TW201927872A - Manufacturing method of resin film - Google Patents

Manufacturing method of resin film Download PDF

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TW201927872A
TW201927872A TW107135403A TW107135403A TW201927872A TW 201927872 A TW201927872 A TW 201927872A TW 107135403 A TW107135403 A TW 107135403A TW 107135403 A TW107135403 A TW 107135403A TW 201927872 A TW201927872 A TW 201927872A
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resin film
film
resin
formula
mass
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TW107135403A
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TWI771505B (en
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中谷昭彦
野殿光紀
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日商住友化學股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/34Component parts, details or accessories; Auxiliary operations
    • B29C41/42Removing articles from moulds, cores or other substrates
    • B29C41/44Articles of indefinite length
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/34Component parts, details or accessories; Auxiliary operations
    • B29C41/38Moulds, cores or other substrates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2077/00Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08PI, i.e. polyimides or derivatives thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00Flat articles, e.g. films or sheets
    • B29L2007/002Panels; Plates; Sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulding By Coating Moulds (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Laminated Bodies (AREA)

Abstract

An objective of the present invention is to improve a drying step of a resin film in order to prevent small scratches on the resin film. The present invention provides a manufacturing method of resin film, wherein, in the step of peeling a resin film obtained by applying a resin varnish on a support from the support and then drying it, the tension applied per unit width of the resin film is 82 N/m or less.

Description

樹脂膜的製造方法 Method for producing resin film

本發明係關於樹脂膜的製造方法,特別係關於視認性高的透明樹脂膜之製造方法。 The present invention relates to a method for producing a resin film, and more particularly to a method for producing a transparent resin film having high visibility.

就如液晶顯示裝置及太陽電池之裝置的透明構件而言,有時能使用透明樹脂膜。該透明樹脂膜有時能利用具有高耐熱性之聚醯亞胺膜(專利文獻1)。 For a transparent member such as a liquid crystal display device or a solar cell device, a transparent resin film may be used. In the transparent resin film, a polyimide film having high heat resistance can be used (Patent Document 1).

又,獲得透明的聚醯亞胺膜時,係將含有聚醯亞胺之清漆塗佈於支撐體上之後,剝離支撐體後乾燥,再積層保護層而進行。 Further, when a transparent polyimide film is obtained, a varnish containing a polyimide pigment is applied onto a support, and then the support is peeled off, dried, and a protective layer is laminated.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開平10-310639號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 10-310639

然而,就將聚醯亞胺膜乾燥之步驟而言,係在將聚醯亞胺膜從支撐體剝離,並以膜移動之狀態進行乾燥,乾燥後進行附著保護膜而保護聚醯亞胺膜,惟在膜 移動並乾燥時,會於聚醯亞胺膜形成通常難以辨識之非常微小的傷痕(例如微小傷痕或擦痕)。聚醯亞胺膜中,就要求能在明亮的光源下使用的高度透明性之聚醯亞胺膜而言,必須避免如此之傷痕。 However, in the step of drying the polyimide film, the polyimide film is peeled off from the support, dried in a state in which the film is moved, and dried to adhere the protective film to protect the polyimide film. Only in the membrane When moved and dried, very small scratches (such as minor scratches or scratches) that are often difficult to discern are formed on the polyimide film. In the polyimide film, a highly transparent polyimide film which can be used under a bright light source is required to avoid such a flaw.

因此,本發明係為了防止上述微小的傷痕而進行研究,目的在於加以改良聚醯亞胺膜之乾燥步驟。 Therefore, the present invention has been studied in order to prevent such minute scratches, and an object thereof is to improve the drying step of the polyimide film.

亦即,本發明提供一種樹脂膜的製造方法,其係於將藉由在支撐體上塗佈樹脂清漆所得之樹脂膜從支撐體剝離後使樹脂膜乾燥之步驟中,對前述樹脂膜之每單位寬度施加的張力為82N/m以下。 In other words, the present invention provides a method for producing a resin film, which is a step of drying a resin film obtained by coating a resin varnish on a support from a support and then drying the resin film. The tension applied per unit width is 82 N/m or less.

上述樹脂清漆較佳係含有選自由聚醯亞胺、聚醯胺醯亞胺及聚醯胺所組成群組的至少1種樹脂。 The resin varnish preferably contains at least one resin selected from the group consisting of polyimine, polyamidimide, and polyamidamine.

從支撐體剝離後之樹脂膜中的殘存溶媒量為5質量%以上,且前述樹脂清漆中之樹脂的重量平均分子量為200,000至500,000。 The amount of the residual solvent in the resin film after peeling from the support is 5% by mass or more, and the weight average molecular weight of the resin in the resin varnish is 200,000 to 500,000.

前述樹脂膜中之殘存溶媒量較佳為30質量%以下。 The amount of the residual solvent in the resin film is preferably 30% by mass or less.

在本發明係藉由在乾燥步驟中,對前述樹脂膜之每單位寬度施加之張力為82N/m以下,而可防止微細的傷痕,尤其可防止微小傷痕。藉由不產生微小傷痕,樹脂膜之透明性會提高。又,藉由可防止微小傷痕,光之漫反射會減少,且在以背光等使光穿透時,亦可減少背光 之電力。 In the present invention, by applying a tension of 82 N/m or less per unit width of the resin film in the drying step, it is possible to prevent fine scratches and, in particular, to prevent minute scratches. The transparency of the resin film is improved by not causing minute scratches. Moreover, by preventing small scratches, the diffuse reflection of light is reduced, and when the light is penetrated by a backlight or the like, the backlight can be reduced. Electricity.

1‧‧‧捲筒 1‧‧ ‧ reel

2‧‧‧保護膜捲取捲筒 2‧‧‧Protective film take-up reel

3‧‧‧樹脂膜 3‧‧‧ resin film

4‧‧‧乾燥爐 4‧‧‧ drying oven

5‧‧‧導引輥 5‧‧‧ Guide roller

6‧‧‧第2捲筒 6‧‧‧2nd reel

7‧‧‧保護膜捲筒 7‧‧‧ Protective film reel

8‧‧‧移動方向(縱方向) 8‧‧‧Moving direction (longitudinal direction)

9‧‧‧導引輥 9‧‧‧ Guide roller

第1圖係記載本發明樹脂膜之製造步驟的步驟圖。 Fig. 1 is a view showing the steps of a manufacturing step of the resin film of the present invention.

第2圖係示意性表示本發明樹脂膜的製造方法之步驟的圖。 Fig. 2 is a view schematically showing the steps of a method for producing a resin film of the present invention.

第3圖係用以說明對每單位寬度施加之張力的示意圖。 Figure 3 is a schematic diagram for explaining the tension applied per unit width.

第4圖係微小傷痕多的樹脂膜之照片。 Fig. 4 is a photograph of a resin film having a small number of scratches.

以下,使用第1圖至第4圖詳細說明本發明之數個實施形態。但是,本發明之樹脂膜的製造方法並不侷限於第1圖至第4圖之態樣。 Hereinafter, several embodiments of the present invention will be described in detail using Figs. 1 to 4 . However, the method for producing the resin film of the present invention is not limited to the aspects of Figs. 1 to 4 .

第1圖係記載本發明樹脂膜之製造步驟的步驟圖。如第1圖之記載,本發明之樹脂膜係經過所謂清漆化、預製膜、剝離支撐體及乾燥之步驟而製造。在清漆化之步驟中,係將樹脂溶解或分散於溶媒中而形成樹脂清漆;在預製膜步驟中,係將所得之樹脂清漆使用塗裝裝置塗佈於支撐體上,簡單乾燥後,將保護膜被覆於樹脂膜上而暫時作成積層膜。然後將該積層膜移至支撐體剝離步驟,以無剝離痕跡之方式剝離支撐體。將由在剝離步驟所得之樹脂膜與保護膜所構成者移動至第1圖之乾燥步驟,將保護膜剝離,同時將樹脂膜乾燥。 Fig. 1 is a view showing the steps of a manufacturing step of the resin film of the present invention. As described in Fig. 1, the resin film of the present invention is produced by a so-called varnishing, pre-forming film, peeling support, and drying step. In the step of varnishing, the resin is dissolved or dispersed in a solvent to form a resin varnish; in the pre-filming step, the obtained resin varnish is applied to the support using a coating device, and after simple drying, the resin is protected. The film is coated on the resin film to temporarily form a laminated film. The laminated film is then transferred to a support peeling step to peel the support without peeling marks. The resin film and the protective film obtained in the peeling step are moved to the drying step of Fig. 1, and the protective film is peeled off while the resin film is dried.

在第1圖之清漆化步驟中,係如上述般將 樹脂溶解或分散於溶媒而形成樹脂清漆,就本發明之製造方法中所使用之樹脂而言,可舉例如:聚醯亞胺系高分子(包含聚醯亞胺及聚醯胺醯亞胺)、聚醯胺、聚酯、聚(甲基)丙烯酸酯、乙酸纖維素、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、環烯烴聚合物及其等之共聚物等。從透明性、耐熱性、各種機械物性優異之點而言,較佳係聚醯亞胺系高分子及聚醯胺,更佳係聚醯亞胺。所含之樹脂可為1種,亦可為2種以上。所得之樹脂膜可為著色或無色之樹脂膜,但適合為無色透明之樹脂膜。 In the varnishing step of Figure 1, it will be as above The resin is dissolved or dispersed in a solvent to form a resin varnish, and the resin used in the production method of the present invention may, for example, be a polyimine-based polymer (including polyimine and polyamidimide). Polyacetamide, polyester, poly(meth) acrylate, cellulose acetate, polyethylene terephthalate, polyethylene naphthalate, copolymers of cyclic olefin polymers and the like. From the viewpoint of excellent transparency, heat resistance, and various mechanical properties, a polyimide-based polymer and a polyamine are preferable, and a polyimide is more preferable. The resin to be contained may be one type or two or more types. The obtained resin film may be a colored or colorless resin film, but is preferably a colorless transparent resin film.

