KR20230019064A - Polyimide film and manufacturing method thereof - Google Patents
Polyimide film and manufacturing method thereof Download PDFInfo
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- KR20230019064A KR20230019064A KR1020227023207A KR20227023207A KR20230019064A KR 20230019064 A KR20230019064 A KR 20230019064A KR 1020227023207 A KR1020227023207 A KR 1020227023207A KR 20227023207 A KR20227023207 A KR 20227023207A KR 20230019064 A KR20230019064 A KR 20230019064A
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- South Korea
- Prior art keywords
- layer
- polyimide
- film
- mass
- solution
- Prior art date
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 249
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 239000004642 Polyimide Substances 0.000 claims abstract description 185
- 239000002243 precursor Substances 0.000 claims abstract description 33
- 239000000203 mixture Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims description 59
- 150000004985 diamines Chemical class 0.000 claims description 57
- 239000011248 coating agent Substances 0.000 claims description 56
- -1 alicyclic tetracarboxylic acid Chemical class 0.000 claims description 52
- 238000010438 heat treatment Methods 0.000 claims description 48
- 230000007704 transition Effects 0.000 claims description 45
- 230000015572 biosynthetic process Effects 0.000 claims description 37
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 33
- 239000000126 substance Substances 0.000 claims description 28
- 238000002834 transmittance Methods 0.000 claims description 24
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 23
- 239000013557 residual solvent Substances 0.000 claims description 22
- 238000012643 polycondensation polymerization Methods 0.000 claims description 16
- 229910052717 sulfur Inorganic materials 0.000 claims description 8
- 125000004434 sulfur atom Chemical group 0.000 claims description 8
- 101150055324 aba1 gene Proteins 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 abstract description 10
- 230000000704 physical effect Effects 0.000 abstract description 10
- 150000003949 imides Chemical class 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 274
- 229920005575 poly(amic acid) Polymers 0.000 description 60
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 30
- 239000000314 lubricant Substances 0.000 description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 21
- 238000006243 chemical reaction Methods 0.000 description 18
- 238000001035 drying Methods 0.000 description 18
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 18
- 239000007787 solid Substances 0.000 description 18
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 14
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 13
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 12
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 9
- 229920002799 BoPET Polymers 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 239000012298 atmosphere Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 238000006358 imidation reaction Methods 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- WVOLTBSCXRRQFR-SJORKVTESA-N Cannabidiolic acid Natural products OC1=C(C(O)=O)C(CCCCC)=CC(O)=C1[C@@H]1[C@@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-SJORKVTESA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- WVOLTBSCXRRQFR-DLBZAZTESA-N cannabidiolic acid Chemical compound OC1=C(C(O)=O)C(CCCCC)=CC(O)=C1[C@H]1[C@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-DLBZAZTESA-N 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 239000001294 propane Substances 0.000 description 6
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 5
- 239000001273 butane Substances 0.000 description 5
- 239000008119 colloidal silica Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 5
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 4
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 3
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 3
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 3
- LACZRKUWKHQVKS-UHFFFAOYSA-N 4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenoxy]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1C(F)(F)F LACZRKUWKHQVKS-UHFFFAOYSA-N 0.000 description 3
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- BDWOQDZGSYLSCZ-UHFFFAOYSA-N [1,3]oxazolo[4,5-f][1,3]benzoxazole Chemical compound C1=C2OC=NC2=CC2=C1OC=N2 BDWOQDZGSYLSCZ-UHFFFAOYSA-N 0.000 description 3
- PMJNNCUVWHTTMV-UHFFFAOYSA-N [1,3]oxazolo[5,4-f][1,3]benzoxazole Chemical compound C1=C2OC=NC2=CC2=C1N=CO2 PMJNNCUVWHTTMV-UHFFFAOYSA-N 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
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- 238000010926 purge Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- MXPYJVUYLVNEBB-UHFFFAOYSA-N 2-[2-(2-carboxybenzoyl)oxycarbonylbenzoyl]oxycarbonylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(=O)OC(=O)C1=CC=CC=C1C(O)=O MXPYJVUYLVNEBB-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- ZIXLDMFVRPABBX-UHFFFAOYSA-N 2-methylcyclopentan-1-one Chemical compound CC1CCCC1=O ZIXLDMFVRPABBX-UHFFFAOYSA-N 0.000 description 2
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 2
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 2
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 2
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 2
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- SMEJCQZFRMVYGC-UHFFFAOYSA-N cyclohexane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C(C(O)=O)C1C(O)=O SMEJCQZFRMVYGC-UHFFFAOYSA-N 0.000 description 2
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910000096 monohydride Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
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- 125000003003 spiro group Chemical group 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
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- STIUJDCDGZSXGO-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)=C1 STIUJDCDGZSXGO-UHFFFAOYSA-N 0.000 description 1
- GSHMRKDZYYLPNZ-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-amino-3-phenoxyphenyl)methanone Chemical compound NC1=CC=C(C(=O)C=2C=C(N)C(OC=3C=CC=CC=3)=CC=2)C=C1OC1=CC=CC=C1 GSHMRKDZYYLPNZ-UHFFFAOYSA-N 0.000 description 1
- PHPTWVBSQRENOR-UHFFFAOYSA-N (3-amino-4-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C(C=C1N)=CC=C1OC1=CC=CC=C1 PHPTWVBSQRENOR-UHFFFAOYSA-N 0.000 description 1
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 1
- HFAMSBMTCKNPRG-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(OC=3C=CC=CC=3)C(N)=CC=2)=C1 HFAMSBMTCKNPRG-UHFFFAOYSA-N 0.000 description 1
- NILYJZJYFZUPPO-UHFFFAOYSA-N (4-amino-3-phenoxyphenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C(OC=2C=CC=CC=2)=C1 NILYJZJYFZUPPO-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- BEBVJSBFUZVWMS-UHFFFAOYSA-N 2-(2-methylpropyl)cyclohexane-1,4-diamine Chemical compound CC(C)CC1CC(N)CCC1N BEBVJSBFUZVWMS-UHFFFAOYSA-N 0.000 description 1
- IKSUMZCUHPMCQV-UHFFFAOYSA-N 2-(3-aminophenyl)-1,3-benzoxazol-5-amine Chemical compound NC1=CC=CC(C=2OC3=CC=C(N)C=C3N=2)=C1 IKSUMZCUHPMCQV-UHFFFAOYSA-N 0.000 description 1
- VSMRWFMFAFOGGD-UHFFFAOYSA-N 2-(3-aminophenyl)-1,3-benzoxazol-6-amine Chemical compound NC1=CC=CC(C=2OC3=CC(N)=CC=C3N=2)=C1 VSMRWFMFAFOGGD-UHFFFAOYSA-N 0.000 description 1
- SFZGLHDSSSDCHH-UHFFFAOYSA-N 2-[4-(6-amino-1,3-benzoxazol-2-yl)phenyl]-1,3-benzoxazol-6-amine Chemical compound C1=C(N)C=C2OC(C3=CC=C(C=C3)C3=NC4=CC=C(C=C4O3)N)=NC2=C1 SFZGLHDSSSDCHH-UHFFFAOYSA-N 0.000 description 1
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- OMGMPQSKRWSUHO-UHFFFAOYSA-N naphthalene-1,2,5-tricarboxylic acid Chemical compound OC(=O)C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OMGMPQSKRWSUHO-UHFFFAOYSA-N 0.000 description 1
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- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
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- 239000002244 precipitate Substances 0.000 description 1
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- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
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- Manufacturing & Machinery (AREA)
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Abstract
인장 파단 강도와 인장 탄성률이 높고, 파단 신도가 크고, 또한 낮은 선팽창 계수를 갖는 무색의 폴리이미드 필름 및 그 제조 방법을 제공한다. 고강도의 폴리이미드를 (a) 외층에, 광학 특성이 우수한 폴리이미드를 (b) 내층에 이용한 다층 필름으로 한다. (a)/(b) 2층이어도 좋지만, 3층 이상이 바람직하다. 각 층을 구성하는 폴리이미드 또는 폴리이미드 전구체의 용액을 가지지체에 도포하고, 열처리하여 이미드 필름으로 하지만, 도포시에, 먼저 도포한 층이 건조하기 전에 다음 층을 도포하는 것에 의해, 각 층 사이에 조성이 단계적으로 변화하여 혼재하는 천이층을 형성하는 것에 의해, 층간 물성의 불균질함이 완충되고 균형잡힌 필름이 된다. A colorless polyimide film having high tensile strength at break and high tensile modulus, high elongation at break, and a low coefficient of linear expansion, and a method for producing the same. A multilayer film using high-strength polyimide for (a) the outer layer and polyimide with excellent optical properties for (b) the inner layer. (a) / (b) Although it may be two layers, three or more layers are preferable. A solution of polyimide or a polyimide precursor constituting each layer is applied to a temporary support and heat-treated to obtain an imide film, but at the time of application, the next layer is applied before the previously applied layer is dried, so that each layer By forming a transitional layer in which the composition is gradually changed and mixed between the layers, heterogeneity in physical properties between layers is buffered and a balanced film is obtained.
Description
본 발명은, 무색이며, 또한 낮은 선팽창 계수와 양호한 기계 특성을 갖는 폴리이미드 필름 및 그 제조 방법에 관한 것이다. The present invention relates to a polyimide film that is colorless and has a low linear expansion coefficient and good mechanical properties, and a method for producing the same.
폴리이미드 필름은 우수한 내열성, 양호한 기계 특성을 가지며, 게다가 플렉시블한 소재로서 전기 및 전자 분야에서 널리 사용되고 있다. 그러나, 일반적인 폴리이미드 필름은 황갈색으로 착색되어 있기 때문에, 표시 장치 등의 광투과가 필요한 부분에 적용할 수는 없다. Polyimide film has excellent heat resistance and good mechanical properties, and is widely used in the electrical and electronic fields as a flexible material. However, since a general polyimide film is colored yellowish brown, it cannot be applied to a portion requiring light transmission, such as a display device.
한편 표시 장치는 박형화, 경량화가 진행되고, 또한 플렉시블화가 요구되고 있다. 그 때문에 기판 재료를 유리 기판으로부터 플렉시블한 고분자 필름 기판으로 바꾸려고 하는 시도가 진행되고 있지만, 착색되어 있는 폴리이미드 필름은, 광선 투과를 ON/OFF하는 것에 의해 표시를 행하는 액정 디스플레이의 기판 재료로서는 사용할 수 없고, 표시 장치의 구동 회로가 탑재되는 TAB, COF 등의 주변 회로나, 반사형 표시 방식 내지 자발광형 표시 장치에서의 배면측 등 극히 일부에만 적용할 수 있다. On the other hand, thinning and weight reduction of display devices are progressing, and flexibility is required. For this reason, attempts are being made to change the substrate material from glass substrates to flexible polymer film substrates, but colored polyimide films cannot be used as substrate materials for liquid crystal displays that display by turning on/off light transmission. There is no, and it can be applied only to a small part, such as peripheral circuits such as TAB and COF in which the driving circuit of the display device is mounted, or the rear side of a reflective display method or a self-emissive display device.
이러한 배경에서, 무색 투명의 폴리이미드 필름의 개발이 진행되고 있다. 대표적인 예로서 불소화폴리이미드 수지나 반지환형 혹은 전지환형 폴리이미드 수지 등을 이용한 무색 투명 폴리이미드 필름을 개발하는 것이 시도되고 있다(특허문헌 1∼3). 이들 필름은 착색이 적고 투명성을 갖고 있지만, 착색되어 있는 폴리이미드 필름 정도로 기계 특성이 올라가지는 않고, 또한 공업적 생산 및 고온에 노출되는 용도를 상정한 경우, 열분해 내지 산화 반응 등이 생기기 때문에, 반드시 무색성, 투명성을 유지할 수 있는 것은 아니다. 이 관점에서, 산소 함유량을 규정한 기체를 내뿜으면서 가열 처리하는 방법이 제안되어 있지만(특허문헌 4), 산소 농도 18% 미만이 되는 환경에서는 그 제조 비용이 높아, 공업적 생산은 매우 어렵다. Against this background, development of a colorless and transparent polyimide film is progressing. As a representative example, attempts have been made to develop colorless and transparent polyimide films using fluorinated polyimide resins, semi-cyclic or full-cyclic polyimide resins, and the like (Patent Documents 1 to 3). Although these films are less colored and have transparency, mechanical properties do not rise to the level of colored polyimide films, and when industrial production and applications exposed to high temperatures are assumed, thermal decomposition or oxidation reactions occur, so Colorlessness and transparency cannot be maintained. From this point of view, a method of heat treatment while exhaling a gas with a defined oxygen content has been proposed (Patent Document 4), but its manufacturing cost is high in an environment where the oxygen concentration is less than 18%, and industrial production is very difficult.
즉 내열성, 기계 특성 등의 실용 특성과, 무색 투명성은 트레이드오프의 관계에 있어, 전부를 만족시키는 무색의 투명 폴리이미드 필름을 제조하는 것은 매우 어려웠다. 본 발명은, 기계 특성 및 무색 투명성이 우수한 폴리이미드 필름을 제공하는 것을 과제로 한다. That is, practical properties such as heat resistance and mechanical properties and colorless transparency are in a trade-off relationship, and it has been very difficult to produce a colorless transparent polyimide film that satisfies all of them. An object of the present invention is to provide a polyimide film excellent in mechanical properties and colorless transparency.
본 발명자들은, 복수의 폴리이미드 수지를 조합함으로써 균형잡힌 폴리이미드 필름의 실현을 시도했다. 일반적으로 복수 성분의 수지를 조합하여 배합, 블렌드, 혹은 공중합한 경우에는, 반드시 각각의 성분이 좋은 점만이 조합된 결과를 얻을 수 있는 것은 아니며, 오히려 결점이 상승되어 발현하는 케이스가 적지 않다. 그러나 본 발명자들은 예의 연구를 계속한 결과, 특정한 구조를 형성하도록 폴리이미드 수지를 조합하여 필름화함으로써, 각각의 성분의 장점을 충분히 끌어낼 수 있는 것을 발견하여 본 발명에 도달했다. The present inventors attempted to realize a well-balanced polyimide film by combining a plurality of polyimide resins. In general, when blending, blending, or copolymerizing resins of a plurality of components in combination, it is not always possible to obtain a result of combining only the good points of each component, and rather, there are not a few cases in which defects are increased and expressed. However, as a result of intensive research, the present inventors have found that the advantages of each component can be sufficiently brought out by combining polyimide resins to form a film to form a specific structure, and have reached the present invention.
즉 본 발명은 이하의 구성이다. That is, the present invention has the following configurations.
[1] 조성이 상이한 적어도 2종의 폴리이미드층이 두께 방향으로 적층된 다층 폴리이미드층과, [1] a multi-layer polyimide layer in which at least two types of polyimide layers having different compositions are laminated in the thickness direction;
상기 다층 폴리이미드층을 구성하는 (a)층과 상기 (a)층에 인접하는 (b)층 사이에 존재하고, 화학 조성이 단계적으로 변화하는 천이층A transition layer in which the chemical composition changes stepwise and exists between the (a) layer constituting the multi-layer polyimide layer and the (b) layer adjacent to the (a) layer.
을 가지며, has,
상기 천이층의 두께는, 하한이 필름 총 두께의 3%, 또는 1 μm 중 어느 하나이며, 상한이 필름 총 두께의 10%, 또는 3 μm 중 어느 하나이며, The thickness of the transition layer has a lower limit of 3% of the total film thickness or 1 μm, and an upper limit of 10% of the total film thickness or 3 μm,
필름 전체의 두께가 3 μm 이상 120 μm 이하이며, The thickness of the entire film is 3 μm or more and 120 μm or less,
필름 전체의 옐로우 인덱스가 5 이하이며, The yellow index of the entire film is 5 or less,
필름 전체의 전광선 투과율이 86% 이상인 The total light transmittance of the entire film is 86% or more.
것을 특징으로 하는 다층 폴리이미드 필름. A multilayer polyimide film, characterized in that.
[2] 상기 (a)층은, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 10 이하이며, 전광선 투과율이 85% 이상인 폴리이미드로 주로 구성되고, [2] The (a) layer is mainly composed of polyimide having a yellow index of 10 or less and a total light transmittance of 85% or more when used alone as a film having a thickness of 25 ± 2 μm,
상기 (b)층은, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 5 이하이며, 전광선 투과율이 90% 이상인 폴리이미드로 주로 구성되어 있는The (b) layer is mainly composed of polyimide having a yellow index of 5 or less and a total light transmittance of 90% or more when used alone as a film having a thickness of 25 ± 2 μm.
것을 특징으로 하는 [1]에 기재된 다층 폴리이미드 필름. The multilayer polyimide film according to [1] characterized by the above.
[3] 상기 (a)층은, 상기 (b)층의 한쪽 면측과 다른쪽 면측의 양쪽에 존재하고, [3] The (a) layer is present on both one side and the other side of the (b) layer,
상기 천이층은, 상기 (b)층의 한쪽 면측의 (a)층과 상기 (b)층의 사이, 및, 상기 (b)층의 다른쪽 면측의 (a)층과 상기 (b)층의 사이에 존재하고, The transition layer is between the (a) layer and the (b) layer on one side of the (b) layer, and between the (a) layer and the (b) layer on the other side of the (b) layer. exist between
상기 (a)층, 상기 천이층, 상기 (b)층, 상기 천이층, 상기 (a)층의 순으로 적층된 층구성을 갖고 있는 The (a) layer, the transition layer, the (b) layer, the transition layer, and the (a) layer are laminated in this order.
것을 특징으로 하는 [1] 또는 [2]에 기재된 다층 폴리이미드 필름. The multilayer polyimide film according to [1] or [2], characterized by the above.
[4] 상기 (a)층의 폴리이미드가, [4] The polyimide of the layer (a),
지환족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 분자 내에 아미드 결합을 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드, A polyimide having a chemical structure obtained by condensation polymerization of a tetracarboxylic acid anhydride containing 70% by mass or more of an alicyclic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having an amide bond in the molecule;
또는 or
지환족 테트라카르복실산무수물을 30 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드Polyi comprising a chemical structure obtained by condensation polymerization of a tetracarboxylic acid anhydride containing 30% by mass or more of an alicyclic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having a trifluoromethyl group in a molecule mid
인 것을 특징으로 하는 [1]∼[3] 중 어느 하나에 기재된 다층 폴리이미드 필름. The multilayer polyimide film according to any one of [1] to [3], characterized in that
[5] 상기 (b)층의 폴리이미드가, [5] The polyimide of the layer (b),
방향족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 분자 내에 황 원자를 갖는 디아민을 70 질량% 이상 함유하는 디아민으로부터 얻어지는 화학 구조를 포함하는 폴리이미드, A polyimide comprising a chemical structure obtained from a tetracarboxylic acid anhydride containing 70% by mass or more of an aromatic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having a sulfur atom in the molecule;
또는 or
트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드Obtained by condensation polymerization of a tetracarboxylic anhydride containing 70% by mass or more of a tetracarboxylic acid containing a trifluoromethyl group in a molecule and a diamine containing 70% by mass or more of a diamine having a trifluoromethyl group in a molecule Polyimide Containing Chemical Structure
인 것을 특징으로 하는 [1]∼[4] 중 어느 하나에 기재된 다층 폴리이미드 필름. The multilayer polyimide film according to any one of [1] to [4], characterized in that
[6] 1 : (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 가지지체에 도포하여, 도포막 a1을 얻는 공정, [6] 1: (a) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to a temporary support to obtain a coating film a1;
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정, 2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
3 : 전층을 가열하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 적층체를 얻는 공정, 3: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
을 적어도 포함하는 [1], [2], [4] 또는 [5]에 기재된 다층 폴리이미드 필름의 제조 방법. The manufacturing method of the multilayer polyimide film as described in [1], [2], [4], or [5] containing at least.
[7] 1 : (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 가지지체에 도포하여, 도포막 a1을 얻는 공정, [7] 1: (a) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to a temporary support to obtain a coating film a1;
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정, 2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
3 : 전층을 가열하여, 전층 기준의 잔용제량이 5 질량% 이상 40 질량%인 적층체를 얻은 후, 가지지체로부터 박리하여, 자기 지지성이 있는 필름을 얻는 공정, Step 3: Heating all layers to obtain a laminate having a residual solvent amount of 5% by mass or more and 40% by mass based on all layers, and then peeling from the temporary support to obtain a self-supporting film;
5 : 상기 자기 지지성이 있는 필름의 양쪽 단부를 파지하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 필름을 더 얻는 공정, 5: A step of gripping both ends of the self-supporting film to further obtain a film having a residual solvent amount of 0.5% by mass or less based on the entire layer;
을 적어도 포함하는 [1], [2], [4] 또는 [5]에 기재된 다층 폴리이미드 필름의 제조 방법. The manufacturing method of the multilayer polyimide film as described in [1], [2], [4], or [5] containing at least.
