JP7107451B2 - Polyimide film and its manufacturing method - Google Patents
Polyimide film and its manufacturing method Download PDFInfo
- Publication number
- JP7107451B2 JP7107451B2 JP2021559596A JP2021559596A JP7107451B2 JP 7107451 B2 JP7107451 B2 JP 7107451B2 JP 2021559596 A JP2021559596 A JP 2021559596A JP 2021559596 A JP2021559596 A JP 2021559596A JP 7107451 B2 JP7107451 B2 JP 7107451B2
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- Prior art keywords
- layer
- polyimide
- film
- mass
- coating film
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- 229920001721 polyimide Polymers 0.000 title claims description 245
- 238000004519 manufacturing process Methods 0.000 title claims description 63
- 239000004642 Polyimide Substances 0.000 claims description 183
- -1 tetracarboxylic anhydride Chemical class 0.000 claims description 69
- 238000000576 coating method Methods 0.000 claims description 66
- 239000011248 coating agent Substances 0.000 claims description 63
- 150000004985 diamines Chemical class 0.000 claims description 57
- 230000007704 transition Effects 0.000 claims description 49
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000002243 precursor Substances 0.000 claims description 32
- 239000000126 substance Substances 0.000 claims description 27
- 238000002834 transmittance Methods 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 23
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 23
- 239000013557 residual solvent Substances 0.000 claims description 22
- 238000012643 polycondensation polymerization Methods 0.000 claims description 16
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 14
- 229910052717 sulfur Inorganic materials 0.000 claims description 8
- 125000004434 sulfur atom Chemical group 0.000 claims description 8
- 101150055324 aba1 gene Proteins 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 250
- 239000000243 solution Substances 0.000 description 121
- 229920005575 poly(amic acid) Polymers 0.000 description 58
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 33
- 239000000314 lubricant Substances 0.000 description 27
- 238000006243 chemical reaction Methods 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 21
- 239000007787 solid Substances 0.000 description 16
- 238000001035 drying Methods 0.000 description 15
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 14
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 13
- 239000002253 acid Substances 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 12
- 238000003756 stirring Methods 0.000 description 11
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 230000000704 physical effect Effects 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000000945 filler Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 238000010992 reflux Methods 0.000 description 7
- WVOLTBSCXRRQFR-SJORKVTESA-N Cannabidiolic acid Natural products OC1=C(C(O)=O)C(CCCCC)=CC(O)=C1[C@@H]1[C@@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-SJORKVTESA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- WVOLTBSCXRRQFR-DLBZAZTESA-M cannabidiolate Chemical compound OC1=C(C([O-])=O)C(CCCCC)=CC(O)=C1[C@H]1[C@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-DLBZAZTESA-M 0.000 description 6
- 230000001143 conditioned effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000001273 butane Substances 0.000 description 5
- 239000008119 colloidal silica Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 5
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 5
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 4
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 3
- LACZRKUWKHQVKS-UHFFFAOYSA-N 4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenoxy]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F LACZRKUWKHQVKS-UHFFFAOYSA-N 0.000 description 3
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 3
- BDWOQDZGSYLSCZ-UHFFFAOYSA-N [1,3]oxazolo[4,5-f][1,3]benzoxazole Chemical compound C1=C2OC=NC2=CC2=C1OC=N2 BDWOQDZGSYLSCZ-UHFFFAOYSA-N 0.000 description 3
- PMJNNCUVWHTTMV-UHFFFAOYSA-N [1,3]oxazolo[5,4-f][1,3]benzoxazole Chemical compound C1=C2OC=NC2=CC2=C1N=CO2 PMJNNCUVWHTTMV-UHFFFAOYSA-N 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 2
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 2
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 2
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 2
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 2
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 2
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- ZPAKUZKMGJJMAA-UHFFFAOYSA-N Cyclohexane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)CC1C(O)=O ZPAKUZKMGJJMAA-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 230000001050 lubricating effect Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- STIUJDCDGZSXGO-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=C1 STIUJDCDGZSXGO-UHFFFAOYSA-N 0.000 description 1
- GSHMRKDZYYLPNZ-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)C=C1OC1=CC=CC=C1 GSHMRKDZYYLPNZ-UHFFFAOYSA-N 0.000 description 1
- PHPTWVBSQRENOR-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C(C=C1N)=CC=C1OC1=CC=CC=C1 PHPTWVBSQRENOR-UHFFFAOYSA-N 0.000 description 1
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- HFAMSBMTCKNPRG-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)=C1 HFAMSBMTCKNPRG-UHFFFAOYSA-N 0.000 description 1
- NILYJZJYFZUPPO-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C(OC=2C=CC=CC=2)=C1 NILYJZJYFZUPPO-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- BEBVJSBFUZVWMS-UHFFFAOYSA-N 2-(2-methylpropyl)cyclohexane-1,4-diamine Chemical compound CC(C)CC1CC(N)CCC1N BEBVJSBFUZVWMS-UHFFFAOYSA-N 0.000 description 1
- IKSUMZCUHPMCQV-UHFFFAOYSA-N 2-(3-aminophenyl)-1,3-benzoxazol-5-amine Chemical compound NC1=CC=CC(C=2OC3=CC=C(N)C=C3N=2)=C1 IKSUMZCUHPMCQV-UHFFFAOYSA-N 0.000 description 1
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- VQXJDOIQDHMFPQ-UHFFFAOYSA-N [4-(4-amino-3-phenoxybenzoyl)phenyl]-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=CC(=CC=2)C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)C=C1OC1=CC=CC=C1 VQXJDOIQDHMFPQ-UHFFFAOYSA-N 0.000 description 1
- JAGJCSPSIXPCAK-UHFFFAOYSA-N [4-[4-(3-aminophenoxy)benzoyl]phenyl]-[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 JAGJCSPSIXPCAK-UHFFFAOYSA-N 0.000 description 1
- JZFJDKQWTNQXPN-UHFFFAOYSA-N [6'-(4-aminobenzoyl)oxyspiro[fluorene-9,9'-xanthene]-3'-yl] 4-aminobenzoate Chemical compound C1=CC=C2C(=C1)C3=CC=CC=C3C24C5=C(C=C(C=C5)OC(=O)C6=CC=C(C=C6)N)OC7=C4C=CC(=C7)OC(=O)C8=CC=C(C=C8)N JZFJDKQWTNQXPN-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229960000643 adenine Drugs 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- ZIXLDMFVRPABBX-UHFFFAOYSA-N alpha-methylcyclopentanone Natural products CC1CCCC1=O ZIXLDMFVRPABBX-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- CJYIPJMCGHGFNN-UHFFFAOYSA-N bicyclo[2.2.1]heptane-2,3,5,6-tetracarboxylic acid Chemical compound C1C2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O CJYIPJMCGHGFNN-UHFFFAOYSA-N 0.000 description 1
- BKDVBBSUAGJUBA-UHFFFAOYSA-N bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic acid Chemical class C1=CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O BKDVBBSUAGJUBA-UHFFFAOYSA-N 0.000 description 1
- XQBSPQLKNWMPMG-UHFFFAOYSA-N bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic acid Chemical compound C1CC2C(C(O)=O)C(C(=O)O)C1C(C(O)=O)C2C(O)=O XQBSPQLKNWMPMG-UHFFFAOYSA-N 0.000 description 1
- JMHUKWKCCHMXEL-UHFFFAOYSA-N bis(1,3-dioxo-2-benzofuran-5-yl) benzene-1,4-dicarboxylate Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC(=O)C2=CC=C(C=C2)C(OC=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 JMHUKWKCCHMXEL-UHFFFAOYSA-N 0.000 description 1
- SONDVQSYBUQGDH-UHFFFAOYSA-N bis(3-amino-4-phenoxyphenyl)methanone Chemical compound NC1=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=CC=C1OC1=CC=CC=C1 SONDVQSYBUQGDH-UHFFFAOYSA-N 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- LRSFHOCOLGECMQ-UHFFFAOYSA-N bis(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)C=C1OC1=CC=CC=C1 LRSFHOCOLGECMQ-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- BBRLKRNNIMVXOD-UHFFFAOYSA-N bis[4-(3-aminophenoxy)phenyl]methanone Chemical compound NC1=CC=CC(OC=2C=CC(=CC=2)C(=O)C=2C=CC(OC=3C=C(N)C=CC=3)=CC=2)=C1 BBRLKRNNIMVXOD-UHFFFAOYSA-N 0.000 description 1
- LSDYQEILXDCDTR-UHFFFAOYSA-N bis[4-(4-aminophenoxy)phenyl]methanone Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 LSDYQEILXDCDTR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- JUNWLZAGQLJVLR-UHFFFAOYSA-J calcium diphosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])(=O)OP([O-])([O-])=O JUNWLZAGQLJVLR-UHFFFAOYSA-J 0.000 description 1
- FUFJGUQYACFECW-UHFFFAOYSA-L calcium hydrogenphosphate Chemical compound [Ca+2].OP([O-])([O-])=O FUFJGUQYACFECW-UHFFFAOYSA-L 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 229940043256 calcium pyrophosphate Drugs 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 239000013310 covalent-organic framework Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- SMEJCQZFRMVYGC-UHFFFAOYSA-N cyclohexane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C(C(O)=O)C1C(O)=O SMEJCQZFRMVYGC-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 235000019821 dicalcium diphosphate Nutrition 0.000 description 1
- 235000019700 dicalcium phosphate Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- OMGMPQSKRWSUHO-UHFFFAOYSA-N naphthalene-1,2,5-tricarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OMGMPQSKRWSUHO-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
本発明は、無色であり、かつ低い線膨張係数と良好な機械特性を有するポリイミドフィルム、およびその製造方法に関する。 TECHNICAL FIELD The present invention relates to a colorless polyimide film having a low coefficient of linear expansion and good mechanical properties, and a method for producing the same.
ポリイミドフィルムは優れた耐熱性、良好な機械特性を有し、なおかつフレキシブルな素材として電気および電子分野にて広く使用されている。しかしながら、一般のポリイミドフィルムは黄褐色に着色しているため、表示装置などの光透過が必要な部分に適用することはできない。
一方で表示装置は薄型化、軽量化が進み、さらにフレキシブル化が求められてきている。そのため基板材料をガラス基板からフレキシブルな高分子フィルム基板に代えようという試みが進められているが、着色しているポリイミドフィルムは、光線透過をON/OFFすることによって表示を行う液晶ディスプレイの基板材料としては使用できず、表示装置の駆動回路が搭載されるTAB,COFなどの周辺回路や、反射型表示方式ないし自発光型表示装置における背面側など、ごく一部にしか適用することができない。Polyimide films have excellent heat resistance, good mechanical properties, and are widely used in the electrical and electronic fields as flexible materials. However, since a general polyimide film is colored yellowish brown, it cannot be applied to parts such as display devices that require light transmission.
On the other hand, display devices are becoming thinner and lighter, and are required to be more flexible. Attempts have therefore been made to replace glass substrates with flexible polymer film substrates, but colored polyimide films are used as substrate materials for liquid crystal displays that display images by turning light transmission on and off. Therefore, it can be applied only to a small part, such as peripheral circuits such as TABs and COFs on which drive circuits of display devices are mounted, and the rear side of reflective display systems or self-luminous display devices.
かかる背景から、無色透明のポリイミドフィルムの開発が進められている。代表的な例としてフッ素化ポリイミド樹脂や半脂環型もしくは全脂環型ポリイミド樹脂などを用いた無色透明ポリイミドフィルムを開発する試みがある(特許文献1~3)。これらのフィルムは着色が少なく、かつ透明性を有しているが、着色しているポリイミドフィルムほどには機械特性があがらず、また工業的生産、ならびに高温に暴露される用途を想定した場合、熱分解ないし酸化反応などが生じるため必ずしも無色性、透明性を保持できるとは限らない。この観点より、酸素含有量を規定した気体を噴きつけながら加熱処理する方法が提案されているが(特許文献4)、酸素濃度18%未満となる環境ではその製造コストが高く、工業的生産は極めて困難である。 Against this background, colorless and transparent polyimide films have been developed. Typical examples include attempts to develop colorless and transparent polyimide films using fluorinated polyimide resins, semi-alicyclic or fully alicyclic polyimide resins, and the like (Patent Documents 1 to 3). These films are less colored and have transparency, but their mechanical properties are not as good as colored polyimide films. Colorlessness and transparency cannot always be maintained due to thermal decomposition or oxidation reaction. From this point of view, a method of heat treatment while blowing a gas with a specified oxygen content has been proposed (Patent Document 4), but the production cost is high in an environment where the oxygen concentration is less than 18%, and industrial production is not possible. Extremely difficult.
すなわち耐熱性、機械特性などの実用特性と、無色透明性はトレードオフの関係にあり、すべてを満足させる無色の透明ポリイミドフィルムを製造することは非常に困難であった。本発明は、機械特性および無色透明性に優れるポリイミドフィルムを提供することを課題とする。 In other words, practical properties such as heat resistance and mechanical properties are in a trade-off relationship with colorless transparency, and it has been very difficult to produce a colorless transparent polyimide film that satisfies all requirements. An object of the present invention is to provide a polyimide film having excellent mechanical properties and colorless transparency.
本発明者らは、複数のポリイミド樹脂を組み合わせることでバランスの取れたポリイミドフィルムの実現を試みた。一般に複数成分の樹脂を組み合わせて配合、ブレンド、あるいは共重合した場合には、必ずしもそれぞれの成分の良い点のみが組み合わされた結果を得ることができるとは限らず、むしろ欠点が相乗されて発現するケースが少なくない。しかしながら本発明者らは鋭意研究を続けた結果、特定の構造を形成するようにポリイミド樹脂を組み合わせてフィルム化することで、それぞれの成分の長所を十分に引き出すことができることを見出し本発明に到達した。 The present inventors attempted to realize a well-balanced polyimide film by combining a plurality of polyimide resins. In general, when compounding, blending, or copolymerizing multiple component resins, it is not always possible to obtain the result of combining only the good points of each component, rather, the drawbacks are synergistic and appear. There are quite a few cases where However, as a result of continuing intensive research, the present inventors have found that by forming a film by combining polyimide resins so as to form a specific structure, the advantages of each component can be sufficiently brought out, and the present invention has been achieved. did.
すなわち本発明は以下の構成である。
[1] 組成が異なる少なくとも2種のポリイミド層が厚さ方向に積層された多層ポリイミド層と、
前記多層ポリイミド層を構成する(a)層と前記(a)層に隣り合う(b)層との間に存在し、化学組成が傾斜をもって変化する遷移層と
を有し、
前記遷移層の厚さは、下限がフィルム総厚さの3%、または1μmのいずれかであり、上限がフィルム総厚さの10%、または3μmのいずれかであり、
フィルム全体の厚さ3がμm以上120μm以下であり、
フィルム全体のイエローインデックスが5以下であり、
フィルム全体の全光線透過率が86%以上である
ことを特徴とする多層ポリイミドフィルム。
[2] 前記(a)層は、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが10以下であり、全光線透過率が85%以上であるポリイミドから主として構成され、
前記(b)層は、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが5以下であり、全光線透過率が90%以上であるポリイミドから主として構成されている
ことを特徴とする、[1]に記載の多層ポリイミドフィルム。
[3] 前記(a)層は、前記(b)層の一方の面側と他方の面側の両方に存在し、
前記遷移層は、前記(b)層の一方の面側の(a)層と前記(b)層との間、及び、前記(b)層の他方の面側の(a)層と前記(b)層との間に存在し、
前記(a)層、前記遷移層、前記(b)層、前記遷移層、前記(a)層の順に積層された層構成を有している
ことを特徴とする、[1]または[2]に記載の多層ポリイミドフィルム。
[4] 前記(a)層のポリイミドが、
脂環族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、分子内にアミド結合を有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、
または
脂環族テトラカルボン酸無水物を30質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、
であることを特徴とする[1]~[3]のいずれかに記載の多層ポリイミドフィルム。
[5] 前記(b)層のポリイミドが、
芳香族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、分子内にイオウ原子を有するジアミンを70質量%以上含有するジアミンから得られる化学構造からなるポリイミド、
または
トリフルオロメチル基を分子内に含有するテトラカルボン酸を70質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、
であることを特徴とする[1]~[4]のいずれかに記載の多層ポリイミドフィルム。
[6]1:(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を仮支持体に塗布し、塗膜a1を得る工程、
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:全層を加熱し、全層基準の残溶剤量が0.5質量%以下である積層体を得る工程、
を少なくとも含む[1]、[2]、[4]または[5]に記載の多層ポリイミドフィルムの製造方法。
[7]1:(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を仮支持体に塗布し、塗膜a1を得る工程、
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:全層を加熱し、全層基準の残溶剤量が5質量%以上40質量%である積層体を得た後、仮支持体から剥離し、自己支持性のあるフィルムを得る工程、
5:前記自己支持性のあるフィルムの両端を把持し、さらに全層基準の残溶剤量が0.5質量%以下であるフィルムを得る工程、
を少なくとも含む[1]、[2]、[4]または[5]に記載の多層ポリイミドフィルムの製造方法。
[8]1:(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を仮支持体上に塗布し、塗膜a1を得る工程、
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:塗膜ab1作製後100秒以内に、(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜ab1に塗布し、塗膜aba1を得る工程、
4:全層を加熱し、全層基準の残溶剤量が0.5質量%以下である積層体を得る工程、
を少なくとも含む[1]~[5]のいずれかに記載の多層ポリイミドフィルムの製造方法。
[9]1:(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を仮支持体に塗布し、塗膜a1を得る工程、
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:塗膜ab1作製後100秒以内に、(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜ab1に塗布し、塗膜aba1を得る工程、
4:全層を加熱し、全層基準の残溶剤量が8質量%以上40質量%である積層体を得た後、仮支持体から剥離し、自己支持性のあるフィルムを得る工程、
5:前記自己支持性のあるフィルムの両端を把持し、さらに全層基準の残溶剤量が0.5質量%以下であるフィルムを得る工程、
を少なくとも含む[1]~[5]のいずれかに記載の多層ポリイミドフィルムの製造方法。That is, the present invention has the following configurations.
[1] A multilayer polyimide layer in which at least two polyimide layers having different compositions are laminated in the thickness direction,
A transition layer that exists between the (a) layer constituting the multilayer polyimide layer and the (b) layer adjacent to the (a) layer and whose chemical composition changes with a gradient,
the thickness of the transition layer has a lower limit of either 3% of the total film thickness or 1 μm and an upper limit of either 10% of the total film thickness or 3 μm;
The thickness 3 of the entire film is μm or more and 120 μm or less,
The yellow index of the entire film is 5 or less,
A multilayer polyimide film having a total light transmittance of 86% or more.
[2] The layer (a) is mainly composed of a polyimide having a yellow index of 10 or less and a total light transmittance of 85% or more when made into a film having a thickness of 25±2 μm by itself,
The layer (b) is mainly composed of polyimide having a yellow index of 5 or less and a total light transmittance of 90% or more when made into a film having a thickness of 25±2 μm by itself. , the multilayer polyimide film according to [1].
[3] The layer (a) is present on both one side and the other side of the layer (b),
The transition layer is provided between the (a) layer and the (b) layer on one side of the (b) layer, and between the (a) layer and the (b) layer on the other side of the (b) layer. b) present between the layers,
[1] or [2], characterized by having a layer structure in which the (a) layer, the transition layer, the (b) layer, the transition layer, and the (a) layer are laminated in this order. The multilayer polyimide film according to .
[4] The polyimide of the layer (a) is
A polyimide having a chemical structure obtained by condensation polymerization of a tetracarboxylic anhydride containing 70% by mass or more of an alicyclic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having an amide bond in the molecule. ,
Or a chemical structure obtained by condensation polymerization of a tetracarboxylic anhydride containing 30% by mass or more of an alicyclic tetracarboxylic anhydride and a diamine containing 70% by mass or more of a diamine having a trifluoromethyl group in the molecule polyimide, consisting of
The multilayer polyimide film according to any one of [1] to [3], characterized in that:
[5] The polyimide of the layer (b) is
A polyimide having a chemical structure obtained from a tetracarboxylic anhydride containing 70% by mass or more of an aromatic tetracarboxylic anhydride and a diamine containing 70% by mass or more of a diamine having a sulfur atom in the molecule;
or condensation polymerization of a tetracarboxylic acid anhydride containing 70% by mass or more of a tetracarboxylic acid containing a trifluoromethyl group in the molecule and a diamine containing 70% by weight or more of a diamine having a trifluoromethyl group in the molecule A polyimide consisting of a chemical structure obtained by
The multilayer polyimide film according to any one of [1] to [4], characterized in that:
[6] 1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to [1], [2], [4] or [5].
[7] 1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: After heating all layers to obtain a laminate having a residual solvent amount of 5% by mass or more and 40% by mass based on all layers, peeling from the temporary support to obtain a self-supporting film;
5: A step of holding both ends of the self-supporting film and further obtaining a film having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to [1], [2], [4] or [5].
[8] 1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution onto a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: Within 100 seconds after the coating film ab1 is produced, (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to any one of [1] to [5].
[9] 1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: Within 100 seconds after the coating film ab1 is produced, (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4: After heating all layers to obtain a laminate having a residual solvent amount of 8% by mass or more and 40% by mass based on all layers, peeling from the temporary support to obtain a self-supporting film;
5: A step of holding both ends of the self-supporting film and further obtaining a film having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to any one of [1] to [5].
本発明ではさらに以下の構成を含んでも良い。
[10] 前記[6]における1と2を繰り返して5層以上の奇数層とすることを特徴とする多層ポリイミドフィルムの製造方法。
[11] (a)層の厚さがフィルム総厚さの34%以下であることを特徴とする[1]~[5]に記載の多層ポリイミドフィルム。ただし(a)層が複数ある場合には(a)層の厚さの総計がフィルム総厚さの1%以上、好ましくは2%以上、さらに好ましくは4%以上であり、25%以下、好ましくは13%以下、さらに好ましくは7%以下であることを特徴とする[1]~[5]に記載の多層ポリイミドフィルム。The present invention may further include the following configurations.