在本說明書中,所謂的聚醯亞胺係以含有醯亞胺基之重複構造單元為主之聚合物,所謂的聚醯胺係以含有醯胺基之重複構造單元為主之聚合物,所謂的聚醯亞胺系高分子係表示聚醯亞胺及以含有醯亞胺基之構造單元以及含有醯胺基之構造單元為主之聚合物。 In the present specification, the polyimine is a polymer mainly composed of a repeating structural unit containing a sulfimine group, and the polyamine is a polymer mainly composed of a repeating structural unit containing a guanamine group. The polyimine-based polymer system is a polymer mainly composed of a polyimine and a structural unit containing a quinone group and a structural unit containing a guanamine group.

本發明之聚醯亞胺系高分子可將後述之四羧酸化合物與二胺化合物作為主原料而製造,係具有以式(10)所示之重複構造單元。其中,G為4價有機基,A為2價有機基。G及/或A為相異,亦可含有2種以上之式(10)所示之構造。又,就本實施形態之聚醯亞胺系高分子而言,係可在不損及所得之聚醯亞胺系高分子膜的各種物性之範圍含有式(11)、式(12)或式(13)所示之構造。 The polyimine-based polymer of the present invention can be produced by using a tetracarboxylic acid compound and a diamine compound which will be described later as a main raw material, and has a repeating structural unit represented by the formula (10). Wherein G is a tetravalent organic group and A is a divalent organic group. G and/or A are different, and may have two or more structures represented by the formula (10). In addition, the polyimine-based polymer of the present embodiment can contain the formula (11), the formula (12) or the formula without impairing the various physical properties of the obtained polyimide-based polymer film. (13) The configuration shown.

G及G1為4價有機基,較佳係可被烴基或經氟取代之烴基所取代的有機基,可例示式(20)、式(21)、式(22)、式(23)、式(24)、式(25)、式(26)、式(27)、式(28)或式(29)所示之基以及4價的碳數6以下之鏈式烴基。式中之*表示鍵結鍵,Z表示單鍵、-O-、-CH2-、-CH2-CH2-、-CH(CH3)-、-C(CH3)2-、-C(CF3)2-、-Ar-、-SO2-、-CO-、-O-Ar-O-、-Ar-O-Ar-、-Ar-CH2-Ar-、-Ar-C(CH3)2-Ar-或-Ar-SO2-Ar-。Ar表示可被氟原子取代之碳數6至20的伸芳基,具體例可列舉伸苯基。 G and G 1 are a tetravalent organic group, and are preferably an organic group which may be substituted by a hydrocarbon group or a fluorine-substituted hydrocarbon group, and may be exemplified by the formula (20), the formula (21), the formula (22), the formula (23), a group represented by the formula (24), the formula (25), the formula (26), the formula (27), the formula (28) or the formula (29), and a tetravalent hydrocarbon group having 6 or less carbon atoms. Wherein * represents a bonding bond, and Z represents a single bond, -O-, -CH 2 -, -CH 2 -CH 2 -, -CH(CH 3 )-, -C(CH 3 ) 2 -, -C (CF 3 ) 2 -, -Ar-, -SO 2 -, -CO-, -O-Ar-O-, -Ar-O-Ar-, -Ar-CH 2 -Ar-, -Ar-C ( CH 3 ) 2 -Ar- or -Ar-SO 2 -Ar-. Ar represents an extended aryl group having 6 to 20 carbon atoms which may be substituted by a fluorine atom, and specific examples thereof include a stretching phenyl group.

G2為3價有機基,較佳係可被烴基或經氟取代之烴基所取代的有機基,可例示式(20)、式(21)、式(22)、式(23)、式(24)、式(25)、式(26)、式(27)、式(28)或式(29)所示之基的鍵結鍵之任一者經置換為氫原子之基以及3價之碳數6以下的鏈式烴基。 G 2 is a trivalent organic group, preferably an organic group which may be substituted by a hydrocarbon group or a fluorine-substituted hydrocarbon group, and may be exemplified by the formula (20), the formula (21), the formula (22), the formula (23), and the formula (23). 24), any one of the bond bonds of the group represented by the formula (25), the formula (26), the formula (27), the formula (28) or the formula (29) is substituted with a hydrogen atom group and a trivalent A chain hydrocarbon group having 6 or less carbon atoms.

G3為2價有機基,較佳係可被烴基或經氟取代之烴基所取代的有機基,可例示式(20)、式(21)、式(22)、式(23)、式(24)、式(25)、式(26)、式(27)、式(28)或式(29)所示之基的鍵結鍵之中未鄰接的2者被置換為氫原子之基及碳數6以下之鏈式烴基。 G 3 is a divalent organic group, preferably an organic group which may be substituted by a hydrocarbon group or a fluorine-substituted hydrocarbon group, and may be exemplified by the formula (20), the formula (21), the formula (22), the formula (23), and the formula (23). 24), two of the bonding bonds of the group represented by the formula (25), the formula (26), the formula (27), the formula (28) or the formula (29) are substituted with a hydrogen atom group and A chain hydrocarbon group having 6 or less carbon atoms.

A、A1、A2、A3皆為2價有機基,較佳係可被烴基或經氟取代之烴基所取代的有機基,可例示以下之式(30)、式(31)、式(32)、式(33)、式(34)、式(35)、式(36)、式(37)或式(38)所示之基;其等可例示經甲基、氟基、氯基或三氟甲基取代之基以及碳數6以下之鏈式烴基。式中之*表示鍵結鍵,Z1、Z2及Z3係分別獨立地表示單鍵、-O-、 -CH2-、-CH2-CH2-、-CH(CH3)-、-C(CH3)2-、-C(CF3)2-、-SO2-或-CO-。一例係Z1及Z3為-O-,且Z2為-CH2-、-C(CH3)2-、-C(CF3)2-或-SO2-。以Z1與Z2及Z2與Z3分別是對於各環為間位或對位為較佳。 A, A 1 , A 2 and A 3 are each a divalent organic group, and are preferably an organic group which may be substituted by a hydrocarbon group or a fluorine-substituted hydrocarbon group, and the following formula (30), formula (31), and formula are exemplified. (32), a group represented by the formula (33), the formula (34), the formula (35), the formula (36), the formula (37) or the formula (38); and the like may be exemplified by a methyl group, a fluorine group, or a chlorine group. a group substituted with a trifluoromethyl group and a chain hydrocarbon group having a carbon number of 6 or less. Wherein * represents a bonding bond, and Z 1 , Z 2 and Z 3 each independently represent a single bond, -O-, -CH 2 -, -CH 2 -CH 2 -, -CH(CH 3 )-, -C(CH 3 ) 2 -, -C(CF 3 ) 2 -, -SO 2 - or -CO-. In one example, Z 1 and Z 3 are -O-, and Z 2 is -CH 2 -, -C(CH 3 ) 2 -, -C(CF 3 ) 2 - or -SO 2 -. It is preferred that Z 1 and Z 2 and Z 2 and Z 3 are meta or para positions for each ring, respectively.

本發明之聚醯胺係以式(13)所示的重複構造單元為主的聚合物。較佳之例及具體例係與聚醯亞胺系高分子中之G3及A3相同。亦可含有G3及/或A3為相異之2種以上的式(13)所示之構造。 The polyamine of the present invention is a polymer mainly composed of a repeating structural unit represented by the formula (13). Preferred examples and specific examples are the same as G 3 and A 3 in the polyimine-based polymer. It is also possible to contain a structure represented by the formula (13) in which two or more kinds of G 3 and/or A 3 are different.

聚醯亞胺系高分子係例如可藉由二胺與四羧酸化合物(四羧酸二酐等)之聚縮合而得到,例如可依日本特開2006-199945號公報或日本特開2008-163107號公報記載之方法而合成。聚醯亞胺之市售品可列舉如三菱瓦斯化學(股份公司)製的Neopulim等。 The polyimine-based polymer can be obtained, for example, by polycondensation of a diamine and a tetracarboxylic acid compound (tetracarboxylic dianhydride, etc.), for example, according to JP-A-2006-199945 or JP-A-2008- It is synthesized by the method described in 163107. Commercial products of polyimine are, for example, Neopulim manufactured by Mitsubishi Gas Chemical Co., Ltd.

就聚醯亞胺之合成所使用的四羧酸化合物 而言,可列舉如芳香族四羧酸二酐等芳香族四羧酸化合物及脂肪族四羧酸二酐等脂肪族四羧酸化合物。四羧酸化合物可單獨使用,亦可併用2種以上。四羧酸化合物除了可為二酐之外,亦可為醯氯化合物等四羧酸化合物類似物。 a tetracarboxylic acid compound used in the synthesis of polyimine An aliphatic tetracarboxylic acid compound such as an aromatic tetracarboxylic acid compound such as an aromatic tetracarboxylic dianhydride or an aliphatic tetracarboxylic dianhydride may be mentioned. The tetracarboxylic acid compound may be used singly or in combination of two or more. The tetracarboxylic acid compound may be a tetracarboxylic acid compound analog such as a ruthenium chloride compound, in addition to the dianhydride.