[8] 1 : (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 가지지체 상에 도포하여, 도포막 a1을 얻는 공정, [8] 1: (a) a step of applying a polyimide solution or a polyimide precursor solution for layer formation on a temporary support to obtain a coating film a1;
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정, 2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
3 : 도포막 ab1 제작후 100초 이내에, (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 ab1에 도포하여, 도포막 aba1을 얻는 공정, Step 3: Within 100 seconds after the formation of the coating film ab1, (a) a step of applying a polyimide solution for layer formation or a polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4 : 전층을 가열하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 적층체를 얻는 공정, 4: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
을 적어도 포함하는 [1]∼[5] 중 어느 하나에 기재된 다층 폴리이미드 필름의 제조 방법. The manufacturing method of the multilayer polyimide film in any one of [1]-[5] containing at least.
[9] 1 : (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 가지지체에 도포하여, 도포막 a1을 얻는 공정, [9] 1: (a) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to a temporary support to obtain a coating film a1;
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정, 2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
3 : 도포막 ab1 제작후 100초 이내에, (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 ab1에 도포하여, 도포막 aba1을 얻는 공정, Step 3: Within 100 seconds after the formation of the coating film ab1, (a) a step of applying a polyimide solution for layer formation or a polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4 : 전층을 가열하여, 전층 기준의 잔용제량이 8 질량% 이상 40 질량%인 적층체를 얻은 후, 가지지체로부터 박리하여, 자기 지지성이 있는 필름을 얻는 공정, 4: step of heating all layers to obtain a laminate having a residual solvent amount of 8% by mass or more and 40% by mass based on all layers, then peeling from the temporary support to obtain a self-supporting film;
5 : 상기 자기 지지성이 있는 필름의 양쪽 단부를 파지하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 필름을 더 얻는 공정, 5: A step of gripping both ends of the self-supporting film to further obtain a film having a residual solvent amount of 0.5% by mass or less based on the entire layer;
을 적어도 포함하는 [1]∼[5] 중 어느 하나에 기재된 다층 폴리이미드 필름의 제조 방법. The manufacturing method of the multilayer polyimide film in any one of [1]-[5] containing at least.
본 발명에서는 이하의 구성을 더 포함해도 좋다. In this invention, you may further include the following structures.
[10] 상기 [6]에서의 1과 2를 반복하여 5층 이상의 홀수층으로 하는 것을 특징으로 하는 다층 폴리이미드 필름의 제조 방법. [10] A method for producing a multilayer polyimide film, characterized in that steps 1 and 2 in [6] are repeated to form five or more odd-numbered layers.
[11] (a)층의 두께가 필름 총 두께의 34% 이하인 것을 특징으로 하는 [1]∼[5]에 기재된 다층 폴리이미드 필름. 다만 (a)층이 복수인 경우에는 (a)층의 두께의 총계가 필름 총 두께의 1% 이상, 바람직하게는 2% 이상, 더욱 바람직하게는 4% 이상이고, 25% 이하, 바람직하게는 13% 이하, 더욱 바람직하게는 7% 이하인 것을 특징으로 하는 [1]∼[5]에 기재된 다층 폴리이미드 필름. [11] The multilayer polyimide film according to [1] to [5], wherein the layer (a) has a thickness of 34% or less of the total film thickness. However, when there are a plurality of (a) layers, the total thickness of the (a) layers is 1% or more, preferably 2% or more, more preferably 4% or more, and 25% or less, preferably 25% or less, of the total thickness of the film. The multilayer polyimide film according to [1] to [5] characterized by being 13% or less, more preferably 7% or less.
본 발명은, 필름을 상이한 조성으로 이루어진 복수의 층으로 구성하는 것에 의해, 광학 특성(무색 투명성)이 우수하고, 또한 플렉시블한 필름으로서 충분한 취급성이 얻어지는 기계 특성을 갖춘 내열 필름을 실현하는 것이다. The present invention realizes a heat-resistant film having excellent optical properties (colorless transparency) and sufficient mechanical properties as a flexible film to be obtained by configuring a film with a plurality of layers having different compositions.
본 발명에서의 (a)층의 폴리이미드는, 바람직하게는, 지환족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 분자 내에 아미드 결합을 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드, 또는 지환족 테트라카르복실산무수물을 30 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드이며, 이러한 폴리이미드는 양호한 기계 특성, 높은 파단 신도를 가지며, 또한 낮은 CTE를 나타내는 우수한 특성을 갖지만, 비교적 착색되기 쉽다. The polyimide of layer (a) in the present invention is preferably composed of tetracarboxylic acid anhydride containing 70% by mass or more of alicyclic tetracarboxylic acid anhydride and 70% by mass or more of diamine having an amide bond in the molecule. A polyimide having a chemical structure obtained by condensation polymerization of diamine containing or a tetracarboxylic acid anhydride containing 30 mass% or more of an alicyclic tetracarboxylic acid anhydride and a diamine having a trifluoromethyl group in the molecule are 70 A polyimide having a chemical structure obtained by condensation polymerization of a diamine containing at least % by mass, and this polyimide has good mechanical properties, high elongation at break, and excellent properties of showing a low CTE, but is relatively easily colored.
한쪽의 (b)층의 폴리이미드는, 바람직하게는, 방향족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 분자 내에 황 원자를 갖는 디아민을 70 질량% 이상 함유하는 디아민으로부터 얻어지는 화학 구조를 포함하는 폴리이미드, 또는, 트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드이며, 높은 무색 투명성을 갖고 있지만, 수지로서는 딱딱하고 취약하여, 필름화했을 때에 충분한 파단 신도를 내는 것이 어렵기 때문에, 플렉시블한 용도에 대한 적성이 반드시 좋다고는 할 수 없고, 또한 연속 필름으로서 생산하는 것도 어렵다. The polyimide of one (b) layer is preferably a tetracarboxylic acid anhydride containing 70 mass% or more of an aromatic tetracarboxylic acid anhydride and a diamine containing 70 mass% or more of a diamine having a sulfur atom in the molecule. A polyimide having a chemical structure obtained from, or a tetracarboxylic acid anhydride containing 70 mass% or more of a tetracarboxylic acid containing a trifluoromethyl group in a molecule, and a diamine having a trifluoromethyl group in a molecule of 70 It is a polyimide containing a chemical structure obtained by condensation polymerization of diamine containing at least % by mass, and has high colorless transparency, but as a resin, it is hard and brittle, and it is difficult to give sufficient elongation at break when filmed, so it is flexible. The suitability for one use is not necessarily good, and it is also difficult to produce as a continuous film.
양자를 블렌드 내지 공중합하면, 쌍방의 중간, 또는 그 이하의 물성의 필름밖에 얻을 수 없고, 또한 무색 투명성에 관해서도, 착색되기 쉬운 (a)층의 특성으로 인장되는 경향이 있다. When both are blended or copolymerized, only a film with physical properties intermediate or lower than both can be obtained, and also tends to be stretched due to the property of layer (a), which is easy to be colored, with respect to colorless transparency.
그러나, 본 발명과 같이, 이들 2 성분의 폴리이미드를, 각각 독립된 층으로서 형성함으로써 기능을 분담하고, 또한 특정한 제조 방법을 적용하는 것에 의해, 균형잡힌, 즉 무색 투명성과 실용상 충분한 필름 강도, 높은 파단 신도, 낮은 선팽창 계수를 갖는 필름을 얻을 수 있다.However, as in the present invention, functions are shared by forming the polyimide of these two components as independent layers, and by applying a specific manufacturing method, balanced, that is, colorless transparency and practically sufficient film strength, high A film having elongation at break and a low coefficient of linear expansion can be obtained.
폴리이미드 필름은 폴리이미드 용액 내지 폴리이미드 전구체의 용액을 지지체에 도포하여 건조시키고, 필요에 따라서 화학 반응을 행하여 얻어지지만, 본 발명에서는 복수의 성분의 용액을, 단시간의 시간차, 가장 바람직하게는 동시에 도포하는 제조 방법을 이용하는 것이 특징이 된다. 이러한 도포 방법에 의하면, 상이한 성분이 접하는 면에서 한정된 두께 영역에, 확산 내지 유동에 의한 물질 이동이 생겨, 조성이 단계적으로 변하는 천이층이 형성된다. 이러한 천이층이 물성이 상이한 층과 층의 사이에 생기는 응력 등의 미스매치를 완충하기 때문에, 특정 부위에 내부 변형이 집중하지 않고 밸런스가 좋은 필름을 얻을 수 있다. A polyimide film is obtained by applying a polyimide solution or a solution of a polyimide precursor to a support, drying it, and performing a chemical reaction as necessary. It is characterized by using a manufacturing method of coating. According to this coating method, material movement by diffusion or flow occurs in a limited thickness region on the surface where different components are in contact, and a transitional layer in which the composition changes step by step is formed. Since such a transitional layer buffers mismatches such as stress generated between layers having different physical properties, a well-balanced film can be obtained without concentration of internal strain in a specific region.
본 발명의 다층 폴리이미드 필름은, 두께 3 μm 이상 120 μm 이하이다. 기계 특성이 양호해지기 때문에 바람직하게는 4 μm 이상이고, 보다 바람직하게는 5 μm 이상이고, 더욱 바람직하게는 8 μm 이상이다. 또한, 투명성이 양호해지기 때문에 100 μm 이하인 것이 바람직하고, 보다 바람직하게는 80 μm 이하이며, 더욱 바람직하게는 60 μm 이하이다. The multilayer polyimide film of the present invention has a thickness of 3 μm or more and 120 μm or less. Since the mechanical properties become good, it is preferably 4 μm or more, more preferably 5 μm or more, still more preferably 8 μm or more. Moreover, since transparency becomes good, it is preferable that it is 100 micrometers or less, More preferably, it is 80 micrometers or less, More preferably, it is 60 micrometers or less.
본 발명의 다층 폴리이미드 필름은, 옐로우 인덱스가 5 이하이다. 투명성이 양호해지기 때문에 바람직하게는 4 이하이며, 보다 바람직하게는 3.5 이하이며, 더욱 바람직하게는 3 이하이다. 옐로우 인덱스는 낮은 쪽이 좋기 때문에 하한은 특별히 한정되지 않지만, 공업적으로는 0.1 이상이면 되고, 0.2 이상이어도 지장없다. The multilayer polyimide film of the present invention has a yellow index of 5 or less. Since transparency becomes good, Preferably it is 4 or less, More preferably, it is 3.5 or less, More preferably, it is 3 or less. Although the lower limit is not particularly limited since the yellow index is preferably lower, it may be industrially 0.1 or more, and 0.2 or more is not a problem.
본 발명의 다층 폴리이미드 필름은, 전광선 투과율이 86% 이상이다. 투명성이 양호해지기 때문에 바람직하게는 87% 이상이고, 보다 바람직하게는 88% 이상이고, 더욱 바람직하게는 89% 이상이다. 상한은 특별히 한정되지 않지만, 공업적으로는 99% 이하이면 되고, 98% 이하이어도 지장없다. The multilayer polyimide film of the present invention has a total light transmittance of 86% or more. Since the transparency becomes good, it is preferably 87% or more, more preferably 88% or more, still more preferably 89% or more. The upper limit is not particularly limited, but industrially it may be 99% or less, and 98% or less is not a problem.
본 발명에서는 적어도 조성이 상이한 2종류의 폴리이미드를 이용하여, 이들을 두께 방향으로 적층한다. 폴리이미드는 일반적으로 테트라카르복실산무수물과 디아민의 축중합 반응에 의해 얻어지는 고분자이다. 상기 적어도 2종의 폴리이미드층이 (a)층과 (b)층을 포함하고, 상기 (a)층과 (b)층은 각각 하기의 특성의 폴리이미드로 주로 구성되어 있는 것이 바람직하다. 여기서, 주로란, 각 하기 특성의 폴리이미드가 각각의 층에 70 질량% 이상 함유하는 것이 바람직하고, 보다 바람직한 함유량은 80 질량% 이상이고, 더욱 바람직하게는 90 질량% 이상이고, 특히 바람직하게는 100 질량%이다. 또한, 조성이 상이하다는 것은, 적어도 각 폴리이미드의 수지 조성이 상이할 필요가 있고, 예컨대 수지 조성이 동일하고 윤활제의 유무나 배합량 등만이 상이한 것과는 다르다. In the present invention, at least two types of polyimides having different compositions are used, and these are laminated in the thickness direction. Polyimide is generally a polymer obtained by condensation polymerization of tetracarboxylic acid anhydride and diamine. It is preferable that the at least two types of polyimide layers include a layer (a) and a layer (b), and the layer (a) and the layer (b) are mainly composed of polyimide having the following characteristics, respectively. Here, "mainly" preferably contains 70% by mass or more of the polyimide of each of the following characteristics in each layer, more preferably 80% by mass or more, still more preferably 90% by mass or more, particularly preferably It is 100 mass %. In addition, different compositions differ from the case where at least the resin composition of each polyimide needs to be different, and, for example, the resin composition is the same and only the presence or absence of a lubricant or the compounding amount is different.
(a)층에 주로 이용되는 폴리이미드(이하, 「주로」를 생략하고, 단순히 「(a)층에 이용되는 폴리이미드」나 「(a)층으로서 이용되는 폴리이미드」 등으로 기재하는 경우가 있다.)는, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 10 이하이며, 전광선 투과율이 85% 이상인 폴리이미드인 것이 바람직하다. 투명성이 양호해지기 때문에 옐로우 인덱스는 9 이하인 것이 바람직하고, 보다 바람직하게는 8 이하이며, 더욱 바람직하게는 7 이하이다. 옐로우 인덱스의 하한은 특별히 한정되지 않지만, 공업적으로는 0.1 이상이면 되고, 0.2 이상이어도 지장없다. 전광선 투과율은 86% 이상인 것이 바람직하고, 보다 바람직하게는 87% 이상이고, 더욱 바람직하게는 88% 이상이다. 상한은 특별히 한정되지 않지만, 공업적으로는 99% 이하이면 되고, 98% 이하이어도 지장없다. The polyimide mainly used for the layer (a) (hereinafter, “mainly” is omitted, and “polyimide used for layer (a)” or “polyimide used for layer (a)” is simply described). ) is preferably a polyimide having a yellow index of 10 or less and a total light transmittance of 85% or more when used alone as a film having a thickness of 25±2 μm. Since the transparency becomes good, the yellow index is preferably 9 or less, more preferably 8 or less, still more preferably 7 or less. The lower limit of the yellow index is not particularly limited, but industrially it may be 0.1 or more, and 0.2 or more is not a problem. The total light transmittance is preferably 86% or higher, more preferably 87% or higher, still more preferably 88% or higher. The upper limit is not particularly limited, but industrially it may be 99% or less, and 98% or less is not a problem.
다층 폴리이미드 필름에서의 (a)층의 두께는 기계 강도가 양호해지기 때문에 1 μm 초과인 것이 바람직하고, 보다 바람직하게는 1.5 μm 이상이고, 더욱 바람직하게는 2 μm 이상이고, 특히 바람직하게는 3 μm 이상이다. 또한 투명성이 양호해지기 때문에 119 μm 미만인 것이 바람직하고, 보다 바람직하게는 100 μm 이하이며, 더욱 바람직하게는 50 μm 이하이며, 특히 바람직하게는 20 μm 이하이다. The thickness of the (a) layer in the multilayer polyimide film is preferably greater than 1 μm, more preferably 1.5 μm or more, still more preferably 2 μm or more, particularly preferably, since mechanical strength becomes good. greater than 3 μm. In addition, since transparency becomes good, it is preferably less than 119 μm, more preferably 100 μm or less, still more preferably 50 μm or less, and particularly preferably 20 μm or less.
(a)층에 주로 이용되는 폴리이미드는, 바람직하게는, 전체 산성분을 100 질량%으로 했을 때, 지환족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 전체 아민 성분을 100 질량%으로 했을 때, 분자 내에 아미드 결합을 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드, 또는 지환족 테트라카르복실산무수물을 30 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드이다. The polyimide mainly used in the (a) layer is preferably a tetracarboxylic acid anhydride containing 70% by mass or more of an alicyclic tetracarboxylic acid anhydride and all amines when the total acid component is 100% by mass. 30% by mass of a polyimide having a chemical structure obtained by condensation polymerization of a diamine containing 70% by mass or more of diamine having an amide bond in the molecule when the component is 100% by mass, or an alicyclic tetracarboxylic acid anhydride It is a polyimide containing a chemical structure obtained by condensation polymerization of tetracarboxylic acid anhydride contained above and diamine containing 70% by mass or more of diamine having a trifluoromethyl group in a molecule.
(b)층에 주로 이용되는 폴리이미드(이하, 「주로」를 생략하고, 단순히 「(b)층에 이용되는 폴리이미드」나 「(b)층으로서 이용되는 폴리이미드」 등으로 기재하는 경우가 있다.)는, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 5 이하이며, 전광선 투과율이 90% 이상인 폴리이미드인 것이 바람직하다. 투명성이 양호해지기 때문에 옐로우 인덱스는 4 이하인 것이 바람직하고, 보다 바람직하게는 3 이하이다. 옐로우 인덱스의 하한은 특별히 한정되지 않지만, 공업적으로는 0.1 이상이면 되고, 0.2 이상이어도 지장없다. 전광선 투과율은 91% 이상인 것이 바람직하고, 보다 바람직하게는 92% 이상이다. 상한은 특별히 한정되지 않지만, 공업적으로는 99% 이하이면 되고, 98% 이하이어도 지장없다. (b)층에 이용되는 폴리이미드의 옐로우 인덱스는, (a)층에 이용되는 폴리이미드의 옐로우 인덱스보다 작은 것이 바람직하다. 또한, (b)층에 이용되는 폴리이미드의 전광선 투과율은, (a)층에 이용되는 폴리이미드의 전광선 투과율보다 큰 것이 바람직하다. The polyimide mainly used for the (b) layer (hereinafter, “mainly” is omitted, and “polyimide used for the (b) layer” or “polyimide used for the (b) layer” is simply described). ) is preferably a polyimide having a yellow index of 5 or less and a total light transmittance of 90% or more when used alone as a film having a thickness of 25±2 μm. Since transparency becomes good, it is preferable that the yellow index is 4 or less, More preferably, it is 3 or less. The lower limit of the yellow index is not particularly limited, but industrially it may be 0.1 or more, and 0.2 or more is not a problem. The total light transmittance is preferably 91% or higher, more preferably 92% or higher. The upper limit is not particularly limited, but industrially it may be 99% or less, and 98% or less is not a problem. It is preferable that the yellow index of the polyimide used in the (b) layer is smaller than the yellow index of the polyimide used in the (a) layer. Moreover, it is preferable that the total light transmittance of the polyimide used for the (b) layer is larger than the total light transmittance of the polyimide used for the (a) layer.
다층 폴리이미드 필름에서의 (b)층의 두께는 기계 강도가 양호해지기 때문에 1 μm 초과인 것이 바람직하고, 보다 바람직하게는 2 μm 이상이고, 더욱 바람직하게는 3 μm 이상이고, 특히 바람직하게는 4 μm 이상이다. 또한 투명성이 양호해지기 때문에 119 μm 미만인 것이 바람직하고, 보다 바람직하게는 100 μm 이하이며, 더욱 바람직하게는 80 μm 이하이며, 특히 바람직하게는 50 μm 이하이다. The thickness of the (b) layer in the multilayer polyimide film is preferably greater than 1 μm, more preferably 2 μm or more, still more preferably 3 μm or more, and particularly preferably greater than 4 μm. In addition, since transparency becomes good, it is preferably less than 119 μm, more preferably 100 μm or less, still more preferably 80 μm or less, and particularly preferably 50 μm or less.
(b)층에 주로 이용되는 폴리이미드는, 바람직하게는, 전체 산성분을 100 질량%으로 했을 때, 방향족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 전체 아민 성분을 100 질량%으로 했을 때, 적어도 분자 내에 황 원자를 갖는 디아민을 70 질량% 이상 함유하는 디아민으로부터 얻어지는 화학 구조를 포함하는 폴리이미드, 또는, 적어도 트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 적어도 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드이다. The polyimide mainly used in the (b) layer is preferably a tetracarboxylic acid anhydride containing 70% by mass or more of an aromatic tetracarboxylic acid anhydride based on 100% by mass of the total acid component, and all amine components Polyimide having a chemical structure obtained from diamine containing at least 70% by mass of diamine having a sulfur atom in the molecule when 100% by mass, or tetracarboxylic acid containing at least a trifluoromethyl group in the molecule It is a polyimide having a chemical structure obtained by condensation polymerization of a tetracarboxylic acid anhydride containing 70% by mass or more of a diamine containing 70% by mass or more of a diamine having at least a trifluoromethyl group in a molecule.