[10] A method for producing a multilayer polyimide film, wherein 1 and 2 in the above [6] are repeated to form 5 or more odd-numbered layers.
[11] The multilayer polyimide film of [1] to [5], wherein the thickness of the layer (a) is 34% or less of the total thickness of the film. However, when there are multiple layers (a), the total thickness of the layers (a) is 1% or more, preferably 2% or more, more preferably 4% or more, and preferably 25% or less, of the total thickness of the film. is 13% or less, more preferably 7% or less, the multilayer polyimide film according to [1] to [5].
本発明は、フィルムを異なる組成からなる複数の層で構成することにより、光学特性(無色透明性)に優れ、さらにフレキシブルなフィルムとして十分なハンドリング性が得られる機械特性を備えた耐熱フィルムを実現するものである。 The present invention realizes a heat-resistant film with excellent optical properties (colorless transparency) and mechanical properties that provide sufficient handling properties as a flexible film by forming the film from multiple layers of different compositions. It is something to do.
本発明における(a)層のポリイミドは、好ましくは、脂環族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、分子内にアミド結合を有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、または脂環族テトラカルボン酸無水物を30質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミドであり、かかるポリイミドは良好な機械特性、高い破断伸度を有し、かつ低いCTEを示す優れた特性を有するが、比較的着色しやすい。
一方の(b)層のポリイミドは、好ましくは、芳香族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、分子内にイオウ原子を有するジアミンを70質量%以上含有するジアミンから得られる化学構造からなるポリイミド、または、トリフルオロメチル基を分子内に含有するテトラカルボン酸を70質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、であり高い無色透明性を有しているが、樹脂としては硬脆く、フィルム化した際に十分な破断伸度を出すことが難しいため、フレキシブルな用途への適性が必ずしも良いとは言えず、さらに連続フィルムとして生産することも困難である。
両者をブレンド、ないし共重合すると、双方の中間、またはそれ以下の物性のフィルムしか得ることができず、さらに無色透明性についても、着色しやすい(a)層の特性に引っ張られる傾向がある。The polyimide of the (a) layer in the present invention preferably contains 70% by mass or more of a tetracarboxylic anhydride containing 70% by mass or more of an alicyclic tetracarboxylic anhydride and 70% by mass or more of a diamine having an amide bond in the molecule. A polyimide having a chemical structure obtained by condensation polymerization with a diamine, or a tetracarboxylic anhydride containing 30% by mass or more of an alicyclic tetracarboxylic anhydride and a diamine having a trifluoromethyl group in the molecule at 70 It is a polyimide having a chemical structure obtained by condensation polymerization with a diamine containing more than 1% by mass, and such polyimide has excellent mechanical properties, high elongation at break, and low CTE. easy to color.
The polyimide of one (b) layer is preferably a tetracarboxylic anhydride containing 70% by mass or more of an aromatic tetracarboxylic anhydride and a diamine containing 70% by mass or more of a diamine having a sulfur atom in the molecule. or a tetracarboxylic anhydride containing 70% by mass or more of a tetracarboxylic acid containing a trifluoromethyl group in the molecule, and a diamine having a trifluoromethyl group in the molecule 70 It is a polyimide having a chemical structure obtained by condensation polymerization with a diamine containing more than 10% by mass, and has high colorless transparency. It is not always suitable for flexible applications because it is difficult to process, and it is also difficult to produce as a continuous film.
When the two are blended or copolymerized, it is possible to obtain a film having physical properties intermediate or lower than those of the two, and the colorless transparency tends to be influenced by the properties of the (a) layer, which is easily colored.
しかしながら、本発明のように、これら2成分のポリイミドを、それぞれ独立の層として形成することで機能分担を行い、さらに特定の製造方法を適用することにより、バランスの取れた、すなわち無色透明性と実用上十分なフィルム強度、高い破断伸度、低い線膨張係数を有するフィルムを得ることができる。
ポリイミドフィルムはポリイミド溶液ないしポリイミド前駆体の溶液を支持体に塗布し、乾燥させ、必要に応じて化学反応を行わせて得られるが、本発明では複数の成分の溶液を、短時間の時間差、最も好ましくは同時に塗布する製造方法を用いることが特徴となる。かかる塗布方法によれば、異なる成分が接する面において限定された厚さ領域に、拡散ないし流動による物質移動が生じ、組成が傾斜した遷移層が形成される。かかる遷移層が物性の異なる層と層の間に生じる応力などのミスマッチを緩衝するため、特定部位に内部ひずみが集中することなくバランスの良いフィルムを得ることができる。However, as in the present invention, these two-component polyimides are formed as independent layers to divide the functions, and by applying a specific manufacturing method, a well-balanced colorless transparency and transparency can be obtained. A film having practically sufficient film strength, high elongation at break, and low coefficient of linear expansion can be obtained.
A polyimide film can be obtained by applying a polyimide solution or a solution of a polyimide precursor to a support, drying it, and optionally chemically reacting it. Most preferably, it is characterized by using a manufacturing method of simultaneous coating. According to such a coating method, mass transfer by diffusion or flow occurs in a limited thickness region on the surface where different components come into contact, forming a transition layer with a graded composition. Since the transition layer buffers mismatches such as stress occurring between layers having different physical properties, a well-balanced film can be obtained without concentrating internal strain on a specific site.
本発明の多層ポリイミドフィルムは、厚さ3μm以上120μm以下である。機械特性が良好となることから好ましくは4μm以上であり、より好ましくは5μm以上であり、さらに好ましくは8μm以上である。また、透明性が良好となることから100μm以下であることが好ましく、より好ましくは80μm以下であり、さらに好ましくは60μm以下である。 The multilayer polyimide film of the present invention has a thickness of 3 μm or more and 120 μm or less. The thickness is preferably 4 μm or more, more preferably 5 μm or more, and still more preferably 8 μm or more, because good mechanical properties are obtained. Further, the thickness is preferably 100 μm or less, more preferably 80 μm or less, and still more preferably 60 μm or less, because transparency is improved.
本発明の多層ポリイミドフィルムは、イエローインデックスが5以下である。透明性が良好となることから好ましくは4以下であり、より好ましくは3.5以下であり、さらに好ましくは3以下である。イエローインデックスは低い方が良いため下限は特に限定されないが、工業的には0.1以上であれば良く、0.2以上であっても差し支えない。 The multilayer polyimide film of the present invention has a yellow index of 5 or less. It is preferably 4 or less, more preferably 3.5 or less, and still more preferably 3 or less, because the transparency becomes good. Since the lower the yellow index is, the better, the lower limit is not particularly limited.
本発明の多層ポリイミドフィルムは、全光線透過率が86%以上である。透明性が良好となることから好ましくは87%以上であり、より好ましくは88%以上であり、さらに好ましくは89%以上である。上限は特に限定されないが、工業的には99%以下であれば良く、98%以下であっても差し支えない。 The multilayer polyimide film of the present invention has a total light transmittance of 86% or more. It is preferably 87% or more, more preferably 88% or more, and still more preferably 89% or more, because good transparency is achieved. Although the upper limit is not particularly limited, it may be 99% or less industrially, and may be 98% or less.
本発明では少なくとも組成の異なる2種類のポリイミドを用い、これらを厚さ方向に積層する。ポリイミドは一般にテトラカルボン酸無水物とジアミンとの縮重合反応により得られる高分子である。前記少なくとも2種のポリイミド層が(a)層と(b)層とを含み、前記(a)層と(b)層とは各々下記の特性のポリイミドから主として構成されていることが好ましい。ここで、主としてとは、各下記特性のポリイミドがそれぞれの層に70質量%以上含有することが好ましく、より好ましい含有量は80質量%以上であり、さらに好ましくは90質量%以上であり、特に好ましくは100質量%である。また、組成が異なるとは、少なくとも各ポリイミドの樹脂組成が異なる必要があり、例えば樹脂組成が同じで滑剤の有無や配合量等のみが異なるものとは異なる。 In the present invention, at least two kinds of polyimides having different compositions are used and laminated in the thickness direction. Polyimide is generally a polymer obtained by condensation polymerization reaction of tetracarboxylic anhydride and diamine. Preferably, the at least two polyimide layers include a layer (a) and a layer (b), and the layers (a) and (b) are each mainly composed of polyimide having the following characteristics. Here, the term "mainly" means that each layer preferably contains 70% by mass or more, more preferably 80% by mass or more, still more preferably 90% by mass or more, and particularly Preferably it is 100% by mass. In addition, "having different compositions" means that at least the resin composition of each polyimide is different.
(a)層に主として用いられるポリイミド(以下、「主として」を省略し、単に「(a)層に用いられるポリイミド」や「(a)層として用いられるポリイミド」等と記載することがある。)は、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが10以下であり、全光線透過率が85%以上であるポリイミドであることが好ましい。透明性が良好となることからイエローインデックスは9以下であることが好ましく、より好ましくは8以下であり、さらに好ましくは7以下である。イエローインデックスの下限は特に限定されないが、工業的には0.1以上であれば良く、0.2以上であっても差し支えない。全光線透過率は86%以上であることが好ましく、より好ましくは87%以上であり、さらに好ましくは88%以上である。上限は特に限定されないが、工業的には99%以下であれば良く、98%以下であっても差し支えない。 Polyimide mainly used in the (a) layer (hereinafter, "mainly" is omitted, and may be simply described as "polyimide used in the (a) layer" or "polyimide used as the (a) layer", etc.) is preferably a polyimide having a yellow index of 10 or less and a total light transmittance of 85% or more when made into a film having a thickness of 25±2 μm by itself. The yellow index is preferably 9 or less, more preferably 8 or less, and still more preferably 7 or less, because good transparency is obtained. The lower limit of the yellow index is not particularly limited. The total light transmittance is preferably 86% or higher, more preferably 87% or higher, and still more preferably 88% or higher. Although the upper limit is not particularly limited, it may be 99% or less industrially, and may be 98% or less.
多層ポリイミドフィルムにおける(a)層の厚さは機械強度が良好となることから1μm超であることが好ましく、より好ましくは1.5μm以上であり、さらに好ましくは2μm以上であり、特に好ましくは3μm以上である。また透明性が良好となることから119μm未満であることが好ましく、より好ましくは100μm以下であり、さらに好ましくは50μm以下であり、特に好ましくは20μm以下である。 The thickness of the (a) layer in the multilayer polyimide film is preferably more than 1 μm, more preferably 1.5 μm or more, still more preferably 2 μm or more, and particularly preferably 3 μm, because the mechanical strength is improved. That's it. Further, the thickness is preferably less than 119 μm, more preferably 100 μm or less, still more preferably 50 μm or less, and particularly preferably 20 μm or less, because transparency is improved.
(a)層に主として用いられるポリイミは、好ましくは、全酸成分を100質量%としたとき、脂環族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、全アミン成分を100質量%としたとき、分子内にアミド結合を有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、または脂環族テトラカルボン酸無水物を30質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミドである。 The polyimide mainly used in the layer (a) is preferably a tetracarboxylic anhydride containing 70% by mass or more of an alicyclic tetracarboxylic anhydride when the total acid component is 100% by mass, and all amine components is 100% by mass, a polyimide having a chemical structure obtained by condensation polymerization with a diamine containing 70% by mass or more of a diamine having an amide bond in the molecule, or 30% by mass of an alicyclic tetracarboxylic acid anhydride It is a polyimide having a chemical structure obtained by condensation polymerization of a tetracarboxylic anhydride containing the above and a diamine containing 70% by mass or more of a diamine having a trifluoromethyl group in the molecule.
(b)層に主として用いられるポリイミド(以下、「主として」を省略し、単に「(b)層に用いられるポリイミド」や「(b)層として用いられるポリイミド」等と記載することがある。)は、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが5以下であり、全光線透過率が90%以上であるポリイミドであることが好ましい。透明性が良好となることからイエローインデックスは4以下であることが好ましく、より好ましくは3以下である。イエローインデックスの下限は特に限定されないが、工業的には0.1以上であれば良く、0.2以上であっても差し支えない。全光線透過率は91%以上であることが好ましく、より好ましくは92%以上である。上限は特に限定されないが、工業的には99%以下であれば良く、98%以下であっても差し支えない。(b)層に用いられるポリイミドのイエローインデックスは、(a)層に用いられるポリイミドのイエローインデックスより小さいことが好ましい。また、(b)層に用いられるポリイミドの全光線透過率は、(a)層に用いられるポリイミドの全光線透過率より大きいことが好ましい。 Polyimide mainly used in the (b) layer (hereinafter, "mainly" is omitted, and may be simply described as "polyimide used in the (b) layer" or "polyimide used as the (b) layer", etc.) is preferably a polyimide having a yellow index of 5 or less and a total light transmittance of 90% or more when made into a film having a thickness of 25±2 μm by itself. The yellow index is preferably 4 or less, and more preferably 3 or less, because good transparency is achieved. The lower limit of the yellow index is not particularly limited. The total light transmittance is preferably 91% or more, more preferably 92% or more. Although the upper limit is not particularly limited, it may be 99% or less industrially, and may be 98% or less. The yellow index of the polyimide used in the (b) layer is preferably smaller than the yellow index of the polyimide used in the (a) layer. Moreover, the total light transmittance of the polyimide used for the (b) layer is preferably higher than the total light transmittance of the polyimide used for the (a) layer.
多層ポリイミドフィルムにおける(b)層の厚さは機械強度が良好となることから1μm超であることが好ましく、より好ましくは2μm以上であり、さらに好ましくは3μm以上であり、特に好ましくは4μm以上である。また透明性が良好となることから119μm未満であることが好ましく、より好ましくは100μm以下であり、さらに好ましくは80μm以下であり、特に好ましくは50μm以下である。 The thickness of the (b) layer in the multilayer polyimide film is preferably more than 1 μm, more preferably 2 μm or more, still more preferably 3 μm or more, and particularly preferably 4 μm or more, because the mechanical strength is improved. be. Further, the thickness is preferably less than 119 μm, more preferably 100 μm or less, still more preferably 80 μm or less, and particularly preferably 50 μm or less, because transparency is improved.
(b)層に主として用いられるポリイミドは、好ましくは、全酸成分を100質量%としたとき、芳香族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、全アミン成分を100質量%としたとき、少なくとも分子内にイオウ原子を有するジアミンを70質量%以上含有するジアミンから得られる化学構造からなるポリイミド、または、少なくともトリフルオロメチル基を分子内に含有するテトラカルボン酸を70質量%以上含有するテトラカルボン酸無水物と、少なくともトリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミドである。 The polyimide mainly used in the layer (b) is preferably a tetracarboxylic anhydride containing 70% by mass or more of an aromatic tetracarboxylic anhydride when the total acid component is 100% by mass, and all amine components. A polyimide having a chemical structure obtained from a diamine containing 70% by mass or more of a diamine having at least a sulfur atom in the molecule when 100% by mass, or a tetracarboxylic acid containing at least a trifluoromethyl group in the molecule. It is a polyimide having a chemical structure obtained by condensation polymerization of a tetracarboxylic anhydride containing 70% by mass or more and a diamine containing 70% by mass or more of a diamine having at least a trifluoromethyl group in the molecule.
本発明における脂環族テトラカルボン酸無水物としては、1,2,3,4-シクロブタンテトラカルボン酸、1,2,3,4-シクロペンタンテトラカルボン酸、1,2,3,4-シクロヘキサンテトラカルボン酸、1,2,4,5-シクロヘキサンテトラカルボン酸、3,3’,4,4’-ビシクロヘキシルテトラカルボン酸、ビシクロ[2,2、1]ヘプタン-2,3,5,6-テトラカルボン酸、ビシクロ[2,2,2]オクタン-2,3,5,6-テトラカルボン酸、ビシクロ[2,2,2]オクト-7-エン-2,3,5,6-テトラカルボン酸、テトラヒドロアントラセン-2,3,6,7-テトラカルボン酸、テトラデカヒドロ-1,4:5,8:9,10-トリメタノアントラセン-2,3,6,7-テトラカルボン酸、デカヒドロナフタレン-2,3,6,7-テトラカルボン酸、デカヒドロ-1,4:5,8-ジメタノナフタレン-2,3,6,7-テトラカルボン酸、デカヒドロ-1,4-エタノ-5,8-メタノナフタレン-2,3,6,7-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロペンタノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸(別名「ノルボルナン-2-スピロ-2’-シクロペンタノン-5’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸」)、メチルノルボルナン-2-スピロ-α-シクロペンタノン-α’-スピロ-2’’-(メチルノルボルナン)-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロヘキサノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸(別名「ノルボルナン-2-スピロ-2’-シクロヘキサノン-6’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸」)、メチルノルボルナン-2-スピロ-α-シクロヘキサノン-α’-スピロ-2’’-(メチルノルボルナン)-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロプロパノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロブタノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロヘプタノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロオクタノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロノナノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロデカノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロウンデカノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロドデカノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロトリデカノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロテトラデカノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-シクロペンタデカノン-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-(メチルシクロペンタノン)-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、ノルボルナン-2-スピロ-α-(メチルシクロヘキサノン)-α’-スピロ-2’’-ノルボルナン-5,5’’,6,6’’-テトラカルボン酸、などのテトラカルボン酸及びこれらの酸無水物が挙げられる。これらの中でも、2個の酸無水物構造を有する二無水物が好適であり、特に、1,2,3,4-シクロブタンテトラカルボン酸二無水物、1,2,3,4-シクロヘキサンテトラカルボン酸二無水物、1,2,4,5-シクロヘキサンテトラカルボン酸二無水物が好ましく、1,2,3,4-シクロブタンテトラカルボン酸二無水物、1,2,4,5-シクロヘキサンテトラカルボン酸二無水物がより好ましく、1,2,3,4-シクロブタンテトラカルボン酸二無水物がさらに好ましい。なお、これらは単独で用いてもよいし、二種以上を併用してもよい。 The alicyclic tetracarboxylic acid anhydrides used in the present invention include 1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, and 1,2,3,4-cyclohexane. Tetracarboxylic acid, 1,2,4,5-cyclohexanetetracarboxylic acid, 3,3′,4,4′-bicyclohexyltetracarboxylic acid, bicyclo[2,2,1]heptane-2,3,5,6 -tetracarboxylic acid, bicyclo[2,2,2]octane-2,3,5,6-tetracarboxylic acid, bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetra carboxylic acids, tetrahydroanthracene-2,3,6,7-tetracarboxylic acid, tetradecahydro-1,4:5,8:9,10-trimethanoanthracene-2,3,6,7-tetracarboxylic acid, Decahydronaphthalene-2,3,6,7-tetracarboxylic acid, Decahydro-1,4:5,8-dimethanonaphthalene-2,3,6,7-tetracarboxylic acid, Decahydro-1,4-ethano- 5,8-methanonaphthalene-2,3,6,7-tetracarboxylic acid, norbornane-2-spiro-α-cyclopentanone-α′-spiro-2″-norbornane-5,5″,6, 6''-tetracarboxylic acid (also known as "norbornane-2-spiro-2'-cyclopentanone-5'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid" ), methylnorbornane-2-spiro-α-cyclopentanone-α′-spiro-2″-(methylnorbornane)-5,5″,6,6″-tetracarboxylic acid, norbornane-2-spiro - α-cyclohexanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid (also known as "norbornane-2-spiro-2'-cyclohexanone-6'-spiro- 2″-norbornane-5,5″,6,6″-tetracarboxylic acid”), methylnorbornane-2-spiro-α-cyclohexanone-α′-spiro-2″-(methylnorbornane)-5 ,5'',6,6''-tetracarboxylic acid, norbornane-2-spiro-α-cyclopropanone-α'-spiro-2''-norbornane-5,5'',6,6''- Tetracarboxylic acid, norbornane-2-spiro-α-cyclobutanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid, norbornane-2-spiro-α-cyclo Heptanone- α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid, norbornane-2-spiro-α-cyclooctanone-α'-spiro-2''-norbornane- 5,5'',6,6''-tetracarboxylic acid, norbornane-2-spiro-α-cyclononanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetra Carboxylic acid, norbornane-2-spiro-α-cyclodecanone-α'-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic acid, norbornane-2-spiro-α-cyclounde Kanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic acid, norbornane-2-spiro-α-cyclododecanone-α′-spiro-2″- norbornane-5,5'',6,6''-tetracarboxylic acid, norbornane-2-spiro-α-cyclotridecanone-α'-spiro-2''-norbornane-5,5'',6,6 ''-tetracarboxylic acid, norbornane-2-spiro-α-cyclotetradecanone-α'-spiro-2''-norbornane-5,5'',6,6''-tetracarboxylic acid, norbornane-2 -spiro-α-cyclopentadecanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic acid, norbornane-2-spiro-α-(methylcyclopentanone )-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic acid, norbornane-2-spiro-α-(methylcyclohexanone)-α′-spiro-2″ -norbornane-5,5″,6,6″-tetracarboxylic acid, and other tetracarboxylic acids and their acid anhydrides. Among these, dianhydrides having two acid anhydride structures are preferred, particularly 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic acid Acid dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride is preferred, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic An acid dianhydride is more preferred, and 1,2,3,4-cyclobutanetetracarboxylic acid dianhydride is even more preferred. In addition, these may be used independently and may use 2 or more types together.