芳香族四羧酸二酐之具體例可舉例如:4,4’-氧二鄰苯二甲酸二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、2,2’,3,3’-二苯甲酮四羧酸二酐、3,3’,4,4’-聯苯基四羧酸二酐、2,2’,3,3’-聯苯基四羧酸二酐、3,3’,4,4’-二苯基碸四羧酸二酐、2,2-雙(3,4-二羧基苯基)丙烷二酐、2,2-雙(2,3-二羧基苯基)丙烷二酐、2,2-雙(3,4-二羧基苯氧基苯基)丙烷二酐、4,4’-(六氟亞異丙基)二鄰苯二甲酸二酐、1,2-雙(2,3-二羧基苯基)乙烷二酐、1,1-雙(2,3-二羧基苯基)乙烷二酐、1,2-雙(3,4-二羧基苯基)乙烷二酐、1,1-雙(3,4-二羧基苯基)乙烷二酐、雙(3,4-二羧基苯基)甲烷二酐、雙(2,3-二羧基苯基)甲烷二酐、4,4’-(對伸苯基二氧)二鄰苯二甲酸二酐、4,4’-(間伸苯基二氧)二鄰苯二甲酸二酐及2,3,6,7-萘四羧酸二酐。此等係可單獨使用或組合2種以上而使用。 Specific examples of the aromatic tetracarboxylic dianhydride include, for example, 4,4'-oxydiphthalic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, and 2, 2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyl Tetracarboxylic dianhydride, 3,3',4,4'-diphenylphosphonium tetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-double (2,3-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenoxyphenyl)propane dianhydride, 4,4'-(hexafluoroisopropylidene) Phthalic phthalic anhydride, 1,2-bis(2,3-dicarboxyphenyl)ethane dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, 1,2 - bis(3,4-dicarboxyphenyl)ethane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, bis(3,4-dicarboxyphenyl)methane Anhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, 4,4'-(p-phenylenedioxy)diphthalic dianhydride, 4,4'-(meta-phenylene dioxygen) Diphthalic dianhydride and 2,3,6,7-naphthalenetetracarboxylic dianhydride. These may be used alone or in combination of two or more.

脂肪族四羧酸二酐可列舉環式或非環式之脂肪族四羧酸二酐。環式脂肪族四羧酸二酐係指具有脂環式烴構造之四羧酸二酐,其具體例可列舉:1,2,4,5-環己烷四羧酸二酐、1,2,3,4-環丁烷四羧酸二酐、1,2,3,4-環戊烷四羧酸二酐等環烷烴四羧酸二酐、聯環[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐、二環己基3,3’-4,4’-四羧酸二酐及此等之位置異構物。此等係可單獨使用或組合2種以上而使 用。非環式脂肪族四羧酸二酐之具體例可舉例如:1,2,3,4-丁烷四羧酸二酐、1,2,3,4-戊烷四羧酸二酐等,此等係可單獨使用或組合2種以上而使用。 The aliphatic tetracarboxylic dianhydride may, for example, be a cyclic or acyclic aliphatic tetracarboxylic dianhydride. The cyclic aliphatic tetracarboxylic dianhydride refers to a tetracarboxylic dianhydride having an alicyclic hydrocarbon structure, and specific examples thereof include 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 1,2 , cycloalkane tetracarboxylic dianhydride such as 3,4-cyclobutane tetracarboxylic dianhydride and 1,2,3,4-cyclopentane tetracarboxylic dianhydride, bicyclo [2.2.2] oct-7- Alkene-2,3,5,6-tetracarboxylic dianhydride, dicyclohexyl 3,3'-4,4'-tetracarboxylic dianhydride and these positional isomers. These may be used alone or in combination of two or more. use. Specific examples of the acyclic aliphatic tetracarboxylic dianhydride include 1,2,3,4-butanetetracarboxylic dianhydride and 1,2,3,4-pentanetetracarboxylic dianhydride. These may be used alone or in combination of two or more.

上述四羧酸二酐之中,從高透明性及低著色性之觀點來看,較佳係1,2,4,5-環己烷四羧酸二酐、聯環[2.2.2]辛-7-烯-2,3,5,6-四羧酸二酐及4,4’-(六氟亞異丙基)二鄰苯二甲酸二酐。 Among the above tetracarboxylic dianhydrides, 1,2,4,5-cyclohexanetetracarboxylic dianhydride and bicyclo [2.2.2] octane are preferred from the viewpoint of high transparency and low coloring property. -7-ene-2,3,5,6-tetracarboxylic dianhydride and 4,4'-(hexafluoroisopropylidene)diphthalic dianhydride.

又,本發明之聚醯亞胺系高分子在不損及所得之聚醯亞胺系高分子膜的各種物性之範圍,除了上述之聚醯亞胺合成所使用之四羧酸的酐以外,亦可為進一步與四羧酸、三羧酸及二羧酸以及其等之酐及衍生物反應而成者。 In addition, the polyimine-based polymer of the present invention does not detract from the various physical properties of the obtained polyamidene-based polymer film, in addition to the anhydride of the tetracarboxylic acid used in the synthesis of the above polyimine. Further, it may be further reacted with tetracarboxylic acids, tricarboxylic acids, and dicarboxylic acids, and anhydrides and derivatives thereof.

三羧酸化合物可列舉:芳香族三羧酸、脂肪族三羧酸及其等之類似的醯氯化合物、酸酐等,亦可併用2種以上。具體例可列舉:1,2,4-苯三羧酸之酐;2,3,6-萘三羧酸-2,3-酐;酞酸酐與安息香酸以單鍵、-O-、-CH2-、-C(CH3)2-、-C(CF3)2-、-SO2-或伸苯基連接之化合物。 Examples of the tricarboxylic acid compound include an aromatic tricarboxylic acid, an aliphatic tricarboxylic acid, and the like, and a similar chlorochemical compound, an acid anhydride, or the like, and two or more kinds thereof may be used in combination. Specific examples thereof include: 1,2,4-benzenetricarboxylic acid anhydride; 2,3,6-naphthalenetricarboxylic acid-2,3-anhydride; phthalic anhydride and benzoic acid as single bonds, -O-, -CH a compound in which 2-, -C(CH 3 ) 2 -, -C(CF 3 ) 2 -, -SO 2 - or a phenyl group is attached.

二羧酸化合物可列舉:芳香族二羧酸、脂肪族二羧酸及其等之類似的醯氯化合物、酸酐等,可併用2種以上。具體例可列舉:對苯二甲酸;間苯二甲酸;萘二羧酸;4,4’-聯苯基二羧酸;3,3’-聯苯基二羧酸;碳數8以下之鏈式烴的二羧酸化合物及2個安息香酸以單鍵、-O-、-CH2-、-C(CH3)2-、-C(CF3)2-、-SO2-或伸苯基連接之化合物。 Examples of the dicarboxylic acid compound include an aromatic dicarboxylic acid, an aliphatic dicarboxylic acid, and the like, and a similar ruthenium chloride compound or an acid anhydride, and two or more kinds thereof may be used in combination. Specific examples thereof include terephthalic acid; isophthalic acid; naphthalene dicarboxylic acid; 4,4'-biphenyldicarboxylic acid; 3,3'-biphenyldicarboxylic acid; and chains having a carbon number of 8 or less. a dicarboxylic acid compound of the formula hydrocarbon and two benzoic acid with a single bond, -O-, -CH 2 -, -C(CH 3 ) 2 -, -C(CF 3 ) 2 -, -SO 2 - or benzene a compound attached to the group.

就可使用於聚醯亞胺合成之二胺而言,可為脂肪族二胺、芳香族二胺或其等之混合物。又,在本實施形態中,所謂「芳香族二胺」表示胺基直接鍵結於芳香環之二胺,其構造之一部分可含有脂肪族基或其他取代基。芳香環可為單環亦可為縮合環,可例示苯環、萘環、蒽環及茀環等,但不限定於此等。此等之中,較佳係苯環。又,「脂肪族二胺」係表示胺基直接鍵結於脂肪族基之二胺,可於其構造之一部分含有芳香環或其他取代基。 The diamine used for the synthesis of the polyimine may be an aliphatic diamine, an aromatic diamine or a mixture thereof. Further, in the present embodiment, the "aromatic diamine" means a diamine in which an amine group is directly bonded to an aromatic ring, and a part of the structure may contain an aliphatic group or another substituent. The aromatic ring may be a monocyclic ring or a condensed ring, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, and an anthracene ring, but are not limited thereto. Among these, a benzene ring is preferred. Further, the "aliphatic diamine" means a diamine in which an amine group is directly bonded to an aliphatic group, and an aromatic ring or other substituent may be contained in a part of its structure.

脂肪族二胺可舉例如:六亞甲基二胺等非環式脂肪族二胺及1,3-雙(胺基甲基)環己烷、1,4-雙(胺基甲基)環己烷、降莰烷二胺、4,4’-二胺基二環己基甲烷等環式脂肪族二胺等,此等可單獨或組合2種以上而使用。 The aliphatic diamine may, for example, be an acyclic aliphatic diamine such as hexamethylenediamine, a 1,3-bis(aminomethyl)cyclohexane or a 1,4-bis(aminomethyl) ring. A cycloaliphatic diamine such as hexane, norbornanediamine or 4,4'-diaminodicyclohexylmethane may be used alone or in combination of two or more.

