金属部分に接続されるとともに、前記集積回路の外部に設けられたグランドに接続される第2のピンと、
前記複数のパッドのうちの第3のパッドを介して前記集積回路の内部で前記第2のパッドに接続されるとともに、前記集積回路の外部で前記第2のピンと絶縁された第3のピンと、
を具備する集積回路。 - 集積回路であって、
内部回路と、前記内部回路に接続された複数のパッドとを有するチップと、
前記複数のパッドのうちの第1のパッドに接続されるとともに、前記集積回路の外部に設けられた電源に接続される第1のピンと、
前記複数のパッドのうちの第2のパッドに接続されるとともに、前記集積回路の外部に設けられたグランドと接続される第2のピンと、
前記複数のパッドのうちの第3のパッドに接続される第3のピンと、
を具備する集積回路と、
前記第1のピンに接続される前記電源と、
前記第2のピンに接続される前記グランドと、
前記第1のピンと前記第3のピンとの間に接続されたコンデンサと、
を具備する回路基板と、
を有し、
前記第3のピンは、前記グランドと絶縁されている電子回路。 - 前記第3のピンは、抵抗を介して前記グランドと接続されている請求項6に記載の電子回路。
- 前記抵抗の抵抗値は、0.5Ω以上、10Ω以下である請求項7に記載の電子回路。
- 前記第3のピンは、インダクタを介して前記グランドと接続されている請求項6に記載の電子回路。
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JP2005197401A (ja) | 2004-01-06 | 2005-07-21 | Ricoh Co Ltd | 半導体集積回路装置 |
JP2008028218A (ja) | 2006-07-24 | 2008-02-07 | Murata Mfg Co Ltd | 多層プリント基板 |
US20180287266A1 (en) | 2017-03-31 | 2018-10-04 | Anokiwave, Inc. | Apparatus and Method for RF Isolation in a Packaged Integrated Circuit |
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JP2005197401A (ja) | 2004-01-06 | 2005-07-21 | Ricoh Co Ltd | 半導体集積回路装置 |
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