본 발명에서의 지환족 테트라카르복실산무수물로는, 1,2,3,4-시클로부탄테트라카르복실산, 1,2,3,4-시클로펜탄테트라카르복실산, 1,2,3,4-시클로헥산테트라카르복실산, 1,2,4,5-시클로헥산테트라카르복실산, 3,3',4,4'-비시클로헥실테트라카르복실산, 비시클로[2,2,1]헵탄-2,3,5,6-테트라카르복실산, 비시클로[2,2,2]옥탄-2,3,5,6-테트라카르복실산, 비시클로[2,2,2]옥토-7-엔-2,3,5,6-테트라카르복실산, 테트라히드로안트라센-2,3,6,7-테트라카르복실산, 테트라데카히드로-1,4:5,8:9,10-트리메타노안트라센-2,3,6,7-테트라카르복실산, 데카히드로나프탈렌-2,3,6,7-테트라카르복실산, 데카히드로-1,4:5,8-디메타노나프탈렌-2,3,6,7-테트라카르복실산, 데카히드로-1,4-에타노-5,8-메타노나프탈렌-2,3,6,7-테트라카르복실산, 노보난-2-스피로-α-시클로펜타논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산(별칭 「노보난-2-스피로-2'-시클로펜타논-5'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산」), 메틸노보난-2-스피로-α-시클로펜타논-α'-스피로-2''-(메틸노보난)-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로헥사논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산(별칭 「노보난-2-스피로-2'-시클로헥사논-6'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산」), 메틸노보난-2-스피로-α-시클로헥사논-α'-스피로-2''-(메틸노보난)-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로프로파논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로부타논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로헵타논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로옥타논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로노나논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로데카논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로운데카논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로도데카논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로트리데카논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로테트라데카논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로-α-시클로펜타데카논-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로(메틸시클로펜타논)-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산, 노보난-2-스피로(메틸시클로헥사논)-α'-스피로-2''-노보난-5,5'',6,6''-테트라카르복실산 등의 테트라카르복실산 및 이들의 산무수물을 들 수 있다. 이들 중에서도, 2개의 산무수물 구조를 갖는 이무수물이 적합하며, 특히, 1,2,3,4-시클로부탄테트라카르복실산이무수물, 1,2,3,4-시클로헥산테트라카르복실산이무수물, 1,2,4,5-시클로헥산테트라카르복실산이무수물이 바람직하고, 1,2,3,4-시클로부탄테트라카르복실산이무수물, 1,2,4,5-시클로헥산테트라카르복실산이무수물이 보다 바람직하고, 1,2,3,4-시클로부탄테트라카르복실산이무수물이 더욱 바람직하다. 또, 이들은 단독으로 이용해도 좋고, 2종 이상을 병용해도 좋다. As the alicyclic tetracarboxylic acid anhydride in the present invention, 1,2,3,4-cyclobutanetetracarboxylic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, 1,2,3, 4-cyclohexanetetracarboxylic acid, 1,2,4,5-cyclohexanetetracarboxylic acid, 3,3',4,4'-bicyclohexyltetracarboxylic acid, bicyclo[2,2,1 ]heptane-2,3,5,6-tetracarboxylic acid, bicyclo[2,2,2]octane-2,3,5,6-tetracarboxylic acid, bicyclo[2,2,2]octo -7-ene-2,3,5,6-tetracarboxylic acid, tetrahydroanthracene-2,3,6,7-tetracarboxylic acid, tetradecahydro-1,4:5,8:9,10 -trimethanoanthracene-2,3,6,7-tetracarboxylic acid, decahydronaphthalene-2,3,6,7-tetracarboxylic acid, decahydro-1,4:5,8-dimethano Naphthalene-2,3,6,7-tetracarboxylic acid, decahydro-1,4-ethano-5,8-methanonaphthalene-2,3,6,7-tetracarboxylic acid, norbonane-2 -Spiro-α-cyclopentanone-α'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid (aka "norbonane-2-spiro-2'- Cyclopentanone-5'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid"), methylnorbornane-2-spiro-α-cyclopentanone-α '-spiro-2''-(methylnorbornane)-5,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro-α-cyclohexanone-α'-spiro-2 ''-norbonane-5,5'',6,6''-tetracarboxylic acid (aka "norbonane-2-spiro-2'-cyclohexanone-6'-spiro-2''-norbonane -5,5'',6,6''-tetracarboxylic acid"), methylnorbornane-2-spiro-α-cyclohexanone-α'-spiro-2''-(methylnorbornane)-5 ,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro-α-cyclopropanone-α'-spiro-2''-norbonane-5,5'',6,6 ''-tetracarboxylic acid, norbonane-2-spiro-α-cyclobutanone-α'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid, Norbonane-2-spiro-α-cycloheptanone-α'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro-α -Cyclooctanone-α'-spiro-2''-norbonane- 5,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro-α-cyclononanone-α'-spiro-2''-norbonane-5,5'',6, 6''-tetracarboxylic acid, norbonane-2-spiro-α-cyclodecanone-α'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid , Norbonane-2-spiro-α-cycloundecanone-α'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro- α-cyclododecanone-α'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro-α-cyclotridecanone-α '-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro-α-cyclotetradecanone-α'-spiro-2'' -Norbonane-5,5'',6,6''-tetracarboxylic acid, norbonane-2-spiro-α-cyclopentadecanone-α'-spiro-2''-norbonane-5,5 '',6,6''-tetracarboxylic acid, norbonane-2-spiro(methylcyclopentanone)-α'-spiro-2''-norbonane-5,5'',6,6'' Tetracarboxylic acid, norbonane-2-spiro (methylcyclohexanone) -α'-spiro-2''-norbonane-5,5'',6,6''-tetracarboxylic acid, etc. carboxylic acids and acid anhydrides thereof; Among these, dianhydrides having two acid anhydride structures are suitable, and in particular, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclohexanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride is preferred, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride This is more preferable, and 1,2,3,4-cyclobutane tetracarboxylic dianhydride is still more preferable. Moreover, these may be used independently and may use 2 or more types together.
본 발명에서의 방향족 테트라카르복실산무수물로는, 4,4'-(2,2-헥사플루오로이소프로필리덴)디프탈산, 4,4'-옥시디프탈산, 비스(1,3-디옥소-1,3-디히드로-2-벤조푸란-5-카르복실산)1,4-페닐렌, 비스(1,3-디옥소-1,3-디히드로-2-벤조푸란-5-일)벤젠-1,4-디카르복실레이트, 4,4'-[4,4'-(3-옥소-1,3-디히드로-2-벤조푸란-1,1-디일)비스(벤젠-1,4-디일옥시)]디벤젠-1,2-디카르복실산, 3,3',4,4'-벤조페논테트라카르복실산, 4,4'-[(3-옥소-1,3-디히드로-2-벤조푸란-1,1-디일)비스(톨루엔-2,5-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-[(3-옥소-1,3-디히드로-2-벤조푸란-1,1-디일)비스(1,4-크실렌-2,5-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-[4,4'-(3-옥소-1,3-디히드로-2-벤조푸란-1,1-디일)비스(4-이소프로필-톨루엔-2,5-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-[4,4'-(3-옥소-1,3-디히드로-2-벤조푸란-1,1-디일)비스(나프탈렌-1,4-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-[4,4'-(3H-2,1-벤즈옥사티올-1,1-디옥시드-3,3-디일)비스(벤젠-1,4-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-벤조페논테트라카르복실산, 4,4'-[(3H-2,1-벤즈옥사티올-1,1-디옥시드-3,3-디일)비스(톨루엔-2,5-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-[(3H-2,1-벤즈옥사티올-1,1-디옥시드-3,3-디일)비스(1,4-크실렌-2,5-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-[4,4'-(3H-2,1-벤즈옥사티올-1,1-디옥시드-3,3-디일)비스(4-이소프로필-톨루엔-2,5-디일옥시)]디벤젠-1,2-디카르복실산, 4,4'-[4,4'-(3H-2,1-벤즈옥사티올-1,1-디옥시드-3,3-디일)비스(나프탈렌-1,4-디일옥시)]디벤젠-1,2-디카르복실산, 3,3',4,4'-벤조페논테트라카르복실산, 3,3',4,4'-벤조페논테트라카르복실산, 3,3',4,4'-디페닐술폰테트라카르복실산, 3,3',4,4'-비페닐테트라카르복실산, 2,3,3',4'-비페닐테트라카르복실산, 피로멜리트산, 4,4'-[스피로(크산텐-9,9'-플루오렌)-2,6-디일비스(옥시카르보닐)]디프탈산, 4,4'-[스피로(크산텐-9,9'-플루오렌)-3,6-디일비스(옥시카르보닐)]디프탈산 등의 테트라카르복실산 및 이들의 산무수물을 들 수 있다. 또, 방향족 테트라카르복실산류는 단독으로 이용해도 좋고, 2종 이상을 병용해도 좋다. As the aromatic tetracarboxylic acid anhydride in the present invention, 4,4'-(2,2-hexafluoroisopropylidene)diphthalic acid, 4,4'-oxydiphthalic acid, bis(1,3-dioxo -1,3-dihydro-2-benzofuran-5-carboxylic acid) 1,4-phenylene, bis(1,3-dioxo-1,3-dihydro-2-benzofuran-5-yl ) Benzene-1,4-dicarboxylate, 4,4'-[4,4'-(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(benzene- 1,4-diyloxy)]dibenzene-1,2-dicarboxylic acid, 3,3',4,4'-benzophenonetetracarboxylic acid, 4,4'-[(3-oxo-1 ,3-dihydro-2-benzofuran-1,1-diyl)bis(toluene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4'-[(3 -Oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(1,4-xylene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid; 4,4'-[4,4'-(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis(4-isopropyl-toluene-2,5-diyloxy )]dibenzene-1,2-dicarboxylic acid, 4,4'-[4,4'-(3-oxo-1,3-dihydro-2-benzofuran-1,1-diyl)bis( naphthalene-1,4-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4'-[4,4'-(3H-2,1-benzoxathiol-1,1-dioxy seed-3,3-diyl)bis(benzene-1,4-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4'-benzophenonetetracarboxylic acid, 4,4'- [(3H-2,1-benzoxathiol-1,1-dioxide-3,3-diyl)bis(toluene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid; 4,4'-[(3H-2,1-benzoxathiol-1,1-dioxide-3,3-diyl)bis(1,4-xylene-2,5-diyloxy)]dibenzene- 1,2-dicarboxylic acid, 4,4'-[4,4'-(3H-2,1-benzoxathiol-1,1-dioxide-3,3-diyl)bis(4-isopropyl -toluene-2,5-diyloxy)]dibenzene-1,2-dicarboxylic acid, 4,4'-[4,4'-(3H-2,1-benzoxathiol-1,1- Dioxide-3,3-diyl)bis(naphthalene-1,4-diyloxy)]dibenzene-1,2-dicarboxylic acid, 3,3',4,4'-benzophenonetetracarboxylic acid , 3,3 ', 4,4'-benzophenone tetracarboxylic acid, 3,3 ',4,4'-diphenylsulfotetracarboxylic acid, 3,3',4,4'-biphenyltetracarboxylic acid, 2,3,3',4'-biphenyltetracarboxylic acid, pyro Mellitic acid, 4,4'-[spiro(xanthene-9,9'-fluorene)-2,6-diylbis(oxycarbonyl)]diphthalic acid, 4,4'-[spiro(xanthene-9 and tetracarboxylic acids such as ,9'-fluorene)-3,6-diylbis(oxycarbonyl)]diphthalic acid and acid anhydrides thereof. Moreover, aromatic tetracarboxylic acids may be used independently and may use 2 or more types together.
본 발명에서는, 테트라카르복실산무수물에 더해 트리카르복실산, 디카르복실산을 이용해도 좋다. In this invention, you may use tricarboxylic acid and dicarboxylic acid in addition to tetracarboxylic acid anhydride.
트리카르복실산류로는, 트리멜리트산, 1,2,5-나프탈렌트리카르복실산, 디페닐에테르-3,3',4'-트리카르복실산, 디페닐술폰-3,3',4'-트리카르복실산 등의 방향족 트리카르복실산, 혹은 헥사히드로트리멜리트산 등의 상기 방향족 트리카르복실산의 수소 첨가물, 에틸렌글리콜비스트리멜리테이트, 프로필렌글리콜비스트리멜리테이트, 1,4-부탄디올비스트리멜리테이트, 폴리에틸렌글리콜비스트리멜리테이트 등의 알킬렌글리콜비스트리멜리테이트, 및 이들의 1무수물, 에스테르화물을 들 수 있다. 이들 중에서도, 1개의 산무수물 구조를 갖는 1무수물이 적합하며, 특히, 트리멜리트산무수물, 헥사히드로트리멜리트산무수물이 바람직하다. 또한, 이들은 단독으로 사용해도 좋고 복수를 조합하여 사용해도 좋다. Examples of tricarboxylic acids include trimellitic acid, 1,2,5-naphthalene tricarboxylic acid, diphenyl ether-3,3',4'-tricarboxylic acid, and diphenylsulfone-3,3',4 Aromatic tricarboxylic acids such as '-tricarboxylic acid, or hydrogenated products of the aromatic tricarboxylic acids such as hexahydrotrimellitic acid, ethylene glycol bistrimellitate, propylene glycol bistrimellitate, 1,4- alkylene glycol bistrimellitate such as butanediol bistrimellitate and polyethylene glycol bistrimellitate; and monohydrides and esterified products thereof. Among these, a monohydride having a single acid anhydride structure is preferable, and trimellitic anhydride and hexahydrotrimellitic anhydride are particularly preferable. In addition, these may be used individually or may be used combining plurality.
디카르복실산류로는, 테레프탈산, 이소프탈산, 오르토프탈산, 나프탈렌디카르복실산, 4,4'-옥시디벤젠카르복실산 등의 방향족 디카르복실산, 혹은 1,6-시클로헥산디카르복실산 등의 상기 방향족 디카르복실산의 수소 첨가물, 옥살산, 숙신산, 글루탈산, 아디프산, 헵탄2산, 옥탄2산, 아젤라산, 세바스산, 운데카2산, 도데칸2산, 2-메틸숙신산, 및 이들의 산염화물 혹은 에스테르화물 등을 들 수 있다. 이들 중에서 방향족 디카르복실산 및 그 수소 첨가물이 적합하며, 특히, 테레프탈산, 1,6-시클로헥산디카르복실산, 4,4'-옥시디벤젠카르복실산이 바람직하다. 또한, 디카르복실산류는 단독으로 사용해도 좋고 복수를 조합하여 사용해도 좋다. Examples of dicarboxylic acids include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, orthophthalic acid, naphthalene dicarboxylic acid, and 4,4'-oxydibenzenecarboxylic acid, or 1,6-cyclohexanedicarboxylic acid. Hydrogenates of the above aromatic dicarboxylic acids such as acids, oxalic acid, succinic acid, glutalic acid, adipic acid, heptanedioic acid, octanedioic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, 2- methyl succinic acid, acid chlorides or ester compounds thereof, and the like. Among these, aromatic dicarboxylic acids and hydrogenated products thereof are suitable, and terephthalic acid, 1,6-cyclohexanedicarboxylic acid, and 4,4'-oxydibenzenecarboxylic acid are particularly preferred. In addition, dicarboxylic acids may be used independently or may be used in combination of plurality.
본 발명에서의 분자 내에 아미드 결합을 갖는 디아민으로는, 방향족 디아민, 지환족 아민을 주로 이용할 수 있다. As the diamine having an amide bond in the molecule in the present invention, aromatic diamines and alicyclic amines can be mainly used.