芳香族二胺可舉例如:對伸苯基二胺、間伸苯基二胺、2,4-甲苯二胺、間伸苯二甲基二胺、對伸苯二甲基二胺、1,5-二胺基萘、2,6-二胺基萘等具有1個芳香環之芳香族二胺;4,4’-二胺基二苯基甲烷、4,4’-二胺基二苯基丙烷、4,4’-二胺基二苯基醚、3,4’-二胺基二苯基醚、3,3’-二胺基二苯基醚、4,4’-二胺基二苯基碸、3,4’-二胺基二苯基碸、3,3’-二胺基二苯基碸、1,4-雙(4-胺基苯氧基)苯、1,3-雙(4-胺基苯氧基)苯、4,4’-二胺基二苯基碸、雙[4-(4-胺基苯氧基)苯基]碸、雙[4-(3-胺基苯氧基)苯基]碸、2,2-雙[4-(4-胺基苯氧基)苯基]丙烷、2,2-雙[4-(3-胺基苯氧基)苯基]丙烷、2,2’-二甲基聯苯胺、2,2’-雙(三氟甲基)聯苯胺、4,4’-雙(4-胺基苯氧基)聯苯基、4,4’-二胺基二苯基 醚、3,4’-二胺基二苯基醚、4,4’-二胺基二苯基甲烷、9,9-雙(4-胺基苯基)茀、9,9-雙(4-胺基-3-甲基苯基)茀、9,9-雙(4-胺基-3-氯苯基)茀、9,9-雙(4-胺基-3-氟苯基)茀等具有2個以上芳香環的芳香族二胺,此等係可單獨使用或組合2種以上而使用。 Examples of the aromatic diamine include p-phenylenediamine, meta-phenylenediamine, 2,4-toluenediamine, meta-xylylenediamine, and p-xylylenediamine. An aromatic diamine having one aromatic ring such as 5-diaminonaphthalene or 2,6-diaminonaphthalene; 4,4'-diaminodiphenylmethane and 4,4'-diaminodiphenyl Propane, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 4,4'-diamino Diphenylanthracene, 3,4'-diaminodiphenylanthracene, 3,3'-diaminodiphenylanthracene, 1,4-bis(4-aminophenoxy)benzene, 1,3 - bis(4-aminophenoxy)benzene, 4,4'-diaminodiphenylanthracene, bis[4-(4-aminophenoxy)phenyl]anthracene, bis[4-(3 -aminophenoxy)phenyl]anthracene, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy) Phenyl]propane, 2,2'-dimethylbenzidine, 2,2'-bis(trifluoromethyl)benzidine, 4,4'-bis(4-aminophenoxy)biphenyl 4,4'-diaminodiphenyl Ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 9,9-bis(4-aminophenyl)anthracene, 9,9-bis (4) -amino-3-methylphenyl)anthracene, 9,9-bis(4-amino-3-chlorophenyl)anthracene, 9,9-bis(4-amino-3-fluorophenyl)anthracene An aromatic diamine having two or more aromatic rings may be used alone or in combination of two or more.

上述二胺之中,從高透明性及低著色性之觀點來看,較佳係使用選自由具有聯苯基構造之芳香族二胺所組成群組的1種以上。更佳係使用選自由2,2’-二甲基聯苯胺、2,2’-雙(三氟甲基)聯苯胺、4,4’-雙(4-胺基苯氧基)聯苯基及4,4’-二胺基二苯基醚所組成群組的1種以上,再更佳係含有2,2’-雙(三氟甲基)聯苯胺。 Among the above-mentioned diamines, one or more selected from the group consisting of aromatic diamines having a biphenyl structure is preferably used from the viewpoint of high transparency and low coloring property. More preferably, it is selected from the group consisting of 2,2'-dimethylbenzidine, 2,2'-bis(trifluoromethyl)benzidine, 4,4'-bis(4-aminophenoxy)biphenyl And one or more of the group consisting of 4,4'-diaminodiphenyl ether, and more preferably 2,2'-bis(trifluoromethyl)benzidine.

屬於至少含有1種以式(10)、式(11)、式(12)或式(13)表示之重複構造單元的聚合物之聚醯亞胺系高分子及聚醯胺,係二胺、與由四羧酸化合物(醯氯化合物、四羧酸二酐等四羧酸化合物類似物)、三羧酸化合物(醯氯化合物、三羧酸酐等三羧酸化合物類似物)及二羧酸化合物(醯氯化合物等二羧酸化合物類似物)所組成群組所包含的至少1種化合物之聚縮合生成物的縮合型高分子。就起始原料而言,除了使用此等以外,有時也會進一步使用二羧酸化合物(包含醯氯化合物等類似物)。式(11)所示之重複構造單元通常係衍生自二胺類及四羧酸化合物。式(12)所示之重複構造單元通常係衍生自二胺及三羧酸化合物。式(13)所示之重複構造單元通常係衍生自二胺及二羧酸化合物。二胺及四羧酸化合物之具體例如上述。 a polyimide-based polymer and a polyamine which are polymers containing at least one type of repeating structural unit represented by formula (10), formula (11), formula (12) or formula (13), which are diamines, And a tetracarboxylic acid compound (a tetracarboxylic acid compound analog such as a ruthenium chloride compound or a tetracarboxylic dianhydride), a tricarboxylic acid compound (a tricarboxylic acid compound analog such as a ruthenium chloride compound or a tricarboxylic acid anhydride), and a dicarboxylic acid compound. A condensation type polymer of a polycondensation product of at least one compound contained in a group consisting of (a dicarboxylic acid compound analog such as a chloro compound). As the starting material, in addition to the use of the above, a dicarboxylic acid compound (including a ruthenium chloride compound or the like) may be further used. The repeating structural unit represented by the formula (11) is usually derived from a diamine and a tetracarboxylic acid compound. The repeating structural unit represented by the formula (12) is usually derived from a diamine and a tricarboxylic acid compound. The repeating structural unit represented by the formula (13) is usually derived from a diamine and a dicarboxylic acid compound. Specific examples of the diamine and tetracarboxylic acid compound are as described above.

就本發明之聚醯亞胺系高分子及聚醯胺中,標準聚苯乙烯換算的重量平均分子量通常係10,000至500,000,較佳係50,000至500,000,更佳係100,000至500,000,再更佳係200,000至500,000,尤佳係300,000至450,000。當聚醯亞胺系高分子及聚醯胺之重量平均分子量在前述範圍,膜化時愈有容易顯現高耐彎曲性之傾向,而且含有樹脂之溶液的黏度不會過高,而有加工性不易降低之傾向。在本發明中可使用2種以上之聚醯亞胺系高分子或聚醯亞胺。 The polystyrene-based polymer and polyamine of the present invention have a weight average molecular weight in terms of standard polystyrene of usually 10,000 to 500,000, preferably 50,000 to 500,000, more preferably 100,000 to 500,000, and still more preferably 200,000 to 500,000, especially 300,000 to 450,000. When the weight average molecular weight of the polyimine-based polymer and the polyamine is in the above range, the filming tends to exhibit high bending resistance, and the viscosity of the resin-containing solution is not excessively high, and the workability is high. It is not easy to reduce the tendency. In the present invention, two or more kinds of polyimine-based polymers or polyimines can be used.

聚醯亞胺系高分子及聚醯胺係藉由含有含氟取代基,而提高膜化時之彈性率,且YI值有降低之傾向。若膜之彈性率高,則有抑制傷痕及皺褶等產生之傾向。從膜之透明性的觀點來看,聚醯亞胺系高分子及聚醯胺係以具有含氟取代基為較佳。含氟取代基之具體例,可列舉氟基及三氟甲基。 The polyimine-based polymer and the polyamine contain a fluorine-containing substituent to increase the modulus at the time of film formation, and the YI value tends to decrease. When the modulus of elasticity of the film is high, there is a tendency to suppress the occurrence of scratches, wrinkles, and the like. From the viewpoint of transparency of the film, the polyimide-based polymer and the polyamine-based compound preferably have a fluorine-containing substituent. Specific examples of the fluorine-containing substituent include a fluorine group and a trifluoromethyl group.

就聚醯亞胺系高分子及聚醯胺中之氟原子的含量而言,以聚醯亞胺系高分子或聚醯胺之質量作為基準,較佳係1質量%以上40質量%以下,更佳係5質量%以上40質量%以下。 The content of the fluorine atom in the polyimine-based polymer and the polyamine is preferably 1% by mass or more and 40% by mass or less based on the mass of the polyimine-based polymer or the polyamine. More preferably, it is 5 mass% or more and 40 mass% or less.

在樹脂清漆中,除了含有前述聚醯亞胺系高分子及/或聚醯胺,亦可更含有無機粒子等無機材料。 The resin varnish may further contain an inorganic material such as inorganic particles in addition to the polyimine-based polymer and/or polyamine.

就無機材料而言,較佳可可列舉氧化矽粒子、正矽酸四乙酯等4級烷氧基矽烷等矽化合物,從清漆穩定性之觀點來看,較佳係可可列舉氧化矽粒子。 As the inorganic material, a ruthenium compound such as a quaternary oxide such as cerium oxide particles or tetraethyl ortho-nonanoate may be preferably exemplified, and from the viewpoint of varnish stability, cerium oxide particles are preferred.