本発明における芳香族テトラカルボン酸無水物としては、4,4’-(2,2-ヘキサフルオロイソプロピリデン)ジフタル酸、4,4’-オキシジフタル酸、ビス(1,3-ジオキソ-1,3-ジヒドロ-2-ベンゾフラン-5-カルボン酸)1,4-フェニレン、ビス(1,3-ジオキソ-1,3-ジヒドロ-2-ベンゾフラン-5-イル)ベンゼン-1,4-ジカルボキシレート、4,4’-[4,4’-(3-オキソ-1,3-ジヒドロ-2-ベンゾフラン-1,1-ジイル)ビス(ベンゼン-1,4-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、3,3’,4,4’-ベンゾフェノンテトラカルボン酸、4,4’-[(3-オキソ-1,3-ジヒドロ-2-ベンゾフラン-1,1-ジイル)ビス(トルエン-2,5-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-[(3-オキソ-1,3-ジヒドロ-2-ベンゾフラン-1,1-ジイル)ビス(1,4-キシレン-2,5-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-[4,4’-(3-オキソ-1,3-ジヒドロ-2-ベンゾフラン-1,1-ジイル)ビス(4-イソプロピル―トルエン-2,5-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-[4,4’-(3-オキソ-1,3-ジヒドロ-2-ベンゾフラン-1,1-ジイル)ビス(ナフタレン-1,4-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-[4,4’-(3H-2,1-ベンズオキサチオール-1,1-ジオキシド-3,3-ジイル)ビス(ベンゼン-1,4-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-ベンゾフェノンテトラカルボン酸、4,4’-[(3H-2,1-ベンズオキサチオール-1,1-ジオキシド-3,3-ジイル)ビス(トルエン-2,5-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-[(3H-2,1-ベンズオキサチオール-1,1-ジオキシド-3,3-ジイル)ビス(1,4-キシレン-2,5-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-[4,4’-(3H-2,1-ベンズオキサチオール-1,1-ジオキシド-3,3-ジイル)ビス(4-イソプロピル―トルエン-2,5-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、4,4’-[4,4’-(3H-2,1-ベンズオキサチオール-1,1-ジオキシド-3,3-ジイル)ビス(ナフタレン-1,4-ジイルオキシ)]ジベンゼン-1、2-ジカルボン酸、3,3’,4,4’-ベンゾフェノンテトラカルボン酸、3,3’,4,4’-ベンゾフェノンテトラカルボン酸、3,3’,4,4’-ジフェニルスルホンテトラカルボン酸、3,3’,4,4’-ビフェニルテトラカルボン酸、2,3,3’,4’-ビフェニルテトラカルボン酸、ピロメリット酸、4,4’-[スピロ(キサンテン-9,9’-フルオレン)-2,6-ジイルビス(オキシカルボニル)]ジフタル酸、4,4’-[スピロ(キサンテン-9,9’-フルオレン)-3,6-ジイルビス(オキシカルボニル)]ジフタル酸、などのテトラカルボン酸及びこれらの酸無水物が挙げられる。なお、芳香族テトラカルボン酸類は単独で用いてもよいし、二種以上を併用してもよい。 The aromatic tetracarboxylic anhydrides used in the present invention include 4,4′-(2,2-hexafluoroisopropylidene)diphthalic acid, 4,4′-oxydiphthalic acid, bis(1,3-dioxo-1,3 -dihydro-2-benzofuran-5-carboxylic acid) 1,4-phenylene, bis(1,3-dioxo-1,3-dihydro-2-benzofuran-5-yl)benzene-1,4-dicarboxylate, 4,4′-[4,4′-(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(benzene-1,4-diyloxy)]dibenzene-1,2-dicarbon acid, 3,3′,4,4′-benzophenonetetracarboxylic acid, 4,4′-[(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(toluene-2, 5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4′-[(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(1,4-xylene-2 ,5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4′-[4,4′-(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(4 -isopropyl-toluene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4′-[4,4′-(3-oxo-1,3-dihydro-2-benzofuran-1,1 -diyl)bis(naphthalene-1,4-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4′-[4,4′-(3H-2,1-benzoxathiol-1,1-dioxide -3,3-diyl)bis(benzene-1,4-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4′-benzophenonetetracarboxylic acid, 4,4′-[(3H-2,1- Benzoxathiol-1,1-dioxide-3,3-diyl)bis(toluene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4′-[(3H-2,1-benz oxathiol-1,1-dioxide-3,3-diyl)bis(1,4-xylene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4′-[4,4′- (3H-2,1-benzoxathiol-1,1-dioxide-3,3-diyl)bis(4-isopropyl-toluene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4 '-[4,4'-(3H-2,1-benzoxathio diyl-1,1-dioxide-3,3-diyl)bis(naphthalene-1,4-diyloxy)]dibenzene-1,2-dicarboxylic acid, 3,3′,4,4′-benzophenonetetracarboxylic acid, 3,3′,4,4′-benzophenonetetracarboxylic acid, 3,3′,4,4′-diphenylsulfonetetracarboxylic acid, 3,3′,4,4′-biphenyltetracarboxylic acid, 2,3, 3′,4′-biphenyltetracarboxylic acid, pyromellitic acid, 4,4′-[spiro(xanthene-9,9′-fluorene)-2,6-diylbis(oxycarbonyl)]diphthalic acid, 4,4′ -[spiro(xanthene-9,9′-fluorene)-3,6-diylbis(oxycarbonyl)]diphthalic acid, tetracarboxylic acids and acid anhydrides thereof. Aromatic tetracarboxylic acids may be used alone, or two or more of them may be used in combination.
本発明では、テトラカルボン酸無水物に加えてトリカルボン酸、ジカルボンサン酸を用いても良い。
トリカルボン酸類としては、トリメリット酸、1,2,5-ナフタレントリカルボン酸、ジフェニルエーテル-3,3’,4’-トリカルボン酸、ジフェニルスルホン-3,3’,4’-トリカルボン酸などの芳香族トリカルボン酸、或いはヘキサヒドロトリメリット酸などの上記芳香族トリカルボン酸の水素添加物、エチレングリコールビストリメリテート、プロピレングリコールビストリメリテート、1,4-ブタンジオールビストリメリテート、ポリエチレングリコールビストリメリテートなどのアルキレングリコールビストリメリテート、及びこれらの一無水物、エステル化物が挙げられる。これらの中でも、1個の酸無水物構造を有する一無水物が好適であり、特に、トリメリット酸無水物、ヘキサヒドロトリメリット酸無水物が好ましい。尚、これらは単独で使用してもよいし複数を組み合わせて使用してもよい。In the present invention, tricarboxylic acid and dicarboxylic acid may be used in addition to tetracarboxylic anhydride.
Tricarboxylic acids include aromatic tricarboxylic acids such as trimellitic acid, 1,2,5-naphthalenetricarboxylic acid, diphenylether-3,3′,4′-tricarboxylic acid, and diphenylsulfone-3,3′,4′-tricarboxylic acid. acids or hydrogenated products of the above aromatic tricarboxylic acids such as hexahydrotrimellitic acid; Glycol bistrimellitate, and their monoanhydrides and esters. Among these, monoanhydrides having one acid anhydride structure are preferred, and trimellitic anhydride and hexahydrotrimellitic anhydride are particularly preferred. In addition, these may be used individually and may be used in combination.
ジカルボン酸類としては、テレフタル酸、イソフタル酸、オルソフタル酸、ナフタレンジカルボン酸、4、4’-オキシジベンゼンカルボン酸などの芳香族ジカルボン酸、或いは1,6-シクロヘキサンジカルボン酸などの上記芳香族ジカルボン酸の水素添加物、シュウ酸、コハク酸、グルタル酸、アジピン酸、ヘプタン二酸、オクタン二酸、アゼライン酸、セバシン酸、ウンデカ二酸、ドデカン二酸、2-メチルコハク酸、及びこれらの酸塩化物或いはエステル化物などが挙げられる。これらの中で芳香族ジカルボン酸及びその水素添加物が好適であり、特に、テレフタル酸、1,6-シクロヘキサンジカルボン酸、4、4’-オキシジベンゼンカルボン酸が好ましい。尚、ジカルボン酸類は単独で使用してもよいし複数を組み合わせて使用してもよい。 Dicarboxylic acids include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, orthophthalic acid, naphthalenedicarboxylic acid, 4,4'-oxydibenzenecarboxylic acid, or the above aromatic dicarboxylic acids such as 1,6-cyclohexanedicarboxylic acid. Hydrogenates of oxalic acid, succinic acid, glutaric acid, adipic acid, heptanedioic acid, octanedioic acid, azelaic acid, sebacic acid, undecadeic acid, dodecanedioic acid, 2-methylsuccinic acid, and their acid chlorides Alternatively, an esterified product and the like can be mentioned. Among these, aromatic dicarboxylic acids and hydrogenated products thereof are preferred, and terephthalic acid, 1,6-cyclohexanedicarboxylic acid, and 4,4'-oxydibenzenecarboxylic acid are particularly preferred. In addition, dicarboxylic acids may be used alone or in combination.
本発明における分子内にアミド結合を有するジアミンとしては、芳香族ジアミン、脂環族アミンを主に用いることができる。
芳香族ジアミン類としては、例えば、2,2’-ジメチル-4,4’-ジアミノビフェニル、1,4-ビス[2-(4-アミノフェニル)-2-プロピル]ベンゼン、1,4-ビス(4-アミノ-2-トリフルオロメチルフェノキシ)ベンゼン、2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル、4,4’-ビス(4-アミノフェノキシ)ビフェニル、4,4’-ビス(3-アミノフェノキシ)ビフェニル、ビス[4-(3-アミノフェノキシ)フェニル]ケトン、ビス[4-(3-アミノフェノキシ)フェニル]スルフィド、ビス[4-(3-アミノフェノキシ)フェニル]スルホン、2,2-ビス[4-(3-アミノフェノキシ)フェニル]プロパン、2,2-ビス[4-(3-アミノフェノキシ)フェニル]-1,1,1,3,3,3-ヘキサフルオロプロパン、m-フェニレンジアミン、o-フェニレンジアミン、p-フェニレンジアミン、m-アミノベンジルアミン、p-アミノベンジルアミン、4-アミノ-N-(4-アミノフェニル)ベンズアミド、3,3’-ジアミノジフェニルエーテル、3,4’-ジアミノジフェニルエーテル、4,4’-ジアミノジフェニルエーテル、2,2’-トリフルオロメチル-4,4’-ジアミノジフェニルエーテル、3,3’-ジアミノジフェニルスルフィド、3,4’-ジアミノジフェニルスルフィド、4,4’-ジアミノジフェニルスルフィド、3,3’-ジアミノジフェニルスルホキシド、3,4’-ジアミノジフェニルスルホキシド、4,4’-ジアミノジフェニルスルホキシド、3,3’-ジアミノジフェニルスルホン、3,4’-ジアミノジフェニルスルホン、4,4’-ジアミノジフェニルスルホン、3,3’-ジアミノベンゾフェノン、3,4’-ジアミノベンゾフェノン、4,4’-ジアミノベンゾフェノン、3,3’-ジアミノジフェニルメタン、3,4’-ジアミノジフェニルメタン、4,4’-ジアミノジフェニルメタン、ビス[4-(4-アミノフェノキシ)フェニル]メタン、1,1-ビス[4-(4-アミノフェノキシ)フェニル]エタン、1,2-ビス[4-(4-アミノフェノキシ)フェニル]エタン、1,1-ビス[4-(4-アミノフェノキシ)フェニル]プロパン、1,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパン、1,3-ビス[4-(4-アミノフェノキシ)フェニル]プロパン、2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパン、1,1-ビス[4-(4-アミノフェノキシ)フェニル]ブタン、1,3-ビス[4-(4-アミノフェノキシ)フェニル]ブタン、1,4-ビス[4-(4-アミノフェノキシ)フェニル]ブタン、2,2-ビス[4-(4-アミノフェノキシ)フェニル]ブタン、2,3-ビス[4-(4-アミノフェノキシ)フェニル]ブタン、2-[4-(4-アミノフェノキシ)フェニル]-2-[4-(4-アミノフェノキシ)-3-メチルフェニル]プロパン、2,2-ビス[4-(4-アミノフェノキシ)-3-メチルフェニル]プロパン、2-[4-(4-アミノフェノキシ)フェニル]-2-[4-(4-アミノフェノキシ)-3,5-ジメチルフェニル]プロパン、2,2-ビス[4-(4-アミノフェノキシ)-3,5-ジメチルフェニル]プロパン、2,2-ビス[4-(4-アミノフェノキシ)フェニル]-1,1,1,3,3,3-ヘキサフルオロプロパン、1,4-ビス(3-アミノフェノキシ)ベンゼン、1,3-ビス(3-アミノフェノキシ)ベンゼン、1,4-ビス(4-アミノフェノキシ)ベンゼン、4,4’-ビス(4-アミノフェノキシ)ビフェニル、ビス[4-(4-アミノフェノキシ)フェニル]ケトン、ビス[4-(4-アミノフェノキシ)フェニル]スルフィド、ビス[4-(4-アミノフェノキシ)フェニル]スルホキシド、ビス[4-(4-アミノフェノキシ)フェニル]スルホン、ビス[4-(3-アミノフェノキシ)フェニル]エーテル、ビス[4-(4-アミノフェノキシ)フェニル]エーテル、1,3-ビス[4-(4-アミノフェノキシ)ベンゾイル]ベンゼン、1,3-ビス[4-(3-アミノフェノキシ)ベンゾイル]ベンゼン、1,4-ビス[4-(3-アミノフェノキシ)ベンゾイル]ベンゼン、4,4’-ビス[(3-アミノフェノキシ)ベンゾイル]ベンゼン、1,1-ビス[4-(3-アミノフェノキシ)フェニル]プロパン、1,3-ビス[4-(3-アミノフェノキシ)フェニル]プロパン、3,4’-ジアミノジフェニルスルフィド、2,2-ビス[3-(3-アミノフェノキシ)フェニル]-1,1,1,3,3,3-ヘキサフルオロプロパン、ビス[4-(3-アミノフェノキシ)フェニル]メタン、1,1-ビス[4-(3-アミノフェノキシ)フェニル]エタン、1,2-ビス[4-(3-アミノフェノキシ)フェニル]エタン、ビス[4-(3-アミノフェノキシ)フェニル]スルホキシド、4,4’-ビス[3-(4-アミノフェノキシ)ベンゾイル]ジフェニルエーテル、4,4’-ビス[3-(3-アミノフェノキシ)ベンゾイル]ジフェニルエーテル、4,4’-ビス[4-(4-アミノ-α,α-ジメチルベンジル)フェノキシ]ベンゾフェノン、4,4’-ビス[4-(4-アミノ-α,α-ジメチルベンジル)フェノキシ]ジフェニルスルホン、ビス[4-{4-(4-アミノフェノキシ)フェノキシ}フェニル]スルホン、1,4-ビス[4-(4-アミノフェノキシ)フェノキシ-α,α-ジメチルベンジル]ベンゼン、1,3-ビス[4-(4-アミノフェノキシ)フェノキシ-α,α-ジメチルベンジル]ベンゼン、1,3-ビス[4-(4-アミノ-6-トリフルオロメチルフェノキシ)-α,α-ジメチルベンジル]ベンゼン、1,3-ビス[4-(4-アミノ-6-フルオロフェノキシ)-α,α-ジメチルベンジル]ベンゼン、1,3-ビス[4-(4-アミノ-6-メチルフェノキシ)-α,α-ジメチルベンジル]ベンゼン、1,3-ビス[4-(4-アミノ-6-シアノフェノキシ)-α,α-ジメチルベンジル]ベンゼン、3,3’-ジアミノ-4,4’-ジフェノキシベンゾフェノン、4,4’-ジアミノ-5,5’-ジフェノキシベンゾフェノン、3,4’-ジアミノ-4,5’-ジフェノキシベンゾフェノン、3,3’-ジアミノ-4-フェノキシベンゾフェノン、4,4’-ジアミノ-5-フェノキシベンゾフェノン、3,4’-ジアミノ-4-フェノキシベンゾフェノン、3,4’-ジアミノ-5’-フェノキシベンゾフェノン、3,3’-ジアミノ-4,4’-ジビフェノキシベンゾフェノン、4,4’-ジアミノ-5,5’-ジビフェノキシベンゾフェノン、3,4’-ジアミノ-4,5’-ジビフェノキシベンゾフェノン、3,3’-ジアミノ-4-ビフェノキシベンゾフェノン、4,4’-ジアミノ-5-ビフェノキシベンゾフェノン、3,4’-ジアミノ-4-ビフェノキシベンゾフェノン、3,4’-ジアミノ-5’-ビフェノキシベンゾフェノン、1,3-ビス(3-アミノ-4-フェノキシベンゾイル)ベンゼン、1,4-ビス(3-アミノ-4-フェノキシベンゾイル)ベンゼン、1,3-ビス(4-アミノ-5-フェノキシベンゾイル)ベンゼン、1,4-ビス(4-アミノ-5-フェノキシベンゾイル)ベンゼン、1,3-ビス(3-アミノ-4-ビフェノキシベンゾイル)ベンゼン、1,4-ビス(3-アミノ-4-ビフェノキシベンゾイル)ベンゼン、1,3-ビス(4-アミノ-5-ビフェノキシベンゾイル)ベンゼン、1,4-ビス(4-アミノ-5-ビフェノキシベンゾイル)ベンゼン、2,6-ビス[4-(4-アミノ-α,α-ジメチルベンジル)フェノキシ]ベンゾニトリル、4,4’-[9H-フルオレン-9,9-ジイル]ビスアニリン(別名「9,9-ビス(4-アミノフェニル)フルオレン」)、スピロ(キサンテン-9,9’-フルオレン)-2,6-ジイルビス(オキシカルボニル)]ビスアニリン、4,4’-[スピロ(キサンテン-9,9’-フルオレン)-2,6-ジイルビス(オキシカルボニル)]ビスアニリン、4,4’-[スピロ(キサンテン-9,9’-フルオレン)-3,6-ジイルビス(オキシカルボニル)]ビスアニリン、5-アミノ-2-(p-アミノフェニル)ベンゾオキサゾール、6-アミノ-2-(p-アミノフェニル)ベンゾオキサゾール、5-アミノ-2-(m-アミノフェニル)ベンゾオキサゾール、6-アミノ-2-(m-アミノフェニル)ベンゾオキサゾール、2,2’-p-フェニレンビス(5-アミノベンゾオキサゾール)、2,2’-p-フェニレンビス(6-アミノベンゾオキサゾール)、1-(5-アミノベンゾオキサゾロ)-4-(6-アミノベンゾオキサゾロ)ベンゼン、2,6-(4,4’-ジアミノジフェニル)ベンゾ[1,2-d:5,4-d’]ビスオキサゾール、2,6-(4,4’-ジアミノジフェニル)ベンゾ[1,2-d:4,5-d’]ビスオキサゾール、2,6-(3,4’-ジアミノジフェニル)ベンゾ[1,2-d:5,4-d’]ビスオキサゾール、2,6-(3,4’-ジアミノジフェニル)ベンゾ[1,2-d:4,5-d’]ビスオキサゾール、2,6-(3,3’-ジアミノジフェニル)ベンゾ[1,2-d:5,4-d’]ビスオキサゾール、2,6-(3,3’-ジアミノジフェニル)ベンゾ[1,2-d:4,5-d’]ビスオキサゾール等が挙げられる。また、上記芳香族ジアミンの芳香環上の水素原子の一部もしくは全てが、ハロゲン原子、炭素数1~3のアルキル基もしくはアルコキシル基、またはシアノ基で置換されても良く、さらに前記炭素数1~3のアルキル基もしくはアルコキシル基の水素原子の一部もしくは全部がハロゲン原子で置換されても良い。Aromatic diamines and alicyclic amines can be mainly used as the diamine having an amide bond in the molecule in the present invention.