방향족 디아민류로는, 예컨대, 2,2'-디메틸-4,4'-디아미노비페닐, 1,4-비스[2-(4-아미노페닐)-2-프로필]벤젠, 1,4-비스(4-아미노-2-트리플루오로메틸페녹시)벤젠, 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐, 4,4'-비스(4-아미노페녹시)비페닐, 4,4'-비스(3-아미노페녹시)비페닐, 비스[4-(3-아미노페녹시)페닐]케톤, 비스[4-(3-아미노페녹시)페닐]술피드, 비스[4-(3-아미노페녹시)페닐]술폰, 2,2-비스[4-(3-아미노페녹시)페닐]프로판, 2,2-비스[4-(3-아미노페녹시)페닐]-1,1,1,3,3,3-헥사플루오로프로판, m-페닐렌디아민, o-페닐렌디아민, p-페닐렌디아민, m-아미노벤질아민, p-아미노벤질아민, 4-아미노-N-(4-아미노페닐)벤즈아미드, 3,3'-디아미노디페닐에테르, 3,4'-디아미노디페닐에테르, 4,4'-디아미노디페닐에테르, 2,2'-트리플루오로메틸-4,4'-디아미노디페닐에테르, 3,3'-디아미노디페닐술피드, 3,4'-디아미노디페닐술피드, 4,4'-디아미노디페닐술피드, 3,3'-디아미노디페닐술폭시드, 3,4'-디아미노디페닐술폭시드,4,4'-디아미노디페닐술폭시드,3,3'-디아미노디페닐술폰, 3,4'-디아미노디페닐술폰, 4,4'-디아미노디페닐술폰, 3,3'-디아미노벤조페논, 3,4'-디아미노벤조페논, 4,4'-디아미노벤조페논, 3,3'-디아미노디페닐메탄, 3,4'-디아미노디페닐메탄, 4,4'-디아미노디페닐메탄, 비스[4-(4-아미노페녹시)페닐]메탄, 1,1-비스[4-(4-아미노페녹시)페닐]에탄, 1,2-비스[4-(4-아미노페녹시)페닐]에탄, 1,1-비스[4-(4-아미노페녹시)페닐]프로판, 1,2-비스[4-(4-아미노페녹시)페닐]프로판, 1,3-비스[4-(4-아미노페녹시)페닐]프로판, 2,2-비스[4-(4-아미노페녹시)페닐]프로판, 1,1-비스[4-(4-아미노페녹시)페닐]부탄, 1,3-비스[4-(4-아미노페녹시)페닐]부탄, 1,4-비스[4-(4-아미노페녹시)페닐]부탄, 2,2-비스[4-(4-아미노페녹시)페닐]부탄, 2,3-비스[4-(4-아미노페녹시)페닐]부탄, 2-[4-(4-아미노페녹시)페닐]-2-[4-(4-아미노페녹시)-3-메틸페닐]프로판, 2,2-비스[4-(4-아미노페녹시)-3-메틸페닐]프로판, 2-[4-(4-아미노페녹시)페닐]-2-[4-(4-아미노페녹시)-3,5-디메틸페닐]프로판, 2,2-비스[4-(4-아미노페녹시)-3,5-디메틸페닐]프로판, 2,2-비스[4-(4-아미노페녹시)페닐]-1,1,1,3,3,3-헥사플루오로프로판, 1,4-비스(3-아미노페녹시)벤젠, 1,3-비스(3-아미노페녹시)벤젠, 1,4-비스(4-아미노페녹시)벤젠, 4,4'-비스(4-아미노페녹시)비페닐, 비스[4-(4-아미노페녹시)페닐]케톤, 비스[4-(4-아미노페녹시)페닐]술피드, 비스[4-(4-아미노페녹시)페닐]술폭시드, 비스[4-(4-아미노페녹시)페닐]술폰, 비스[4-(3-아미노페녹시)페닐]에테르, 비스[4-(4-아미노페녹시)페닐]에테르, 1,3-비스[4-(4-아미노페녹시)벤조일]벤젠, 1,3-비스[4-(3-아미노페녹시)벤조일]벤젠, 1,4-비스[4-(3-아미노페녹시)벤조일]벤젠, 4,4'-비스[(3-아미노페녹시)벤조일]벤젠, 1,1-비스[4-(3-아미노페녹시)페닐]프로판, 1,3-비스[4-(3-아미노페녹시)페닐]프로판, 3,4'-디아미노디페닐술피드, 2,2-비스[3-(3-아미노페녹시)페닐]-1,1,1,3,3,3-헥사플루오로프로판, 비스[4-(3-아미노페녹시)페닐]메탄, 1,1-비스[4-(3-아미노페녹시)페닐]에탄, 1,2-비스[4-(3-아미노페녹시)페닐]에탄, 비스[4-(3-아미노페녹시)페닐]술폭시드, 4,4'-비스[3-(4-아미노페녹시)벤조일]디페닐에테르, 4,4'-비스[3-(3-아미노페녹시)벤조일]디페닐에테르, 4,4'-비스[4-(4-아미노-α,α-디메틸벤질)페녹시]벤조페논, 4,4'-비스[4-(4-아미노-α,α-디메틸벤질)페녹시]디페닐술폰, 비스[4-{4-(4-아미노페녹시)페녹시}페닐]술폰, 1,4-비스[4-(4-아미노페녹시)페녹시-α,α-디메틸벤질]벤젠, 1,3-비스[4-(4-아미노페녹시)페녹시-α,α-디메틸벤질]벤젠, 1,3-비스[4-(4-아미노-6-트리플루오로메틸페녹시)-α,α-디메틸벤질]벤젠, 1,3-비스[4-(4-아미노-6-플루오로페녹시)-α,α-디메틸벤질]벤젠, 1,3-비스[4-(4-아미노-6-메틸페녹시)-α,α-디메틸벤질]벤젠, 1,3-비스[4-(4-아미노-6-시아노페녹시)-α,α-디메틸벤질]벤젠, 3,3'-디아미노-4,4'-디페녹시벤조페논, 4,4'-디아미노-5,5'-디페녹시벤조페논, 3,4'-디아미노-4,5'-디페녹시벤조페논, 3,3'-디아미노-4-페녹시벤조페논, 4,4'-디아미노-5-페녹시벤조페논, 3,4'-디아미노-4-페녹시벤조페논, 3,4'-디아미노-5'-페녹시벤조페논, 3,3'-디아미노-4,4'-디비페녹시벤조페논, 4,4'-디아미노-5,5'-디비페녹시벤조페논, 3,4'-디아미노-4,5'-디비페녹시벤조페논, 3,3'-디아미노-4-비페녹시벤조페논, 4,4'-디아미노-5-비페녹시벤조페논, 3,4'-디아미노-4-비페녹시벤조페논, 3,4'-디아미노-5'-비페녹시벤조페논, 1,3-비스(3-아미노-4-페녹시벤조일)벤젠, 1,4-비스(3-아미노-4-페녹시벤조일)벤젠, 1,3-비스(4-아미노-5-페녹시벤조일)벤젠, 1,4-비스(4-아미노-5-페녹시벤조일)벤젠, 1,3-비스(3-아미노-4-비페녹시벤조일)벤젠, 1,4-비스(3-아미노-4-비페녹시벤조일)벤젠, 1,3-비스(4-아미노-5-비페녹시벤조일)벤젠, 1,4-비스(4-아미노-5-비페녹시벤조일)벤젠, 2,6-비스[4-(4-아미노-α,α-디메틸벤질)페녹시]벤조니트릴, 4,4'-[9H-플루오렌-9,9-디일]비스아닐린(별칭 「9,9-비스(4-아미노페닐)플루오렌」), 스피로(크산텐-9,9'-플루오렌)-2,6-디일비스(옥시카르보닐)]비스아닐린, 4,4'-[스피로(크산텐-9,9'-플루오렌)-2,6-디일비스(옥시카르보닐)]비스아닐린, 4,4'-[스피로(크산텐-9,9'-플루오렌)-3,6-디일비스(옥시카르보닐)]비스아닐린, 5-아미노-2-(p-아미노페닐)벤조옥사졸, 6-아미노-2-(p-아미노페닐)벤조옥사졸, 5-아미노-2-(m-아미노페닐)벤조옥사졸, 6-아미노-2-(m-아미노페닐)벤조옥사졸, 2,2'-p-페닐렌비스(5-아미노벤조옥사졸), 2,2'-p-페닐렌비스(6-아미노벤조옥사졸), 1-(5-아미노벤조옥사졸로)-4-(6-아미노벤조옥사졸로)벤젠, 2,6-(4,4'-디아미노디페닐)벤조[1,2-d:5,4-d']비스옥사졸, 2,6-(4,4'-디아미노디페닐)벤조[1,2-d:4,5-d']비스옥사졸, 2,6-(3,4'-디아미노디페닐)벤조[1,2-d:5,4-d']비스옥사졸, 2,6-(3,4'-디아미노디페닐)벤조[1,2-d:4,5-d']비스옥사졸, 2,6-(3,3'-디아미노디페닐)벤조[1,2-d:5,4-d']비스옥사졸, 2,6-(3,3'-디아미노디페닐)벤조[1,2-d:4,5-d']비스옥사졸 등을 들 수 있다. 또한, 상기 방향족 디아민의 방향환 상의 수소 원자의 일부 혹은 전부가, 할로겐 원자, 탄소수 1∼3의 알킬기 혹은 알콕실기, 또는 시아노기로 치환되어도 좋고, 또한 상기 탄소수 1∼3의 알킬기 혹은 알콕실기의 수소 원자의 일부 혹은 전부가 할로겐 원자로 치환되어도 좋다. Examples of aromatic diamines include 2,2'-dimethyl-4,4'-diaminobiphenyl, 1,4-bis[2-(4-aminophenyl)-2-propyl]benzene, and 1,4- Bis (4-amino-2-trifluoromethylphenoxy) benzene, 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl, 4,4'-bis (4-aminophenoxy ) Biphenyl, 4,4'-bis (3-aminophenoxy) biphenyl, bis [4- (3-aminophenoxy) phenyl] ketone, bis [4- (3-aminophenoxy) phenyl] sulfide , bis[4-(3-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy) Phenyl] -1,1,1,3,3,3-hexafluoropropane, m-phenylenediamine, o-phenylenediamine, p-phenylenediamine, m-aminobenzylamine, p-aminobenzylamine, 4-amino-N-(4-aminophenyl)benzamide, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 2, 2'-trifluoromethyl-4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diamino Diphenylsulfide, 3,3'-diaminodiphenylsulfoxide, 3,4'-diaminodiphenylsulfoxide, 4,4'-diaminodiphenylsulfoxide, 3,3'-diaminodiphenyl Sulfone, 3,4'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 3,3'-diaminobenzophenone, 3,4'-diaminobenzophenone, 4,4'-dia Minobenzophenone, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, bis[4-(4-aminophenoxy)phenyl] Methane, 1,1-bis[4-(4-aminophenoxy)phenyl]ethane, 1,2-bis[4-(4-aminophenoxy)phenyl]ethane, 1,1-bis[4-(4 -aminophenoxy)phenyl]propane, 1,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,3-bis[4-(4-aminophenoxy)phenyl]propane, 2,2 -bis[4-(4-aminophenoxy)phenyl]propane, 1,1-bis[4-(4-aminophenoxy)phenyl]butane, 1,3-bis[4-(4-aminophenoxy) phenyl] butane, 1,4-bis [4- (4-aminophenoxy) phenyl] butane, 2,2-bis [4- (4-aminophenoxy) phenyl] butane, 2,3-bis[4-(4-aminophenoxy)phenyl]butane, 2-[4-(4-aminophenoxy)phenyl]-2-[4-(4-aminophenoxy)-3-methylphenyl ]propane, 2,2-bis[4-(4-aminophenoxy)-3-methylphenyl]propane, 2-[4-(4-aminophenoxy)phenyl]-2-[4-(4-aminophenoxy) oxy)-3,5-dimethylphenyl]propane, 2,2-bis[4-(4-aminophenoxy)-3,5-dimethylphenyl]propane, 2,2-bis[4-(4-aminophenoxy) cy)phenyl] -1,1,1,3,3,3-hexafluoropropane, 1,4-bis (3-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ketone, bis[4-( 4-aminophenoxy)phenyl]sulfide, bis[4-(4-aminophenoxy)phenyl]sulfoxide, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-amino) Phenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, 1,3-bis [4- (4-aminophenoxy) benzoyl] benzene, 1,3-bis [4- ( 3-aminophenoxy)benzoyl]benzene, 1,4-bis[4-(3-aminophenoxy)benzoyl]benzene, 4,4'-bis[(3-aminophenoxy)benzoyl]benzene, 1,1 -bis[4-(3-aminophenoxy)phenyl]propane, 1,3-bis[4-(3-aminophenoxy)phenyl]propane, 3,4'-diaminodiphenylsulfide, 2,2 -bis[3-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, bis[4-(3-aminophenoxy)phenyl]methane, 1,1 -Bis[4-(3-aminophenoxy)phenyl]ethane, 1,2-bis[4-(3-aminophenoxy)phenyl]ethane, bis[4-(3-aminophenoxy)phenyl]sulfoxide , 4,4'-bis[3-(4-aminophenoxy)benzoyl]diphenyl ether, 4,4'-bis[3-(3-aminophenoxy)benzoyl]diphenyl ether, 4,4'- bis[4-(4-amino-α,α-dimethylbenzyl)phenoxy]benzophenone, 4,4′-bis[4-(4-amino-α,α-dimethylbenzyl)phenoxy]diphenylsulfone, Bis[4-{4-(4-aminophenoxy)phenoxy}phenyl]sulfone, 1,4-bis[4-(4-aminophenoxy)phenoxy-α,α-dimethylbenzyl]benzene, 1, 3-bis[4-(4-aminophenoc cy)phenoxy-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-amino-6-trifluoromethylphenoxy)-α,α-dimethylbenzyl]benzene, 1,3- Bis[4-(4-amino-6-fluorophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-amino-6-methylphenoxy)-α,α- Dimethylbenzyl]benzene, 1,3-bis[4-(4-amino-6-cyanophenoxy)-α,α-dimethylbenzyl]benzene, 3,3'-diamino-4,4'-diphenoxy Cybenzophenone, 4,4'-diamino-5,5'-diphenoxybenzophenone, 3,4'-diamino-4,5'-diphenoxybenzophenone, 3,3'-diamino- 4-phenoxybenzophenone, 4,4'-diamino-5-phenoxybenzophenone, 3,4'-diamino-4-phenoxybenzophenone, 3,4'-diamino-5'-phenoxy Benzophenone, 3,3'-diamino-4,4'-dibiphenoxybenzophenone, 4,4'-diamino-5,5'-dibiphenoxybenzophenone, 3,4'-diamino-4 ,5'-dibiphenoxybenzophenone, 3,3'-diamino-4-biphenoxybenzophenone, 4,4'-diamino-5-biphenoxybenzophenone, 3,4'-diamino- 4-biphenoxybenzophenone, 3,4'-diamino-5'-biphenoxybenzophenone, 1,3-bis (3-amino-4-phenoxybenzoyl) benzene, 1,4-bis (3 -Amino-4-phenoxybenzoyl)benzene, 1,3-bis(4-amino-5-phenoxybenzoyl)benzene, 1,4-bis(4-amino-5-phenoxybenzoyl)benzene, 1,3 -bis(3-amino-4-biphenoxybenzoyl)benzene, 1,4-bis(3-amino-4-biphenoxybenzoyl)benzene, 1,3-bis(4-amino-5-biphenoxy Benzoyl) benzene, 1,4-bis (4-amino-5-biphenoxybenzoyl) benzene, 2,6-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] benzonitrile, 4 ,4'-[9H-fluorene-9,9-diyl]bisaniline (also known as "9,9-bis(4-aminophenyl)fluorene"), spiro(xanthene-9,9'-fluorene) -2,6-diylbis(oxycarbonyl)]bisaniline, 4,4'-[spiro(xanthen-9,9'-fluorene)-2,6-diylbis(oxycarbonyl)]bisaniline , 4,4'-[spiro(xanthen-9,9'-fluorene)-3,6-diylbis(oxycarbonyl)]bisaniline, 5-amino-2-(p-aminophenyl)benzoxa sol, 6-amino-2-(p-aminophenyl)benzoate sazole, 5-amino-2-(m-aminophenyl)benzoxazole, 6-amino-2-(m-aminophenyl)benzoxazole, 2,2'-p-phenylenebis(5-aminobenzoxa sol), 2,2'-p-phenylenebis(6-aminobenzooxazole), 1-(5-aminobenzooxazolo)-4-(6-aminobenzooxazolo)benzene, 2,6-( 4,4'-diaminodiphenyl)benzo[1,2-d:5,4-d']bisoxazole, 2,6-(4,4'-diaminodiphenyl)benzo[1,2- d:4,5-d']bisoxazole, 2,6-(3,4'-diaminodiphenyl)benzo[1,2-d:5,4-d']bisoxazole, 2,6 -(3,4'-diaminodiphenyl)benzo[1,2-d:4,5-d']bisoxazole, 2,6-(3,3'-diaminodiphenyl)benzo[1, 2-d:5,4-d']bisoxazole, 2,6-(3,3'-diaminodiphenyl)benzo[1,2-d:4,5-d']bisoxazole, etc. can be heard In addition, some or all of the hydrogen atoms on the aromatic ring of the aromatic diamine may be substituted with a halogen atom, an alkyl group or alkoxyl group having 1 to 3 carbon atoms, or a cyano group, or a C 1 to 3 alkyl group or alkoxyl group Some or all of the hydrogen atoms may be substituted with halogen atoms.
지환족 디아민류로는, 예컨대, 1,4-디아미노시클로헥산, 1,4-디아미노-2-메틸시클로헥산, 1,4-디아미노-2-에틸시클로헥산, 1,4-디아미노-2-n-프로필시클로헥산, 1,4-디아미노-2-이소프로필시클로헥산, 1,4-디아미노-2-n-부틸시클로헥산, 1,4-디아미노-2-이소부틸시클로헥산, 1,4-디아미노-2-sec-부틸시클로헥산, 1,4-디아미노-2-tert-부틸시클로헥산, 4,4'-메틸렌비스(2,6-디메틸시클로헥실아민), 9,10-비스(4-아미노페닐)아데닌, 2,4-비스(4-아미노페닐)시클로부탄-1,3-디카르복실산디메틸 등을 들 수 있다. Examples of alicyclic diamines include 1,4-diaminocyclohexane, 1,4-diamino-2-methylcyclohexane, 1,4-diamino-2-ethylcyclohexane, and 1,4-diamino. -2-n-propylcyclohexane, 1,4-diamino-2-isopropylcyclohexane, 1,4-diamino-2-n-butylcyclohexane, 1,4-diamino-2-isobutylcyclo Hexane, 1,4-diamino-2-sec-butylcyclohexane, 1,4-diamino-2-tert-butylcyclohexane, 4,4'-methylenebis(2,6-dimethylcyclohexylamine), 9,10-bis(4-aminophenyl)adenine, 2,4-bis(4-aminophenyl)cyclobutane-1,3-dicarboxylic acid dimethyl, etc. are mentioned.
본 발명에서는, (a)층은, (b)층의 한쪽 면측과 다른쪽 면측의 양쪽에 존재하고, 천이층은, (b)층의 한쪽 면측의 (a)층과 (b)층 사이, 및, (b)층의 다른쪽 면측의 (a)층과 (b)층 사이에 존재하고, (a)층, 천이층, (b)층, 천이층, (a)층의 순으로 적층된 층구성을 갖고 있는 것이 바람직하다. 이하, (a)층, 천이층, (b)층, 천이층, (a)층의 순으로 적층된 층구성을 「(a)/(b)/(a)」이라고도 한다. 또한, 마찬가지로, (a)층, 천이층, (b)층의 순으로 적층된 층구성을 「(a)/(b)」라고도 하고, (a)층, 천이층, (b)층, 천이층, (a)층, 천이층, (b)층, 천이층, (a)층의 순으로 적층된 층구성을 「(a)/(b)/(a)/(b)/(a)」라고도 한다. In the present invention, the (a) layer is present on both one side and the other side of the (b) layer, and the transition layer is between the (a) layer and (b) layer on one side of the (b) layer, And, it exists between the (a) layer and the (b) layer on the other side of the (b) layer, and the (a) layer, the transition layer, the (b) layer, the transition layer, and the (a) layer are laminated in this order. It is preferable to have a layered structure. Hereinafter, the layer configuration in which layers (a), transition layers, (b) layers, transition layers, and (a) layers are laminated in this order is also referred to as "(a)/(b)/(a)". Similarly, the layer structure in which (a) layer, transition layer, and (b) layer are laminated in this order is also referred to as "(a)/(b)", and (a) layer, transition layer, (b) layer, transition Layer, (a) layer, transition layer, (b) layer, transition layer, and (a) layer are laminated in the order of “(a)/(b)/(a)/(b)/(a) It is also called.
본 발명에서는, 이러한 (a)층과 (b)층이, (a)/(b)의 2층 구성, 혹은 (a)/(b)/(a)의 3층 구성, 또한 바람직하게는, (a)/(b)/(a)/(b)/(a)의 5층 구성, 나아가 7층, 9층 또는 그 이상의 홀수층의 필름으로 해도 좋다. 홀수층의 경우에는 (a)층이 최외층에 위치하도록 배치하는 것이 바람직하다. (b)층에 비교하여 기계 특성이 우수하고 선팽창 계수가 작은 (a)층을 최외층으로 함으로써, 필름 전체의 선팽창 계수를 낮은 측으로 억제할 수 있고, 또한 기계적 강도가 우수한 표층을 부여함으로써, 필름의 핸드링이 향상되고, 또한 내층이 되는 (b)층 폴리이미드가 우수한 광학 특성을 최대한 인출할 수 있다. (b)층은 (a)층보다 두꺼운 것이 바람직하다. (b)층의 두께와 (a)층의 두께의 비율은, (b)층/(a)층=1 초과인 것이 바람직하고, 보다 바람직하게는 1.5 이상이고, 더욱 바람직하게는 2 이상이다. 또한, 20 이하인 것이 바람직하고, 보다 바람직하게는 15 이하이며, 더욱 바람직하게는 12 이하이다. In the present invention, the (a) layer and the (b) layer have a two-layer structure of (a) / (b) or a three-layer structure of (a) / (b) / (a), and preferably, (a) / (b) / (a) / (b) / (a) may be a five-layer structure, furthermore, it is good also as a film of 7 layers, 9 layers or more odd-numbered layers. In the case of odd-numbered layers, it is preferable to arrange the (a) layer to be located in the outermost layer. Compared to the layer (b), by making the (a) layer superior in mechanical properties and having a small linear expansion coefficient as the outermost layer, the linear expansion coefficient of the entire film can be suppressed to the low side, and by providing a surface layer excellent in mechanical strength, the film Handling is improved, and the optical properties excellent in the (b) layer polyimide serving as the inner layer can be brought out to the maximum extent. The layer (b) is preferably thicker than the layer (a). The ratio of the thickness of the (b) layer to the thickness of the (a) layer is preferably greater than (b) layer/(a) layer = 1, more preferably 1.5 or more, still more preferably 2 or more. Moreover, it is preferably 20 or less, more preferably 15 or less, still more preferably 12 or less.
본 발명에서는 (a)층의 두께가, (a)층이 복수층인 경우에는 이들의 두께의 합계가, 필름 총 두께의 34% 이하인 것이 바람직하고, 26% 이하가 더욱 바람직하고, 13% 이하가 더욱 바람직하고, 더욱 바람직하게는 7% 이하가 되도록 구성하는 것이 바람직하다. (a)층의 두께는 필름 총 두께의 1% 이상, 바람직하게는 2% 이상, 더욱 바람직하게는 4% 이상이다. (a)층의 두께를 이 범위 내로 하는 것에 의해, (a)층이 갖는 기계 특성과 (b)층이 갖는 광학 특성이 균형을 이룬 필름을 얻을 수 있다. In the present invention, the thickness of the (a) layer, when the (a) layer is a plurality of layers, the sum of these thicknesses is preferably 34% or less of the total film thickness, more preferably 26% or less, and 13% or less It is more preferable, and it is preferable to configure so that it is more preferably 7% or less. The thickness of layer (a) is 1% or more, preferably 2% or more, more preferably 4% or more of the total film thickness. By setting the thickness of the layer (a) within this range, a film in which the mechanical properties of the layer (a) and the optical properties of the layer (b) are balanced can be obtained.
또, (a)층, (b)층의 두께를 나타내는 경우에는, 천이층의 두께 방향의 중심으로부터 (a)층측은 (a)층에, (b)층측은 (b)층에 포함시키는 것으로 한다. In the case of indicating the thickness of the (a) layer and the (b) layer, the (a) layer side from the center in the thickness direction of the transition layer is included in the (a) layer, and the (b) layer side is included in the (b) layer. do.
본 발명에서는, (a)층과 (b)층의 사이에, (a)층의 폴리이미드로부터 (b)층의 폴리이미드로 조성이 연속적으로 변화되는 천이층(혼합층)이 존재한다. 천이층의 두께의 하한은 필름 총 두께의 3%, 또는 1 μm 중 어느 하나이며, 천이층의 두께의 상한은 필름 총 두께의 10%, 또는 3 μm 중 어느 하나인 것이 바람직하다. 하한의 바람직한 범위로는, 필름 총 두께의 3% 초과, 또는 1.1 μm 중 어느 하나이며, 보다 바람직하게는 필름 총 두께의 3.2%, 또는 1.2 μm 중 어느 하나이며, 필름 총 두께의 3.5%, 또는 1.5 μm 중 어느 하나인 것이 더욱 바람직하다. 또한, 상한의 바람직한 범위로는, 필름 총 두께의 9%, 또는 2.8 μm 중 어느 하나이며, 필름 총 두께의 8%, 또는 2.6 μm 중 어느 하나인 것이 보다 바람직하다. 천이층을 상기 범위 내로 함으로써 투명성과 기계적 강도를 양립시킬 수 있다. In the present invention, between the (a) layer and the (b) layer, there is a transition layer (mixed layer) whose composition continuously changes from the polyimide of the (a) layer to the polyimide of the (b) layer. The lower limit of the thickness of the transition layer is preferably either 3% of the total thickness of the film or 1 μm, and the upper limit of the thickness of the transition layer is preferably either 10% of the total thickness of the film or 3 μm. A preferred range of the lower limit is either greater than 3% of the total film thickness or 1.1 μm, more preferably either 3.2% or 1.2 μm of the total film thickness, 3.5% of the total film thickness, or It is more preferable that it is either 1.5 μm. In addition, as a preferred range of the upper limit, it is either 9% of the total thickness of the film or 2.8 µm, and more preferably 8% of the total thickness of the film or 2.6 µm. By setting the transition layer within the above range, both transparency and mechanical strength can be achieved.