就氧化矽粒子之平均一次粒徑而言,較佳係10至100nm,更佳係20至80nm。若氧化矽粒子之平均一次粒徑在前述之範圍,則透明性會提高,且因氧化矽粒子之凝集力會弱化,故有容易處理之傾向。 The average primary particle diameter of the cerium oxide particles is preferably from 10 to 100 nm, more preferably from 20 to 80 nm. When the average primary particle diameter of the cerium oxide particles is within the above range, the transparency is improved, and the cohesive force of the cerium oxide particles is weakened, so that it tends to be easily handled.

本發明之氧化矽微粒子,可為使氧化矽粒子分散於有機溶劑等之氧化矽溶膠,亦可使用以氣相法製造之氧化矽微粒子粉末,惟就容易操作而言,較佳係氧化矽溶膠。 The cerium oxide microparticles of the present invention may be a cerium oxide sol in which cerium oxide particles are dispersed in an organic solvent or the like, and cerium oxide microparticle powder produced by a vapor phase method may be used, but in terms of ease of handling, cerium oxide sol is preferred. .

所得之樹脂膜中的氧化矽粒子之平均一次粒徑可藉由穿透式電子顯微鏡(TEM)之觀察而求取。形成樹脂膜之前的氧化矽粒子之粒度分布,可藉由市售之雷射繞射式粒度分佈儀求出。 The average primary particle diameter of the cerium oxide particles in the obtained resin film can be determined by observation by a transmission electron microscope (TEM). The particle size distribution of the cerium oxide particles before the formation of the resin film can be determined by a commercially available laser diffraction type particle size distribution analyzer.

在本發明之樹脂膜中,無機材料之含量較佳係0質量%以上90質量%以下,更佳係10質量%以上60質量%以下,再更佳係20質量%以上50質量%以下。無機材料之含量若為上述之範圍內,則有容易兼具樹脂膜之透明性及機械強度之傾向。 In the resin film of the present invention, the content of the inorganic material is preferably 0% by mass or more and 90% by mass or less, more preferably 10% by mass or more and 60% by mass or less, and still more preferably 20% by mass or more and 50% by mass or less. When the content of the inorganic material is within the above range, it tends to have both transparency and mechanical strength of the resin film.

樹脂膜除了含有以上所說明之成分以外,亦可更含有其他之成分。其他之成分可舉例如:抗氧化劑、離型劑、穩定劑、上藍(blueing)劑、阻燃劑、光滑劑及調平劑。 The resin film may contain other components in addition to the components described above. Other ingredients include, for example, an antioxidant, a release agent, a stabilizer, a blueing agent, a flame retardant, a smoothing agent, and a leveling agent.

相對於樹脂膜之質量,樹脂成分及無機材料以外之成分的含量較佳係超過0質量%且20質量%以下,更佳係超過0質量%且10質量%以下。 The content of the components other than the resin component and the inorganic material is preferably more than 0% by mass and 20% by mass or less, more preferably more than 0% by mass and not more than 10% by mass based on the mass of the resin film.

就本發明所使用之樹脂清漆而言,例如可為將選自前述四羧酸化合物、前述二胺及前述其他原料並使其反應而得之聚醯亞胺系高分子及/或聚醯胺的反應液、溶媒、以及依需要而使用之前述其他成分進行混合、攪拌而調製。亦可將聚醯亞胺系高分子等之反應液改為使用購得的聚醯亞胺系高分子等之溶液、購得的固體聚醯亞胺系高分子等之溶液。 The resin varnish used in the present invention may be, for example, a polyimide-based polymer and/or polyamine which is obtained by reacting and reacting the above-mentioned tetracarboxylic acid compound, the above-mentioned diamine and the above-mentioned other raw materials. The reaction liquid, the solvent, and the other components used as needed are mixed and stirred to prepare. The reaction solution of the polyimine-based polymer or the like may be changed to a solution using a commercially available polyimine-based polymer or the like, or a commercially available solid polyimide-based polymer.

就樹脂清漆所能使用之溶媒而言,若為能使樹脂成分溶解或分散者即可,可舉例如:N,N-二甲基甲醯胺、N,N-二甲基乙醯胺等醯胺系溶媒;γ-丁內酯、γ-戊內酯等內酯系溶媒;二甲基碸、二甲基亞碸、環丁碸等含硫系溶劑;碳酸乙烯酯、碳酸丙烯酯等碳酸酯系溶媒等。溶媒之量係以成為樹脂清漆可處理之黏度之方式選擇,故無特別限制,惟例如相對於樹脂清漆整體,通常為70至95質量%,較佳係80至90質量%。 In the solvent which can be used for the resin varnish, the resin component may be dissolved or dispersed, and examples thereof include N,N-dimethylformamide, N,N-dimethylacetamide, and the like. A phthalamide-based solvent; a lactone-based solvent such as γ-butyrolactone or γ-valerolactone; a sulfur-containing solvent such as dimethyl hydrazine, dimethyl hydrazine or cyclobutyl hydrazine; ethylene carbonate or propylene carbonate; A carbonate-based solvent or the like. The amount of the solvent is selected in such a manner that it can be a viscosity which can be treated by the resin varnish, and is not particularly limited. For example, it is usually 70 to 95% by mass, preferably 80 to 90% by mass based on the total of the resin varnish.

樹脂清漆之形成係能夠藉由將上述樹脂膜之成分以溶媒混合而製造。混合係使用一般之混合裝置來進行。 The formation of the resin varnish can be produced by mixing the components of the above resin film with a solvent. The mixing is carried out using a general mixing device.

製造含有無機材料之樹脂膜時,係添加無機材料,進行攪拌及混合,而調製無機材料均勻分散之樹脂清漆(分散液)。 When a resin film containing an inorganic material is produced, an inorganic material is added and stirred and mixed to prepare a resin varnish (dispersion liquid) in which the inorganic material is uniformly dispersed.

形成樹脂清漆之後,係如第1圖所示,移動至預製膜步驟。在預製膜步驟中,係將樹脂清漆藉由塗裝裝置塗佈於支撐體上,並進行簡單乾燥,而在支撐體上 形成樹脂膜之層。支撐體可為例如樹脂膜基材、鋼基材(例如SUS輸送帶)。樹脂膜基材可舉例如聚對苯二甲酸乙二酯(PET)膜。支撐體之厚度並無特別限制,惟較佳係50至250μm,更佳係100至200μm。較薄者有能夠抑制成本之傾向,較厚者有可以抑制在除去一部分溶媒的步驟所產生之翹曲的傾向。 After the resin varnish is formed, as shown in Fig. 1, it is moved to the pre-filming step. In the pre-filming step, the resin varnish is applied to the support by a coating device, and is simply dried, and on the support. A layer of a resin film is formed. The support may be, for example, a resin film substrate or a steel substrate (for example, a SUS conveyor belt). The resin film substrate may, for example, be a polyethylene terephthalate (PET) film. The thickness of the support is not particularly limited, but is preferably 50 to 250 μm, more preferably 100 to 200 μm. A thinner has a tendency to suppress the cost, and a thicker one has a tendency to suppress warpage caused by the step of removing a part of the solvent.

如上所述,在預乾燥步驟中,係在支撐體上形成樹脂膜之層,但通常會在樹脂膜上進一步形成保護膜。保護膜係用以保護樹脂膜之膜,且能夠使用聚乙烯、聚丙烯等聚烯烴系膜、聚對苯二甲酸乙二酯等聚酯系膜等的膜。因此,在預乾燥步驟中,係在支撐體上形成樹脂膜之層,並進一步在樹脂膜之層上形成保護膜,而形成積層膜。 As described above, in the pre-drying step, a layer of a resin film is formed on the support, but a protective film is usually further formed on the resin film. The protective film is used to protect the film of the resin film, and a film such as a polyolefin film such as polyethylene or polypropylene or a polyester film such as polyethylene terephthalate can be used. Therefore, in the pre-drying step, a layer of a resin film is formed on the support, and a protective film is further formed on the layer of the resin film to form a laminated film.

第1圖之預乾燥步驟的後續步驟為支撐體剝離步驟。支撐體剝離步驟,係在付諸後續之乾燥步驟之前,從樹脂膜層將支撐體以無剝離痕跡的方式進行剝離支撐體之步驟。該的時間點之樹脂膜係尚未經過乾燥步驟者,故為仍殘存許多溶媒成分者,於付諸乾燥步驟之前,必須十分小心地剝離支撐體,而設有該支撐體剝離步驟。在此所得之樹脂膜係由保護膜與樹脂膜之兩層所構成,通常係捲取成捲筒狀。捲筒可為例如:將積層體捲繞於外徑50至200mm之捲取管(塑膠芯、金屬輥等)之周圍,而成為積層體之捲筒。捲取管可使用市售之直徑3英吋、6英吋的塑膠芯等。在第2圖之乾燥步驟中,亦可將該捲筒使用於 積層膜的捲取捲筒。 The subsequent step of the pre-drying step of Figure 1 is the support stripping step. The support peeling step is a step of peeling the support from the resin film layer without peeling off the mark before the subsequent drying step. The resin film at this point in time has not been subjected to the drying step, so that a plurality of solvent components remain, and the support body must be peeled off very carefully before the drying step, and the support peeling step is provided. The resin film obtained here is composed of two layers of a protective film and a resin film, and is usually wound into a roll shape. The reel may be, for example, a roll of a laminate which is wound around a take-up tube (plastic core, metal roll, or the like) having an outer diameter of 50 to 200 mm to form a laminate. For the take-up tube, a commercially available plastic core of 3 inches in diameter and 6 inches in diameter can be used. In the drying step of Figure 2, the reel can also be used in The take-up reel of the laminated film.