Examples of aromatic diamines include 2,2′-dimethyl-4,4′-diaminobiphenyl, 1,4-bis[2-(4-aminophenyl)-2-propyl]benzene, 1,4-bis (4-amino-2-trifluoromethylphenoxy)benzene, 2,2′-ditrifluoromethyl-4,4′-diaminobiphenyl, 4,4′-bis(4-aminophenoxy)biphenyl, 4,4′- Bis(3-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl]ketone, bis[4-(3-aminophenoxy)phenyl]sulfide, bis[4-(3-aminophenoxy)phenyl]sulfone , 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoro Propane, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, 4-amino-N-(4-aminophenyl)benzamide, 3,3'-diaminodiphenyl ether , 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 2,2′-trifluoromethyl-4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl sulfide, 3,4′-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfoxide, 3,4'-diaminodiphenyl sulfoxide, 4,4'-diaminodiphenyl sulfoxide, 3,3'-diaminodiphenyl sulfone, 3,4 '-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 3,3'-diaminobenzophenone, 3,4'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminodiphenylmethane, 3,4 '-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, bis[4-(4-aminophenoxy)phenyl]methane, 1,1-bis[4-(4-aminophenoxy)phenyl]ethane, 1,2-bis [4-(4-aminophenoxy)phenyl]ethane, 1,1-bis[4-(4-aminophenoxy)phenyl]propane, 1,2-bis[4-(4-aminophenoxy)phenyl]propane, 1 ,3-bis[4-(4-aminophenoxy)phenyl]propane, 2,2 -bis[4-(4-aminophenoxy)phenyl]propane, 1,1-bis[4-(4-aminophenoxy)phenyl]butane, 1,3-bis[4-(4-aminophenoxy)phenyl]butane , 1,4-bis[4-(4-aminophenoxy)phenyl]butane, 2,2-bis[4-(4-aminophenoxy)phenyl]butane, 2,3-bis[4-(4-aminophenoxy) ) phenyl]butane, 2-[4-(4-aminophenoxy)phenyl]-2-[4-(4-aminophenoxy)-3-methylphenyl]propane, 2,2-bis[4-(4-amino phenoxy)-3-methylphenyl]propane, 2-[4-(4-aminophenoxy)phenyl]-2-[4-(4-aminophenoxy)-3,5-dimethylphenyl]propane, 2,2-bis [4-(4-aminophenoxy)-3,5-dimethylphenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoro Propane, 1,4-bis(3-aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4- aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ketone, bis[4-(4-aminophenoxy)phenyl]sulfide, bis[4-(4-aminophenoxy)phenyl]sulfoxide, bis[4 -(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ether, 1,3-bis[4-(4- aminophenoxy)benzoyl]benzene, 1,3-bis[4-(3-aminophenoxy)benzoyl]benzene, 1,4-bis[4-(3-aminophenoxy)benzoyl]benzene, 4,4'-bis[ (3-aminophenoxy)benzoyl]benzene, 1,1-bis[4-(3-aminophenoxy)phenyl]propane, 1,3-bis[4-(3-aminophenoxy)phenyl]propane, 3,4' -diaminodiphenyl sulfide, 2,2-bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, bis[4-(3-aminophenoxy)phenyl] methane, 1,1-bis[4-(3-aminophenoxy)phenyl]ethane, 1,2-bis Su[4-(3-aminophenoxy)phenyl]ethane, bis[4-(3-aminophenoxy)phenyl]sulfoxide, 4,4′-bis[3-(4-aminophenoxy)benzoyl]diphenyl ether, 4,4 '-bis[3-(3-aminophenoxy)benzoyl]diphenyl ether, 4,4'-bis[4-(4-amino-α,α-dimethylbenzyl)phenoxy]benzophenone, 4,4'-bis[4- (4-amino-α,α-dimethylbenzyl)phenoxy]diphenylsulfone, bis[4-{4-(4-aminophenoxy)phenoxy}phenyl]sulfone, 1,4-bis[4-(4-aminophenoxy) Phenoxy-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-aminophenoxy)phenoxy-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-amino-6 -trifluoromethylphenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-amino-6-fluorophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[ 4-(4-amino-6-methylphenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-amino-6-cyanophenoxy)-α,α-dimethylbenzyl]benzene, 3,3′-diamino-4,4′-diphenoxybenzophenone, 4,4′-diamino-5,5′-diphenoxybenzophenone, 3,4′-diamino-4,5′-diphenoxybenzophenone, 3, 3'-diamino-4-phenoxybenzophenone, 4,4'-diamino-5-phenoxybenzophenone, 3,4'-diamino-4-phenoxybenzophenone, 3,4'-diamino-5'-phenoxybenzophenone, 3,3 '-diamino-4,4'-dibiphenoxybenzophenone, 4,4'-diamino-5,5'-dibiphenoxybenzophenone, 3,4'-diamino-4,5'-dibiphenoxybenzophenone, 3,3'- diamino-4-biphenoxybenzophenone, 4,4'-diamino-5-biphenoxybenzophenone, 3,4'-diamino-4-biphenoxybenzophenone, 3,4'-diamino-5'-biphenoxybenzophenone, 1, 3-bis(3-amino-4-phenoxybenzoyl)benzene, 1,4-bis(3-amino-4-phenoxybenzoyl)benzene, 1,3-bis(4-amino-5-pheno xybenzoyl)benzene, 1,4-bis(4-amino-5-phenoxybenzoyl)benzene, 1,3-bis(3-amino-4-biphenoxybenzoyl)benzene, 1,4-bis(3-amino- 4-biphenoxybenzoyl)benzene, 1,3-bis(4-amino-5-biphenoxybenzoyl)benzene, 1,4-bis(4-amino-5-biphenoxybenzoyl)benzene, 2,6-bis[ 4-(4-amino-α,α-dimethylbenzyl)phenoxy]benzonitrile, 4,4′-[9H-fluorene-9,9-diyl]bisaniline (also known as “9,9-bis(4-aminophenyl) fluorene”), spiro(xanthene-9,9′-fluorene)-2,6-diylbis(oxycarbonyl)]bisaniline, 4,4′-[spiro(xanthene-9,9′-fluorene)-2,6- diylbis(oxycarbonyl)]bisaniline, 4,4′-[spiro(xanthene-9,9′-fluorene)-3,6-diylbis(oxycarbonyl)]bisaniline, 5-amino-2-(p-aminophenyl) benzoxazole, 6-amino-2-(p-aminophenyl)benzoxazole, 5-amino-2-(m-aminophenyl)benzoxazole, 6-amino-2-(m-aminophenyl)benzoxazole, 2, 2′-p-phenylenebis(5-aminobenzoxazole), 2,2′-p-phenylenebis(6-aminobenzoxazole), 1-(5-aminobenzoxazolo)-4-(6-aminobenzo oxazolo)benzene, 2,6-(4,4'-diaminodiphenyl)benzo[1,2-d:5,4-d']bisoxazole, 2,6-(4,4'-diaminodiphenyl)benzo [1,2-d:4,5-d′]bisoxazole, 2,6-(3,4′-diaminodiphenyl)benzo[1,2-d:5,4-d′]bisoxazole, 2, 6-(3,4′-diaminodiphenyl)benzo[1,2-d:4,5-d′]bisoxazole, 2,6-(3,3′-diaminodiphenyl)benzo[1,2-d: 5,4-d']bisoxazole, 2,6-(3,3'-diaminodiphenyl)benzo[1,2-d:4,5-d']bisoxazole and the like. In addition, some or all of the hydrogen atoms on the aromatic ring of the aromatic diamine may be substituted with a halogen atom, an alkyl or alkoxyl group having 1 to 3 carbon atoms, or a cyano group, and Some or all of the hydrogen atoms in the alkyl or alkoxyl groups of 1 to 3 may be substituted with halogen atoms.
脂環族ジアミン類としては、例えば、1,4-ジアミノシクロヘキサン、1,4-ジアミノ-2-メチルシクロヘキサン、1,4-ジアミノ-2-エチルシクロヘキサン、1,4-ジアミノ-2-n-プロピルシクロヘキサン、1,4-ジアミノ-2-イソプロピルシクロヘキサン、1,4-ジアミノ-2-n-ブチルシクロヘキサン、1,4-ジアミノ-2-イソブチルシクロヘキサン、1,4-ジアミノ-2-sec-ブチルシクロヘキサン、1,4-ジアミノ-2-tert-ブチルシクロヘキサン、4,4’-メチレンビス(2,6-ジメチルシクロヘキシルアミン)、9,10-ビス(4-アミノフェニル)アデニン、2,4-ビス(4-アミノフェニル)シクロブタン-1,3-ジカルボン酸ジメチル、等が挙げられる。 Alicyclic diamines include, for example, 1,4-diaminocyclohexane, 1,4-diamino-2-methylcyclohexane, 1,4-diamino-2-ethylcyclohexane, 1,4-diamino-2-n-propyl cyclohexane, 1,4-diamino-2-isopropylcyclohexane, 1,4-diamino-2-n-butylcyclohexane, 1,4-diamino-2-isobutylcyclohexane, 1,4-diamino-2-sec-butylcyclohexane, 1,4-diamino-2-tert-butylcyclohexane, 4,4′-methylenebis(2,6-dimethylcyclohexylamine), 9,10-bis(4-aminophenyl)adenine, 2,4-bis(4- aminophenyl)cyclobutane-dimethyl-1,3-dicarboxylate, and the like.
本発明では、(a)層は、(b)層の一方の面側と他方の面側の両方に存在し、遷移層は、(b)層の一方の面側の(a)層と(b)層との間、及び、(b)層の他方の面側の(a)層と(b)層との間に存在し、(a)層、遷移層、(b)層、遷移層、(a)層の順に積層された層構成を有していることが好ましい。以下、(a)層、遷移層、(b)層、遷移層、(a)層の順に積層された層構成を「(a)/(b)/(a)」ともいう。また、同様に、(a)層、遷移層、(b)層の順に積層された層構成を「(a)/(b)」ともいい、(a)層、遷移層、(b)層、遷移層、(a)層、遷移層、(b)層、遷移層、(a)層の順に積層された層構成を「(a)/(b)/(a)/(b)/(a)」ともいう。
本発明では、かかる(a)層と(b)層が、(a)/(b)の二層構成、あるいは(a)/(b)/(a)の三層構成、また好ましくは、(a)/(b)/(a)/(b)/(a)の五層構成、さらには七層、九層、またはそれ以上の奇数層のフィルムとしても良い。奇数層の場合には(a)層が最外層に位置するように配置することが好ましい。(b)層に比較して機械特性に優れ、線膨張係数が小さい(a)層を最外層とすることで、フィルム全体の線膨張係数を低い側に抑え込むことができ、かつ機械的強度に優れる表層を与えることで、フィルムのハンドリングが向上し、かつ内層となる(b)層ポリイミドの優れた光学特性を最大限に引き出すことができる。(b)層は(a)層よりも厚いことが好ましい。(b)層の厚さと(a)層の厚さの比率は、(b)層/(a)層=1超であることが好ましく、より好ましくは1.5以上であり、さらに好ましくは2以上である。また、20以下であることが好ましく、より好ましくは15以下であり、さらに好ましくは12以下である。In the present invention, the (a) layer exists on both one surface side and the other surface side of the (b) layer, and the transition layer includes the (a) layer on one surface side of the (b) layer and ( (a) layer, transition layer, (b) layer, transition layer , (a) layers are laminated in this order. Hereinafter, the layer structure in which the (a) layer, the transition layer, the (b) layer, the transition layer, and the (a) layer are laminated in this order is also referred to as "(a)/(b)/(a)". Similarly, a layer structure in which the (a) layer, the transition layer, and the (b) layer are laminated in this order is also referred to as "(a)/(b)", and the (a) layer, the transition layer, the (b) layer, The layer structure in which the transition layer, (a) layer, transition layer, (b) layer, transition layer, and (a) layer are laminated in this order is expressed as "(a)/(b)/(a)/(b)/(a )”.
In the present invention, the (a) layer and the (b) layer have a two-layer structure of (a) / (b), or a three-layer structure of (a) / (b) / (a), and preferably, ( A film having a five-layer structure of a)/(b)/(a)/(b)/(a), or an odd-numbered film having seven layers, nine layers, or more layers may be used. In the case of an odd number of layers, it is preferred that the layer (a) be positioned as the outermost layer. By making the (a) layer, which has excellent mechanical properties and a small linear expansion coefficient compared to the (b) layer, the outermost layer, the linear expansion coefficient of the entire film can be suppressed to a low side, and mechanical strength is improved. By providing an excellent surface layer, the handling of the film is improved and the excellent optical properties of the (b) layer polyimide, which is the inner layer, can be maximized. The (b) layer is preferably thicker than the (a) layer. The ratio of the thickness of the (b) layer to the thickness of the (a) layer is preferably greater than (b) layer/(a) layer = 1, more preferably 1.5 or more, and still more preferably 2 That's it. Also, it is preferably 20 or less, more preferably 15 or less, and even more preferably 12 or less.
本発明では(a)層の厚さが、(a)層が複数層ある場合にはそれらの厚さの合計が、フィルム総厚さの34%以下であることが好ましく、さらに26%以下が好ましく、さらに13%以下、さらに好ましくは7%以下となるように構成することが好ましい。(a)層の厚さはフィルム総厚さの1%以上、好ましくは2%以上、さらに好ましくは4%以上である。(a)層の厚さをこの範囲に収めることにより、(a)層の持つ機械特性と(b)層の持つ光学特性がバランスしたフィルムを得ることができる。
なお、(a)層、(b)層の厚さを示す場合には、遷移層の厚さ方向の中心から(a)層側は(a)層に、(b)層側は(b)層に含めるものとする。In the present invention, the thickness of the (a) layer is preferably 34% or less of the total thickness of the film when the (a) layer has a plurality of layers, and more preferably 26% or less. It is preferable to configure it to be 13% or less, more preferably 7% or less. The thickness of the layer (a) is 1% or more, preferably 2% or more, more preferably 4% or more of the total thickness of the film. By setting the thickness of the (a) layer within this range, it is possible to obtain a film in which the mechanical properties of the (a) layer and the optical properties of the (b) layer are well balanced.
In addition, when indicating the thickness of the (a) layer and the (b) layer, from the center of the thickness direction of the transition layer, the (a) layer side is the (a) layer, and the (b) layer side is the (b) layer. shall be included in the layer.
本発明では、(a)層と(b)層の間に、(a)層のポリイミドから(b)層のポリイミドへと組成が連続的に変化する遷移層(混じり合いの層)が存在する。遷移層の厚さの下限はフィルム総厚さの3%、または1μmのいずれかであり、遷移層の厚さの上限はフィルム総厚さの10%、または3μmのいずれかであることが好ましい。下限の好ましい範囲としては、フィルム総厚さの3%超、または1.1μmのいずれかであり、より好ましくはフィルム総厚さの3.2%、または1.2μmのいずれかであり、フィルム総厚さの3.5%、または1.5μmのいずれかであることがさらに好ましい。また、上限の好ましい範囲としては、フィルム総厚さの9%、または2.8μmのいずれかであり、フィルム総厚さの8%、または2.6μmのいずれかであることがより好ましい。遷移層を前記範囲内とすることで透明性と機械的強度を両立することができる。
なお、遷移層の厚さとは(a)層のポリイミドと(b)層のポリイミドが混じり合って組成が片方からもう片方に傾斜してゆく領域の厚さであり、混合層の(a)層のポリイミド/(b)層のポリイミドの構成比(質量比)が5/95~95/5の範囲を言う。遷移層の厚さは、フィルムを厚さ方向に斜め切断し、ポリイミドの組成分布を見ることにより測定することができる。In the present invention, a transition layer (mixed layer) exists between the (a) layer and the (b) layer, the composition of which continuously changes from the polyimide of the (a) layer to the polyimide of the (b) layer. . Preferably, the lower limit of the transition layer thickness is either 3% of the total film thickness, or 1 μm, and the upper limit of the transition layer thickness is either 10% of the total film thickness, or 3 μm. . The lower limit is preferably more than 3% of the total thickness of the film, or 1.1 μm, more preferably 3.2% of the total thickness of the film, or 1.2 μm. More preferably, it is either 3.5% of the total thickness, or 1.5 μm. The upper limit is preferably 9% of the total thickness of the film or 2.8 μm, more preferably 8% of the total thickness of the film or 2.6 μm. By adjusting the thickness of the transition layer within the above range, both transparency and mechanical strength can be achieved.
The thickness of the transition layer is the thickness of the region where the polyimide of the (a) layer and the polyimide of the (b) layer are mixed and the composition is inclined from one side to the other, and the (a) layer of the mixed layer. The composition ratio (mass ratio) of the polyimide of the layer/the polyimide of the layer (b) is in the range of 5/95 to 95/5. The thickness of the transition layer can be measured by obliquely cutting the film in the thickness direction and observing the composition distribution of the polyimide.
遷移層の厚さは、多層ポリイミドフィルムが2層の積層構成の場合は、層と層の間(界面)が1ヶ所なので、当該界面に存在する遷移層の厚さとフィルムの総厚さから求めることができる。多層ポリイミドフィルムが3層の積層構成の場合は層と層の間(界面)が2ヶ所となるので、それぞれの遷移層の厚さの合計量とフィルムの総厚さから求めることができる。多層ポリイミドフィルムが4層以上の積層構成の場合も同様に、全ての遷移層の厚さの合計量と、フィルムの総厚さから求めることができる。 The thickness of the transition layer is obtained from the thickness of the transition layer present at the interface and the total thickness of the film, since there is one place between the layers (interface) when the multilayer polyimide film has a laminated structure of two layers. be able to. When the multilayer polyimide film has a laminated structure of three layers, there are two layers (interfaces) between the layers, so it can be determined from the total thickness of each transition layer and the total thickness of the film. When the multi-layered polyimide film has a laminated structure of four or more layers, it can be similarly determined from the total thickness of all the transition layers and the total thickness of the film.
本発明における(a)層に用いられるポリイミドは、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが10以下であり、全光線透過率が85%以上であるポリイミドであることが好ましい。さらに(a)層に用いられるポリイミドはCTEが25ppm/K以下、さらには20ppm/K以下であることが好ましく、引張破断強度が100MPa以上、さらには120MPa以上であることが好ましく、破断伸度が10%以上、さらには12%以上であることが好ましい。
かかる(a)層の好ましいポリイミドとして、脂環族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、分子内にアミド結合を有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミドを例示できる。
また(a)層に用いられるポリイミドとして、脂環族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミドを例示することができる。
いずれの(a)層用ポリイミドも脂環族テトラカルボン酸無水物を使用することができる。脂環族テトラカルボン酸無水物の含有量は、全テトラカルボン酸無水物の70質量%以上が好ましく、より好ましくは80質量%以上であり、さらに好ましくは90質量%以上であり、なおさらに好ましくは95質量%以上である。脂環族テトラカルボン酸の含有量を所定範囲に収めることにより着色が抑制される。The polyimide used for the layer (a) in the present invention is preferably a polyimide having a yellow index of 10 or less and a total light transmittance of 85% or more when made into a film having a thickness of 25±2 μm alone. . Furthermore, the polyimide used for the layer (a) preferably has a CTE of 25 ppm/K or less, more preferably 20 ppm/K or less, a tensile strength at break of 100 MPa or more, preferably 120 MPa or more, and a breaking elongation of It is preferably 10% or more, more preferably 12% or more.
Preferred polyimides for the layer (a) include a tetracarboxylic anhydride containing 70% by mass or more of an alicyclic tetracarboxylic anhydride and a diamine containing 70% by mass or more of a diamine having an amide bond in the molecule. A polyimide having a chemical structure obtained by condensation polymerization can be exemplified.
Further, the polyimide used for the layer (a) contains a tetracarboxylic anhydride containing 70% by mass or more of an alicyclic tetracarboxylic anhydride and 70% by mass or more of a diamine having a trifluoromethyl group in the molecule. A polyimide having a chemical structure obtained by condensation polymerization with a diamine can be exemplified.
An alicyclic tetracarboxylic acid anhydride can be used for any polyimide for layer (a). The content of the alicyclic tetracarboxylic anhydride is preferably 70% by mass or more, more preferably 80% by mass or more, still more preferably 90% by mass or more, and even more preferably 70% by mass or more of the total tetracarboxylic anhydride. is 95% by mass or more. Coloring is suppressed by keeping the content of the alicyclic tetracarboxylic acid within a predetermined range.
分子内にアミド結合を有するジアミンとしては、4-アミノ-N-(4-アミノフェニル)ベンズアミドが好ましい。アミド結合を有するジアミンは全ジアミン中の70質量%以上が好ましく、80質量%以上、さらには90質量%以上の使用が好ましい。
また、トリフルオロメチル基を分子内に有するジアミンとしては、2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル、1,4-ビス(4-アミノ-2-トリフルオロメチルフェノキシ)ベンゼン、2,2’-トリフルオロメチル-4,4’-ジアミノジフェニルエーテルが好ましい。これら分子内にフッ素原子を有するジアミン化合物、特にトリフルオロメチル基を分子内に有するジアミンを使用する場合に、その使用量は、全ジアミン中の70質量%以上が好ましく、80質量%以上、さらには90質量%以上の使用が好ましい。As the diamine having an amide bond in the molecule, 4-amino-N-(4-aminophenyl)benzamide is preferred. The diamine having an amide bond is preferably used in an amount of 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more in the total diamine.
Diamines having a trifluoromethyl group in the molecule include 2,2′-ditrifluoromethyl-4,4′-diaminobiphenyl and 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene. , 2,2′-trifluoromethyl-4,4′-diaminodiphenyl ether are preferred. When using a diamine compound having a fluorine atom in the molecule, particularly a diamine having a trifluoromethyl group in the molecule, the amount used is preferably 70% by mass or more, preferably 80% by mass or more, of the total diamine. is preferably used in an amount of 90% by mass or more.
本発明における(b)層に用いられるポリイミドは、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが5以下であり、全光線透過率が90%以上であるポリイミドであることが好ましい。
かかる(b)層に用いられるポリイミドとしては、芳香族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、少なくとも分子内にイオウ原子を有するジアミンを70質量%以上含有するジアミンから得られる化学構造からなるポリイミドを例示することができる。
また、(b)層に好適なポリイミドとして、少なくともトリフルオロメチル基を分子内に含有するテトラカルボン酸を30質量%以上含有するテトラカルボン酸無水物と、少なくともトリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミドを例示することができる。The polyimide used for the layer (b) in the present invention is preferably a polyimide having a yellow index of 5 or less and a total light transmittance of 90% or more when made into a film having a thickness of 25±2 μm alone. .
The polyimide used in the layer (b) includes a tetracarboxylic anhydride containing 70% by mass or more of an aromatic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having at least a sulfur atom in the molecule. A polyimide having a chemical structure obtained from can be exemplified.
Further, as a polyimide suitable for the (b) layer, a tetracarboxylic anhydride containing 30% by mass or more of a tetracarboxylic acid containing at least a trifluoromethyl group in the molecule and at least a trifluoromethyl group in the molecule A polyimide having a chemical structure obtained by condensation polymerization with a diamine containing 70% by mass or more of diamine can be exemplified.
(b)層のポリイミドに好ましく用いられる芳香族テトラカルボン酸無水物としては、4,4’-オキシジフタル酸、ピロメリット酸、3,3’,4,4’-ビフェニルテトラカルボン酸、が好ましい。(b)層のポリイミドに用いられる芳香族テトラカルボン酸二無水物は、(b)層ポリイミドの全テトラカルボン酸の70質量%以上が好ましく、より好ましくは80質量%以上であり、さらに好ましくは90質量%以上であり、なおさらに好ましくは95質量%以上である。芳香族テトラカルボン酸の含有量を所定範囲に収めることにより耐熱性が改善される。 As the aromatic tetracarboxylic acid anhydride preferably used in the polyimide of layer (b), 4,4'-oxydiphthalic acid, pyromellitic acid, and 3,3',4,4'-biphenyltetracarboxylic acid are preferred. The aromatic tetracarboxylic dianhydride used in the (b) layer polyimide is preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 80% by mass or more of the total tetracarboxylic acid in the (b) layer polyimide It is 90% by mass or more, and still more preferably 95% by mass or more. The heat resistance is improved by setting the content of the aromatic tetracarboxylic acid within a predetermined range.