또, 천이층의 두께란 (a)층의 폴리이미드와 (b)층의 폴리이미드가 혼합되어 조성이 한쪽으로부터 다른 한쪽으로 경사져 가는 영역의 두께이며, 혼합층의 (a)층의 폴리이미드/(b)층의 폴리이미드의 구성비(질량비)가 5/95∼95/5인 범위를 말한다. 천이층의 두께는, 필름을 두께 방향으로 비스듬히 절단하여, 폴리이미드의 조성 분포를 보는 것에 의해 측정할 수 있다. In addition, the thickness of the transition layer is the thickness of the region where the polyimide of the (a) layer and the polyimide of the (b) layer are mixed and the composition is inclined from one side to the other, and the polyimide of the (a) layer of the mixed layer / ( b) refers to a range in which the composition ratio (mass ratio) of polyimide in the layer is 5/95 to 95/5. The thickness of the transition layer can be measured by cutting the film obliquely in the thickness direction and observing the composition distribution of the polyimide.
천이층의 두께는, 다층 폴리이미드 필름이 2층의 적층 구성인 경우는, 층과 층 사이(계면)가 1개소이기 때문에, 그 계면에 존재하는 천이층의 두께와 필름의 총 두께로부터 구할 수 있다. 다층 폴리이미드 필름이 3층의 적층 구성인 경우는 층과 층 사이(계면)가 2개소가 되기 때문에, 각각의 천이층의 두께의 합계량과 필름의 총 두께로부터 구할 수 있다. 다층 폴리이미드 필름이 4층 이상의 적층 구성인 경우도 마찬가지로, 모든 천이층의 두께의 합계량과, 필름의 총 두께로부터 구할 수 있다. The thickness of the transition layer can be obtained from the thickness of the transition layer present at the interface and the total thickness of the film, since there is only one layer (interface) between layers when the multilayer polyimide film has a laminated structure of two layers. there is. When the multilayer polyimide film has a laminated structure of three layers, since there are two places between layers (interfaces), it can be obtained from the total thickness of each transition layer and the total thickness of the film. Similarly, when the multilayer polyimide film has a laminated structure of four or more layers, it can be obtained from the total thickness of all the transition layers and the total thickness of the film.
본 발명에서의 (a)층에 이용되는 폴리이미드는, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 10 이하이며, 전광선 투과율이 85% 이상인 폴리이미드인 것이 바람직하다. 또한 (a)층에 이용되는 폴리이미드는 CTE가 25 ppm/K 이하, 나아가 20 ppm/K 이하인 것이 바람직하고, 인장 파단 강도가 100 MPa 이상, 나아가 120 MPa 이상인 것이 바람직하고, 파단 신도가 10% 이상, 나아가 12% 이상인 것이 바람직하다. The polyimide used in the (a) layer in the present invention is preferably a polyimide having a yellow index of 10 or less and a total light transmittance of 85% or more when used alone as a film having a thickness of 25±2 μm. Further, the polyimide used in the (a) layer preferably has a CTE of 25 ppm/K or less, more preferably 20 ppm/K or less, has a tensile breaking strength of 100 MPa or more, preferably 120 MPa or more, and has a breaking elongation of 10%. It is more preferable that it is more than 12% further.
이러한 (a)층의 바람직한 폴리이미드로서, 지환족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 분자 내에 아미드 결합을 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드를 예시할 수 있다. As a preferred polyimide for the layer (a), condensation polymerization of tetracarboxylic acid anhydride containing 70% by mass or more of alicyclic tetracarboxylic acid anhydride and diamine containing 70% by mass or more of diamine having an amide bond in the molecule A polyimide containing a chemical structure obtained by can be exemplified.
또한 (a)층에 이용되는 폴리이미드로서, 지환족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드를 예시할 수 있다. Further, as the polyimide used in the layer (a), tetracarboxylic acid anhydride containing 70 mass% or more of alicyclic tetracarboxylic acid anhydride and diamine containing 70 mass% or more of diamine having a trifluoromethyl group in the molecule A polyimide containing a chemical structure obtained by condensation polymerization of can be exemplified.
모든 (a)층용 폴리이미드가 지환족 테트라카르복실산무수물을 사용할 수 있다. 지환족 테트라카르복실산무수물의 함유량은, 전체 테트라카르복실산무수물의 70 질량% 이상이 바람직하고, 보다 바람직하게는 80 질량% 이상이고, 더욱 바람직하게는 90 질량% 이상이고, 더욱 더 바람직하게는 95 질량% 이상이다. 지환족 테트라카르복실산의 함유량을 소정 범위 내로 하는 것에 의해 착색이 억제된다. All polyimides for layers (a) can use alicyclic tetracarboxylic acid anhydrides. The content of the alicyclic tetracarboxylic acid anhydride is preferably 70% by mass or more, more preferably 80% by mass or more, still more preferably 90% by mass or more, and still more preferably is 95 mass% or more. Coloring is suppressed by carrying out content of an alicyclic tetracarboxylic acid in a predetermined range.
분자 내에 아미드 결합을 갖는 디아민으로는, 4-아미노-N-(4-아미노페닐)벤즈아미드가 바람직하다. 아미드 결합을 갖는 디아민은 전체 디아민 중의 70 질량% 이상이 바람직하고, 80 질량% 이상, 나아가 90 질량% 이상의 사용이 바람직하다. As the diamine having an amide bond in the molecule, 4-amino-N-(4-aminophenyl)benzamide is preferable. As for the diamine which has an amide bond, use of 70 mass % or more of all diamines is preferable, 80 mass % or more, and furthermore, 90 mass % or more is used.
또한, 트리플루오로메틸기를 분자 내에 갖는 디아민으로는, 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐, 1,4-비스(4-아미노-2-트리플루오로메틸페녹시)벤젠, 2,2'-트리플루오로메틸-4,4'-디아미노디페닐에테르가 바람직하다. 이들 분자 내에 불소 원자를 갖는 디아민 화합물, 특히 트리플루오로메틸기를 분자 내에 갖는 디아민을 사용하는 경우에, 그 사용량은, 전체 디아민 중의 70 질량% 이상이 바람직하고, 80 질량% 이상, 나아가 90 질량% 이상의 사용이 바람직하다. In addition, as the diamine having a trifluoromethyl group in the molecule, 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl, 1,4-bis(4-amino-2-trifluoro Methylphenoxy)benzene and 2,2'-trifluoromethyl-4,4'-diaminodiphenyl ether are preferred. When using a diamine compound having a fluorine atom in the molecule, particularly a diamine having a trifluoromethyl group in the molecule, the amount used is preferably 70% by mass or more, 80% by mass or more, and more preferably 90% by mass of the total diamine. Use of the above is preferable.
본 발명에서의 (b)층에 이용되는 폴리이미드는, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 5 이하이며, 전광선 투과율이 90% 이상인 폴리이미드인 것이 바람직하다. The polyimide used in the (b) layer in the present invention is preferably a polyimide having a yellow index of 5 or less and a total light transmittance of 90% or more when used alone as a film having a thickness of 25±2 μm.
이러한 (b)층에 이용되는 폴리이미드로는, 방향족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 적어도 분자 내에 황 원자를 갖는 디아민을 70 질량% 이상 함유하는 디아민으로부터 얻어지는 화학 구조를 포함하는 폴리이미드를 예시할 수 있다. The polyimide used in the (b) layer is selected from tetracarboxylic acid anhydride containing 70 mass% or more of aromatic tetracarboxylic acid anhydride and diamine containing 70 mass% or more of diamine having at least a sulfur atom in the molecule. Polyimide containing the obtained chemical structure can be illustrated.
또한, (b)층에 적합한 폴리이미드로서, 적어도 트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산을 30 질량% 이상 함유하는 테트라카르복실산무수물과, 적어도 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드를 예시할 수 있다. Further, as the polyimide suitable for layer (b), tetracarboxylic acid anhydride containing 30 mass% or more of tetracarboxylic acid containing at least a trifluoromethyl group in a molecule, and diamine having at least a trifluoromethyl group in a molecule A polyimide having a chemical structure obtained by condensation polymerization of a diamine containing 70% by mass or more can be exemplified.
(b)층의 폴리이미드에 바람직하게 이용되는 방향족 테트라카르복실산무수물로는, 4,4'-옥시디프탈산, 피로멜리트산, 3,3',4,4'-비페닐테트라카르복실산이 바람직하다. (b)층의 폴리이미드에 이용되는 방향족 테트라카르복실산이무수물은, (b)층 폴리이미드의 전체 테트라카르복실산의 70 질량% 이상이 바람직하고, 보다 바람직하게는 80 질량% 이상이고, 더욱 바람직하게는 90 질량% 이상이고, 더욱 더 바람직하게는 95 질량% 이상이다. 방향족 테트라카르복실산의 함유량을 소정 범위 내로 하는 것에 의해 내열성이 개선된다. As the aromatic tetracarboxylic acid anhydride preferably used for the polyimide of the layer (b), 4,4'-oxydiphthalic acid, pyromellitic acid, and 3,3',4,4'-biphenyltetracarboxylic acid are selected from the group consisting of: desirable. The aromatic tetracarboxylic dianhydride used in the polyimide of the layer (b) is preferably 70% by mass or more, more preferably 80% by mass or more, of all tetracarboxylic acids in the polyimide of the layer (b). Preferably it is 90 mass % or more, and still more preferably 95 mass % or more. Heat resistance is improved by carrying out content of aromatic tetracarboxylic acid in a predetermined range.
(b)층의 폴리이미드에 이용되는 트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산으로는, 4,4'-(2,2-헥사플루오로이소프로필리덴)디프탈산이무수물이 바람직하다. (b)층의 폴리이미드에 이용되는 트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산은, (b)층 폴리이미드의 전체 테트라카르복실산의 30 질량% 이상이 바람직하고, 보다 바람직하게는 45 질량% 이상이고, 더욱 바람직하게는 60 질량% 이상이고, 더욱 더 바람직하게는 80 질량% 이상이다. 트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산의 함유량을 소정 범위 내로 하는 것에 의해 무색 투명성이 개선된다. As the tetracarboxylic acid containing a trifluoromethyl group in the molecule used in the polyimide of layer (b), 4,4'-(2,2-hexafluoroisopropylidene)diphthalic dianhydride is preferable. . The tetracarboxylic acid containing a trifluoromethyl group used in the polyimide of the layer (b) in the molecule is preferably 30 mass% or more of the total tetracarboxylic acids of the polyimide of the layer (b), more preferably 45 It is mass % or more, More preferably, it is 60 mass % or more, Even more preferably, it is 80 mass % or more. Colorless transparency is improved by making the content of tetracarboxylic acid containing a trifluoromethyl group in a molecule within a predetermined range.
본 발명의 (b)층으로서 바람직하게 이용되는 폴리이미드에 있어서, 바람직하게 이용되는 디아민은 적어도 분자 내에 황 원자를 갖는 디아민, 및/또는 트리플루오로메틸기를 분자 내에 갖는 디아민이다. In the polyimide preferably used as the (b) layer of the present invention, the diamine preferably used is at least a diamine having a sulfur atom in the molecule and/or a diamine having a trifluoromethyl group in the molecule.
분자 내에 황 원자를 갖는 디아민으로는, 3,3'-디아미노디페닐술폰, 3,4'-디아미노디페닐술폰, 4,4'-디아미노디페닐술폰을 이용할 수 있다. 본 발명에서는, 분자 내에 황 원자를 갖는 디아민을 70 질량% 이상, 바람직하게는 80 질량% 이상, 더욱 바람직하게는 90 질량% 이상 함유하는 디아민을 이용함으로써, 방향족 테트라카르복실산무수물과 조합한 경우에도 무색 투명성을 얻을 수 있다. As the diamine having a sulfur atom in the molecule, 3,3'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone, and 4,4'-diaminodiphenylsulfone can be used. In the present invention, when a diamine containing 70% by mass or more, preferably 80% by mass or more, and more preferably 90% by mass or more of diamine having a sulfur atom in the molecule is used, and combined with an aromatic tetracarboxylic acid anhydride Even colorless transparency can be obtained.
트리플루오로메틸기를 갖는 디아민으로는, 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐, 1,4-비스(4-아미노-2-트리플루오로메틸페녹시)벤젠, 2,2'-트리플루오로메틸-4,4'-디아미노디페닐에테르가 바람직하다. As the diamine having a trifluoromethyl group, 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl, 1,4-bis(4-amino-2-trifluoromethylphenoxy) Benzene and 2,2'-trifluoromethyl-4,4'-diaminodiphenyl ether are preferred.
이들 분자 내에 불소 원자를 갖는 디아민 화합물, 특히 트리플루오로메틸기를 분자 내에 갖는 디아민을 사용하는 경우에 사용량은, 전체 디아민 중의 70 질량% 이상이 바람직하고, 80 질량% 이상, 나아가 90 질량% 이상의 사용이 바람직하다. In the case of using a diamine compound having a fluorine atom in the molecule, particularly a diamine having a trifluoromethyl group in the molecule, the amount used is preferably 70% by mass or more, 80% by mass or more, and more preferably 90% by mass or more of the total diamine. this is preferable
본 발명에서의 (a)층의 폴리이미드, (b)층의 폴리이미드는, 단독으로 두께 25±2 μm의 필름으로 했을 때의 옐로우 인덱스와 전광선 투과율, 기계 특성 등에 의해 특징지어진다. 여기에 단독으로 두께 25±2 μm의 필름으로 하는 조작은, 실험실에서 가능한 스케일의 평가이며, 상기 폴리이미드의 용액 내지 폴리이미드 전구체의 용액을, 10 cm 사방, 바람직하게는 20 cm 사방 이상의 사이즈의 유리판에 도포하고, 우선 120℃까지의 온도로 예비 가열하여 잔용제량이 도포막의 40 질량% 이하가 될 때까지 예비 가열·건조하고, 또한 질소 등의 불활성 기체 중에서 300℃로 20분간 가열하여 얻어진 필름을 평가하여 얻어지는 수치이다. 물성을 조정하기 위해 윤활제, 필러 등의 무기 성분을 함유하는 경우는 이들을 포함한 상태의 용액을 이용하여 얻어진 필름의 물성 수치를 이용한다. The polyimide of the layer (a) and the polyimide of the layer (b) in the present invention are characterized by yellow index, total light transmittance, mechanical properties, etc. when used alone as a film having a thickness of 25 ± 2 μm. Here, the operation of making a film with a thickness of 25 ± 2 μm alone is an evaluation of the scale possible in the laboratory, and the polyimide solution or the polyimide precursor solution is 10 cm square, preferably 20 cm square or larger. A film obtained by coating on a glass plate, first preheating at a temperature of up to 120°C, preheating and drying until the amount of residual solvent is 40% by mass or less of the coating film, and further heating at 300°C for 20 minutes in an inert gas such as nitrogen. It is a number obtained by evaluating . In the case of containing inorganic components such as lubricants and fillers to adjust the physical properties, the values of the physical properties of the film obtained by using a solution containing these are used.
본 발명에서의 (a)층의 폴리이미드, (b)층의 폴리이미드에는, 각각 윤활제(필러)를 함유할 수 있다. 윤활제로는, 무기 필러이어도 좋고 유기 필러이어도 좋지만, 무기 필러인 것이 바람직하다. 윤활제로는, 특별히 한정되지 않고, 실리카, 카본, 세라믹 등을 들 수 있고, 그 중에서도 실리카인 것이 바람직하다. 이들 윤활제를 단독으로 사용해도 좋고, 2종류 이상을 병용해도 좋다. 윤활제의 평균 입자 직경은 10 nm 이상인 것이 바람직하고, 보다 바람직하게는 30 nm 이상이고, 더욱 바람직하게는 50 nm 이상이다. 또한, 1 μm 이하인 것이 바람직하고, 보다 바람직하게는 500 nm 이하이며, 더욱 바람직하게는 100 nm 이하이다. (a)층의 폴리이미드, (b)층의 폴리이미드에서의 윤활제의 함유량은, 0.01 질량% 이상인 것이 바람직하다. 폴리이미드 필름의 평활성이 양호해지기 때문에, 보다 바람직하게는 0.02 질량% 이상이고, 더욱 바람직하게는 0.05 질량% 이상이고, 특히 바람직하게는 0.1 질량% 이상이다. 또한, 투명성의 관점에서는, 30 질량% 이하인 것이 바람직하고, 보다 바람직하게는 20 질량% 이하이며, 더욱 바람직하게는 10 질량% 이하이며, 특히 바람직하게는 5 질량% 이하이다. The polyimide of the (a) layer and the polyimide of the (b) layer in the present invention may each contain a lubricant (filler). The lubricant may be an inorganic filler or an organic filler, but an inorganic filler is preferable. It does not specifically limit as a lubricant, Silica, carbon, ceramics, etc. are mentioned, Among them, silica is preferable. These lubricants may be used alone or in combination of two or more. The average particle diameter of the lubricant is preferably 10 nm or more, more preferably 30 nm or more, still more preferably 50 nm or more. Further, it is preferably 1 μm or less, more preferably 500 nm or less, and still more preferably 100 nm or less. It is preferable that content of the lubricant in the polyimide of (a) layer and the polyimide of (b) layer is 0.01 mass % or more. Since the smoothness of the polyimide film becomes good, it is more preferably 0.02% by mass or more, still more preferably 0.05% by mass or more, and particularly preferably 0.1% by mass or more. Further, from the viewpoint of transparency, it is preferably 30% by mass or less, more preferably 20% by mass or less, still more preferably 10% by mass or less, and particularly preferably 5% by mass or less.
이하에 본 발명의 다층 폴리이미드 필름을 얻기 위한 제조 방법에 관해 설명한다. 본 발명의 다층 폴리이미드 필름 중 2층 구성의 폴리이미드 필름은, A manufacturing method for obtaining the multilayer polyimide film of the present invention is described below. Among the multilayer polyimide films of the present invention, the two-layered polyimide film,
바람직하게는, 온도가 10℃ 이상 40℃ 이하, 습도가 10% 이상 55% 이하인 대기중 또는 불활성 기체 중에서, Preferably, in the air or inert gas with a temperature of 10 ° C. or more and 40 ° C. or less, and a humidity of 10% or more and 55% or less,
1 : (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 가지지체에 도포하여, 도포막 a1을 얻는 공정, 1: (a) Step of applying a polyimide solution or polyimide precursor solution for layer formation to a temporary support to obtain a coated film a1;
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정, 2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
3 : 전층을 가열하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 적층체를 얻는 공정, 3: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
을 거쳐 제작할 수 있다. can be produced through
상기 가지지체는 길이가 길고 플렉시블한 것이 바람직하다. 또한, 3의 공정에서의 가열 시간은 5분 이상 60분 이하인 것이 바람직하다. 또, 3의 공정에서의 전층 기준의 잔용제량은 도포막 ab1만의 질량으로부터 구하는 것으로 하고, 가지지체의 질량은 포함시키지 않는 것으로 한다. 또한, 2의 공정에서의 100초의 기산점은, (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액의 가지지체에 대한 도포 완료후이다. 이하의 조작에서도 동일하게 한다. The temporary support is preferably long and flexible. In addition, it is preferable that the heating time in step 3 is 5 minutes or more and 60 minutes or less. In addition, the amount of residual solvent on the basis of the entire layer in the step 3 is determined from the mass of the coating film ab1 alone, and the mass of the temporary support is not included. In addition, the starting point of 100 seconds in step 2 is after the completion of application of the polyimide solution or polyimide precursor solution to the temporary support for layer (a) formation. The following operation is also performed in the same way.
또한, 3의 공정을 2단계로 나눠, In addition, the process of 3 is divided into two stages,
3' : 전층 기준의 잔용제량이 8 질량% 이상 40 질량%가 될 때까지, 5분 이상 45분 이하의 시간을 들여 가열한 후에 가지지체로부터 박리하여, 자기 지지성이 있는 필름을 얻는 공정, 3': step of obtaining a self-supporting film by peeling from the temporary support after heating over a period of 5 minutes to 45 minutes until the amount of residual solvents based on the entire layer is 8% by mass or more and 40% by mass,
4 : 상기 자기 지지성이 있는 필름의 양쪽 단부를 파지하고, 또한 전층 기준의 잔용제량이 0.5 질량% 이하가 될 때까지 가열하는 공정, 4: A step of gripping both ends of the self-supporting film and heating until the amount of residual solvent based on the entire layer is 0.5% by mass or less;
으로 해도 좋다. 자기 지지성이 있는 필름의 단계에서 가지지체로부터 박리하는 것에 의해, 건조 및 화학 반응에 의해 생성되는 부생물을 신속하게 필름으로부터 배출하는 것이 가능해지고, 또한 표리의 물성차, 구조차를 작게 할 수 있다. can be done with By peeling off the temporary support at the stage of the self-supporting film, by-products generated by drying and chemical reactions can be quickly discharged from the film, and the difference in physical properties and structure between the front and back can be reduced. there is.
또한, 3층 이상의 필름으로 하는 경우에는, 상기 1 및 2의 후에 한번 더 (a)층 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포하면 되고, (a)층, (b)층을 더욱 반복하여 도포함으로써 더욱 다층의 필름을 얻을 수 있다. In addition, in the case of a film having three or more layers, the (a) layer polyimide solution or polyimide precursor solution may be applied once again after the above steps 1 and 2, and the (a) layer and (b) layer are further repeatedly applied. By doing so, a further multi-layered film can be obtained.