乾燥步驟係具體地示意性表示於第2圖。在先前的預乾燥步驟所得之樹脂膜與保護膜之兩層積層膜,於第2圖中係以捲筒1之形態表示。從捲筒1所送出之積層膜中,保護膜係被捲取於保護膜捲取捲筒2,而僅使樹脂膜3在乾燥爐4內之複數導引輥5上行進。此時,樹脂膜3與導引輥5接觸之面可為在上述支撐體剝離前接觸支撐體之支撐體面、或與其相反的未接觸支撐體之反支撐體面中之任一者,惟反支撐體面因為硬度高,而為較佳者。使於導引輥行進中在乾燥爐4內充分進行乾燥後,經由導引輥9捲取於第2捲筒6。在捲取於該第2捲筒6時,通常也將保護膜從保護膜捲筒7送出,而以保護膜進行被覆。第2圖中,以8所示之箭號係表示樹脂膜之移動方向(縱方向)。 The drying step is specifically shown schematically in Figure 2. The two-layer laminated film of the resin film and the protective film obtained in the previous pre-drying step is shown in the form of the roll 1 in Fig. 2 . In the laminated film sent from the reel 1, the protective film is wound up on the protective film take-up reel 2, and only the resin film 3 is traveled on the plurality of guide rolls 5 in the drying furnace 4. At this time, the surface of the resin film 3 in contact with the guide roller 5 may be any one of the support body surface contacting the support body before the support body is peeled off, or the opposite support body surface of the contactless support body opposite thereto, but the counter support Decent is preferred because of its high hardness. After the guide roller is sufficiently dried in the drying furnace 4 during traveling, it is taken up by the guide roller 9 to the second reel 6. When the second reel 6 is taken up, the protective film is usually sent out from the protective film roll 7 and covered with a protective film. In Fig. 2, the arrow direction indicated by 8 indicates the moving direction (longitudinal direction) of the resin film.

在本發明,若在上述乾燥步驟中,對樹脂膜3之每單位寬度施加的張力為82N/m以下,便可減輕微小傷痕。本說明書中,所謂「對每單位寬度施加的張力」係指將「對樹脂膜之移動方向(縱方向)施加的張力」除以「樹脂膜之寬度的長度」之值。使用第3圖說明對每單位寬度施加之張力。第3圖之F係對樹脂膜之移動方向(縱方向)施加之張力,單位為N(牛頓)。 In the present invention, when the tension applied per unit width of the resin film 3 is 82 N/m or less in the drying step, minute scratches can be reduced. In the present specification, the term "tension applied per unit width" means a value obtained by dividing "the tension applied to the moving direction (longitudinal direction) of the resin film" by the "length of the width of the resin film". Use Figure 3 to illustrate the tension applied per unit width. F in Fig. 3 is a tension applied to the moving direction (longitudinal direction) of the resin film, and the unit is N (Newton).

L係表示在與移動方向呈直角的方向之樹脂膜的寬度,單位為m(公尺)。「對每單位寬度施加之張力」係將張力(F)除以寬度(L)之值,F/L(N/m)。在本發明中,對每單位寬度 施加之張力為82N/m以下,故必須為F/L≦82N/m。若對每單位寬度施加之張力超過82N/m,則微小傷痕會増佳,於透明性有礙。對每單位寬度施加之張力較佳係30至81N/m,更佳係35至65N/m,再更佳為40至60N/m。若對每單位寬度施加之張力太小,則恐會因為樹脂膜在乾燥爐內蛇行而產生擦傷等其他缺陷。 L represents the width of the resin film in a direction perpendicular to the moving direction, and the unit is m (meter). The "tension applied per unit width" is the value of the tension (F) divided by the width (L), F/L (N/m). In the present invention, for each unit width The applied tension is 82 N/m or less, so it must be F/L ≦ 82 N/m. If the tension applied per unit width exceeds 82 N/m, the minute flaws will be better and the transparency will be hindered. The tension applied per unit width is preferably from 30 to 81 N/m, more preferably from 35 to 65 N/m, still more preferably from 40 to 60 N/m. If the tension applied per unit width is too small, there is a fear that other defects such as scratches may occur due to the resin film being meandered in the drying furnace.

就在乾燥爐4之乾燥而言,可為了從塗膜除去溶媒之乾燥,而依需要將塗膜加熱。例如,可進行調整而使加熱溫度在40至240℃之範圍、加熱時間在10至180分鐘、較佳係10至120分鐘之範圍。在藉由熱風乾燥(除去溶媒)時,可進行調整而使熱風之風速在0至15m/秒之範圍。除去溶媒時,亦可在惰性氣體環境或減壓之條件下加熱塗膜。乾燥爐4內之導引輥的直徑較佳係10至300mm,更佳係30至250mm,再更佳係50至200mm。又,就依據JIS B0601測定出之導引輥的表面粗度(Rmax)而言,較佳係0.01以上1.0以下,更佳係0.03以上0.9以下,再更佳係0.05以上0.7以下。若表面粗度大於0.01,則與樹脂膜接觸時之阻抗變小,若小於1.0,則導引輥表面形狀會難以轉印至樹脂膜。再者,就依據JIS Z2244測定出之導引輥的維氏硬度而言,較佳係500以上2,000以下,更佳係520以上1,500以下,再更佳係550以上1,300以下。金屬輥之表面處理方法可列舉:鎳鍍覆、無電解鎳鍍覆、鎳-硼鍍覆、硬質鉻鍍覆、派克處理(parkerizing)鍍覆等,較佳係可舉例如硬質鉻鍍覆。 In the drying of the drying furnace 4, the coating film may be heated as needed in order to remove the drying of the solvent from the coating film. For example, adjustment may be made such that the heating temperature is in the range of 40 to 240 ° C, and the heating time is in the range of 10 to 180 minutes, preferably 10 to 120 minutes. When it is dried by hot air (removing the solvent), the wind speed of the hot air can be adjusted in the range of 0 to 15 m/sec. When the solvent is removed, the coating film may be heated under an inert gas atmosphere or under reduced pressure. The diameter of the guide rolls in the drying oven 4 is preferably from 10 to 300 mm, more preferably from 30 to 250 mm, still more preferably from 50 to 200 mm. In addition, the surface roughness (Rmax) of the guide roll measured in accordance with JIS B0601 is preferably 0.01 or more and 1.0 or less, more preferably 0.03 or more and 0.9 or less, and still more preferably 0.05 or more and 0.7 or less. When the surface roughness is more than 0.01, the resistance at the time of contact with the resin film becomes small, and if it is less than 1.0, the surface shape of the guide roll is difficult to transfer to the resin film. In addition, the Vickers hardness of the guide roll measured according to JIS Z2244 is preferably 500 or more and 2,000 or less, more preferably 520 or more and 1,500 or less, and still more preferably 550 or more and 1,300 or less. Examples of the surface treatment method of the metal roll include nickel plating, electroless nickel plating, nickel-boron plating, hard chrome plating, parkerizing plating, and the like, and preferably, for example, hard chrome plating.

所得之樹脂膜的厚度可依照應用樹脂膜之各種裝置而適當調整,惟較佳係10至500μm,更佳係15至200μm,再更佳係20至100μm。如此之構成的樹脂膜可具有特別優異之彎曲性。 The thickness of the obtained resin film can be appropriately adjusted in accordance with various means for applying the resin film, but is preferably 10 to 500 μm, more preferably 15 to 200 μm, still more preferably 20 to 100 μm. The resin film thus constituted can have particularly excellent flexibility.

又,在本說明書中,「微小傷痕」係指從膜之移動方向(亦即縱方向)照射3,000流明以上,例如3,400流明之照度的光,而可以目視辨識到的點狀缺陷,大小係指為40至400μm之大小者。將樹脂膜之表面的微小傷痕之照片表示於第4圖。 In addition, in the present specification, "small scar" refers to light that is irradiated with illuminance of 3,000 lumens or more, for example, 3,400 lumens, from the moving direction of the film (that is, the longitudinal direction), and can be visually recognized as a point defect, and the size refers to It is 40 to 400 μm in size. A photograph of a minute flaw on the surface of the resin film is shown in Fig. 4.

微小傷痕之產生係與樹脂膜之製膜以後的步驟之樹脂膜中的殘存溶媒量有所關聯。若樹脂膜中之殘存溶媒量多,則膜表面變柔軟而變得容易造成微小傷痕。上述預製膜後之樹脂膜中的殘存溶媒,在該樹脂膜100質量份中,通常為5至30質量%,較佳係5至20質量%左右,經過乾燥步驟後的殘存溶媒之量通常為0至10質量%,較佳為0至5質量%。若為乾燥步驟後之殘存溶媒量,則認為在樹脂膜搬送中產生微小傷痕之風險變成非常小。 The generation of minute flaws is related to the amount of residual solvent in the resin film in the step after film formation of the resin film. When the amount of the residual solvent in the resin film is large, the surface of the film becomes soft and it is easy to cause minute scratches. The residual solvent in the resin film after the pre-film formation is usually 5 to 30% by mass, preferably about 5 to 20% by mass, based on 100 parts by mass of the resin film, and the amount of the residual solvent after the drying step is usually 0 to 10% by mass, preferably 0 to 5% by mass. If the amount of the solvent remaining after the drying step is considered to be extremely small, the risk of occurrence of minute scratches in the resin film transfer becomes extremely small.