(b)層のポリイミドに用いられるトリフルオロメチル基を分子内に含有するテトラカルボン酸としては、4,4’-(2,2-ヘキサフルオロイソプロピリデン)ジフタル酸二無水物が好ましい。(b)層のポリイミドに用いられるトリフルオロメチル基を分子内に含有するテトラカルボン酸は、(b)層ポリイミドの全テトラカルボン酸の30質量%以上が好ましく、より好ましくは45質量%以上であり、さらに好ましくは60質量%以上であり、なおさらに好ましくは80質量%以上である。トリフルオロメチル基を分子内に含有するテトラカルボン酸の含有量を所定範囲に収めることにより無色透明性が改善される。 4,4'-(2,2-hexafluoroisopropylidene)diphthalic dianhydride is preferable as the tetracarboxylic acid containing a trifluoromethyl group in the molecule used in the polyimide of the layer (b). The tetracarboxylic acid containing a trifluoromethyl group in the molecule used in the polyimide layer (b) is preferably 30% by mass or more, more preferably 45% by mass or more, of the total tetracarboxylic acid in the polyimide layer (b). more preferably 60% by mass or more, and even more preferably 80% by mass or more. The colorless transparency is improved by keeping the content of the tetracarboxylic acid containing a trifluoromethyl group in the molecule within a predetermined range.
本発明の(b)層として好ましく用いられるポリイミドにおいて、好ましく用いられるジアミンは少なくとも分子内にイオウ原子を有するジアミン、および/またはトリフルオロメチル基を分子内に有するジアミンである。
分子内にイオウ原子を有するジアミンとしては、3,3’-ジアミノジフェニルスルホン、3,4’-ジアミノジフェニルスルホン、4,4’-ジアミノジフェニルスルホン、を用いることができる。本発明では、分子内にイオウ原子を有するジアミンを70質量%以上、好ましくは80質量%以上、さらに好ましくは90質量%以上含有するジアミンを用いることで、芳香族テトラカルボン酸無水物と組み合わせた場合にも無色透明性を得ることができる。
トリフルオロメチル基を有するジアミンとしては、2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル、1,4-ビス(4-アミノ-2-トリフルオロメチルフェノキシ)ベンゼン、2,2’-トリフルオロメチル-4,4’-ジアミノジフェニルエーテルが好ましい。
これら分子内にフッ素原子を有するジアミン化合物、特にトリフルオロメチル基を分子内に有するジアミンを使用する場合に使用量は、全ジアミン中の70質量%以上が好ましく、80質量%以上、さらには90質量%以上の使用が好ましい。In the polyimide preferably used as the (b) layer of the present invention, the diamine preferably used is a diamine having at least a sulfur atom in the molecule and/or a diamine having a trifluoromethyl group in the molecule.
3,3'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone, and 4,4'-diaminodiphenylsulfone can be used as the diamine having a sulfur atom in the molecule. In the present invention, a diamine containing 70% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more of a diamine having a sulfur atom in the molecule is used in combination with an aromatic tetracarboxylic acid anhydride. Colorless transparency can be obtained also in the case.
Diamines having a trifluoromethyl group include 2,2′-ditrifluoromethyl-4,4′-diaminobiphenyl, 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene, 2,2′ -trifluoromethyl-4,4'-diaminodiphenyl ether is preferred.
When using a diamine compound having a fluorine atom in the molecule, particularly a diamine having a trifluoromethyl group in the molecule, the amount used is preferably 70% by mass or more, 80% by mass or more, and further 90% by mass of the total diamine. It is preferable to use at least 10% by mass.
本発明における(a)層のポリイミド、(b)層のポリイミドは、単独で厚さ25±2μmのフィルムとした際のイエローインデックスと全光線透過率、機械特性などにより特徴づけられる。ここに単独で厚さ25±2μmのフィルムとする操作は、実験室で可能なスケールの評価であり、該ポリイミドの溶液ないしポリイミド前駆体の溶液を、10cm四方、好ましくは20cm四方以上のサイズのガラス板に塗布し、まず120℃までの温度で予備加熱して残溶剤量が塗膜の40質量%以下となるまで予備加熱・乾燥し、さらに窒素などの不活性気体中で300℃にて20分間加熱して得られたフィルムを評価して得られる数値である。物性調整のために滑剤、フィラーなどの無機成分を含有する場合はそれらを含んだ状態の溶液を用いて得られたフィルムの物性数値を用いる。 The polyimide layer (a) and the polyimide layer (b) in the present invention are characterized by their yellow index, total light transmittance, mechanical properties, etc. when made into a film having a thickness of 25±2 μm. Here, the operation to form a film with a thickness of 25 ± 2 µm alone is an evaluation on a scale possible in a laboratory, and the polyimide solution or polyimide precursor solution is 10 cm square, preferably 20 cm square or more. It is applied to a glass plate, first preheated at a temperature of up to 120°C, preheated and dried until the amount of residual solvent is 40% by mass or less of the coating film, and further at 300°C in an inert gas such as nitrogen. It is a numerical value obtained by evaluating a film obtained by heating for 20 minutes. When inorganic components such as lubricants and fillers are contained for adjustment of physical properties, numerical values of the physical properties of the film obtained using a solution containing them are used.
本発明における(a)層のポリイミド、(b)層のポリイミドには、それぞれ滑剤(フィラー)を含有することができる。滑剤としては、無機フィラーであっても有機フィラーであっても良いが、無機フィラーであることが好ましい。滑剤としては、特に限定されず、シリカ、カーボン、セラミック等が挙げられ、中でもシリカであることが好ましい。これら滑剤を単独で使用しても良いし、2種類以上を併用してもよい。滑剤の平均粒子径は10nm以上であることが好ましく、より好ましくは30nm以上であり、さらに好ましくは50nm以上である。また、1μm以下であることが好ましく、より好ましくは500nm以下であり、さらに好ましくは100nm以下である。(a)層のポリイミド、(b)層のポリイミドにおける滑剤の含有量は、0.01質量%以上であることが好ましい。ポリイミドフィルムの平滑性が良好となることから、より好ましくは0.02質量%以上であり、さらに好ましくは0.05質量%以上であり、特に好ましくは0.1質量%以上である。また、透明性の観点からは、30質量%以下であることが好ましく、より好ましくは20質量%以下であり、さらに好ましくは10質量%以下であり、特に好ましくは5質量%以下である。 The polyimide layer (a) and the polyimide layer (b) in the present invention may each contain a lubricant (filler). The lubricant may be an inorganic filler or an organic filler, but an inorganic filler is preferred. The lubricant is not particularly limited, and includes silica, carbon, ceramics, etc. Among them, silica is preferable. These lubricants may be used alone, or two or more of them may be used in combination. The average particle size of the lubricant is preferably 10 nm or more, more preferably 30 nm or more, and still more preferably 50 nm or more. Also, it is preferably 1 μm or less, more preferably 500 nm or less, and still more preferably 100 nm or less. The content of the lubricant in the polyimide of layer (a) and the polyimide of layer (b) is preferably 0.01% by mass or more. It is more preferably 0.02% by mass or more, still more preferably 0.05% by mass or more, and particularly preferably 0.1% by mass or more because the smoothness of the polyimide film is improved. From the viewpoint of transparency, the content is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less, and particularly preferably 5% by mass or less.
以下に本発明の多層ポリイミドフィルムを得るための製造方法について説明する。本発明の多層ポリイミドフィルムのうち、2層構成のポリイミドフィルムは、
好ましくは、温度が10℃以上40℃以下、湿度が10%以上55%以下の大気中または不活性気体中にて、1:(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を仮支持体に塗布し、塗膜a1を得る工程、
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:全層を加熱し、全層基準の残溶剤量が0.5質量%以下である積層体を得る工程、
を経て作製することができる。
前記仮支持体は長尺でフレキシブルなものであることが好ましい。また、3の工程における加熱時間は5分以上60分以下であることが好ましい。なお、3の工程における全層基準の残溶剤量は塗膜ab1のみの質量から求めるものとし、仮支持体の質量は含めないものとする。また、2の工程における100秒の起算点は、(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液の仮支持体への塗布完了後である。以下の操作においても同様とする。
さらに、3の工程を二段階に分けて、
3’:全層基準の残溶剤量が8質量%以上40質量%となるまで、5分以上45分以下の時間をかけて加熱した後に仮支持体から剥離し、自己支持性のあるフィルムを得る工程、
4:前記自己支持性のあるフィルムの両端を把持し、さらに全層基準の残溶剤量が0.5質量%以下となるまで加熱する工程、
としても良い。自己支持性のあるフィルムの段階で仮支持体から剥離することにより、乾燥並びに化学反応によって生成する副生物をすみやかにフィルムから排出することが可能となり、さらに表裏の物性差、構造差を小さくすることができる。The manufacturing method for obtaining the multilayer polyimide film of the present invention is described below. Among the multilayer polyimide films of the present invention, the polyimide film having a two-layer structure is
Preferably, the temperature is 10 ° C. or higher and 40 ° C. or lower and the humidity is 10% or higher and 55% or lower in the atmosphere or in an inert gas, 1: (a) Temporarily supporting the polyimide solution or polyimide precursor solution for layer formation Applying to the body to obtain a coating film a1,
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
can be made via
The temporary support is preferably long and flexible. Also, the heating time in step 3 is preferably 5 minutes or more and 60 minutes or less. The amount of residual solvent on the basis of all layers in step 3 is obtained from the mass of the coating film ab1 only, and does not include the mass of the temporary support. In addition, the starting point of 100 seconds in the step 2 is after the completion of applying the (a) layer-forming polyimide solution or polyimide precursor solution to the temporary support. The same applies to the following operations.
Furthermore, the process of 3 is divided into two stages,
3′: After heating for 5 minutes or more and 45 minutes or less until the residual solvent amount based on all layers reaches 8% by mass or more and 40% by mass, peel from the temporary support to form a self-supporting film. the step of obtaining
4: A step of holding both ends of the self-supporting film and further heating until the amount of residual solvent on the basis of all layers is 0.5% by mass or less,
It is good as By peeling off the temporary support at the stage of the self-supporting film, it is possible to quickly discharge the by-products generated by drying and chemical reaction from the film, and further reduce the difference in physical properties and structure between the front and back. be able to.
また、3層以上のフィルムとする場合には、前記1および2の後にもう一度(a)層ポリイミド溶液またはポリイミド前駆体溶液を塗布すればよく、(a)層、(b)層をさらに繰り返して塗布することでさらに多層のフィルムを得ることができる。 In the case of a film having three or more layers, the (a) layer polyimide solution or polyimide precursor solution may be applied once again after the above 1 and 2, and the (a) layer and the (b) layer are further repeated. A multi-layered film can be obtained by coating.
本発明では、ポリイミド溶液またはポリイミド前駆体溶液の塗布を、温度が10℃以上40℃以下、好ましくは15℃以上35℃以下、湿度が10%RH以上55%RH以下、好ましくは20%RH以上50%RHの大気中または不活性気体中にて、長尺でフレキシブルな仮支持体上に行うことが好ましい。かつ、一工程前の層を塗布した後に100秒以内、好ましくは50秒以内、さらに好ましくは25秒以内に次の層を塗布することが好ましい。次の層を塗布するまでの時間は早い方が好ましいため下限は特に限定されないが、工業的には1秒以上であれば良く、2秒以上であっても差し支えない。塗布方法としては、最初に塗布される層は、コンマコーター、バーコーター、スリットコーターなどを用いて塗布可能であり、二層目以後はダイコーター、カーテンコーター、スプレーコーターなどで塗布することができる。また多層ダイを用いることにより、これら複数の層を事実上同時に塗布することも可能である。 In the present invention, the polyimide solution or polyimide precursor solution is applied at a temperature of 10° C. or higher and 40° C. or lower, preferably 15° C. or higher and 35° C. or lower, and a humidity of 10% RH or higher and 55% RH or lower, preferably 20% RH or higher. It is preferably carried out on a long flexible temporary support in the atmosphere of 50% RH or in an inert gas. In addition, it is preferable to apply the next layer within 100 seconds, preferably within 50 seconds, more preferably within 25 seconds after applying the layer one step before. Since it is preferable that the time until the next layer is applied is as short as possible, the lower limit is not particularly limited. As for the coating method, the first layer can be coated using a comma coater, bar coater, slit coater, etc., and the second and subsequent layers can be coated using a die coater, curtain coater, spray coater, etc. . It is also possible to apply these multiple layers virtually simultaneously by using a multi-layer die.
溶液を塗布する環境は大気中ないし不活性気体中であることが好ましい。不活性気体とは、実質的には酸素濃度が低い気体と解釈してよく、経済的な観点から窒素、ないし二酸化炭素を用いればよい。 The environment in which the solution is applied is preferably in the air or in an inert gas. The inert gas may be interpreted as a gas having a substantially low oxygen concentration, and nitrogen or carbon dioxide may be used from an economical point of view.
塗布環境における温度は、塗液の粘性に影響し、二種の塗液が重ねられた際に界面において二種の塗液が互いに混ざりあって遷移層を形成する際の遷移層厚さの形成に影響する。本発明のポリイミド溶液ないしポリイミド前駆体溶液の粘度は、特に二層目以後の非接触式の塗布法において適切な粘度範囲に調整されることが好ましく、かかる温度域が二層界面の混ざりあいにおいても該粘度範囲の流動性を適切に保つことに寄与する。 The temperature in the coating environment affects the viscosity of the coating fluid and the formation of the transition layer thickness when the two coating fluids mix with each other at the interface to form the transition layer when the two coating fluids are superimposed. affects The viscosity of the polyimide solution or polyimide precursor solution of the present invention is preferably adjusted to an appropriate viscosity range, particularly in the non-contact coating method for the second and subsequent layers, and such a temperature range is in the mixing of the two-layer interface. also contributes to maintaining appropriate fluidity in this viscosity range.
ポリイミド溶液、ないしポリイミド前駆体溶液に使用される溶剤の多くは吸湿性があり、溶剤が吸湿して溶剤の含水率があがると樹脂成分の溶解度が下がり、溶解成分が溶液内に析出し、溶液粘度の急激な上昇を生じる場合がある。塗布された後に、かかる状況が生じると、適切な厚さの遷移層形成が阻害される。湿度を所定範囲に収めることにより、100秒以内程度の時間であれば、このような溶解成分の析出を十分に防ぐことが可能である。 Many of the solvents used for polyimide solutions and polyimide precursor solutions are hygroscopic. When the solvent absorbs moisture and the water content of the solvent increases, the solubility of the resin component decreases, the dissolved component precipitates in the solution, and the solution A rapid increase in viscosity may occur. After application, if such a situation occurs, formation of a transition layer of adequate thickness will be inhibited. By keeping the humidity within a predetermined range, it is possible to sufficiently prevent the precipitation of such dissolved components within a period of about 100 seconds.
本発明で用いられる仮支持体上としては、ガラス、金属板、金属ベルト、金属ドラム、高分子フィルム、金属箔などを用いることができる。本発明では長尺でフレキシブルな仮支持体を用いることが好ましく、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリイミドなどのフィルムを仮支持体として用いることができる。仮支持体表面に離型処理を施すことは好ましい態様のひとつである。 Glass, a metal plate, a metal belt, a metal drum, a polymer film, a metal foil, etc. can be used as the temporary support used in the present invention. In the present invention, it is preferable to use a long and flexible temporary support, and a film of polyethylene terephthalate, polyethylene naphthalate, polyimide, or the like can be used as the temporary support. It is one of preferred embodiments to subject the surface of the temporary support to release treatment.
本発明では、全ての層が塗布された後、加熱処理により乾燥及び必要に応じて化学反応を行わせる。ポリイミド溶液を用いた場合には、溶媒除去という意味合いで単に乾燥すればよいが、ポリイミド前駆体溶液を用いた場合には乾燥と、化学反応の両方が必要となる。ここにポリイミド前駆体とは好ましくはポリアミド酸ないしポリイソイミドの形態である。ポリアミド酸をポリイミドに転化させるには脱水縮合反応が必要である。脱水縮合反応は加熱のみでも可能であるが、必要に応じてイミド化触媒を作用させることもできる。ポリイソイミドの場合にも加熱によりイソイミド結合からイミド結合への転化をさせることができる。また適度な触媒を併用することも可能である。
最終的なフィルムの残溶剤量は、フィルム全層の平均値として 残溶剤量が0.5質量%以下、好ましくは0.2質量%以下、さらに好ましくは0.08質量%以下である。加熱時間は、5分以上60分以下、好ましくは6分以上50分以下、さらに好ましくは7分以上30分以下の時間が好ましい。加熱時間を所定範囲に収めることにより、溶媒の除去、必要な化学反応を完結できるとともに、適切な厚さに遷移層を制御することができ、かつ無色透明性、機械特性、特には破断伸度を高く保つことができる。加熱時間が短い場合には遷移層の形成が遅れ、また加熱時間が必要以上に長いとフィルム着色が強くなり、かつフィルムの破断伸度が低下する場合がある。In the present invention, after all the layers have been applied, they are subjected to heat treatment to dry and, if necessary, to undergo chemical reactions. When a polyimide solution is used, it may be simply dried in the sense of solvent removal, but when a polyimide precursor solution is used, both drying and chemical reaction are required. Polyimide precursors are preferably in the form of polyamic acids or polyisoimides. A dehydration condensation reaction is required to convert polyamic acid to polyimide. The dehydration-condensation reaction can be carried out only by heating, but if necessary, an imidization catalyst can be used. In the case of polyisoimide as well, isoimide bonds can be converted to imide bonds by heating. Moreover, it is also possible to use an appropriate catalyst together.
The residual solvent content of the final film is 0.5% by mass or less, preferably 0.2% by mass or less, more preferably 0.08% by mass or less as an average value of all layers of the film. The heating time is preferably 5 minutes or more and 60 minutes or less, preferably 6 minutes or more and 50 minutes or less, more preferably 7 minutes or more and 30 minutes or less. By keeping the heating time within a predetermined range, the removal of the solvent and the necessary chemical reaction can be completed, the transition layer can be controlled to an appropriate thickness, and colorless transparency, mechanical properties, especially breaking elongation can be kept high. If the heating time is short, the formation of the transition layer will be delayed, and if the heating time is longer than necessary, the film may be highly colored and the breaking elongation of the film may be lowered.
本発明では、塗布された溶液が加熱により乾燥ないし化学反応を生じ自己支持性で仮支持体から剥離可能であれば、加熱工程の途中で仮支持体から剥離してもよい。
より具体的には、全フィルム層の平均残溶剤量が8質量%以上40質量%の範囲に達するまで、5分以上45分以下、好ましくは6分以上30分以下、さらに好ましくは7分以上20分以下の時間をかけて加熱した後に仮支持体から自己支持性のあるフィルムを剥離し、さらに前記自己支持性のあるフィルムの両端をクリップで挟む、あるいはピンに突き刺して把持し、加熱環境内を搬送して、さらに全層基準の残溶剤量が0.5質量%以下、好ましくは0.2質量%以下、さらに好ましくは0.08質量%以下となるまで加熱することにより多層ポリイミドフィルムを得る工程を採用することができる。
加熱工程途中で仮支持体から自己支持性フィルムを剥離し、さらに加熱を継続することにより、溶媒の蒸発、ポリアミド酸が脱水閉環してポリイミドに転化する際に生じる水をフィルムの両面から速やかに排出することができ、表裏の物性差の小さいフィルムを得ることができる。In the present invention, if the applied solution dries or undergoes a chemical reaction by heating and is self-supporting and can be peeled off from the temporary support, it may be peeled off from the temporary support during the heating step.
More specifically, it takes 5 minutes or more and 45 minutes or less, preferably 6 minutes or more and 30 minutes or less, more preferably 7 minutes or more, until the average amount of residual solvent in all film layers reaches the range of 8% by mass or more and 40% by mass. After heating for 20 minutes or less, the self-supporting film is peeled off from the temporary support, and both ends of the self-supporting film are clamped with clips or pierced with pins and held, and the heating environment The multilayer polyimide film is conveyed inside and heated until the residual solvent amount based on all layers is 0.5% by mass or less, preferably 0.2% by mass or less, more preferably 0.08% by mass or less. can be adopted.
By peeling the self-supporting film from the temporary support in the middle of the heating process and continuing the heating process, the evaporation of the solvent and the water generated when polyamic acid converts to polyimide through dehydration and ring closure can be quickly removed from both sides of the film. It can be discharged, and a film with a small physical property difference between the front and back can be obtained.
本発明では、前記自己支持性フィルムを、延伸してもよい。延伸はフィルム長手方向(MD方向)フィルムの幅方向(TD)のいずれでも良く、両方でも良い。フィルム長手方向の延伸は搬送ロールの速度差あるいは搬送ロールと、両端を把持した後の速度の差を使って行うことができる。フィルム幅方向の延伸は把持したクリプないしピン間を広げることにより行うことができる。延伸と加熱は同時に行っても良い。延伸倍率は1.00倍~2.5倍の間で任意に選ぶことができる。本発明において、フィルムを多層構造とすることで、単独では延伸しにくいポリイミドと、延伸可能なポリイミドを組み合わせることにより、延伸しにくい、すなわち延伸により破断の生じやすい組成にポリイミドも延伸が可能となり、機械物性を向上させることができる。
なおポリイミドは、乾燥ないし脱水縮合によりフィルム化途中で体積が小さくなるため、両端を等間隔で把持している状態(延伸倍率が1.00倍)であっても延伸効果が発現する。In the present invention, the self-supporting film may be stretched. Stretching may be performed in either the longitudinal direction (MD direction) or the width direction (TD) of the film, or both. Stretching in the longitudinal direction of the film can be carried out using the speed difference between the transport rolls or the speed difference between the transport rolls and the speed after both ends are gripped. Stretching in the width direction of the film can be carried out by widening the gripped clips or pins. Stretching and heating may be performed simultaneously. The draw ratio can be arbitrarily selected between 1.00 times and 2.5 times. In the present invention, by making the film into a multilayer structure, by combining a polyimide that is difficult to stretch alone and a polyimide that can be stretched, it is possible to stretch the polyimide to a composition that is difficult to stretch, that is, is likely to break when stretched. Mechanical properties can be improved.