본 발명에서는, 폴리이미드 용액 또는 폴리이미드 전구체 용액의 도포를, 온도가 10℃ 이상 40℃ 이하, 바람직하게는 15℃ 이상 35℃ 이하, 습도가 10%RH 이상 55%RH 이하, 바람직하게는 20%RH 이상 50%RH의 대기중 또는 불활성 기체 중에서, 길이가 길고 플렉시블한 가지지체 상에 행하는 것이 바람직하다. 또한, 하나의 공정전의 층을 도포한 후에 100초 이내, 바람직하게는 50초 이내, 더욱 바람직하게는 25초 이내에 다음 층을 도포하는 것이 바람직하다. 다음 층을 도포하기까지의 시간은 빠른 편이 바람직하기 때문에 하한은 특별히 한정되지 않지만, 공업적으로는 1초 이상이면 되고, 2초 이상이어도 지장없다. 도포 방법으로는, 최초로 도포되는 층은, 콤마코터, 바코터, 슬릿코터 등을 이용하여 도포 가능하고, 2층째 이후는 다이코터, 커튼코터, 스프레이코터 등으로 도포할 수 있다. 또한 다층 다이를 이용하는 것에 의해, 이들 복수의 층을 사실상 동시에 도포하는 것도 가능하다. In the present invention, the application of the polyimide solution or the polyimide precursor solution is carried out at a temperature of 10° C. or more and 40° C. or less, preferably 15° C. or more and 35° C. or less, and a humidity of 10%RH or more and 55% RH or less, preferably 20° C. or more. It is preferable to carry out on a long flexible temporary support in the atmosphere of %RH or more 50%RH or in an inert gas. Further, it is preferable to apply the next layer within 100 seconds, preferably within 50 seconds, and more preferably within 25 seconds after applying the layer before one process. The lower limit is not particularly limited, as the time until application of the next layer is preferably earlier, but industrially it may be 1 second or longer, and 2 seconds or longer may be sufficient. As the coating method, the layer to be applied first can be applied using a comma coater, bar coater, slit coater, etc., and the second and subsequent layers can be applied using a die coater, curtain coater, spray coater, or the like. Further, by using a multi-layer die, it is also possible to apply these plural layers substantially simultaneously.
용액을 도포하는 환경은 대기중 내지 불활성 기체 중인 것이 바람직하다. 불활성 기체란, 실질적으로는 산소 농도가 낮은 기체로 해석할 수 있고, 경제적인 관점에서 질소 내지 이산화탄소를 이용하면 된다. The environment in which the solution is applied is preferably atmospheric air or inert gas. An inert gas can be substantially interpreted as a gas with a low oxygen concentration, and nitrogen or carbon dioxide may be used from an economic point of view.
도포 환경에서의 온도는, 도포액의 점성에 영향을 미치며, 2종의 도포액이 중첩될 때에 계면에서 2종의 도포액이 서로 혼합되어 천이층을 형성할 때의 천이층 두께의 형성에 영향을 미친다. 본 발명의 폴리이미드 용액 내지 폴리이미드 전구체 용액의 점도는, 특히 2층째 이후의 비접촉식의 도포법에서 적절한 점도 범위로 조정되는 것이 바람직하고, 이러한 온도 영역이 2층 계면의 혼합에서도 상기 점도 범위의 유동성을 적절하게 유지하는 것에 기여한다. The temperature in the coating environment affects the viscosity of the coating liquid and affects the formation of the thickness of the transition layer when the two coating liquids are mixed with each other at the interface when the two coating liquids are overlapped to form a transition layer. crazy The viscosity of the polyimide solution or polyimide precursor solution of the present invention is preferably adjusted to an appropriate viscosity range, especially in the non-contact coating method of the second layer and thereafter, and the fluidity within the above viscosity range even when this temperature range is mixed at the interface of the two layers. contributes to maintaining the appropriate
폴리이미드 용액 내지 폴리이미드 전구체 용액에 사용되는 용제의 대부분은 흡습성이 있고, 용제가 흡습하여 용제의 함수율이 올라가면 수지 성분의 용해도가 내려가고, 용해 성분이 용액 중에 석출되어, 용액 점도의 급격한 상승이 생기는 경우가 있다. 도포된 후에 이러한 상황이 생기면, 적절한 두께의 천이층 형성이 저해된다. 습도를 소정 범위 내로 하는 것에 의해, 100초 이내 정도의 시간이면, 이러한 용해 성분의 석출을 충분히 방지하는 것이 가능하다. Most of the solvents used in the polyimide solution or the polyimide precursor solution are hygroscopic, and when the solvent absorbs moisture and the moisture content of the solvent increases, the solubility of the resin component decreases, and the dissolved component precipitates in the solution, resulting in a rapid increase in solution viscosity. may occur. If this situation occurs after application, formation of a transitional layer of appropriate thickness is hindered. By setting the humidity within a predetermined range, it is possible to sufficiently prevent the precipitation of such soluble components in a time of about 100 seconds or less.
본 발명에서 이용되는 가지지체 상으로는, 유리, 금속판, 금속 벨트, 금속 드럼, 고분자 필름, 금속박 등을 이용할 수 있다. 본 발명에서는 길이가 길고 플렉시블한 가지지체를 이용하는 것이 바람직하고, 폴리에틸렌테레프탈레이트, 폴리에틸렌나프탈레이트, 폴리이미드 등의 필름을 가지지체로서 이용할 수 있다. 가지지체 표면에 이형 처리를 하는 것은 바람직한 양태의 하나이다. As the temporary support used in the present invention, glass, metal plate, metal belt, metal drum, polymer film, metal foil and the like can be used. In the present invention, it is preferable to use a long and flexible temporary support, and films such as polyethylene terephthalate, polyethylene naphthalate, and polyimide can be used as the temporary support. It is one of the preferable aspects to give release treatment to the surface of a temporary support body.
본 발명에서는, 모든 층이 도포된 후, 가열 처리에 의해 건조 및 필요에 따라서 화학 반응을 행하게 한다. 폴리이미드 용액을 이용한 경우에는, 용매 제거라는 의미에서 단순히 건조시키면 되지만, 폴리이미드 전구체 용액을 이용한 경우에는 건조와, 화학 반응이 모두 필요해진다. 여기에 폴리이미드 전구체란, 바람직하게는 폴리아미드산 내지 폴리이소이미드의 형태이다. 폴리아미드산을 폴리이미드로 전화시키기 위해서는 탈수 축합 반응이 필요하다. 탈수 축합 반응은 가열만으로도 가능하지만, 필요에 따라서 이미드화 촉매를 작용시킬 수도 있다. 폴리이소이미드의 경우에도 가열에 의해 이소이미드 결합으로부터 이미드 결합으로 전화시킬 수 있다. 또한 적절한 촉매를 병용하는 것도 가능하다. In the present invention, after all the layers are applied, they are dried by heat treatment and subjected to a chemical reaction as needed. In the case of using a polyimide solution, it is sufficient to simply dry in the sense of solvent removal, but in the case of using a polyimide precursor solution, both drying and chemical reaction are required. The polyimide precursor here is preferably in the form of polyamic acid or polyisoimide. A dehydration condensation reaction is required to convert polyamic acid to polyimide. The dehydration condensation reaction is possible only by heating, but an imidation catalyst may be applied as needed. Even in the case of polyisoimide, it is possible to convert an isoimide bond into an imide bond by heating. It is also possible to use an appropriate catalyst in combination.
최종적인 필름의 잔용제량은, 필름 전층의 평균치로서 잔용제량이 0.5 질량% 이하, 바람직하게는 0.2 질량% 이하, 더욱 바람직하게는 0.08 질량% 이하이다. 가열 시간은, 5분 이상 60분 이하, 바람직하게는 6분 이상 50분 이하, 더욱 바람직하게는 7분 이상 30분 이하의 시간이 바람직하다. 가열 시간을 소정 범위 내로 하는 것에 의해, 용매의 제거, 필요한 화학 반응을 완결할 수 있음과 더불어, 적절한 두께로 천이층을 제어할 수 있고, 또한 무색 투명성, 기계 특성, 특히 파단 신도를 높게 유지할 수 있다. 가열 시간이 짧은 경우에는 천이층의 형성이 지연되고, 또한 가열 시간이 필요 이상으로 길면 필름 착색이 강해지고 필름의 파단 신도가 저하되는 경우가 있다. The residual solvent amount of the final film is 0.5% by mass or less, preferably 0.2% by mass or less, and more preferably 0.08% by mass or less, as an average value of all layers of the film. The heating time is preferably 5 minutes or more and 60 minutes or less, preferably 6 minutes or more and 50 minutes or less, and more preferably 7 minutes or more and 30 minutes or less. By setting the heating time within a predetermined range, the removal of the solvent and the required chemical reaction can be completed, the transition layer can be controlled to an appropriate thickness, and colorless transparency and mechanical properties, especially the elongation at break, can be maintained high. there is. When the heating time is short, the formation of the transition layer is delayed, and when the heating time is longer than necessary, the color of the film becomes stronger and the elongation at break of the film may decrease.
본 발명에서는, 도포된 용액이 가열에 의해 건조 내지 화학 반응을 일으켜 자기 지지성으로 가지지체로부터 박리 가능하면, 가열 공정의 도중에 가지지체로부터 박리해도 좋다. In the present invention, if the applied solution causes drying or chemical reaction by heating and can be separated from the temporary support in a self-supporting manner, it may be separated from the temporary support in the middle of the heating step.
보다 구체적으로는, 전체 필름층의 평균 잔용제량이 8 질량% 이상 40 질량%의 범위에 도달할 때까지, 5분 이상 45분 이하, 바람직하게는 6분 이상 30분 이하, 더욱 바람직하게는 7분 이상 20분 이하의 시간을 들여 가열한 후에 가지지체로부터 자기 지지성이 있는 필름을 박리하고, 또한 상기 자기 지지성이 있는 필름의 양쪽 단부를 클립 사이에 끼우거나, 혹은 핀으로 찔러서 파지하여, 가열 환경 내를 반송하고, 또한 전층 기준의 잔용제량이 0.5 질량% 이하, 바람직하게는 0.2 질량% 이하, 더욱 바람직하게는 0.08 질량% 이하가 될 때까지 가열하는 것에 의해 다층 폴리이미드 필름을 얻는 공정을 채용할 수 있다. More specifically, 5 minutes or more and 45 minutes or less, preferably 6 minutes or more and 30 minutes or less, still more preferably 7 minutes or more, until the average residual solvent amount of the entire film layer reaches the range of 8% by mass or more and 40% by mass. After heating for a period of 20 minutes or more and 20 minutes or less, the self-supporting film is peeled off from the temporary support, and both ends of the self-supporting film are held between clips or by piercing with pins, A step of obtaining a multilayer polyimide film by conveying in a heating environment and heating until the amount of residual solvent based on the entire layer is 0.5% by mass or less, preferably 0.2% by mass or less, and more preferably 0.08% by mass or less. can be employed.
가열 공정 도중에 가지지체로부터 자기 지지성 필름을 박리하고, 또한 가열을 계속하는 것에 의해, 용매의 증발, 폴리아미드산이 탈수 폐환하여 폴리이미드로 전화할 때에 생기는 물을 필름의 양면으로부터 빠르게 배출할 수 있어, 표리의 물성차가 작은 필름을 얻을 수 있다. By peeling the self-supporting film from the temporary support in the middle of the heating process and continuing the heating, water generated when the solvent is evaporated and the polyamic acid is dehydrated and ring-closed to convert to polyimide can be quickly discharged from both sides of the film. , a film with a small difference in physical properties between the front and back can be obtained.
본 발명에서는, 상기 자기 지지성 필름을 연신해도 좋다. 연신은 필름 길이 방향(MD 방향) 필름의 폭방향(TD)의 어느 하나이어도 좋고, 양쪽이어도 좋다. 필름 길이 방향의 연신은 반송 롤의 속도차 혹은 반송 롤과, 양쪽 단부를 파지한 후의 속도의 차를 사용하여 행할 수 있다. 필름 폭방향의 연신은 파지한 클립 내지 핀 사이를 넓히는 것에 의해 행할 수 있다. 연신과 가열은 동시에 행해도 좋다. 연신 배율은 1.00배∼2.5배의 사이에서 임의로 선택할 수 있다. 본 발명에 있어서, 필름을 다층 구조로 함으로써, 단독으로는 연신하기 어려운 폴리이미드와, 연신 가능한 폴리이미드를 조합하는 것에 의해, 연신하기 어려운, 즉 연신에 의해 파단이 생기기 쉬운 조성에 폴리이미드도 연신이 가능해지고, 기계 물성을 향상시킬 수 있다. In the present invention, the self-supporting film may be stretched. Stretching may be performed in either the film longitudinal direction (MD direction) or in the width direction (TD) of the film. Stretching in the longitudinal direction of the film can be performed using a difference in speed of the conveying roll or a difference in speed after gripping the conveying roll and both end portions. Stretching in the width direction of the film can be performed by widening between the held clips and pins. Stretching and heating may be performed simultaneously. The stretching ratio can be arbitrarily selected from 1.00 times to 2.5 times. In the present invention, by making the film have a multilayer structure, by combining a polyimide that is difficult to stretch alone and a polyimide that can be stretched, the polyimide is also stretched to a composition that is difficult to stretch, that is, easily broken by stretching. This becomes possible, and mechanical properties can be improved.
또 폴리이미드는, 건조 내지 탈수 축합에 의해 필름화 도중에 체적이 작아지기 때문에, 양쪽 단부를 등간격으로 파지하고 있는 상태(연신 배율이 1.00배)라 하더라도 연신 효과가 발현한다. In addition, since the volume of polyimide decreases during film formation due to drying or dehydration condensation, the stretching effect is expressed even in a state where both ends are held at equal intervals (stretch ratio: 1.00 times).
본 발명의 다층 폴리이미드 필름에서의 (a)층, (b)층에는, 윤활제를 폴리이미드 중에 첨가 함유시키거나 하여 층(필름) 표면에 미세한 요철을 부여하여 필름의 슬라이딩성 등을 개선하는 것이 바람직하다. 윤활제는 외층이 되는 (a)층에만 첨가하는 형태가 바람직하다. In the (a) layer and (b) layer of the multilayer polyimide film of the present invention, a lubricant is added to the polyimide to impart fine irregularities to the surface of the layer (film) to improve the sliding properties of the film. desirable. A form in which the lubricant is added only to the (a) layer serving as the outer layer is preferable.
윤활제로는, 무기나 유기의 0.03 μm∼3 μm 정도의 평균 입자 직경을 갖는 미립자를 사용할 수 있고, 구체예로서, 산화티탄, 알루미나, 실리카, 탄산칼슘, 인산칼슘, 인산수소칼슘, 피로인산칼슘, 산화마그네슘, 산화칼슘, 점토광물 등을 들 수 있다. 윤활제의 함유량은 폴리이미드(폴리머) 중, 0.1 질량% 이상인 것이 바람직하고, 보다 바람직하게는 0.4 질량% 이상이다. 또한 50 질량% 이하인 것이 바람직하고, 보다 바람직하게는 30 질량% 이하이다. As the lubricant, inorganic or organic fine particles having an average particle diameter of about 0.03 µm to 3 µm can be used, and specific examples include titanium oxide, alumina, silica, calcium carbonate, calcium phosphate, calcium hydrogen phosphate, and calcium pyrophosphate. , magnesium oxide, calcium oxide, and clay minerals. The content of the lubricant is preferably 0.1% by mass or more, more preferably 0.4% by mass or more, based on the polyimide (polymer). Moreover, it is preferable that it is 50 mass % or less, More preferably, it is 30 mass % or less.
실시예Example
이하, 본 발명에 관해 실시예를 이용하여 상세히 설명하지만, 본 발명은 그 요지를 벗어나지 않는 한, 이하의 실시예에 한정되는 것이 아니다. 또, 제조예, 실시예 중의 각 물성치 등은 이하의 방법으로 측정했다. Hereinafter, the present invention will be described in detail using Examples, but the present invention is not limited to the following Examples unless departing from the gist thereof. In addition, each physical property value in manufacture examples and examples was measured by the following method.
<폴리이미드 필름의 두께 측정> <Measurement of thickness of polyimide film>
마이크로미터(파인류프사 제조, 밀리트론 1245D)를 이용하여 측정했다. It was measured using a micrometer (Militron 1245D, manufactured by Fine Lupe Co., Ltd.).
<인장 탄성률, 인장 강도(파단 강도) 및 파단 신도> <Tensile modulus, tensile strength (strength at break) and elongation at break>
필름을, 도포시의 유동 방향(MD 방향) 및 폭방향(TD 방향)으로 각각 100 mm×10 mm의 스트립형으로 잘라낸 것을 시험편으로 했다. 인장 시험기(시마즈 제작소 제조, 오토그래프(R) 기종명 AG-5000A)를 이용하여, 인장 속도 50 mm/분, 척간 거리 40 mm의 조건으로, MD 방향, TD 방향 각각에 관해, 인장 탄성률, 인장 강도 및 파단 신도를 구하여, MD 방향과 TD 방향의 측정치의 평균치를 구했다. The film was cut into a strip shape of 100 mm x 10 mm in the flow direction (MD direction) and width direction (TD direction) at the time of application, respectively, and was used as a test piece. Using a tensile tester (manufactured by Shimadzu Corporation, Autograph (R) model: AG-5000A), under the conditions of a tensile speed of 50 mm/min and a distance between chucks of 40 mm, tensile modulus and tensile strength in MD and TD directions, respectively. And the elongation at break was calculated|required, and the average value of the measured value of MD direction and TD direction was calculated|required.
<선팽창 계수(CTE)> <Coefficient of linear expansion (CTE)>
필름을, 도포시의 유동 방향(MD 방향) 및 폭방향(TD 방향)에 있어서, 하기 조건으로 신축률을 측정하고, 30℃∼45℃, 45℃∼60℃와 같이 15℃의 간격에서의 신축률/온도를 측정하고, 이 측정을 300℃까지 행하여, 전체 측정치의 평균치를 CTE로서 산출하고, 또한 MD 방향과 TD 방향의 측정치의 평균치를 구했다. In the flow direction (MD direction) and the width direction (TD direction) of the film at the time of application, the expansion rate was measured under the following conditions, and at intervals of 15 ° C., such as 30 ° C. to 45 ° C. and 45 ° C. to 60 ° C. Stretching ratio/temperature was measured, this measurement was carried out up to 300°C, the average value of all measured values was calculated as CTE, and the average value of measured values in the MD and TD directions was also obtained.
기기명; MAC 사이언스사 제조 TMA4000S device name; TMA4000S manufactured by MAC Science
시료 길이; 20 mm sample length; 20mm
시료폭; 2 mm sample width; 2mm
승온 개시 온도; 25℃ heating start temperature; 25℃
승온 종료 온도; 300℃ heating end temperature; 300℃
승온 속도; 5℃/min heating rate; 5℃/min
분위기; 아르곤atmosphere; argon
<천이층 두께> <Transition Layer Thickness>
SAICAS DN-20S형(다이플라 윈테스사)에 의해 필름의 경사 절삭면을 제작하고, 이어서 이 경사 절삭면을 현미 IRCary 620 FTIR(Agilent사)에 의해, 게르마늄 결정(입사각 30°)을 이용한 현미 ATR법으로 스펙트럼을 구하고, (a)층, (b)층 각각의 특징적인 피크의 증감과, 미리 구해 놓은 검량선으로부터 조성의 경사를 질량비 환산으로 구하고, (a)층 조성/(b)층 조성의 비가 5/95 질량비∼95/5 질량비의 범위의 두께를 천이층 두께로서 구했다. The inclined cutting surface of the film is prepared by SAICAS DN-20S type (Difla Wintes Co., Ltd.), and then the inclined cutting surface is processed using brown rice IRCary 620 FTIR (Agilent Co.) using germanium crystal (incidence angle 30 °). The spectrum was obtained by the ATR method, and the increase and decrease of the characteristic peaks of each of the layers (a) and (b) and the gradient of the composition were obtained in terms of mass ratio from the calibration curve obtained in advance, and the composition of (a) layer / composition of (b) layer was obtained. The thickness in the range of the ratio of 5/95 mass ratio to 95/5 mass ratio was obtained as the thickness of the transition layer.
<헤이즈> <Haze>
HAZEMETER(NDH5000, 니폰덴쇼쿠사 제조)를 이용하여 필름의 헤이즈를 측정했다. 광원으로는 D65 램프를 사용했다. 또한, 동일한 측정을 3회 행하여 그 산술 평균치를 채용했다. The haze of the film was measured using HAZEMETER (NDH5000, manufactured by Nippon Denshoku Co., Ltd.). A D65 lamp was used as the light source. In addition, the same measurement was performed three times and the arithmetic average value was adopted.
<전광선 투과율> <Total light transmittance>
HAZEMETER(NDH5000, 니폰덴쇼쿠사 제조)를 이용하여 필름의 전광선 투과율(TT)을 측정했다. 광원으로는 D65 램프를 사용했다. 또한, 동일한 측정을 3회 행하여 그 산술 평균치를 채용했다. The total light transmittance (TT) of the film was measured using HAZEMETER (NDH5000, manufactured by Nippon Denshoku Co., Ltd.). A D65 lamp was used as the light source. In addition, the same measurement was performed three times and the arithmetic average value was adopted.