上述殘存溶媒量的測定係可以「TG-DTA測定」進行。TG-DTA之測定裝置可使用日立Hightech Science公司製「TG/DTA6300」。測定順序如下:從所製作之聚醯亞胺膜取得約20mg之試料。 The measurement of the amount of the remaining solvent can be carried out by "TG-DTA measurement". "TG/DTA6300" manufactured by Hitachi Hightech Science Co., Ltd. can be used as the measuring device for TG-DTA. The measurement procedure was as follows: About 20 mg of the sample was obtained from the produced polyimide film.

將採取之試料從室溫以10℃/分鐘之昇溫速度昇溫至120℃,在120℃保持5分鐘之後,在10℃/分鐘之昇溫速度昇溫至400℃之條件下,於加熱同時測定試料之質量變 化。 The sample to be taken is heated from room temperature to 120 ° C at a temperature increase rate of 10 ° C / min, and after holding at 120 ° C for 5 minutes, the sample is heated while heating at a temperature increase rate of 10 ° C / min to 400 ° C. Quality change Chemical.

從TG-DTA測定結果,依據下述式算出120℃至250℃之質量減少率T(%),作為殘存溶媒量。 From the measurement result of TG-DTA, the mass reduction rate T (%) of 120 ° C to 250 ° C was calculated from the following formula as the amount of residual solvent.

T(%)=100-(W1/W0)×100 T(%)=100-(W 1 /W 0 )×100

(上述式中,W0表示在120℃保持5分鐘後之試料的質量,W1表示在250℃之試料的質量。) (In the above formula, W 0 represents the mass of the sample after holding at 120 ° C for 5 minutes, and W 1 represents the mass of the sample at 250 ° C.)

在本發明之聚醯胺系的樹脂膜中,幾乎無法視覺辨識微小傷痕,而為可使用於光學用途之優異者。 In the polyamine-based resin film of the present invention, it is almost impossible to visually recognize minute scratches, and it is excellent for use in optical applications.

又,就聚醯亞胺系樹脂及聚醯胺之重量平均分子量測定而言,係藉由凝膠浸透色層分析(GPC)測定而以如下之方法進行。 Further, the measurement of the weight average molecular weight of the polyimine-based resin and the polyamine was carried out by gel permeation chromatography (GPC) measurement in the following manner.

(1)前處理方法 (1) Pretreatment method

使試料溶解於γ-丁內酯(GBL)而成為20質量%溶液後,以N,N-二甲基甲醯胺(DMF)溶析液稀釋成100倍,並以0.45μm膜濾器過濾,而將所成者作為測定溶液。 The sample was dissolved in γ-butyrolactone (GBL) to obtain a 20% by mass solution, and then diluted to 100-fold with a N,N-dimethylformamide (DMF) solution, and filtered through a 0.45 μm membrane filter. The resulting one was used as a measurement solution.

(2)測定條件 (2) Measurement conditions

裝置:島津製作所(股份公司)製LC-10Atvp Device: LC-10Atvp manufactured by Shimadzu Corporation (stock company)

管柱:TSKgel Super AWM-H×2+SuperAW2500×1(6.0mm I.D.×150mm×3根) Column: TSKgel Super AWM-H×2+SuperAW2500×1 (6.0mm I.D.×150mm×3)

溶析液:DMF(添加10mM之溴化鋰) Lysate: DMF (addition of 10 mM lithium bromide)

流量:0.6mL/分鐘 Flow rate: 0.6mL/min

檢測器:RI檢測器 Detector: RI detector

管柱溫度:40℃ Column temperature: 40 ° C

注入量:20μL Injection volume: 20μL

分子量標準:標準聚苯乙烯 Molecular weight standard: standard polystyrene

[實施例] [Examples]

以下,舉出實施例以更具體說明本發明。但是,本發明並不侷限於此等實施例。 Hereinafter, the present invention will be described in more detail by way of examples. However, the invention is not limited to such embodiments.

實施例1 Example 1

準備重量平均分子量為360,000之聚醯亞胺(河村產業(股份公司)製「KPI-MX300F」)。將該聚醯亞胺溶解於N,N-二甲基乙醯胺及γ-丁內酯之9:1的混合溶媒,調製樹脂清漆(濃度20質量%)。將該樹脂清漆在厚度188μm、寬度900mm之長條狀聚對苯二甲酸乙二酯(PET)膜基材上藉由澆鑄法以寬度870mm進行塗佈而製膜。使經製膜之樹脂清漆以線性速度0.4m/分通過溫度設定成階段性地為70℃ 120℃之長度12m的爐內,藉此從樹脂溶液除去溶媒,形成樹脂膜(厚度80μm)。其後,在樹脂膜貼合保護膜(Toray Advanced Film(股份公司)製「7332」、弱黏著力之聚烯烴保護膜),並於捲筒芯捲取由保護膜、樹脂膜與PET膜所構成之膜狀積層體而成為捲筒狀(250m)。 A polyimine ("KPI-MX300F" manufactured by Kawamura Industry Co., Ltd.) having a weight average molecular weight of 360,000 was prepared. This polyimine was dissolved in a 9:1 mixed solvent of N,N-dimethylacetamide and γ-butyrolactone to prepare a resin varnish (concentration: 20% by mass). The resin varnish was coated on a long strip of polyethylene terephthalate (PET) film substrate having a thickness of 188 μm and a width of 900 mm by a casting method at a width of 870 mm to form a film. The film-formed resin varnish was set to a furnace having a length of 12 m and a length of 12° C. at a linear velocity of 0.4 m/min to remove the solvent from the resin solution to form a resin film (thickness: 80 μm). Then, a protective film ("7332" manufactured by Toray Advanced Film Co., Ltd., a polyolefin protective film with weak adhesion) was bonded to the resin film, and the protective film, the resin film, and the PET film were taken up from the roll core. The film-like laminate body is formed into a roll shape (250 m).

將上述被捲取於捲筒狀之積層體捲出,同時剝離PET膜基材,並捲取由樹脂膜與保護膜所構成之積層體(取得200m)。 The laminate which was wound up in a roll shape was taken up, and the PET film substrate was peeled off, and a laminate composed of a resin film and a protective film was taken up (200 m was obtained).

將在上述被捲取於捲筒狀之積層體以30N(33.3N/m)之張力捲出,同時剝離保護膜,並將樹脂膜以張力80.5N/m導入於乾燥爐而使其進一步乾燥。於乾燥爐內,使剝離保護膜後之樹脂膜的在剝離前與PET膜基材接觸的 面(支撐體面)側為相反側之面(反支撐體面)側與10根導引輥接觸之方式搬送,前述導引輥係金屬製之直徑100mm、表面粗度(Rmax)0.6S、維氏硬度850之硬質鉻鍍覆的導引輥。在乾燥爐內,樹脂膜寬度870mm、乾燥爐張力70N。因此,對每單位寬度施加之張力為80.5N/n。又,乾燥爐之溫度係設為200℃,搬送速度係設為0.4m/分鐘,乾燥時間係設為30分鐘。以乾燥爐乾燥後之樹脂膜係在兩面貼合保護膜(Toray Advanced Film(股份公司)製「7332」、弱黏著力之聚烯烴保護膜),並捲取於捲筒芯。 The laminate which was wound up in a roll shape was wound up under a tension of 30 N (33.3 N/m), and the protective film was peeled off, and the resin film was introduced into a drying furnace at a tension of 80.5 N/m to be further dried. . In the drying furnace, the resin film after peeling off the protective film is brought into contact with the PET film substrate before peeling. The side of the surface (support surface) on the opposite side (reverse support surface) side is conveyed in contact with ten guide rollers, and the guide roller is made of metal having a diameter of 100 mm, a surface roughness (Rmax) of 0.6 S, and Vickers. Hard chrome plated guide roll with a hardness of 850. In the drying furnace, the resin film has a width of 870 mm and a drying furnace tension of 70 N. Therefore, the tension applied per unit width is 80.5 N/n. Further, the temperature of the drying furnace was set to 200 ° C, the conveying speed was set to 0.4 m/min, and the drying time was set to 30 minutes. The resin film which was dried in a drying oven was bonded to a protective film ("7332" manufactured by Toray Advanced Film Co., Ltd., a polyolefin protective film of weak adhesion) on both sides, and wound up on a roll core.

對於在實施例1所得之乾燥後的樹脂膜,係剝離兩面之保護膜,從200m之捲筒任意地切出1m,而以如下方式評估微小傷痕。 With respect to the dried resin film obtained in Example 1, the protective film on both sides was peeled off, and 1 m was arbitrarily cut out from a 200 m roll, and minute scratches were evaluated as follows.

