JP2020011403A5 - - Google Patents
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- JP2020011403A5 JP2020011403A5 JP2018133378A JP2018133378A JP2020011403A5 JP 2020011403 A5 JP2020011403 A5 JP 2020011403A5 JP 2018133378 A JP2018133378 A JP 2018133378A JP 2018133378 A JP2018133378 A JP 2018133378A JP 2020011403 A5 JP2020011403 A5 JP 2020011403A5
- Authority
- JP
- Japan
- Prior art keywords
- plate
- weight
- mass
- joint surface
- joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018133378A JP7109068B2 (ja) | 2018-07-13 | 2018-07-13 | シクロオレフィンポリマーの接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018133378A JP7109068B2 (ja) | 2018-07-13 | 2018-07-13 | シクロオレフィンポリマーの接合方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020011403A JP2020011403A (ja) | 2020-01-23 |
| JP2020011403A5 true JP2020011403A5 (https=) | 2021-04-01 |
| JP7109068B2 JP7109068B2 (ja) | 2022-07-29 |
Family
ID=69169119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018133378A Active JP7109068B2 (ja) | 2018-07-13 | 2018-07-13 | シクロオレフィンポリマーの接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7109068B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD960122S1 (en) | 2019-12-20 | 2022-08-09 | Amazon Technologies, Inc. | Combined wireless speaker and range extender device |
| USD945979S1 (en) | 2019-12-20 | 2022-03-15 | Amazon Technologies, Inc. | Wireless speaker |
| CN115605425B (zh) * | 2020-05-29 | 2025-06-13 | 日本瑞翁株式会社 | 微通道芯片及其制造方法 |
| JP7570664B2 (ja) * | 2020-07-29 | 2024-10-22 | サムコ株式会社 | マイクロ流路チップ生産方法 |
| JPWO2022172898A1 (https=) * | 2021-02-10 | 2022-08-18 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5019210A (en) * | 1989-04-03 | 1991-05-28 | International Business Machines Corporation | Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment |
| JPH07294861A (ja) * | 1994-04-21 | 1995-11-10 | Sumitomo Electric Ind Ltd | 酸化物誘電体薄膜およびその製造方法 |
| JP2005052967A (ja) | 2004-10-15 | 2005-03-03 | Sumitomo Precision Prod Co Ltd | エッチング表面の洗浄方法 |
| JP2006178191A (ja) | 2004-12-22 | 2006-07-06 | Jsr Corp | 偏光フィルムの製造方法および偏光フィルム |
| EP2000496B1 (en) | 2006-03-29 | 2018-08-15 | Zeon Corporation | Process for production of resin composite molded article |
| JP2014024340A (ja) | 2013-09-11 | 2014-02-06 | Nitto Denko Corp | 積層体の製造方法 |
-
2018
- 2018-07-13 JP JP2018133378A patent/JP7109068B2/ja active Active
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