결과를 표 2∼6에 나타낸다. A result is shown to Tables 2-6.
<옐로우 인덱스> <Yellow Index>
컬러 미터(ZE6000, 니폰덴쇼쿠사 제조) 및 C2 광원을 사용하여, ASTM D1925에 준하여 필름의 3자극값 XYZ값을 측정하고, 하기 식에 의해 황색도 지수(YI)를 산출했다. 또한, 동일한 측정을 3회 행하여 그 산술 평균치를 채용했다. Using a color meter (ZE6000, manufactured by Nippon Denshoku Co., Ltd.) and a C2 light source, the tristimulus values XYZ values of the film were measured according to ASTM D1925, and the yellowness index (YI) was calculated by the following formula. In addition, the same measurement was performed three times and the arithmetic average value was adopted.
YI=100×(1.28X-1.06Z)/YYI=100×(1.28X-1.06Z)/Y
<필름의 휘어짐> <Warling of film>
100 mm×100 mm의 사이즈의 정방형으로 재단한 필름을 시험편으로 하고, 실온에서 평면 상에 시험편을 오목하게 정치하고, 네 모서리의 평면으로부터의 거리(h1rt, h2rt, h3rt, h4rt : 단위 mm)를 측정하여, 그 평균치를 휘어짐량(mm)으로 했다. A film cut into a square with a size of 100 mm × 100 mm is used as a test piece, the test piece is placed concavely on a plane at room temperature, and the distances from the plane at the four corners (h1rt, h2rt, h3rt, h4rt: unit mm) are measured. It was measured, and the average value was set as the amount of warpage (mm).
〔제조예 1 폴리아미드산 용액 A의 제조〕[Production Example 1 Production of polyamic acid solution A]
질소 도입관, 환류관, 교반 막대를 구비한 반응 용기 내를 질소 치환한 후, 22.73 질량부의 4,4'-디아미노벤즈아닐리드(DABAN)를 201.1 질량부의 N,N-디메틸아세트아미드(DMAc)에 용해시키고, 이어서, 19.32 질량부의 1,2,3,4-시클로부탄테트라카르복실산이무수물(CBDA)을 고체인 채로 분할 첨가한 후, 실온에서 24시간 교반했다. 그 후, 173.1 질량부의 DMAc를 가하여 희석하고, NV(고형분) 10 질량%, 환원 점도 3.10 dl/g의 폴리아미드산 용액 A를 얻었다. After purging the inside of the reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod with nitrogen, 22.73 parts by mass of 4,4'-diaminobenzanilide (DABAN) was mixed with 201.1 parts by mass of N,N-dimethylacetamide (DMAc). was dissolved in, and then, 19.32 parts by mass of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) was added separately as a solid, and then stirred at room temperature for 24 hours. Then, 173.1 parts by mass of DMAc was added and diluted to obtain a polyamic acid solution A having an NV (solid content) of 10% by mass and a reduced viscosity of 3.10 dl/g.
〔제조예 2 (a)층 형성용 윤활제가 들어간 폴리아미드산 용액 As의 제조)〕[Production Example 2 (a) Preparation of polyamic acid solution As containing lubricant for layer formation)]
제조예 1에서 얻어진 폴리아미드산 용액 A에, 윤활제로서 콜로이달 실리카를 디메틸아세트아미드에 분산하여 이루어진 분산체(닛산 화학 공업 제조 「스노우텍스(등록상표) DMAC-ST-ZL」)를 실리카(윤활제)가 폴리아미드산 용액 중의 폴리머 고형분 총량으로 1.4 질량%)이 되도록 더 가하여 균일한 폴리아미드산 용액 As를 얻었다. In the polyamic acid solution A obtained in Production Example 1, a dispersion formed by dispersing colloidal silica as a lubricant in dimethylacetamide ("Snowtex (registered trademark) DMAC-ST-ZL" manufactured by Nissan Chemical Industries, Ltd.) was mixed with silica (lubricant) ) was further added so as to be 1.4% by mass in total polymer solid content in the polyamic acid solution) to obtain a uniform polyamic acid solution As.
〔제조예 3 폴리아미드산 용액 B의 제조〕[Production Example 3 Production of polyamic acid solution B]
질소 도입관, 환류관, 교반 막대를 구비한 반응 용기 내를 질소 치환한 후, 32.02 질량부의 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐(TFMB)를, 279.9 질량부의 N,N-디메틸아세트아미드(DMAc)에 용해시키고, 이어서, 9.81 질량부의 1,2,3,4-시클로부탄테트라카르복실산이무수물(CBDA) 및 15.51 질량부의 4,4'-옥시디프탈산이무수물(ODPA)을 각각 고체인 채로 분할 첨가한 후, 실온에서 24시간 교반했다. 그 후, 고형분 17 질량%, 환원 점도 3.60 dl/g의 폴리아미드산 용액 B를 얻었다. After purging the inside of the reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring bar with nitrogen, 32.02 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB) was added to 279.9 Dissolved in N,N-dimethylacetamide (DMAc) by mass, followed by 9.81 parts 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) and 15.51 parts 4,4'-oxydiamine by mass. After dividingly adding phthalic dianhydride (ODPA) as a solid, the mixture was stirred at room temperature for 24 hours. Thereafter, a polyamic acid solution B having a solid content of 17% by mass and a reduced viscosity of 3.60 dl/g was obtained.
〔제조예 4 (a)층 형성용 윤활제가 들어간 폴리아미드산 용액 Bs의 제조)〕[Production Example 4 (a) Preparation of polyamic acid solution Bs containing lubricant for layer formation)]
제조예 3에서 얻어진 폴리아미드산 용액 B에, 윤활제로서 콜로이달 실리카를 디메틸아세트아미드에 분산하여 이루어진 분산체(닛산 화학 공업 제조 「스노우텍스(등록상표) DMAC-ST-ZL」)를 실리카(윤활제)가 폴리아미드산 용액 중의 폴리머 고형분 총량으로 0.45 질량%)이 되도록 가하여 균일한 폴리아미드산 용액 Bs를 얻었다. In the polyamic acid solution B obtained in Production Example 3, a dispersion formed by dispersing colloidal silica as a lubricant in dimethylacetamide ("Snowtex (registered trademark) DMAC-ST-ZL" manufactured by Nissan Chemical Industries, Ltd.) was mixed with silica (lubricant) ) was added so as to be 0.45% by mass in terms of the total polymer solid content in the polyamic acid solution) to obtain a uniform polyamic acid solution Bs.
〔제조예 5 (b)층 형성용 폴리이미드 용액 C의 제조〕[Production Example 5 (b) Production of polyimide solution C for layer formation]
질소 도입관, 딘·스타크 장치 및 환류관, 온도계, 교반 막대를 구비한 반응 용기에 질소 가스를 도입하면서, 32.02 질량부의 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐(TFMB), 230 질량부의 N,N-디메틸아세트아미드(DMAc)를 가하여 완전히 용해시키고, 이어서, 44.42 질량부의 4,4'-(2,2-헥사플루오로이소프로필리덴)디프탈산이무수물(6FDA)을 고체인 채로 분할 첨가한 후, 실온에서 24시간 교반했다. 그 후, 고형분 25 질량%, 환원 엔드 1.10 dl/g의 폴리아미드산 용액 Caa를 얻었다. 2,2'-ditrifluoromethyl-4,4'-diamino ratio of 32.02 parts by mass Phenyl (TFMB), 230 parts by mass of N,N-dimethylacetamide (DMAc) were added to dissolve completely, followed by 44.42 parts by mass of 4,4'-(2,2-hexafluoroisopropylidene)diphthalic dianhydride After dividingly adding (6FDA) as a solid, it stirred at room temperature for 24 hours. Then, a polyamic acid solution Caa having a solid content of 25% by mass and a reduced end of 1.10 dl/g was obtained.
다음에, 얻어진 폴리아미드산 용액 Caa에 DMAc 204 질량부를 가하여 폴리아미드산의 농도가 15 질량%가 되도록 희석한 후, 이미드화 촉진제로서 이소퀴놀린 1.3 질량부를 가했다. 이어서, 폴리아미드산 용액을 교반하면서, 이미드화제로서 무수아세트산 12.25 질량부를 천천히 적하했다. 그 후, 24시간 교반을 계속하고 화학 이미드화 반응을 행하여, 폴리이미드 용액 Cpi를 얻었다. Next, 204 parts by mass of DMAc was added to the obtained polyamic acid solution Caa to dilute the polyamic acid concentration to 15% by mass, and then 1.3 parts by mass of isoquinoline was added as an imidation accelerator. Subsequently, 12.25 parts by mass of acetic anhydride was slowly added dropwise as an imidation agent while stirring the polyamic acid solution. After that, stirring was continued for 24 hours, a chemical imidation reaction was performed, and polyimide solution Cpi was obtained.
다음에, 얻어진 폴리이미드 용액 Cpi 100 질량부를 교반 장치와 교반기를 구비한 반응 용기로 옮기고, 교반하면서 메탄올 150 질량부를 천천히 적하시킨 결과, 분체형의 고체의 석출이 확인되었다. Next, 100 parts by mass of the obtained polyimide solution Cpi was transferred to a reaction vessel equipped with a stirrer and a stirrer, and when 150 parts by mass of methanol was slowly added dropwise while stirring, precipitation of a powdery solid was confirmed.
그 후, 반응 용기의 내용물인 분말을 탈수 여과하고, 또한 메탄올을 이용하여 세정한 후에 50℃에서 24시간 진공 건조한 후, 260℃에서 5시간 더 가열하여, 폴리이미드 분체 Cpd를 얻었다. 얻어진 폴리이미드 분체 20 질량부를 80 질량부의 DMAc에 용해시켜 폴리이미드 용액 C를 얻었다. Thereafter, the powder, which is the content of the reaction vessel, was dehydrated and filtered, washed with methanol, dried under vacuum at 50°C for 24 hours, and then heated at 260°C for 5 hours to obtain polyimide powder Cpd. 20 parts by mass of the obtained polyimide powder was dissolved in 80 parts by mass of DMAc to obtain a polyimide solution C.
〔제조예 6 (b)층 형성용 폴리이미드 용액 D의 제조〕[Production Example 6 (b) Preparation of polyimide solution D for layer formation]
질소 도입관, 딘·스타크 장치 및 환류관, 온도계, 교반 막대를 구비한 반응 용기에 질소 가스를 도입하면서, 120.5 질량부의 4,4'-디아미노디페닐술폰(4,4'-DDS), 51.6 질량부의 3,3'-디아미노디페닐술폰(3,3'-DDS), 500 질량부의 감마부티로락톤(GBL)을 가했다. 계속해서 217.1 질량부의 4,4'-옥시디프탈산이무수물(ODPA), 223 질량부의 GBL, 260 질량부의 톨루엔을 실온에서 가한 후, 내온 160℃까지 승온하고, 160℃에서 1시간 가열 환류하여 이미드화를 행했다. 이미드화 완료후, 180℃까지 승온하고, 톨루엔을 뽑아내면서 반응을 계속했다. 12시간 반응후, 오일바스를 제거하여 실온으로 되돌리고, 고형분이 20 질량% 농도가 되도록 GBL을 가하여, 폴리이미드 용액 D를 얻었다. 120.5 parts by mass of 4,4'-diaminodiphenylsulfone (4,4'-DDS), 51.6 parts by mass of 3,3'-diaminodiphenylsulfone (3,3'-DDS) and 500 parts by mass of gamma butyrolactone (GBL) were added. Subsequently, after adding 217.1 parts by mass of 4,4'-oxydiphthalic dianhydride (ODPA), 223 parts by mass of GBL, and 260 parts by mass of toluene at room temperature, the internal temperature was raised to 160°C, heated to reflux at 160°C for 1 hour, and already did a drawing After completion of the imidation, the temperature was raised to 180°C, and the reaction was continued while extracting toluene. After the reaction for 12 hours, the oil bath was removed, the temperature was returned to room temperature, and GBL was added so that the solid content was 20% by mass to obtain a polyimide solution D.
〔제조예 7 폴리아미드산 용액 E의 제조〕[Production Example 7 Production of polyamic acid solution E]
질소 도입관, 환류관, 교반 막대를 구비한 반응 용기에 질소 분위기하, 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐(TFMB) 161 질량부와 N-메틸-2-피롤리돈 1090 질량부를 혼합 교반하여 용해시킨 후, 1,2,4,5-시클로헥산테트라카르복실산이무수물(CHDA) 112 질량부를 실온에서 고체인 채로 분할 첨가하여, 실온하 12시간 교반했다. 다음으로 공비 용매로서 크실렌 400 질량부를 첨가하여 180℃로 승온하여 3시간 반응을 행하여, 공비되는 생성물을 분리했다. 물의 유출이 끝난 것을 확인하고, 1시간에 걸쳐 190℃로 승온하면서 크실렌을 제거함으로써 폴리아미드산 용액 E를 얻었다. 161 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB) and N-methyl- After mixing and stirring 1090 parts by mass of 2-pyrrolidone to dissolve, 112 parts by mass of 1,2,4,5-cyclohexanetetracarboxylic dianhydride (CHDA) was dividedly added as a solid at room temperature and stirred at room temperature for 12 hours. did. Next, 400 parts by mass of xylene was added as an azeotrope solvent, the temperature was raised to 180° C., reaction was performed for 3 hours, and an azeotropic product was separated. After confirming that the water had flowed out, the polyamic acid solution E was obtained by removing xylene while raising the temperature to 190°C over 1 hour.
〔제조예 8 (a)층 형성용 윤활제가 들어간 폴리아미드산 용액 Es의 제조)〕[Production Example 8 (a) Preparation of polyamic acid solution Es containing lubricant for layer formation)]
제조예 7에서 얻어진 폴리아미드산 용액 E에, 윤활제로서 콜로이달 실리카를 디메틸아세트아미드에 분산하여 이루어진 분산체(닛산 화학 공업 제조 「스노우텍스(등록상표) DMAC-ST-ZL」)를 실리카(윤활제)가 폴리아미드산 용액 중의 폴리머 고형분 총량으로 1.0 질량%)이 되도록 가하여 균일한 폴리아미드산 용액 Es를 얻었다. In the polyamic acid solution E obtained in Production Example 7, a dispersion formed by dispersing colloidal silica as a lubricant in dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd. "Snowtex (registered trademark) DMAC-ST-ZL") was mixed with silica (lubricant) ) was added so that the total polymer solid content in the polyamic acid solution was 1.0% by mass) to obtain a uniform polyamic acid solution Es.
〔제조예 9 (b)층 형성용 필러가 들어간 폴리아미드산 용액 Ef의 제조)〕[Production Example 9 (b) Production of polyamic acid solution Ef containing filler for layer formation)]
제조예 7에서 얻어진 폴리아미드산 용액 E에, 윤활제로서 콜로이달 실리카를 디메틸아세트아미드에 분산하여 이루어진 분산체(닛산 화학 공업 제조 「스노우텍스(등록상표) DMAC-ST-ZL」)를 실리카(윤활제)가 폴리아미드산 용액 중의 폴리머 고형분 총량으로 25 질량%)이 되도록 가하여 필러가 들어간 폴리아미드산 용액 Ef를 얻었다. In the polyamic acid solution E obtained in Production Example 7, a dispersion formed by dispersing colloidal silica as a lubricant in dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd. "Snowtex (registered trademark) DMAC-ST-ZL") was mixed with silica (lubricant) ) was added so that the total polymer solid content in the polyamic acid solution was 25% by mass) to obtain a polyamic acid solution Ef containing a filler.
제조예 1∼9에서 얻어진 폴리이미드 용액, 폴리아미드산 용액(폴리이미드 전구체 용액)을 이하의 방법으로 필름화하여, 광학 특성, 기계 특성을 측정했다. 결과를 표 1에 나타낸다. The polyimide solutions and polyamic acid solutions (polyimide precursor solutions) obtained in Production Examples 1 to 9 were formed into films by the following method, and optical properties and mechanical properties were measured. The results are shown in Table 1.
(단독으로 물성 측정을 위한 필름을 얻는 방법)(How to obtain a film for measuring physical properties alone)
폴리이미드 용액 또는 폴리아미드산 용액을, 한 변 30 cm의 유리판의 중앙부, 대략 20 cm 사방의 영역에 바코터를 이용하여 최종 두께가 25±2 μm이 되도록 도포하고, 드라이 질소를 서서히 흘린 이너트 오븐에서 100℃로 30분간 가열하고, 도포막의 잔용제량이 40 질량% 이하인 것을 확인한 후에, 드라이 질소로 치환한 머플 로에서 300℃로 20분간 가열했다. 이어서 머플 로로부터 꺼내고, 건조 도포막(필름)의 단부를 커터나이프로 일으키고, 신중하게 유리로부터 박리하여 필름을 얻는다. A polyimide solution or polyamic acid solution was applied to the center of a glass plate with a side of 30 cm and an area approximately 20 cm square using a bar coater so that the final thickness was 25 ± 2 μm, and dry nitrogen was gradually flowed. Inert After heating at 100°C for 30 minutes in an oven and confirming that the amount of residual solvent in the coating film was 40 mass% or less, it was heated at 300°C for 20 minutes in a muffle furnace purged with dry nitrogen. Then, it is taken out of the muffle furnace, and the end of the dried coating film (film) is raised with a cutter knife, and it is carefully peeled from the glass to obtain a film.
(실시예 1)(Example 1)
25℃ 45%RH로 공조된 대기중에서, 제조예 2에서 얻은 폴리아미드산 용액 As를, 콤마코터를 이용하여 폴리에틸렌테레프탈레이트제 필름 A4100(도요보 주식회사 제조, 이하 PET 필름으로 약기)의 무활재면 상에 최종 막두께가 5 μm이 되도록 도포하고, 계속해서 10초후에 제조예 5에서 얻은 폴리이미드 용액 C를 폴리아미드산 용액 As의 위에 최종 막두께가 20 μm이 되도록 다이코터에 의해 도포했다. 이것을 110℃에서 10분간 건조시켰다. 건조후에 자기 지지성을 얻은 필름을 지지체로 하여 A4100 필름으로부터 박리하고, 핀을 배치한 핀 시트를 갖는 핀 텐터에 통과시키고, 필름 단부를 핀에 삽입하는 것에 의해 파지하고, 필름이 파단되지 않도록, 그리고 불필요한 이완이 생기지 않도록 핀 시트 간격을 조정하여 반송하고, 200℃에서 3분, 250℃에서 3분, 300℃에서 6분의 조건으로 가열하여, 이미드화 반응을 진행시켰다. 그 후, 2분간 실온까지 냉각시키고, 필름의 양쪽 단부의 평면성이 나쁜 부분을 슬리터로 잘라내고, 롤형으로 감아, 폭 580 mm, 길이 100 m의 필름(실 1)의 롤을 얻었다. In an air-conditioned atmosphere at 25°C and 45% RH, the polyamic acid solution As obtained in Production Example 2 was applied to the non-slip surface of polyethylene terephthalate film A4100 (manufactured by Toyobo Co., Ltd., hereinafter abbreviated as PET film) using a comma coater. was applied so that the final film thickness was 5 μm, and then, 10 seconds later, the polyimide solution C obtained in Production Example 5 was applied on the polyamic acid solution As with a die coater so that the final film thickness was 20 μm. This was dried at 110°C for 10 minutes. After drying, the self-supporting film is peeled from the A4100 film as a support, passed through a pin tenter having a pin sheet on which pins are arranged, and gripped by inserting the end of the film into a pin so that the film does not break, Then, the fin sheet interval was adjusted and conveyed so as not to cause unnecessary slack, and the imidization reaction proceeded by heating under the conditions of 200°C for 3 minutes, 250°C for 3 minutes, and 300°C for 6 minutes. After that, it was cooled to room temperature for 2 minutes, and portions with poor flatness at both ends of the film were cut out with a slitter and wound into a roll to obtain a roll of film (yarn 1) having a width of 580 mm and a length of 100 m.
얻어진 필름(실 1)의 평가 결과를 표 2에 나타낸다. Table 2 shows the evaluation results of the obtained film (yarn 1).
(실시예 2∼4)(Examples 2 to 4)
이하, 표 2에 나타내는 조건 설정에 의해, 필름(실 2)∼(실 4), 비교예 필름(비 1)을 얻었다. 동일하게 평가한 결과를 표 2에 나타낸다. Hereinafter, by setting conditions shown in Table 2, films (yarn 2) to (yarn 4) and comparative film (ratio 1) were obtained. Table 2 shows the results evaluated in the same way.
(비교예 1∼4)(Comparative Examples 1 to 4)
비교예 1로서, 폴리아미드산 용액 As만을 이용하고, 두께 25 μm로 하여 실시예 3과 동일한 조건으로 필름(비 1)을 얻었다. 마찬가지로 폴리이미드 용액 C, 폴리아미드산 용액 Bs만, 폴리이미드 용액 D만을, 각각 이용하여 필름(비 2)∼(비 4)을 얻었다. 각각의 평가 결과를 표 3에 나타낸다. As Comparative Example 1, a film (ratio 1) was obtained under the same conditions as in Example 3 using only the polyamic acid solution As and having a thickness of 25 μm. Similarly, films (ratio 2) to (ratio 4) were obtained using only the polyimide solution C, the polyamic acid solution Bs, and the polyimide solution D, respectively. Each evaluation result is shown in Table 3.
