JP7109068B2 - シクロオレフィンポリマーの接合方法 - Google Patents

シクロオレフィンポリマーの接合方法 Download PDF

Info

Publication number
JP7109068B2
JP7109068B2 JP2018133378A JP2018133378A JP7109068B2 JP 7109068 B2 JP7109068 B2 JP 7109068B2 JP 2018133378 A JP2018133378 A JP 2018133378A JP 2018133378 A JP2018133378 A JP 2018133378A JP 7109068 B2 JP7109068 B2 JP 7109068B2
Authority
JP
Japan
Prior art keywords
joining
plasma
bonding
plate
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018133378A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020011403A5 (https=
JP2020011403A (ja
Inventor
理佐 舩橋
弘和 寺井
泰知 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samco Inc
Original Assignee
Samco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samco Inc filed Critical Samco Inc
Priority to JP2018133378A priority Critical patent/JP7109068B2/ja
Publication of JP2020011403A publication Critical patent/JP2020011403A/ja
Publication of JP2020011403A5 publication Critical patent/JP2020011403A5/ja
Application granted granted Critical
Publication of JP7109068B2 publication Critical patent/JP7109068B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Micromachines (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2018133378A 2018-07-13 2018-07-13 シクロオレフィンポリマーの接合方法 Active JP7109068B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018133378A JP7109068B2 (ja) 2018-07-13 2018-07-13 シクロオレフィンポリマーの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018133378A JP7109068B2 (ja) 2018-07-13 2018-07-13 シクロオレフィンポリマーの接合方法

Publications (3)

Publication Number Publication Date
JP2020011403A JP2020011403A (ja) 2020-01-23
JP2020011403A5 JP2020011403A5 (https=) 2021-04-01
JP7109068B2 true JP7109068B2 (ja) 2022-07-29

Family

ID=69169119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018133378A Active JP7109068B2 (ja) 2018-07-13 2018-07-13 シクロオレフィンポリマーの接合方法

Country Status (1)

Country Link
JP (1) JP7109068B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD960122S1 (en) 2019-12-20 2022-08-09 Amazon Technologies, Inc. Combined wireless speaker and range extender device
USD945979S1 (en) 2019-12-20 2022-03-15 Amazon Technologies, Inc. Wireless speaker
CN115605425B (zh) * 2020-05-29 2025-06-13 日本瑞翁株式会社 微通道芯片及其制造方法
JP7570664B2 (ja) * 2020-07-29 2024-10-22 サムコ株式会社 マイクロ流路チップ生産方法
JPWO2022172898A1 (https=) * 2021-02-10 2022-08-18

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005052967A (ja) 2004-10-15 2005-03-03 Sumitomo Precision Prod Co Ltd エッチング表面の洗浄方法
JP2006178191A (ja) 2004-12-22 2006-07-06 Jsr Corp 偏光フィルムの製造方法および偏光フィルム
WO2007119552A1 (ja) 2006-03-29 2007-10-25 Zeon Corporation 樹脂複合成形体の製造方法
JP2014024340A (ja) 2013-09-11 2014-02-06 Nitto Denko Corp 積層体の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019210A (en) * 1989-04-03 1991-05-28 International Business Machines Corporation Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment
JPH07294861A (ja) * 1994-04-21 1995-11-10 Sumitomo Electric Ind Ltd 酸化物誘電体薄膜およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005052967A (ja) 2004-10-15 2005-03-03 Sumitomo Precision Prod Co Ltd エッチング表面の洗浄方法
JP2006178191A (ja) 2004-12-22 2006-07-06 Jsr Corp 偏光フィルムの製造方法および偏光フィルム
WO2007119552A1 (ja) 2006-03-29 2007-10-25 Zeon Corporation 樹脂複合成形体の製造方法
JP2014024340A (ja) 2013-09-11 2014-02-06 Nitto Denko Corp 積層体の製造方法

Also Published As

Publication number Publication date
JP2020011403A (ja) 2020-01-23

Similar Documents

Publication Publication Date Title
JP7109068B2 (ja) シクロオレフィンポリマーの接合方法
KR102391938B1 (ko) 시클로올레핀 폴리머의 접합 방법
US9004135B2 (en) Method and apparatus for bonding together two wafers by molecular adhesion
JP6394651B2 (ja) 基板の貼り合わせ方法およびマイクロチップの製造方法
US20030175162A1 (en) Microdevice having multilayer structure and method for fabricating the same
US8475671B2 (en) Method for local etching of the surface of a substrate
CN101726815A (zh) 光学元件及光学元件的制造方法
US7238246B2 (en) Process for the flush connection of bodies
WO2018180508A1 (ja) マイクロ流路チップの製造方法
WO2019187275A1 (ja) 流体デバイス用複合部材およびその製造方法
Kettner et al. New results on plasma activated bonding of imprinted polymer features for bio MEMS applications
US10286640B2 (en) Process for laminating works together
JP7089790B2 (ja) シクロオレフィンポリマーと金属の接合方法、およびバイオセンサの製造方法
WO2016060080A1 (ja) ワークの貼り合わせ方法
JP2022077276A (ja) 流路デバイスの製造方法
JP2020011305A (ja) マイクロ流路チップ製造方法
JP7570664B2 (ja) マイクロ流路チップ生産方法
JP2022190586A (ja) Ｃｏｐ板の接合方法及びｃｏｐ製マイクロ流路チップ生産方法
JP7144833B2 (ja) マイクロ流路チップ製造方法
JP4009683B2 (ja) 分析用具の製造方法
TWI275487B (en) Adhesiveless bonding method for plastic substrates
JP7439515B2 (ja) 樹脂接合体の製造方法
JP2021016944A (ja) 水プラズマによる透明樹脂の接合方法
JP7301576B2 (ja) 流体デバイス用部材およびその製造方法
JP2010215931A (ja) 成膜方法および成膜治具

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210212

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210212

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220125

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220208

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220411

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220426

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220705

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220711

R150 Certificate of patent or registration of utility model

Ref document number: 7109068

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250