Since the volume of polyimide decreases during film formation due to drying or dehydration condensation, the stretching effect is exhibited even when both ends are held at equal intervals (stretching ratio is 1.00).
本発明の多層ポリイミドフィルムにおける(a)層、(b)層には、滑剤をポリイミド中に添加含有せしめるなどして層(フィルム)表面に微細な凹凸を付与しフィルムの滑り性などを改善することが好ましい。滑剤は外層となる(a)層にのみ添加する形態が好ましい。
滑剤としては、無機や有機の0.03μm~3μm程度の平均粒子径を有する微粒子が使用でき、具体例として、酸化チタン、アルミナ、シリカ、炭酸カルシウム、燐酸カルシウム、燐酸水素カルシウム、ピロ燐酸カルシウム、酸化マグネシウム、酸化カルシウム、粘土鉱物などが挙げられる。滑剤の含有量はポリイミド(ポリマー)中、0.1質量%以上であることが好ましく、より好ましくは0.4質量%以上である。また50質量%以下であることが好ましく、より好ましくは30質量%以下である。For the layers (a) and (b) in the multilayer polyimide film of the present invention, fine unevenness is imparted to the layer (film) surface by, for example, adding a lubricant to the polyimide to improve the slipperiness of the film. is preferred. A form in which the lubricant is added only to the layer (a), which is the outer layer, is preferred.
As the lubricant, inorganic or organic fine particles having an average particle diameter of about 0.03 μm to 3 μm can be used. Specific examples include titanium oxide, alumina, silica, calcium carbonate, calcium phosphate, calcium hydrogen phosphate, calcium pyrophosphate, Examples include magnesium oxide, calcium oxide, and clay minerals. The lubricant content in the polyimide (polymer) is preferably 0.1% by mass or more, more preferably 0.4% by mass or more. Moreover, it is preferably 50% by mass or less, more preferably 30% by mass or less.
以下、本発明に関し実施例を用いて詳細に説明するが、本発明はその要旨を超えない限り、以下の実施例に限定されるものではない。なお、製造例、実施例中の各物性値などは以下の方法で測定した。 Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to the following examples as long as the gist thereof is not exceeded. In addition, each physical property value in the production examples and examples was measured by the following methods.
<ポリイミドフィルムの厚さ測定>
マイクロメーター(ファインリューフ社製、ミリトロン1245D)を用いて測定した。<Thickness measurement of polyimide film>
It was measured using a micrometer (Millitron 1245D manufactured by Finereuf).
<引張弾性率、引張強度(破断強度)、および、破断伸度>
フィルムを、塗布時の流れ方向(MD方向)および幅方向(TD方向)にそれぞれ100mm×10mmの短冊状に切り出したものを試験片とした。引張試験機(島津製作所製、オートグラフ(R) 機種名AG-5000A)を用い、引張速度50mm/分、チャック間距離40mmの条件で、MD方向、TD方向それぞれについて、引張弾性率、引張強度及び破断伸度を求め、MD方向とTD方向の測定値の平均値を求めた。<Tensile modulus, tensile strength (breaking strength), and breaking elongation>
A strip of 100 mm×10 mm was cut from the film in the flow direction (MD direction) and the width direction (TD direction) at the time of application to prepare a test piece. Using a tensile tester (manufactured by Shimadzu Corporation, Autograph (R) model name AG-5000A), under the conditions of a tensile speed of 50 mm / min and a distance between chucks of 40 mm, the tensile modulus and tensile strength are measured in each of the MD and TD directions. And the breaking elongation was determined, and the average value of the measured values in the MD direction and the TD direction was determined.
<線膨張係数(CTE)>
フィルムを、塗布時の流れ方向(MD方向)および幅方向(TD方向)において、下記条件にて伸縮率を測定し、30℃~45℃、45℃~60℃のように15℃の間隔での伸縮率/温度を測定し、この測定を300℃まで行い、全測定値の平均値をCTEとして算出し、さらにMD方向とTD方向の測定値の平均値を求めた。
機器名 ; MACサイエンス社製TMA4000S
試料長さ ; 20mm
試料幅 ; 2mm
昇温開始温度 ; 25℃
昇温終了温度 ; 300℃
昇温速度 ; 5℃/min
雰囲気 ; アルゴン<Coefficient of linear expansion (CTE)>
The film is stretched in the machine direction (MD direction) and width direction (TD direction) at the time of coating, and the expansion ratio is measured under the following conditions, and at intervals of 15 ° C. such as 30 ° C. to 45 ° C. and 45 ° C. to 60 ° C. This measurement was performed up to 300° C., the average value of all measured values was calculated as CTE, and the average value of the measured values in the MD and TD directions was obtained.
Equipment name; TMA4000S manufactured by MAC Science
Sample length; 20mm
Sample width; 2 mm
Heating start temperature; 25°C
Heating end temperature; 300°C
Temperature rise rate; 5°C/min
atmosphere; argon
<遷移層厚さ>
SAICAS DN-20S型(ダイプラ・ウィンテス社)によってフィルムの斜め切削面を作製し、次いでこの斜め切削面を顕微IRCary 620 FTIR (Agilent社)によって、ゲルマニウム結晶(入射角30°)を用いた顕微ATR法でスペクトルを求め、(a)層、(b)層各々の特徴的なピークの増減と、あらかじめ求めておいた検量線から組成の傾斜を質量比換算で求め、(a)層組成/(b)層組成の比が5/95質量比~95/5質量比の範囲の厚さを遷移層厚さとして求めた。<Transition layer thickness>
A slanted cut surface of the film was prepared by SAICAS DN-20S (Daipla Wintes), and then this slanted cut surface was subjected to microscopic ATR using a germanium crystal (incidence angle of 30°) using a microscopic IRCary 620 FTIR (Agilent). The spectrum is obtained by the method, and the increase and decrease in the characteristic peaks of each of the (a) layer and the (b) layer, and the inclination of the composition is obtained in terms of mass ratio from the calibration curve obtained in advance, and the (a) layer composition / ( b) The transition layer thickness was obtained when the layer composition ratio was in the range of 5/95 mass ratio to 95/5 mass ratio.
<ヘイズ>
HAZEMETER(NDH5000、日本電色社製)を用いてフィルムのヘイズを測定した。光源としてはD65ランプを使用した。尚、同様の測定を3回行い、その算術平均値を採用した。<Haze>
The haze of the film was measured using a Hazemeter (NDH5000, manufactured by Nippon Denshoku Co., Ltd.). A D65 lamp was used as the light source. In addition, the same measurement was performed 3 times and the arithmetic mean value was adopted.
<全光線透過率>
HAZEMETER(NDH5000、日本電色社製)を用いてフィルムの全光線透過率(TT)を測定した。光源としてはD65ランプを使用した。尚、同様の測定を3回行い、その算術平均値を採用した。
結果を表2~6に示す。<Total light transmittance>
The total light transmittance (TT) of the film was measured using a Hazemeter (NDH5000, manufactured by Nippon Denshoku Co., Ltd.). A D65 lamp was used as the light source. In addition, the same measurement was performed 3 times and the arithmetic mean value was adopted.
The results are shown in Tables 2-6.
<イエローインデックス>
カラーメーター(ZE6000、日本電色社製)およびC2光源を使用して、ASTM D1925に準じてフィルムの三刺激値XYZ値を測定し、下記式により黄色度指数(YI)を算出した。尚、同様の測定を3回行い、その算術平均値を採用した。
YI=100×(1.28X-1.06Z)/Y<Yellow index>
Using a color meter (ZE6000, manufactured by Nippon Denshoku Co., Ltd.) and a C2 light source, the tristimulus values XYZ values of the film were measured according to ASTM D1925, and the yellowness index (YI) was calculated according to the following formula. In addition, the same measurement was performed 3 times and the arithmetic mean value was adopted.
YI=100×(1.28X−1.06Z)/Y
<フィルムの反り>
100mm×100mmのサイズの正方形に裁断したフィルムを試験片とし、室温で平面上に試験片を凹状となるように静置し、四隅の平面からの距離(h1rt、h2rt、h3rt、h4rt:単位mm)を測定し、その平均値を反り量(mm)とした。<Warp of film>
A film cut into a square with a size of 100 mm × 100 mm is used as a test piece, and the test piece is placed on a flat surface at room temperature so that it becomes concave, and the distance from the flat surface at the four corners (h1rt, h2rt, h3rt, h4rt: unit mm ) was measured, and the average value was taken as the amount of warpage (mm).
〔製造例1 ポリアミド酸溶液Aの製造〕
窒素導入管、還流管、攪拌棒を備えた反応容器内を窒素置換した後、22.73質量部の4,4’-ジアミノベンズアニリド(DABAN)を201.1質量部のN,N-ジメチルアセトアミド(DMAc)に溶解させ、次いで、19.32質量部の1,2,3,4-シクロブタンテトラカルボン酸無二水物(CBDA)を固体のまま分割添加した後、室温で24時間攪拌した。その後、173.1質量部のDMAcを加え希釈し、NV(固形分)10質量%、還元粘度3.10dl/gのポリアミド酸溶液Aを得た。[Production Example 1 Production of polyamic acid solution A]
After purging the interior of a reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod with nitrogen, 22.73 parts by mass of 4,4'-diaminobenzanilide (DABAN) was added to 201.1 parts by mass of N,N-dimethyl. It was dissolved in acetamide (DMAc), then 19.32 parts by mass of 1,2,3,4-cyclobutanetetracarboxylic acid anhydride (CBDA) was added as a solid in portions, and then stirred at room temperature for 24 hours. . Thereafter, 173.1 parts by mass of DMAc was added for dilution to obtain a polyamic acid solution A having NV (solid content) of 10 mass % and reduced viscosity of 3.10 dl/g.
〔製造例2 (a)層形成用滑剤入りポリアミド酸溶液Asの製造)〕
製造例1で得られたポリアミド酸溶液Aに、さらに滑剤としてコロイダルシリカをジメチルアセトアミドに分散してなる分散体(日産化学工業製「スノーテックス(登録商標)DMAC-ST-ZL」)とをシリカ(滑剤)がポリアミド酸溶液中のポリマー固形分総量にて1.4質量%)になるように加え均一なポリアミド酸溶液Asを得た。[Production Example 2 (a) Production of layer-forming lubricant-containing polyamic acid solution As)]
In the polyamic acid solution A obtained in Production Example 1, a dispersion obtained by dispersing colloidal silica as a lubricant in dimethylacetamide (“Snowtex (registered trademark) DMAC-ST-ZL” manufactured by Nissan Chemical Industries) and silica. (Lubricant) was added so that the total polymer solid content in the polyamic acid solution was 1.4% by mass) to obtain a uniform polyamic acid solution As.
〔製造例3 ポリアミド酸溶液Bの製造〕
窒素導入管、還流管、攪拌棒を備えた反応容器内を窒素置換した後、32.02質量部の2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル(TFMB)を、279.9質量部のN,N-ジメチルアセトアミド(DMAc)に溶解させ、次いで、9.81質量部の1,2,3,4-シクロブタンテトラカルボン酸無二水物(CBDA)及び15.51質量部の4,4’-オキシジフタル酸二無水物(ODPA)をそれぞれ固体のまま分割添加した後、室温で24時間攪拌した。その後、固形分17質量%、還元粘度3.60dl/gのポリアミド酸溶液Bを得た。[Production Example 3 Production of polyamic acid solution B]
After purging the inside of a reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod, 32.02 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB) was added to 279.5 parts by mass. Dissolve in 9 parts by weight of N,N-dimethylacetamide (DMAc), then 9.81 parts by weight of 1,2,3,4-cyclobutanetetracarboxylic anhydride (CBDA) and 15.51 parts by weight 4,4′-oxydiphthalic dianhydride (ODPA) was added in portions as a solid, and then stirred at room temperature for 24 hours. Thereafter, a polyamic acid solution B having a solid content of 17% by mass and a reduced viscosity of 3.60 dl/g was obtained.
〔製造例4 (a)層形成用滑剤入りポリアミド酸溶液Bsの製造)〕
製造例3で得られたポリアミド酸溶液Bに、滑剤としてコロイダルシリカをジメチルアセトアミドに分散してなる分散体(日産化学工業製「スノーテックス(登録商標)DMAC-ST-ZL」)とをシリカ(滑剤)がポリアミド酸溶液中のポリマー固形分総量にて0.45質量%)になるように加え均一なポリアミド酸溶液Bsを得た。[Production Example 4 (a) Production of Polyamic Acid Solution Bs Containing Lubricant for Layer Formation)]
In the polyamic acid solution B obtained in Production Example 3, a dispersion obtained by dispersing colloidal silica as a lubricant in dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd. "Snowtex (registered trademark) DMAC-ST-ZL") and silica ( A uniform polyamic acid solution Bs was obtained by adding a lubricant) so that the total polymer solid content in the polyamic acid solution was 0.45% by mass).
〔製造例5 (b)層形成用ポリイミド溶液Cの製造〕
窒素導入管、ディーン・スターク装置及び還流管、温度計、攪拌棒を備えた反応容器に、窒素ガスを導入しながら、32.02質量部の2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル(TFMB)、230質量部のN,N-ジメチルアセトアミド(DMAc)を加えて完全に溶解させ、次いで、44.42質量部の4,4’-(2,2-ヘキサフルオロイソプロピリデン)ジフタル酸二無水物(6FDA)を固体のまま分割添加した後、室温で24時間攪拌した。その後、固形分25質量%、還元エンド1.10dl/gのポリアミド酸溶液Caaを得た。
次に、得られたポリアミド酸溶液CaaにDMAc204質量部を加えてポリアミド酸の濃度が15質量%になるように希釈した後、イミド化促進剤としてイソキノリン1.3質量部を加えた。次いで、ポリアミド酸溶液を攪拌しながら、イミド化剤として無水酢酸12.25質量部をゆっくりと滴下した。その後、24時間攪拌を続けて化学イミド化反応を行って、ポリイミド溶液Cpiを得た。
次に、得られたポリイミド溶液Cpi100質量部を攪拌装置と攪拌機を備えた反応容器に移し替え、攪拌しながらメタノール150質量部をゆっくりと滴下させたところ、粉体状の固体の析出が確認された。
その後、反応容器の内容物である粉末を脱水濾過し、さらにメタノールを用いて洗浄した後に50℃で24時間真空乾燥した後、260℃で更に5時間加熱し、ポリイミド粉体Cpdを得た。得られたポリイミド粉体20質量部を80質量部のDMAcに溶解させてポリイミド溶液Cを得た。[Production Example 5 (b) Production of layer-forming polyimide solution C]
32.02 parts by mass of 2,2'-ditrifluoromethyl-4,4' was introduced into a reaction vessel equipped with a nitrogen inlet tube, a Dean-Stark apparatus, a reflux tube, a thermometer, and a stirring rod while introducing nitrogen gas. -Diaminobiphenyl (TFMB), 230 parts by weight of N,N-dimethylacetamide (DMAc) are added and completely dissolved, and then 44.42 parts by weight of 4,4'-(2,2-hexafluoroisopropylidene ) Diphthalic dianhydride (6FDA) was added portionwise as a solid, followed by stirring at room temperature for 24 hours. Thereafter, a polyamic acid solution Caa having a solid content of 25% by mass and a reduction end of 1.10 dl/g was obtained.
Next, 204 parts by mass of DMAc was added to the resulting polyamic acid solution Caa to dilute it so that the polyamic acid concentration was 15% by mass, and then 1.3 parts by mass of isoquinoline was added as an imidization accelerator. Then, while stirring the polyamic acid solution, 12.25 parts by mass of acetic anhydride was slowly added dropwise as an imidizing agent. After that, stirring was continued for 24 hours to carry out a chemical imidization reaction to obtain a polyimide solution Cpi.
Next, 100 parts by mass of the obtained polyimide solution Cpi was transferred to a reaction vessel equipped with a stirrer and a stirrer, and 150 parts by mass of methanol was slowly added dropwise while stirring. rice field.
Thereafter, the powder contained in the reaction vessel was dehydrated and filtered, washed with methanol, vacuum dried at 50°C for 24 hours, and then heated at 260°C for 5 hours to obtain polyimide powder Cpd. A polyimide solution C was obtained by dissolving 20 parts by mass of the obtained polyimide powder in 80 parts by mass of DMAc.
〔製造例6 (b)層形成用ポリイミド溶液Dの製造〕
窒素導入管、ディーン・スターク装置及び還流管、温度計、攪拌棒を備えた反応容器に、窒素ガスを導入しながら、120.5質量部の4,4’-ジアミノジフェニルスルホン(4,4’-DDS)、51.6質量部の3,3’-ジアミノジフェニルスルホン(3,3’-DDS)、500質量部のガンマブチロラクトン(GBL)を加えた。続いて217.1質量部の4,4’-オキシジフタル酸無二水物(ODPA)、223質量部のGBL、260質量部のトルエンを室温で加えた後、内温160℃まで昇温し、160℃で1時間加熱還流を行い、イミド化を行った。イミド化完了後、180℃まで昇温し、トルエンを抜き出しながら反応を続けた。12時間反応後、オイルバスを外して室温に戻し、固形分が20質量%濃度となるようにGBLを加え、ポリイミド溶液Dを得た。[Production Example 6 (b) Production of layer-forming polyimide solution D]
120.5 parts by mass of 4,4′-diaminodiphenylsulfone (4,4′ -DDS), 51.6 parts by weight of 3,3′-diaminodiphenylsulfone (3,3′-DDS), and 500 parts by weight of gamma-butyrolactone (GBL) were added. Subsequently, 217.1 parts by mass of 4,4′-oxydiphthalic anhydride (ODPA), 223 parts by mass of GBL, and 260 parts by mass of toluene were added at room temperature, and then the internal temperature was raised to 160° C., The mixture was heated to reflux at 160° C. for 1 hour to effect imidization. After completion of imidization, the temperature was raised to 180° C., and the reaction was continued while extracting toluene. After reacting for 12 hours, the oil bath was removed and the temperature was returned to room temperature.
〔製造例7 ポリアミド酸溶液Eの製造〕
窒素導入管、還流管、攪拌棒を備えた反応容器に窒素雰囲気下、2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル(TFMB)161質量部とN-メチルー2-ピロリドン1090質量部を混合攪拌して溶解させた後、1,2,4,5-シクロヘキサンテトラカルボン酸ニ無水物(CHDA)112質量部を室温にて固体のまま分割添加し、室温下12時間攪拌した。次に共沸溶媒としてキシレン400質量部を添加して180℃に昇温して3時間反応を行い、共沸してくる生成水を分離した。水の流出が終わったことを確認し、1時間かけて190℃に昇温しながらキシレンを除去することでポリアミド酸溶液Eを得た。[Production Example 7 Production of polyamic acid solution E]
161 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB) and 1090 parts by mass of N-methyl-2-pyrrolidone were placed in a reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod under a nitrogen atmosphere. After dissolving by mixing and stirring, 112 parts by mass of 1,2,4,5-cyclohexanetetracarboxylic dianhydride (CHDA) was added portionwise as a solid at room temperature and stirred at room temperature for 12 hours. Next, 400 parts by mass of xylene was added as an azeotropic solvent, the temperature was raised to 180° C., and the reaction was carried out for 3 hours to separate the azeotropically produced water. After confirming that the outflow of water had ended, xylene was removed while the temperature was raised to 190° C. over 1 hour to obtain a polyamic acid solution E.
〔製造例8 (a)層形成用滑剤入りポリアミド酸溶液Esの製造)〕
製造例7で得られたポリアミド酸溶液Eに、滑剤としてコロイダルシリカをジメチルアセトアミドに分散してなる分散体(日産化学工業製「スノーテックス(登録商標)DMAC-ST-ZL」)とをシリカ(滑剤)がポリアミド酸溶液中のポリマー固形分総量にて1.0質量%)になるように加え均一なポリアミド酸溶液Esを得た。[Production Example 8 (a) Production of layer-forming lubricant-containing polyamic acid solution Es)]
In the polyamic acid solution E obtained in Production Example 7, a dispersion obtained by dispersing colloidal silica as a lubricant in dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd. "Snowtex (registered trademark) DMAC-ST-ZL") and silica ( A uniform polyamic acid solution Es was obtained by adding a lubricant) so that the total polymer solid content in the polyamic acid solution was 1.0% by mass).
〔製造例9 (b)層形成用フィラー入りポリアミド酸溶液Efの製造)〕
製造例7で得られたポリアミド酸溶液Eに、滑剤としてコロイダルシリカをジメチルアセトアミドに分散してなる分散体(日産化学工業製「スノーテックス(登録商標)DMAC-ST-ZL」)とをシリカ(滑剤)がポリアミド酸溶液中のポリマー固形分総量にて25質量%)になるように加えフィラー入りポリアミド酸溶液Efを得た。[Production Example 9 (b) Production of layer-forming filler-containing polyamic acid solution Ef)]
In the polyamic acid solution E obtained in Production Example 7, a dispersion obtained by dispersing colloidal silica as a lubricant in dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd. "Snowtex (registered trademark) DMAC-ST-ZL") and silica ( Lubricant) was added so that the total polymer solid content in the polyamic acid solution was 25% by mass) to obtain a filler-containing polyamic acid solution Ef.
製造例1~9にて得られたポリイミド溶液、ポリアミド酸溶液(ポリイミド前駆体溶液)を以下の方法でフィルム化し、光学特性、機械特性を測定した。結果を表1に示す。 The polyimide solutions and polyamic acid solutions (polyimide precursor solutions) obtained in Production Examples 1 to 9 were formed into films by the following method, and optical properties and mechanical properties were measured. Table 1 shows the results.