微小傷痕之評估 Evaluation of minor scars

從移動方向(亦即,縱方向)照射Polarion light [Polarion公司製「PS-X1」](3,400流明)。此時,係以相對於膜面呈20至70°左右之傾角照射。視覺辨識之方向係從評估之樹脂膜面的約正上方(從樹脂膜面為90°之角度),以人眼進行評估。有關視覺辨識之面積,係以包含全部微小傷痕群組的方式描繪出四角,並加總其面積,而作為產生區域(所謂「微小傷痕面積」)。但是,當其四角與相鄰者未間隔0.5cm以上時,係設為相同產生區域。 Polarion light [PS-X1" manufactured by Polarion Co., Ltd. (3,400 lumens) was irradiated from the moving direction (ie, the longitudinal direction). At this time, it is irradiated at an inclination angle of about 20 to 70° with respect to the film surface. The direction of visual recognition was evaluated from the human eye from approximately directly above the surface of the resin film to be evaluated (at an angle of 90° from the surface of the resin film). Regarding the area of visual recognition, the four corners are drawn in such a manner as to include all the small scar groups, and the area is added to form the area (the so-called "small scar area"). However, when the four corners are not spaced apart from each other by 0.5 cm or more, the same generation area is set.

微小傷痕之評估如以下所述。 The evaluation of small scars is as follows.

○:目視到之微小傷痕的產生區域為未達全部面積之5% ○: The area where the micro-scars are visually observed is less than 5% of the total area.

△:目視到之微小傷痕的產生區域為全部面積之5%以上、未達10% △: The area where the microscopic scar is visually observed is 5% or more of the total area, and is less than 10%.

×:目視到之微小傷痕的產生區域為全部面積之10%以上 ×: The area where the small scratch is visually observed is 10% or more of the total area.

在實施例1所得之樹脂膜的微小傷痕在上述測定的評估為○。將實施例1之結果記載於表1。在表1中亦揭示與導引輥之接觸面、樹脂膜寬度(mm)、乾燥爐張力(N)、對每單位寬度施加之張力(N/m)的值、膜評估面積(cm2)、微小傷痕面積(cm2)、膜整體中之微小傷痕比例(%)。又,所謂膜評估面積(cm2)係經評估微小傷痕之膜的面積,膜整體之微小傷痕比例(%)係將微小傷痕面積(cm2)除以膜評估面積(cm2)並乘以100倍者。 The micro-scratch of the resin film obtained in Example 1 was evaluated as ○ in the above measurement. The results of Example 1 are shown in Table 1. Table 1 also shows the contact surface with the guide roll, the resin film width (mm), the drying furnace tension (N), the value of the tension (N/m) applied per unit width, and the film evaluation area (cm 2 ). The area of tiny scratches (cm 2 ) and the proportion of tiny scratches in the whole film (%). In addition, so-called evaluation membrane area (cm 2) area of the film is assessed based minute flaws, the overall percentage of minute flaws film (%) based tiny scar area (cm 2) divided by the membrane area evaluation (cm 2) and multiplied by 100 times.

殘存溶媒量之測定 Determination of residual solvent

所得之樹脂膜中的殘存溶媒量之測定係以「TG-DTA測定」進行。測定順序如以下所述: 從所製作之樹脂膜取得約20mg之試料。 The measurement of the amount of residual solvent in the obtained resin film was carried out by "TG-DTA measurement". The order of measurement is as follows: A sample of about 20 mg was taken from the produced resin film.

將採取之試料以10℃/分鐘之昇溫速度從室溫昇溫至120℃,以120℃保持5分鐘後,在以10℃/分之昇溫速度昇溫至400℃之條件下一邊加熱一邊以TG-DTA之測定裝置:日立hightech science公司製「TG/DTA6300」測定試料之質量變化。 The sample to be taken was heated from room temperature to 120 ° C at a temperature increase rate of 10 ° C /min, held at 120 ° C for 5 minutes, and then heated to a temperature of 400 ° C at a temperature increase rate of 10 ° C / min. DTA measuring device: The quality change of the sample was measured by "TG/DTA6300" manufactured by Hitachi Hightech Science Co., Ltd.

依TG-DTA之測定結果,從下述式計算從120℃至250℃之質量減少率L(%),並以此作為殘存溶媒量:L(%)=100-(W1/W0)×100 According to the measurement result of TG-DTA, the mass reduction rate L (%) from 120 ° C to 250 ° C is calculated from the following formula, and this is used as the amount of residual solvent: L (%) = 100 - (W 1 / W 0 ) ×100

(上述式中,W0表示在120℃保持5分鐘後之試料的質量,W1表示在250℃之試料的質量)。 。針對乾燥前之樹脂膜與乾燥後之樹脂膜分別測定殘存溶媒量。 (In the above formula, W 0 represents the mass of the sample after holding at 120 ° C for 5 minutes, and W 1 represents the mass of the sample at 250 ° C). . The amount of residual solvent was measured for each of the resin film before drying and the resin film after drying.

彈性率之測定 Determination of modulus of elasticity

將所得之樹脂膜在200℃乾燥20分鐘,使用啞鈴型切器(dumbbell cutter)切成10mm×100mm的短籤狀,獲得試樣。將該試樣之彈性率利用島津製作所股份有限公司製之高壓釜AG-IS,以夾具間距500mm、拉伸速度20mm/分鐘的條件測定S-S曲線,從其斜率算出光學膜的彈性率。將結果記載於表1中。 The obtained resin film was dried at 200 ° C for 20 minutes, and cut into a short mark of 10 mm × 100 mm using a dumbbell cutter to obtain a sample. The elastic modulus of the sample was measured using an autoclave AG-IS manufactured by Shimadzu Corporation, and the S-S curve was measured under the conditions of a jig pitch of 500 mm and a tensile speed of 20 mm/min, and the elastic modulus of the optical film was calculated from the slope. The results are shown in Table 1.

實施例2至8及比較例1至2 Examples 2 to 8 and Comparative Examples 1 to 2

對於實施例1所得之樹脂膜,將樹脂膜與導引輥接觸之導引輥的接觸面(支撐體面側/反支撐體面側)、樹脂膜寬度(mm)、乾燥爐張力(N)及對每單位寬度施加之張力(N/m)變更成如表1記載,並使其乾燥之後,進行微小傷痕的評估。將結果表示於表1。在表1中,亦記載膜評估面積(cm2)、微小傷痕面積(cm2)、在膜整體中之微小傷痕比例(%)、殘存溶媒量(乾燥前)、殘存溶媒量(乾燥後)及彈性率。 With respect to the resin film obtained in Example 1, the contact surface of the guide roller in contact with the guide roller (the support surface side/reverse support surface side), the resin film width (mm), the drying furnace tension (N), and the pair The tension (N/m) applied per unit width was changed to as described in Table 1, and after drying, evaluation of minute scratches was performed. The results are shown in Table 1. Table 1 also shows the film evaluation area (cm 2 ), the small scratch area (cm 2 ), the proportion of minute scratches in the entire film (%), the amount of residual solvent (before drying), and the amount of residual solvent (after drying). And elastic rate.

從表1之結果可知,對每單位寬度施加之張力為82N/m以下時,微小傷痕少,且樹脂膜之透明性變大。反之,對每單位寬度施加之張力超過82N/m時,如於比較例1至2所見,係微小傷痕多,且樹脂膜之透明性變差。又,在第4圖所示之白色斑點部分為微小傷痕。 As is clear from the results of Table 1, when the tension applied per unit width is 82 N/m or less, minute scratches are small and the transparency of the resin film is increased. On the other hand, when the tension applied per unit width exceeds 82 N/m, as seen in Comparative Examples 1 and 2, there are many minute scratches and the transparency of the resin film is deteriorated. Further, the white spot portion shown in Fig. 4 is a minute flaw.

[產業上之可利用性] [Industrial availability]

本發明之樹脂膜的製造方法,係藉由在製造透明的樹脂膜時之乾燥時,係藉由調整對每單位寬度施加之張力,而可防止微小的傷痕(尤其是微小傷痕),且可廣泛應用於要求透明性之膜的製造。 The method for producing a resin film of the present invention can prevent minute scratches (especially minute scratches) by adjusting the tension applied per unit width when drying a transparent resin film. It is widely used in the manufacture of films requiring transparency.

Claims (4)

一種樹脂膜的製造方法,係於將藉由在支撐體上塗佈樹脂清漆所得之樹脂膜從支撐體剝離後使樹脂膜乾燥之步驟中,對前述樹脂膜之每單位寬度施加之張力為82N/m以下。 A method for producing a resin film is a step of applying a resin film obtained by coating a resin varnish on a support to a resin film after peeling the resin film from the support, and applying a tension of 82 N per unit width of the resin film. /m below. 如申請專利範圍第1項所述之樹脂膜的製造方法,其中,前述樹脂清漆含有選自由聚醯亞胺、聚醯胺醯亞胺及聚醯胺所組成群組的至少1種樹脂。 The method for producing a resin film according to the first aspect of the invention, wherein the resin varnish contains at least one resin selected from the group consisting of polyimine, polyamidimide, and polyamidamine. 如申請專利範圍第1或2項所述之樹脂膜的製造方法,其中,從支撐體被剝離後之樹脂膜中的殘存溶媒量為5質量%以上,且前述樹脂清漆中之樹脂的重量平均分子量為200,000至500,000。 The method for producing a resin film according to the first or second aspect of the invention, wherein the amount of the residual solvent in the resin film after the support is removed is 5% by mass or more, and the weight average of the resin in the resin varnish The molecular weight is from 200,000 to 500,000. 如申請專利範圍第3項所述之樹脂膜的製造方法,其中,前述樹脂膜中之殘存溶媒量為30質量%以下。 The method for producing a resin film according to the third aspect of the invention, wherein the amount of the residual solvent in the resin film is 30% by mass or less.
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