(単独で物性測定のためのフィルムを得る方法)
ポリイミド溶液またはポリアミド酸溶液を、一辺30cmのガラス板の中央部、おおむね20cm四方のエリアにバーコーターを用いて、最終厚さが25±2μmとなるように塗布し、ドライ窒素を静かに流したイナートオーブンにて100℃で30分間加熱し、塗膜の残溶剤量が40質量%以下であることを確認した後に、ドライ窒素で置換したマッフル炉にて300℃にて20分間加熱した。次いでマッフル炉から取り出し、乾燥塗膜(フィルム)の端をカッターナイフで起こし、慎重にガラスから剥離してフィルムを得る。(How to obtain a film for physical property measurement alone)
A polyimide solution or a polyamic acid solution was applied to the central part of a glass plate with a side of 30 cm and an area of about 20 cm square using a bar coater so that the final thickness was 25 ± 2 µm, and dry nitrogen was gently flowed. After heating at 100° C. for 30 minutes in an inert oven and confirming that the amount of residual solvent in the coating film was 40% by mass or less, heating was performed at 300° C. for 20 minutes in a muffle furnace purged with dry nitrogen. Then, it is taken out from the muffle furnace, the edges of the dried coating (film) are raised with a utility knife, and carefully separated from the glass to obtain a film.
(実施例1)
25℃45%RHに空調された大気中にて、製造例2で得たポリアミド酸溶液Asを、コンマコーターを用いてポリエチレンテレフタレート製フィルムA4100(東洋紡株式会社製、以下PETフィルムと略記する)の無滑材面上に最終膜厚が5μmとなるよう塗布し、続いて10秒後に製造例5で得たポリイミド溶液Cをポリアミド酸溶液Asの上に最終膜厚が20μmとなるようダイコーターによって塗布した。これを110℃にて10分間乾燥した。乾燥後に自己支持性を得たフィルムを支持体としてきたA4100フィルムから剥離し、ピンを配置したピンシートを有するピンテンターに通し、フィルム端部をピンに差し込むことにより把持し、フィルムが破断しないように、かつ不必要なたるみが生じないようにピンシート間隔を調整して搬送し、200℃で3分、250℃で3分、300℃で6分の条件で加熱し、イミド化反応を進行させた。その後、2分間で室温にまで冷却し、フィルムの両端の平面性が悪い部分をスリッターにて切り落とし、ロール状に巻き上げ、幅580mm、長さ100mのフィルム(実1)のロールを得た。
得られたフィルム(実1)の評価結果を表2に示す。(Example 1)
Polyamide acid solution As obtained in Production Example 2 was applied to a polyethylene terephthalate film A4100 (manufactured by Toyobo Co., Ltd., hereinafter abbreviated as PET film) using a comma coater in an air conditioned at 25° C. and 45% RH. After 10 seconds, the polyimide solution C obtained in Production Example 5 was coated on the polyamic acid solution As with a die coater so that the final film thickness was 20 μm. applied. It was dried at 110° C. for 10 minutes. After drying, the film obtained self-supporting property is separated from the A4100 film used as the support, passed through a pin tenter having a pin sheet on which pins are arranged, and gripped by inserting the ends of the film into the pins so as not to break the film. And conveyed by adjusting the pin sheet interval so that unnecessary slack does not occur, and heated under the conditions of 200 ° C. for 3 minutes, 250 ° C. for 3 minutes, and 300 ° C. for 6 minutes to advance the imidization reaction. rice field. After that, the film was cooled to room temperature for 2 minutes, and portions of the film having poor flatness at both ends were cut off with a slitter and rolled up into a roll to obtain a roll of film (Example 1) having a width of 580 mm and a length of 100 m.
Table 2 shows the evaluation results of the obtained film (Example 1).
(実施例2~4)
以下、表2に示す条件設定により、フィルム(実2)~(実4)、比較例フィルム(比1)を得た。同様に評価した結果を表2に示す。(Examples 2-4)
Films (Ex. 2) to (Ex. 4) and a comparative example film (Comp. 1) were obtained by setting the conditions shown in Table 2 below. Table 2 shows the results of the same evaluation.
(比較例1~4)
比較例1として、ポリアミド酸溶液Asのみを用いて、厚さ25μmとして実施例3と同じ条件にてフィルム(比1)を得た。同様にポリイミド溶液C、ポリアミド酸溶液Bsのみ、ポリイミド溶液Dのみを、それぞれ用いてフィルム(比2)~(比4)を得た。それぞれの評価結果を表3に示す。
フィルム(比1)~(比4)の機械特性値は、製造例で得られた試験片の数値より、高い破断強度と高い破断伸度を示している。この差はガラスに塗布したままでフィルム化を行った製造例フィルムに対して、熱処理途中で仮支持体であるPETフィルムから剥離し、フィルム表裏から溶剤および反応生成物を排出しつつフィルム化を行った場合の差を示している。(Comparative Examples 1 to 4)
As Comparative Example 1, a film (Comparison 1) was obtained under the same conditions as in Example 3 with a thickness of 25 μm using only the polyamic acid solution As. Similarly, films (ratio 2) to (ratio 4) were obtained using polyimide solution C, polyamic acid solution Bs alone, and polyimide solution D alone. Each evaluation result is shown in Table 3.
The mechanical property values of the films (Comparison 1) to (Comparison 4) show higher breaking strength and breaking elongation than those of the test pieces obtained in the production examples. This difference is due to the fact that the production example film, which was formed into a film while being coated on the glass, was peeled off from the PET film, which is a temporary support, during the heat treatment, and the film was formed while the solvent and reaction product were discharged from the front and back of the film. It shows the difference if you go.
(計算例1、2)
表4の計算例1欄に示した数値はフィルム(比1)と(比2)の評価結果の算術平均値である。また計算例2は実施例1~4における(a)層と(b)層の厚さ比により重み付けした平均値である。
実施例で得られたフィルムの評価結果と計算例とを比較すると、実施例で得られたフィルムはいずれも計算例1、計算例2よりもヘイズが低く、全光線透過率も高い。またイエローインデックスも小さい値を示しており、光学特性が改善されていることが示されている。また、引張強度、破断伸度ともに実施例の方が高い値となっており、機械特性についても改善されていることがわかる。
なお、反りについては、フィルム厚さ方向に非対称な構成となっているためである。(Calculation examples 1 and 2)
The numerical values shown in column 1 of calculation example in Table 4 are the arithmetic mean values of the evaluation results of films (comparison 1) and (comparison 2). Calculation Example 2 is an average value weighted by the thickness ratio of the (a) layer and the (b) layer in Examples 1-4.
Comparing the evaluation results of the films obtained in the examples with the calculation examples, the films obtained in the examples both have lower haze and higher total light transmittance than calculation examples 1 and 2. The yellow index also shows a small value, indicating that the optical properties are improved. In addition, both the tensile strength and the elongation at break are higher in the example, and it can be seen that the mechanical properties are also improved.
This is because the warp is asymmetrical in the thickness direction of the film.
(比較例5、6)
続いて、表5に示す条件に従って、ポリアミド酸溶液Asとポリイミド溶液Cを用いてフィルム(比5)(比6)を得た。評価結果を表5に示す。(a)層塗布から(b)層塗布までの時間間隔を長くした比較例5においてはヘイズの大幅な増加が見られた。加熱までの時間が長くなったために溶液が雰囲気中の水分を吸収したために塗膜中にて相分離構造が生じ、その形態を残したまま乾燥が進んだため白化が生じたものと推察される。また、遷移層厚さが厚くなっている。遷移層の存在は、(a)層と(b)層が、強固にかつ組成傾斜をもってなだらかに結合するために必要であるが、遷移層部分は(a)層と(b)層の混合組成となる部分であるため、この層が厚く発達しすぎると、多層に分けて機能分担している利点が消されてしまうことが解る。
比較例6は(a)層と(b)層のポリイミドを入れ替えた場合であるが、この場合には、実施例に見られた相乗効果は見られず、光学特性はそれぞれのポリイミドを単独でフィルム化した場合より劣っている。(Comparative Examples 5 and 6)
Subsequently, according to the conditions shown in Table 5, the polyamic acid solution As and the polyimide solution C were used to obtain films (ratio 5) (ratio 6). Table 5 shows the evaluation results. A significant increase in haze was observed in Comparative Example 5 in which the time interval from the coating of the (a) layer to the coating of the (b) layer was lengthened. It is presumed that the solution absorbed moisture in the atmosphere due to the longer heating time, causing a phase-separated structure in the coating film, and whitening occurred as drying progressed while the structure remained. . Also, the thickness of the transition layer is increased. The presence of the transition layer is necessary for the (a) layer and the (b) layer to bond firmly and gently with a composition gradient. Therefore, if this layer grows too thick, the advantage of dividing into multiple layers and sharing functions will be lost.
Comparative Example 6 is a case in which the polyimides of the (a) layer and the (b) layer are exchanged, but in this case, the synergistic effect seen in the example is not observed, and the optical properties are the same as those of the polyimides alone. It is inferior to the case where it is made into a film.
(実施例5~9、12、13) [(a)/(b)/(a) 3層フィルムの製造]
25℃45%RHに空調された大気中にて、製造例2で得たポリアミド酸溶液Asを、コンマコーターを用いてポリエチレンテレフタレート製フィルムA4100(東洋紡株式会社製、以下PETフィルムと略記する)の無滑材面上に最終膜厚が3μmとなるよう塗布し、続いて30秒後に製造例5で得たポリイミド溶液Cをポリアミド酸溶液Asの上に最終膜厚が31μmとなるようダイコーターによって塗布した。さらに30秒後に、もう一台のダイコーターを用いてポリアミド酸溶液Asを最終膜厚が3μmとなるように塗布した。
これを110℃にて10分間乾燥し、乾燥後に自己支持性を得たフィルムを支持体としてきたA4100フィルムから剥離し、ピンを配置したピンシートを有するピンテンターに通し、フィルム端部をピンに差し込むことにより把持し、フィルムが破断しないように、かつ不必要なたるみが生じないようにピンシート間隔を調整して搬送し、200℃で4分、250℃で4分、300℃で6分の条件で加熱し、イミド化反応を進行させた。その後、2分間で室温にまで冷却し、フィルムの両端の平面性が悪い部分をスリッターにて切り落とし、ロール状に巻き上げ、幅580mm、長さ80mのフィルム(実5)のロールを得た。得られたフィルム(実5)の評価結果を表6に示す。
以下同様に、表6~表7に従って、ポリアミド酸溶液、ポリイミド溶液、操作条件を変えてフィルム(実6)~(実9)を得た。また表5に従ってフィルム(実12)、(実13)を得た。それぞれの表に評価結を示す。
実施例1~4と同様に単層で作製したフィルムより特性が向上していることが示されている。さらに実施例1~4に比較して反りが大幅に小さくなっているが、これは厚さ方向の対照性が良くなったからである。(Examples 5 to 9, 12, 13) [(a)/(b)/(a) production of three-layer film]
Polyamide acid solution As obtained in Production Example 2 was applied to a polyethylene terephthalate film A4100 (manufactured by Toyobo Co., Ltd., hereinafter abbreviated as PET film) using a comma coater in an air conditioned at 25° C. and 45% RH. The polyimide solution C obtained in Production Example 5 was coated on the non-slip material surface so that the final film thickness was 3 μm, and after 30 seconds, the polyimide solution C obtained in Production Example 5 was applied onto the polyamic acid solution As by a die coater so that the final film thickness was 31 μm. applied. After another 30 seconds, another die coater was used to apply polyamic acid solution As to a final film thickness of 3 μm.
This is dried at 110° C. for 10 minutes, and the film that has acquired self-supporting properties after drying is peeled off from the A4100 film used as a support, passed through a pin tenter having a pin sheet on which pins are arranged, and the ends of the film are inserted into the pins. Then, the film is conveyed by adjusting the interval between the pin sheets so that the film does not break and unnecessary slack occurs, and the film is heated at 200°C for 4 minutes, 250°C for 4 minutes, and 300°C for 6 minutes. The imidization reaction was allowed to proceed by heating under these conditions. After that, the film was cooled to room temperature for 2 minutes, and portions of the film having poor flatness at both ends were cut off with a slitter and rolled up into a roll to obtain a roll of film (Example 5) having a width of 580 mm and a length of 80 m. Table 6 shows the evaluation results of the obtained film (Example 5).
Similarly, according to Tables 6 and 7, films (Ex. 6) to (Ex. 9) were obtained by changing the polyamic acid solution, the polyimide solution, and the operating conditions. In addition, films (Example 12) and (Example 13) were obtained according to Table 5. Evaluation results are shown in each table.
As in Examples 1-4, it is shown that the properties are better than those of films made of a single layer. Furthermore, the warpage is greatly reduced as compared with Examples 1 to 4, and this is because the contrast in the thickness direction is improved.
(計算例3、4)
表4の計算例3欄に示した数値はフィルム(比3)と(比4)の評価結果の算術平均値である。また計算例4は実施例8における(a)層と(b)層の厚さ比により重み付けした平均値である。
実施例8で得られたフィルムの評価結果と計算例とを比較すると、実施例で得られたフィルムは計算例3、計算例4よりも光学特性が改善されていることが示されている。また機械特性についても改善が見られている。(Calculation examples 3 and 4)
The numerical values shown in column 3 of calculation example in Table 4 are the arithmetic mean values of the evaluation results of films (comparison 3) and (comparison 4). Calculation Example 4 is an average value weighted by the thickness ratio of the (a) layer and the (b) layer in Example 8.
Comparing the evaluation results of the film obtained in Example 8 with the calculation example, it is shown that the film obtained in the example has better optical properties than calculation examples 3 and 4. Improvements in mechanical properties are also observed.
(比較例9)
製造例9で得られたフィラーを添加したポリアミド酸溶液Efを用いて単層50μmのフィルムの試作を試みた。設定した条件を表7に示す。一時乾燥の後、自己支持性となったフィルムを仮支持体のPETから剥がし、ピンテンターに導入したが、加熱の初期にフィルムが縦方向に破断した。ピン幅調整により試験を継続したが、乾燥とポリイミドへの転化反応が進行する途上で、フィルムが非常に脆くなり、物性評価に足るフィルムを得ることはできなかった。(Comparative Example 9)
Using the polyamic acid solution Ef to which the filler was added obtained in Production Example 9, a monolayer film of 50 μm was trial-manufactured. Table 7 shows the set conditions. After temporary drying, the self-supporting film was peeled off from the PET temporary support and introduced into a pin tenter, but the film broke in the longitudinal direction at the initial stage of heating. The test was continued by adjusting the pin width, but the film became very brittle during the drying and conversion reaction to polyimide, and it was not possible to obtain a film sufficient for physical property evaluation.
(実施例10)
フィラー添加を滑剤のみとしたポリアミド酸溶液Esを(a)層に、製造例9で得られたフィラー含有ポリアミド酸溶液Efを(b)層に用いて、表7に設定した条件で(a)/(b)/(a)構成のフィルムの試作を行った。ピン幅調整に時間を要したが、最終的に幅480mm、長さ50mのポリイミドフィルム(実10)を得ることができた。評価結果を表7に示す。 (Example 10)
Using the polyamic acid solution Es in which only the filler was added as a lubricant for the (a) layer and the filler-containing polyamic acid solution Ef obtained in Production Example 9 for the (b) layer, under the conditions set in Table 7 (a) A film having a /(b)/(a) configuration was produced as an experiment. Although it took time to adjust the pin width, a polyimide film (Example 10) having a width of 480 mm and a length of 50 m was finally obtained. Table 7 shows the evaluation results.
(実施例11)
製造例で得られたポリアミド酸溶液Asおよびポリイミド溶液Cを用い、鏡面仕上げ下ステンレスベルトに3層共押し出しT型ダイを用いてコーティングした。ダイのリップギャップはスキン層150μm、コア層500μmであった。以後は表7に示した条件に従って、加熱を行い、端部をスリっとしてロール状に巻きあげて、幅1100mm長さ300mのフィルム(実11)を得た。評価結果を表7に示す。(Example 11)
The polyamic acid solution As and the polyimide solution C obtained in the production example were coated on a mirror-finished stainless steel belt using a three-layer co-extrusion T-shaped die. The lip gap of the die was 150 μm for the skin layer and 500 μm for the core layer. Thereafter, the film was heated according to the conditions shown in Table 7, the ends were slipped, and the film was wound up into a roll to obtain a film (Example 11) having a width of 1100 mm and a length of 300 m. Table 7 shows the evaluation results.
〔製造例10(滑剤入りポリアミド酸溶液Fsの製造)〕
窒素導入管、還流管、攪拌棒を備えた反応容器内を窒素置換した後、33.36質量部の2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル(TFMB)、336.31質量部のN-メチル-2-ピロリドン(NMP)と滑剤としてコロイダルシリカをジメチルアセトアミドに分散してなる分散体(日産化学工業製「スノーテックス(登録商標)DMAC-ST-ZL」)とをシリカ(滑剤)がポリアミド酸溶液中のポリマー固形分総量にて0.3質量%)になるように加え完全に溶解させ、次いで、9.81質量部の1,2,3,4-シクロブタンテトラカルボン酸無二水物(CBDA)、11.34質量部の3,3’,4,4’-ビフェニルテトラカルボン酸、4.85質量部の4,4’-オキシジフタル酸無二水物(ODPA)をそれぞれ固体のまま分割添加した後、室温で24時間攪拌した。その後、固形分15質量%、還元粘度3.50dl/gのポリアミド酸溶液Fs(TFMB//CBDA/BPDA/ODPAのモル比=1.00//0.48/0.37/0.15)を得た。[Production Example 10 (Production of lubricant-containing polyamic acid solution Fs)]
After purging the inside of a reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod, 33.36 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB), 336.31 Parts by mass of N-methyl-2-pyrrolidone (NMP) and a dispersion obtained by dispersing colloidal silica as a lubricant in dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd. "Snowtex (registered trademark) DMAC-ST-ZL") and silica (lubricant) was added so that the total polymer solid content in the polyamic acid solution was 0.3% by mass) and completely dissolved, and then 9.81 parts by mass of 1,2,3,4-cyclobutanetetracarboxylic Acid anhydride (CBDA), 11.34 parts by weight of 3,3′,4,4′-biphenyltetracarboxylic acid, 4.85 parts by weight of 4,4′-oxydiphthalic anhydride (ODPA) were added in portions as solids, and then stirred at room temperature for 24 hours. After that, a polyamic acid solution Fs with a solid content of 15% by mass and a reduced viscosity of 3.50 dl / g (molar ratio of TFMB // CBDA / BPDA / ODPA = 1.00 // 0.48 / 0.37 / 0.15) got
〔製造例11(無滑剤ポリアミド酸溶液Fの製造)〕
窒素導入管、還流管、攪拌棒を備えた反応容器内を窒素置換した後、33.36質量部の2,2’-ジトリフルオロメチル-4,4’-ジアミノビフェニル(TFMB)に336.31質量部のN-メチル-2-ピロリドン(NMP)を加え完全に溶解させ、次いで、9.81質量部の1,2,3,4-シクロブタンテトラカルボン酸無二水物(CBDA)、11.34質量部の3,3’,4,4’-ビフェニルテトラカルボン酸、4.85質量部の4,4’-オキシジフタル酸無二水物(ODPA)をそれぞれ固体のまま分割添加した後、室温で24時間攪拌した。その後、固形分15質量%、還元粘度3.50dl/gのポリアミド酸溶液F(TFMB//CBDA/BPDA/ODPAのモル比=1.00//0.48/0.37/0.15)を得た。[Production Example 11 (Production of non-lubricant polyamic acid solution F)]
After purging the inside of the reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod, 33.36 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB) was added with 336.31 9.81 parts by mass of 1,2,3,4-cyclobutanetetracarboxylic anhydride (CBDA),11. 34 parts by mass of 3,3′,4,4′-biphenyltetracarboxylic acid and 4.85 parts by mass of 4,4′-oxydiphthalic anhydride (ODPA) were separately added as solids, and then cooled to room temperature. for 24 hours. After that, a polyamic acid solution F with a solid content of 15% by mass and a reduced viscosity of 3.50 dl / g (molar ratio of TFMB // CBDA / BPDA / ODPA = 1.00 // 0.48 / 0.37 / 0.15) got
(実施例14)
25℃45%RHに空調された大気中にて、ロールトゥロール式のコンマコーターと連続式乾燥炉を備えた装置を用いて、製造例10で得たポリアミド酸溶液Fsを、仮支持体であるPETフィルムの無滑材面上に最終膜厚が5μmとなるよう塗布し、続いて10秒後に製造例11で得たポリアミド酸溶液Fをポリアミド酸溶液Fsの上に最終膜厚が20μmとなるようダイコーターによって塗布した。これを110℃にて10分間乾燥した。
乾燥後に自己支持性を得たフィルムを支持体としてきたPETフィルムから剥離し、ピンを配置したピンシートを有するピンテンターに通し、フィルム端部をピンに差し込むことにより把持し、フィルムが破断しないように、かつ不必要なたるみが生じないようにピンシート間隔を調整して搬送し、最終加熱として、200℃で3分、250℃で3分、300℃で3分、400℃で3分の条件で加熱し、イミド化反応を進行させた。その後、2分間で室温にまで冷却し、フィルムの両端の平面性が悪い部分をスリッターにて切り落とし、ロール状に巻き上げ、幅530mm、長さ80mのフィルム(実14)のロールを得た。得られたフィルム(実14)はフィルム総厚さ25μm、ヘイズ0.41%、全光線透過率88.2%、イエローインデックス4.1、破断強度230MPa、破断伸度13.1%、弾性率4.4GPa、CTE29ppm/K、反り0.1mm以下、遷移層厚さ0.9μmであった。(Example 14)
The polyamic acid solution Fs obtained in Production Example 10 was coated on a temporary support using an apparatus equipped with a roll-to-roll comma coater and a continuous drying furnace in an air conditioned at 25° C. and 45% RH. A certain PET film was coated on the non-lubricating surface so as to have a final film thickness of 5 μm, and then 10 seconds later, the polyamic acid solution F obtained in Production Example 11 was applied on the polyamic acid solution Fs to a final film thickness of 20 μm. It was applied by a die coater so that It was dried at 110° C. for 10 minutes.
After drying, the film that has acquired self-supporting properties is peeled off from the PET film used as the support, passed through a pin tenter having a pin sheet on which pins are arranged, and gripped by inserting the ends of the film into the pins so as not to break the film. And conveyed by adjusting the pin sheet interval so that unnecessary slack does not occur, and the final heating conditions are 200 ° C. for 3 minutes, 250 ° C. for 3 minutes, 300 ° C. for 3 minutes, and 400 ° C. for 3 minutes. to advance the imidization reaction. After that, the film was cooled to room temperature for 2 minutes, and portions of the film with poor flatness at both ends were cut off with a slitter and rolled up into a roll to obtain a roll of film (Example 14) having a width of 530 mm and a length of 80 m. The resulting film (Example 14) had a total film thickness of 25 μm, a haze of 0.41%, a total light transmittance of 88.2%, a yellow index of 4.1, a breaking strength of 230 MPa, a breaking elongation of 13.1%, and an elastic modulus of The results were 4.4 GPa, CTE 29 ppm/K, warpage 0.1 mm or less, and transition layer thickness 0.9 μm.
(実施例15)
25℃45%RHに空調された大気中にて、ロールトゥロール式のコンマコーターと連続式乾燥炉を備えた装置を用いて、製造例10で得たポリアミド酸溶液Fsを、仮支持体であるPETフィルムの無滑材面上に最終膜厚が3μmとなるよう塗布し、続いて10秒後に製造例11で得たポリアミド酸溶液Fをポリアミド酸溶液Fsの上に最終膜厚が19μmとなるようダイコーターによって塗布し、さらに30秒後にもう一台のダイコーターにてポリアミド酸溶液Fsを最終膜厚が3μmとなるように塗布し、これを110℃にて10分間乾燥した。
乾燥後に自己支持性を得たフィルムを支持体としてきたPETフィルムから剥離し、実施例12と同様にピンテンターを用いて200℃で3分、250℃で3分、300℃で3分、400℃で3分の条件で加熱し、イミド化反応を進行させた。以後同様に操作し、幅530mm、長さ80mのフィルム(実15)のロールを得た。得られたフィルム(実15)はFs/F/Fsの三層構造で、フィルム総厚さ25μm、ヘイズ0.43%、全光線透過率88.1%、イエローインデックス4.1、破断強度180MPa、破断伸度12.5%、弾性率4.2GPa、CTE30ppm/K、反り0.1mm以下、遷移層厚さ(エア面側/ベース面側)1.2μm/1.3μmであった。(Example 15)
The polyamic acid solution Fs obtained in Production Example 10 was coated on a temporary support using an apparatus equipped with a roll-to-roll comma coater and a continuous drying furnace in an air conditioned at 25° C. and 45% RH. A certain PET film was coated on the non-lubricating surface to a final film thickness of 3 μm, and then 10 seconds later, the polyamic acid solution F obtained in Production Example 11 was applied on the polyamic acid solution Fs to a final film thickness of 19 μm. After 30 seconds, another die coater was used to apply polyamic acid solution Fs to a final film thickness of 3 μm, which was dried at 110° C. for 10 minutes.
After drying, the film obtained self-supporting property was peeled off from the PET film used as the support, and a pin tenter was used in the same manner as in Example 12 at 200°C for 3 minutes, 250°C for 3 minutes, 300°C for 3 minutes, and 400°C. The imidization reaction was allowed to proceed by heating under the condition of 3 minutes at . Thereafter, the same operation was performed to obtain a roll of film (Example 15) having a width of 530 mm and a length of 80 m. The resulting film (Example 15) had a three-layer structure of Fs/F/Fs, with a total film thickness of 25 μm, a haze of 0.43%, a total light transmittance of 88.1%, a yellow index of 4.1, and a breaking strength of 180 MPa. , a breaking elongation of 12.5%, an elastic modulus of 4.2 GPa, a CTE of 30 ppm/K, a warp of 0.1 mm or less, and a transition layer thickness (air surface side/base surface side) of 1.2 μm/1.3 μm.
(比較例10)
25℃45%RHに空調された大気中にて、ロールトゥロール式のコンマコーターと連続式乾燥炉を備えた装置を用いて、製造例2で得たポリアミド酸溶液Asを、仮支持体であるPETフィルムの無滑材面上に最終膜厚が20μmとなるよう塗布した。次いで連続式の乾燥機により、一次加熱として、110℃5分間加熱し、残溶剤量が28質量%の半乾燥被膜Agfxを得て、仮支持体ごとロール状に巻き取った。
自己支持性を得た乾燥被膜Agfxを支持体としてきたPETフィルムから剥離し、ピンを配置したピンシートを有するピンテンターに通し、フィルム端部をピンに差し込むことにより把持し、フィルムが破断しないように、かつ不必要なたるみが生じないようにピンシート間隔を調整して搬送し、最終加熱として、200℃で3分、250℃で3分、300℃で6分の条件で加熱し、イミド化反応を進行させた。その後、2分間で室温にまで冷却し、フィルムの両端の平面性が悪い部分をスリッターにて切り落とし、ロール状に巻き上げ、幅530mm、長さ50mのポリイミドフィルム(比10a)のロールを得た。(Comparative Example 10)
In the air conditioned at 25° C. and 45% RH, using an apparatus equipped with a roll-to-roll comma coater and a continuous drying furnace, the polyamic acid solution As obtained in Production Example 2 was coated on a temporary support. It was applied to a final film thickness of 20 μm on the non-lubricated side of a PET film. Next, the film was heated at 110° C. for 5 minutes as primary heating using a continuous dryer to obtain a semi-dry film Agfx having a residual solvent content of 28% by mass, and the film was wound together with the temporary support into a roll.
The dry film Agfx, which has acquired self-supporting properties, is peeled off from the PET film used as the support, passed through a pin tenter having a pin sheet on which pins are arranged, and gripped by inserting the ends of the film into the pins so as not to break the film. And conveyed by adjusting the pin sheet interval so that unnecessary slack does not occur, and the final heating is performed under the conditions of 200 ° C. for 3 minutes, 250 ° C. for 3 minutes, and 300 ° C. for 6 minutes to imidize. The reaction was allowed to proceed. After that, the film was cooled to room temperature for 2 minutes, and portions of the film with poor flatness at both ends were cut off with a slitter and rolled up into a roll to obtain a roll of polyimide film (ratio 10a) with a width of 530 mm and a length of 50 m.
得られたポリイミドフィルム(比10a)ロールを再び前述の装置にセットし、ポリイミドフィルム(比10a)を巻き出して、その上に製造例5で得たポリイミド溶液Cを最終膜厚が5μmとなるようコンマコーターで塗布した。これを二次加熱として110℃にて10分間乾燥した。
乾燥後にピンを配置したピンシートを有するピンテンターに通し、フィルム端部をピンに差し込むことにより把持し、フィルムが破断しないように、かつ不必要なたるみが生じないようにピンシート間隔を調整して搬送し、最終加熱として、200℃で3分、250℃で3分、300℃で6分の条件で加熱し、イミド化反応を進行させた。その後、2分間で室温にまで冷却し、フィルムの両端の平面性が悪い部分をスリッターにて切り落とし、ロール状に巻き上げ、幅450mm、長さ30mのポリイミドフィルム(比10b)のロールを得た。
得られたポリイミドフィルム(比10b)はAs(20μm)/C(5μm)の二層構造で、フィルム総厚さ25μm、ヘイズ0.63%、全光線透過率86.9%、イエローインデックス4.3、破断強度154MPa、破断伸度18%、弾性3.9GPa、CTE19.6ppm/K、反り2.8mm以下、遷移層厚さ0.0μmであった。フィルムの反り量が実施例に比較すると大である。The resulting polyimide film (ratio 10a) roll is again set in the above-described apparatus, the polyimide film (ratio 10a) is unwound, and the polyimide solution C obtained in Production Example 5 is applied thereon to a final film thickness of 5 μm. It was coated with a comma coater. This was dried at 110° C. for 10 minutes as secondary heating.
After drying, the film is passed through a pin tenter having a pin sheet on which pins are arranged, and the edge of the film is gripped by inserting it into the pin. It was transported and heated under the conditions of 200° C. for 3 minutes, 250° C. for 3 minutes, and 300° C. for 6 minutes as the final heating to proceed the imidization reaction. After that, the film was cooled to room temperature for 2 minutes, and portions of the film with poor flatness at both ends were cut off with a slitter and rolled up into a roll to obtain a roll of polyimide film (ratio 10b) with a width of 450 mm and a length of 30 m.
The resulting polyimide film (ratio 10b) had a two-layer structure of As (20 μm)/C (5 μm), with a total film thickness of 25 μm, a haze of 0.63%, a total light transmittance of 86.9%, and a yellow index of 4.0. 3. The breaking strength was 154 MPa, the breaking elongation was 18%, the elasticity was 3.9 GPa, the CTE was 19.6 ppm/K, the warp was 2.8 mm or less, and the transition layer thickness was 0.0 µm. The warping amount of the film is large as compared with the examples.
(比較例11)
25℃45%RHに空調された大気中にて、製造例2で得たポリアミド酸溶液Asを、アプリケータを用いてガラス基板上に最終膜厚が3μmとなるよう塗布し、続いて60秒後に製造例5で得たポリイミド溶液Cをポリアミド酸溶液Asの上に最終膜厚が31μmとなるようアプリケータによって塗布した。さらに60秒後に、アプリケータを用いてポリアミド酸溶液Asを最終膜厚が3μmとなるように塗布した。なお、本比較例における最終膜厚は別途それぞれの溶液をガラス基板に単独に塗布して得られたフィルム厚から求めた値である。
これをイナートオーブンにて110℃にて20分間乾燥し、ついで真空乾燥機にて200℃で10分、250℃で10分、さらにマッフル炉を用いて350℃で5分の条件で加熱し、イミド化反応を進行させ、ガラス基板から剥離してポリイミドフィルム(比11)得た。
得られたポリイミドフィルム(比11)はAs(3μm)/C(31μm)/As(3μm)の三層構造を意図して作製したフィルムという位置づけである。ポリイミドフィルム比11の特性はフィルム総厚さ37μm、ヘイズ5.2%、全光線透過率83.9%、イエローインデックス1.8、破断強度130MPa、破断伸度5.8%、弾性3.9GPa、CTE37ppm/K、反り3.5mm、遷移層厚さ(エア面側/ベース面側)3.5μm/5.6μmであった。フィルムの反り量が実施例5に比較すると大であり、ヘイズ値も上がっている。遷移層厚さは、塗布時に意図したAs層よりも厚くなっており、多層構造というよりは、半ば組成が混合されてしまった状態に近く、強度、伸度ともに低下しており期待した機能分離が発現していないことが伺われる。(Comparative Example 11)
In the air conditioned at 25° C. and 45% RH, the polyamic acid solution As obtained in Production Example 2 was applied onto a glass substrate using an applicator so that the final film thickness was 3 μm, followed by 60 seconds. Later, the polyimide solution C obtained in Production Example 5 was applied onto the polyamic acid solution As by an applicator so that the final film thickness was 31 μm. After 60 seconds, the polyamic acid solution As was applied using an applicator so that the final film thickness was 3 μm. The final film thickness in this comparative example is a value determined from the film thickness obtained by separately applying each solution to a glass substrate.
This was dried in an inert oven at 110°C for 20 minutes, then heated in a vacuum dryer at 200°C for 10 minutes and 250°C for 10 minutes, and further heated in a muffle furnace at 350°C for 5 minutes, The imidization reaction was allowed to proceed, and the film was peeled off from the glass substrate to obtain a polyimide film (comparison 11).
The resulting polyimide film (ratio 11) is positioned as a film produced with the intention of having a three-layer structure of As (3 μm)/C (31 μm)/As (3 μm). The characteristics of polyimide film ratio 11 are total film thickness 37 μm, haze 5.2%, total light transmittance 83.9%, yellow index 1.8, breaking strength 130 MPa, breaking elongation 5.8%, elasticity 3.9 GPa. , CTE 37 ppm/K, warpage 3.5 mm, transition layer thickness (air surface side/base surface side) 3.5 μm/5.6 μm. The warp amount of the film is larger than that of Example 5, and the haze value is also increased. The thickness of the transition layer is thicker than the intended As layer at the time of coating, and rather than a multi-layered structure, it is close to a state in which the composition has been mixed in the middle. is not expressed.
以上述べてきたように、本発明の多層ポリイミドフィルムは、異なる組成のポリイミドを、それぞれを単独でフィルム化した場合に比較して良好な光学特性と機械特性を有することが示された。また本発明の製造方法によれば、多層に分かれて機能分担した異なる組成の層間に特定の厚さの組成傾斜した遷移層を形成することができ、それ故にバランスの取れたフィルムを形成することが可能となる。
本発明の多層ポリイミドフィルムは優れた光学特性、無色透明性を有し、かつ機械特性にすぐれ、比較的低いCTEを示すため、フレキシブルでかつ軽量な表示装置の部材として、あるいは透明性が必要なタッチパネルなどのスイッチ素子、ポインティングデバイスなどに利用することができる。
As described above, it was shown that the multilayer polyimide film of the present invention has better optical properties and mechanical properties than polyimides with different compositions that are individually formed into films. Further, according to the production method of the present invention, it is possible to form a transition layer having a specific thickness and a compositional gradient between layers of different compositions divided into multiple layers and sharing functions, so that a well-balanced film can be formed. becomes possible.
The multilayer polyimide film of the present invention has excellent optical properties, colorless transparency, excellent mechanical properties, and a relatively low CTE. It can be used for switch elements such as touch panels, pointing devices, and the like.
Claims (8)
前記多層ポリイミド層を構成する(a)層と前記(a)層に隣り合う(b)層との間に存在し、化学組成が傾斜をもって変化する遷移層と
を有し、
前記(a)層は、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが6.8以上10以下であり、全光線透過率が85%以上であり、線膨張係数が25ppm/K以下であるポリイミドを70質量%以上含み、
前記(a)層の厚さは1μm超119μm未満であり、
前記(b)層は、単独で厚さ25±2μmのフィルムとした際にイエローインデックスが0.1以上5以下であり、全光線透過率が90%以上であるポリイミドを70質量%以上含み、
前記(b)層の厚さは1μm超119μm未満であり、
前記遷移層は、前記(a)層のポリイミドから前記(b)層のポリイミドへと組成が連続的に変化する層であり、
前記遷移層の厚さは、下限がフィルム総厚さの3%、または1μmのいずれかであり、上限がフィルム総厚さの10%、または3μmのいずれかであり、
フィルム全体の厚さが3μm以上120μm以下であり、
フィルム全体のイエローインデックスが5以下であり、
フィルム全体の全光線透過率が86%以上である
ことを特徴とする多層ポリイミドフィルム。 A multilayer polyimide layer in which at least two polyimide layers having different compositions are laminated in the thickness direction;
A transition layer that exists between the (a) layer constituting the multilayer polyimide layer and the (b) layer adjacent to the (a) layer and whose chemical composition changes with a gradient,
The layer (a) has a yellow index of 6.8 or more and 10 or less, a total light transmittance of 85% or more, and a linear expansion coefficient of 25 ppm/K when made into a film having a thickness of 25 ± 2 µm alone. Contains 70% by mass or more of the following polyimide,
The thickness of the layer (a) is more than 1 μm and less than 119 μm,
The (b) layer contains 70% by mass or more of a polyimide having a yellow index of 0.1 or more and 5 or less and a total light transmittance of 90% or more when made into a film having a thickness of 25 ± 2 µm alone,
The thickness of the layer (b) is more than 1 μm and less than 119 μm,
The transition layer is a layer whose composition continuously changes from the polyimide of the (a) layer to the polyimide of the (b) layer,
the thickness of the transition layer has a lower limit of either 3% of the total film thickness or 1 μm and an upper limit of either 10% of the total film thickness or 3 μm;
The thickness of the entire film is 3 μm or more and 120 μm or less,
The yellow index of the entire film is 5 or less,
A multilayer polyimide film having a total light transmittance of 86% or more.
前記遷移層は、前記(b)層の一方の面側の(a)層と前記(b)層との間、及び、前記(b)層の他方の面側の(a)層と前記(b)層との間に存在し、
前記(a)層、前記遷移層、前記(b)層、前記遷移層、前記(a)層の順に積層された層構成を有している
ことを特徴とする、請求項1に記載の多層ポリイミドフィルム。 The (a) layer is present on both one side and the other side of the (b) layer,
The transition layer is provided between the (a) layer and the (b) layer on one side of the (b) layer, and between the (a) layer and the (b) layer on the other side of the (b) layer. b) present between the layers,
2. The multilayer according to claim 1, having a layer structure in which the (a) layer, the transition layer, the (b) layer, the transition layer, and the (a) layer are laminated in this order. polyimide film.
脂環族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、分子内にアミド結合を有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、
または
脂環族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、
であることを特徴とする請求項1または2に記載の多層ポリイミドフィルム。 The polyimide of the layer (a) is
A polyimide having a chemical structure obtained by condensation polymerization of a tetracarboxylic anhydride containing 70% by mass or more of an alicyclic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having an amide bond in the molecule. ,
Or a chemical structure obtained by condensation polymerization of a tetracarboxylic anhydride containing 70% by mass or more of an alicyclic tetracarboxylic anhydride and a diamine containing 70% by mass or more of a diamine having a trifluoromethyl group in the molecule polyimide, consisting of
The multilayer polyimide film according to claim 1 or 2, characterized in that:
芳香族テトラカルボン酸無水物を70質量%以上含有するテトラカルボン酸無水物と、分子内にイオウ原子を有するジアミンを70質量%以上含有するジアミンから得られる化学構造からなるポリイミド、
または
トリフルオロメチル基を分子内に含有するテトラカルボン酸を30質量%以上含有するテトラカルボン酸無水物と、トリフルオロメチル基を分子内に有するジアミンを70質量%以上含有するジアミンとの縮重合により得られる化学構造からなるポリイミド、
であることを特徴とする請求項1~3のいずれかに記載の多層ポリイミドフィルム。 The polyimide of the layer (b) is
A polyimide having a chemical structure obtained from a tetracarboxylic anhydride containing 70% by mass or more of an aromatic tetracarboxylic anhydride and a diamine containing 70% by mass or more of a diamine having a sulfur atom in the molecule;
or condensation polymerization of a tetracarboxylic anhydride containing 30% by mass or more of a tetracarboxylic acid containing a trifluoromethyl group in the molecule and a diamine containing 70% by weight or more of a diamine having a trifluoromethyl group in the molecule A polyimide consisting of a chemical structure obtained by
The multilayer polyimide film according to any one of claims 1 to 3, characterized in that:
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:全層を加熱し、全層基準の残溶剤量が0.5質量%以下である積層体を得る工程、
を少なくとも含む請求項1、3または4に記載の多層ポリイミドフィルムの製造方法。 1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to claim 1, 3 or 4, comprising at least
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:全層を加熱し、全層基準の残溶剤量が5質量%以上40質量%以下である積層体を得た後、仮支持体から剥離し、自己支持性のあるフィルムを得る工程、
5:前記自己支持性のあるフィルムの両端を把持し、さらに全層基準の残溶剤量が0.5質量%以下であるフィルムを得る工程、
を少なくとも含む請求項1、3または4に記載の多層ポリイミドフィルムの製造方法。 1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: After heating all layers to obtain a laminate having a residual solvent amount of 5% by mass or more and 40% by mass or less based on all layers, peeling from the temporary support to obtain a self-supporting film;
5: A step of holding both ends of the self-supporting film and further obtaining a film having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to claim 1, 3 or 4, comprising at least
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:塗膜ab1作製後100秒以内に、(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜ab1に塗布し、塗膜aba1を得る工程、
4:全層を加熱し、全層基準の残溶剤量が0.5質量%以下である積層体を得る工程、
を少なくとも含む請求項1~4のいずれかに記載の多層ポリイミドフィルムの製造方法。 1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution onto a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: Within 100 seconds after the coating film ab1 is produced, (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to any one of claims 1 to 4, comprising at least
2:塗膜a1作製後100秒以内に、(b)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜a1に塗布し、塗膜ab1を得る工程、
3:塗膜ab1作製後100秒以内に、(a)層形成用のポリイミド溶液またはポリイミド前駆体溶液を塗膜ab1に塗布し、塗膜aba1を得る工程、
4:全層を加熱し、全層基準の残溶剤量が8質量%以上40質量%以下である積層体を得た後、仮支持体から剥離し、自己支持性のあるフィルムを得る工程、
5:前記自己支持性のあるフィルムの両端を把持し、さらに全層基準の残溶剤量が0.5質量%以下であるフィルムを得る工程、
を少なくとも含む請求項1~4のいずれかに記載の多層ポリイミドフィルムの製造方法。
1: (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to a temporary support to obtain a coating film a1;
2: Within 100 seconds after the coating film a1 is produced, (b) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film a1 to obtain the coating film ab1;
3: Within 100 seconds after the coating film ab1 is produced, (a) a step of applying a layer-forming polyimide solution or polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4: After heating all layers to obtain a laminate having a residual solvent amount of 8% by mass or more and 40% by mass or less based on all layers, peeling from the temporary support to obtain a self-supporting film;
5: A step of holding both ends of the self-supporting film and further obtaining a film having a residual solvent amount of 0.5% by mass or less based on all layers;
The method for producing a multilayer polyimide film according to any one of claims 1 to 4, comprising at least
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