필름(비 1)∼(비 4)의 기계 특성치는, 제조예에서 얻어진 시험편의 수치보다, 높은 파단 강도와 높은 파단 신도를 나타낸다. 이 차는 유리에 도포한 채로 필름화를 행한 제조예 필름에 대하여, 열처리 도중에 가지지체인 PET 필름으로부터 박리하고, 필름 표리로부터 용제 및 반응 생성물을 배출하면서 필름화를 행한 경우의 차를 나타낸다. Mechanical property values of the films (Ratio 1) to (Ratio 4) show higher breaking strength and higher breaking elongation than those of the test pieces obtained in Production Examples. This difference indicates the difference in the case where the production example film, which was filmed while being applied to glass, was separated from the PET film as a temporary support during heat treatment and filmed while discharging the solvent and reaction product from the front and back of the film.
(계산예 1, 2) (Calculation examples 1 and 2)
표 4의 계산예 1란에 나타낸 수치는 필름(비 1)과 (비 2)의 평가 결과의 산술 평균치이다. 또한 계산예 2는 실시예 1∼4에서의 (a)층과 (b)층의 두께비에 의해 가중치를 부여한 평균치이다. The numerical value shown in column 1 of the calculation example of Table 4 is the arithmetic average value of the evaluation result of the film (ratio 1) and (ratio 2). Calculation Example 2 is an average value weighted by the thickness ratio of the (a) layer and (b) layer in Examples 1 to 4.
실시예에서 얻어진 필름의 평가 결과와 계산예를 비교하면, 실시예에서 얻어진 필름은 모두 계산예 1, 계산예 2보다 헤이즈가 낮고, 전광선 투과율도 높다. 또한 옐로우 인덱스도 작은 값을 나타내고, 광학 특성이 개선된 것이 나타났다. 또한, 인장 강도, 파단 신도 모두 실시예가 높은 값으로 되어 있고, 기계 특성에 관해서도 개선된 것을 알 수 있다. Comparing the evaluation results of the films obtained in Examples with calculation examples, all of the films obtained in Examples had a lower haze than Calculation Examples 1 and 2, and had a higher total light transmittance. In addition, the yellow index also showed a small value, and it was shown that the optical properties were improved. In addition, both the tensile strength and the elongation at break were high in the examples, and it was found that the mechanical properties were also improved.
또, 휘어짐에 관해서는, 필름 두께 방향으로 비대칭의 구성으로 되어 있기 때문이다. Moreover, it is because it has become an asymmetric structure in the film thickness direction regarding warpage.
(비교예 5, 6)(Comparative Examples 5 and 6)
계속해서, 표 5에 나타내는 조건에 따라서, 폴리아미드산 용액 As와 폴리이미드 용액 C를 이용하여 필름(비 5)(비 6)을 얻었다. 평가 결과를 표 5에 나타낸다. (a)층 도포로부터 (b)층 도포까지의 시간 간격을 길게 한 비교예 5에서는 헤이즈의 대폭적인 증가가 보였다. 가열까지의 시간이 길어졌기 때문에 용액이 분위기 중의 수분을 흡수하여 도포막 중에서 상분리 구조가 생기고, 그 형태를 남긴 채로 건조가 진행되었기 때문에 백화가 생긴 것으로 추찰된다. 또한, 천이층 두께가 두꺼워졌다. 천이층의 존재는, (a)층과 (b)층이, 견고하게, 그리고 조성이 단계적으로 완만하게 결합하기 위해 필요하지만, 천이층 부분은 (a)층과 (b)층의 혼합 조성이 되는 부분이기 때문에, 이 층이 지나치게 두껍게 발달하면, 다층으로 나눠 기능 분담하고 있는 이점이 사라져 버리는 것을 알 수 있다. Subsequently, according to the conditions shown in Table 5, films (ratio 5) (ratio 6) were obtained using polyamic acid solution As and polyimide solution C. Table 5 shows the evaluation results. In Comparative Example 5 in which the time interval from application of the layer (a) to application of the layer (b) was lengthened, a significant increase in haze was observed. It is presumed that whitening occurred because the solution absorbed moisture in the atmosphere because the time until heating was prolonged, and a phase-separated structure was formed in the coating film, and drying proceeded while leaving that shape. Also, the thickness of the transition layer was increased. The existence of the transition layer is necessary for the (a) layer and the (b) layer to be combined firmly and smoothly in a stepwise composition, but the transition layer portion has a mixed composition of the (a) layer and the (b) layer. Since it is a part to become, it can be seen that if this layer develops too thickly, the advantage of dividing into multiple layers and sharing functions disappears.
비교예 6은 (a)층과 (b)층의 폴리이미드를 교체한 경우이지만, 이 경우에는, 실시예에 보인 상승 효과는 보이지 않고, 광학 특성은 각각의 폴리이미드를 단독으로 필름화한 경우보다 떨어졌다. In Comparative Example 6, the polyimide of the (a) layer and the (b) layer were exchanged, but in this case, the synergistic effect shown in the examples was not observed, and the optical properties were obtained when each polyimide was formed into a film alone. fell than
(실시예 5∼9, 12, 13) [(a)/(b)/(a) 3층 필름의 제조](Examples 5 to 9, 12 and 13) [Preparation of (a)/(b)/(a) three-layer film]
25℃ 45%RH로 공조된 대기중에서, 제조예 2에서 얻은 폴리아미드산 용액 As를, 콤마코터를 이용하여 폴리에틸렌테레프탈레이트제 필름 A4100(도요보 주식회사 제조, 이하 PET 필름으로 약기)의 무활재면 상에 최종 막두께가 3 μm이 되도록 도포하고, 계속해서 30초후에 제조예 5에서 얻은 폴리이미드 용액 C를 폴리아미드산 용액 As의 위에 최종 막두께가 31 μm이 되도록 다이코터에 의해 도포했다. 30초후에, 또 1대의 다이코터를 이용하여 폴리아미드산 용액 As를 최종 막두께가 3 μm이 되도록 더 도포했다. In an air-conditioned atmosphere at 25°C and 45% RH, the polyamic acid solution As obtained in Production Example 2 was applied to the non-slip surface of polyethylene terephthalate film A4100 (manufactured by Toyobo Co., Ltd., hereinafter abbreviated as PET film) using a comma coater. was applied so that the final film thickness was 3 μm, and then, 30 seconds later, the polyimide solution C obtained in Production Example 5 was applied on the polyamic acid solution As with a die coater so that the final film thickness was 31 μm. After 30 seconds, the polyamic acid solution As was further applied using another die coater so that the final film thickness was 3 µm.
이것을 110℃에서 10분간 건조시키고, 건조후에 자기 지지성을 얻은 필름을 지지체로 하여 A4100 필름으로부터 박리하고, 핀을 배치한 핀 시트를 갖는 핀 텐터에 통과시키고, 필름 단부를 핀에 삽입하는 것에 의해 파지하고, 필름이 파단되지 않도록, 또한 불필요한 이완이 생기지 않도록 핀 시트 간격을 조정하여 반송하고, 200℃에서 4분, 250℃에서 4분, 300℃에서 6분의 조건으로 가열하여, 이미드화 반응을 진행시켰다. 그 후, 2분간 실온까지 냉각시키고, 필름의 양쪽 단부의 평면성이 나쁜 부분을 슬리터로 잘라내고, 롤형으로 감아, 폭 580 mm, 길이 80 m의 필름(실 5)의 롤을 얻었다. 얻어진 필름(실 5)의 평가 결과를 표 6에 나타낸다. This is dried at 110 ° C. for 10 minutes, and after drying, the self-supporting film is used as a support, peeled off from the A4100 film, passed through a pin tenter having a pin sheet on which pins are arranged, and the end of the film is inserted into a pin. Gripping, conveying with the fin sheet interval adjusted so that the film does not break or unnecessary slack, and heating under the conditions of 200°C for 4 minutes, 250°C for 4 minutes, and 300°C for 6 minutes, followed by an imidization reaction. proceeded. Thereafter, the film was cooled to room temperature for 2 minutes, and portions with poor flatness at both ends of the film were cut out with a slitter and wound into a roll to obtain a roll of film (yarn 5) having a width of 580 mm and a length of 80 m. Table 6 shows the evaluation results of the obtained film (yarn 5).
이하 마찬가지로, 표 6∼표 7에 따라서, 폴리아미드산 용액, 폴리이미드 용액, 조작 조건을 바꿔 필름(실 6)∼(실 9)을 얻었다. 또한 표 5에 따라서 필름(실 12), (실 13)을 얻었다. 각각의 표에 평가 결과를 나타낸다. Similarly, films (yarn 6) to (yarn 9) were obtained by changing the polyamic acid solution, the polyimide solution, and the operating conditions according to Tables 6 to 7. Further, films (yarn 12) and (yarn 13) were obtained according to Table 5. The evaluation results are shown in each table.
실시예 1∼4와 마찬가지로, 단층으로 제작한 필름보다 특성이 향상된 것이 나타났다. 또한 실시예 1∼4에 비교하여 휘어짐이 대폭으로 작아졌지만, 이것은 두께 방향의 대조성이 좋아졌기 때문이다. As in Examples 1 to 4, it was found that the properties were improved compared to the film produced in a single layer. Moreover, although warpage was significantly reduced compared with Examples 1 to 4, this is because the contrast in the thickness direction was improved.
(계산예 3, 4)(Calculation examples 3 and 4)
표 4의 계산예 3란에 나타낸 수치는 필름(비 3)과 (비 4)의 평가 결과의 산술 평균치이다. 또한 계산예 4는 실시예 8에서의 (a)층과 (b)층의 두께비에 의해 가중치를 부여한 평균치이다. The numerical value shown in column 3 of the calculation example of Table 4 is the arithmetic average value of the evaluation results of the film (ratio 3) and (ratio 4). Calculation Example 4 is an average value weighted by the thickness ratio of (a) layer and (b) layer in Example 8.
실시예 8에서 얻어진 필름의 평가 결과와 계산예를 비교하면, 실시예에서 얻어진 필름은 계산예 3, 계산예 4보다 광학 특성이 개선된 것이 나타났다. 또한 기계 특성에 관해서도 개선이 보였다. Comparing the evaluation result of the film obtained in Example 8 with the calculation example, it was found that the optical properties of the film obtained in Example were improved compared to those of Calculation Examples 3 and 4. Improvements were also seen with respect to mechanical properties.
(비교예 9)(Comparative Example 9)
제조예 9에서 얻어진 필러를 첨가한 폴리아미드산 용액 Ef를 이용하여 단층 50 μm의 필름의 시험 제작을 시도했다. 설정한 조건을 표 7에 나타낸다. 일시 건조후, 자기 지지성이 된 필름을 가지지체의 PET로부터 박리하고, 핀 텐터에 도입했지만, 가열 초기에 필름이 세로 방향으로 파단되었다. 핀폭 조정에 의해 시험을 계속했지만, 건조와 폴리이미드로의 전화 반응이 진행되는 도중에 필름이 매우 취약해져, 물성 평가에 충분한 필름을 얻을 수는 없었다. Trial production of a single-layer 50 μm film was attempted using the polyamic acid solution Ef to which the filler obtained in Production Example 9 was added. Table 7 shows the set conditions. After temporary drying, the self-supporting film was peeled off from the temporary support PET and introduced into a pin tenter, but the film broke in the longitudinal direction at the initial stage of heating. Although the test was continued by adjusting the pin width, the film became very brittle during drying and conversion reaction to polyimide, and a film sufficient for physical property evaluation could not be obtained.
(실시예 10)(Example 10)
필러 첨가를 윤활제만으로 한 폴리아미드산 용액 Es를 (a)층에, 제조예 9에서 얻어진 필러 함유 폴리아미드산 용액 Ef를 (b)층에 이용하여, 표 7에 설정한 조건으로 (a)/(b)/(a) 구성의 필름을 시험 제작했다. 핀폭 조정에 시간이 필요했지만, 최종적으로 폭 480 mm, 길이 50 m의 폴리이미드 필름(실 10)을 얻을 수 있었다. 평가 결과를 표 7에 나타낸다. The polyamic acid solution Es in which the filler was added only as a lubricant was used for the (a) layer, and the filler-containing polyamic acid solution Ef obtained in Production Example 9 was used for the (b) layer, under the conditions set in Table 7 (a)/ (b) / (a) The film of the structure was produced as a trial. It took time to adjust the pin width, but finally a polyimide film (yarn 10) with a width of 480 mm and a length of 50 m was obtained. Table 7 shows the evaluation results.
(실시예 11)(Example 11)
제조예에서 얻어진 폴리아미드산 용액 As 및 폴리이미드 용액 C를 이용하여, 경면 마무리한 후 스테인레스 벨트에 3층 공압출 T형 다이를 이용하여 코팅했다. 다이의 립갭은 스킨층 150 μm, 코어층 500 μm였다. 이후는 표 7에 나타낸 조건에 따라서, 가열을 행하고, 단부를 슬릿으로서 롤형으로 감아, 폭 1100 mm 길이 300 m의 필름(실 11)을 얻었다. 평가 결과를 표 7에 나타낸다. After mirror finish using the polyamic acid solution As and the polyimide solution C obtained in Production Example, the stainless belt was coated using a three-layer coextrusion T-type die. The lip gap of the die was 150 μm for the skin layer and 500 μm for the core layer. Thereafter, heating was performed according to the conditions shown in Table 7, and the end was wound into a roll shape as a slit to obtain a film (yarn 11) having a width of 1100 mm and a length of 300 m. Table 7 shows the evaluation results.
〔제조예 10(윤활제가 들어간 폴리아미드산 용액 Fs의 제조)〕[Production Example 10 (production of polyamic acid solution Fs containing lubricant)]
질소 도입관, 환류관, 교반 막대를 구비한 반응 용기 내를 질소 치환한 후, 33.36 질량부의 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐(TFMB), 336.31 질량부의 N-메틸-2-피롤리돈(NMP)과 윤활제로서 콜로이달 실리카를 디메틸아세트아미드에 분산하여 이루어진 분산체(닛산 화학 공업 제조 「스노우텍스(등록상표) DMAC-ST-ZL」)를 실리카(윤활제)가 폴리아미드산 용액 중의 폴리머 고형분 총량으로 0.3 질량%)이 되도록 가하여 완전히 용해시키고, 이어서, 9.81 질량부의 1,2,3,4-시클로부탄테트라카르복실산이무수물(CBDA), 11.34 질량부의 3,3',4,4'-비페닐테트라카르복실산, 4.85 질량부의 4,4'-옥시디프탈산이무수물(ODPA)을 각각 고체인 채로 분할 첨가한 후, 실온에서 24시간 교반했다. 그 후, 고형분 15 질량%, 환원 점도 3.50 dl/g의 폴리아미드산 용액 Fs(TFMB//CBDA/BPDA/ODPA의 몰비=1.00//0.48/0.37/0.15)를 얻었다. After replacing the inside of the reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring rod with nitrogen, 33.36 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB), 336.31 mass A dispersion formed by dispersing negative N-methyl-2-pyrrolidone (NMP) and colloidal silica as a lubricant in dimethylacetamide (manufactured by Nissan Chemical Industries, Ltd. "Snowtex (registered trademark) DMAC-ST-ZL") is a silica (lubricant) was added so as to be 0.3% by mass in terms of the total polymer solid content in the polyamic acid solution) and completely dissolved, followed by 9.81 parts by mass of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA), 11.34 parts by mass Partial 3,3',4,4'-biphenyltetracarboxylic acid and 4.85 parts by mass of 4,4'-oxydiphthalic dianhydride (ODPA) were separately added as solids, and then stirred at room temperature for 24 hours. . Thereafter, a polyamic acid solution Fs (molar ratio of TFMB//CBDA/BPDA/ODPA = 1.00//0.48/0.37/0.15) having a solid content of 15% by mass and a reduced viscosity of 3.50 dl/g was obtained.
〔제조예 11(무윤활제 폴리아미드산 용액 F의 제조)〕[Production Example 11 (Preparation of lubricant-free polyamic acid solution F)]
질소 도입관, 환류관, 교반 막대를 구비한 반응 용기 내를 질소 치환한 후, 33.36 질량부의 2,2'-디트리플루오로메틸-4,4'-디아미노비페닐(TFMB)에 336.31 질량부의 N-메틸-2-피롤리돈(NMP)을 가하여 완전히 용해시키고, 이어서, 9.81 질량부의 1,2,3,4-시클로부탄테트라카르복실산이무수물(CBDA), 11.34 질량부의 3,3',4,4'-비페닐테트라카르복실산, 4.85 질량부의 4,4'-옥시디프탈산이무수물(ODPA)을 각각 고체인 채로 분할 첨가한 후, 실온에서 24시간 교반했다. 그 후, 고형분 15 질량%, 환원 점도 3.50 dl/g의 폴리아미드산 용액 F(TFMB//CBDA/BPDA/ODPA의 몰비=1.00//0.48/0.37/0.15)를 얻었다. After purging the inside of the reaction vessel equipped with a nitrogen inlet tube, a reflux tube, and a stirring bar with nitrogen, 336.31 parts by mass of 2,2'-ditrifluoromethyl-4,4'-diaminobiphenyl (TFMB) was added to 33.36 parts by mass. parts of N-methyl-2-pyrrolidone (NMP) was added to dissolve completely, followed by 9.81 parts of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA), 11.34 parts of 3,3' by mass. After dividingly adding 4,4'-biphenyltetracarboxylic acid and 4.85 parts by mass of 4,4'-oxydiphthalic dianhydride (ODPA) as solids, the mixture was stirred at room temperature for 24 hours. Then, polyamic acid solution F (molar ratio of TFMB//CBDA/BPDA/ODPA = 1.00//0.48/0.37/0.15) having a solid content of 15% by mass and a reduced viscosity of 3.50 dl/g was obtained.
(실시예 14)(Example 14)
25℃ 45%RH로 공조된 대기중에서, 롤투롤식의 콤마코터와 연속식 건조로를 구비한 장치를 이용하여, 제조예 10에서 얻은 폴리아미드산 용액 Fs를, 가지지체인 PET 필름의 무활재면 상에 최종 막두께가 5 μm이 되도록 도포하고, 계속해서 10초후에 제조예 11에서 얻은 폴리아미드산 용액 F를 폴리아미드산 용액 Fs의 위에 최종 막두께가 20 μm이 되도록 다이코터에 의해 도포했다. 이것을 110℃에서 10분간 건조시켰다. In an air-conditioned atmosphere at 25°C and 45% RH, using an apparatus equipped with a roll-to-roll type comma coater and a continuous drying furnace, the polyamic acid solution Fs obtained in Production Example 10 was finally coated on the non-slip surface of the PET film as a temporary support. It was applied so that the film thickness was 5 μm, and then, 10 seconds later, the polyamic acid solution F obtained in Production Example 11 was applied on the polyamic acid solution Fs by a die coater so that the final film thickness was 20 μm. This was dried at 110°C for 10 minutes.
건조후에 자기 지지성을 얻은 필름을 지지체로 하여 PET 필름으로부터 박리하고, 핀을 배치한 핀 시트를 갖는 핀 텐터에 통과시키고, 필름 단부를 핀에 삽입하는 것에 의해 파지하고, 필름이 파단되지 않도록, 또한 불필요한 이완이 생기지 않도록 핀 시트 간격을 조정하여 반송하고, 최종 가열로서, 200℃에서 3분, 250℃에서 3분, 300℃에서 3분, 400℃에서 3분의 조건으로 가열하여, 이미드화 반응을 진행시켰다. 그 후, 2분간 실온까지 냉각시키고, 필름의 양쪽 단부의 평면성이 나쁜 부분을 슬리터로 잘라내고, 롤형으로 감아, 폭 530 mm, 길이 80 m의 필름(실 14)의 롤을 얻었다. 얻어진 필름(실 14)은 필름 총 두께 25 μm, 헤이즈 0.41%, 전광선 투과율 88.2%, 옐로우 인덱스 4.1, 파단 강도 230 MPa, 파단 신도 13.1%, 탄성률 4.4 GPa, CTE 29 ppm/K, 휘어짐 0.1 mm 이하, 천이층 두께 0.9 μm였다. After drying, the self-supporting film is peeled off from the PET film using the support as a support, passed through a pin tenter having a pin sheet on which pins are arranged, and gripped by inserting the ends of the film into pins so that the film does not break, In addition, the fin sheet interval is adjusted and conveyed so that unnecessary slack does not occur, and as the final heating, heating is performed under conditions of 200°C for 3 minutes, 250°C for 3 minutes, 300°C for 3 minutes, and 400°C for 3 minutes to imidize. reaction proceeded. Thereafter, the film was cooled to room temperature for 2 minutes, and portions with poor flatness at both ends of the film were cut out with a slitter and wound into a roll to obtain a roll of film (yarn 14) having a width of 530 mm and a length of 80 m. The obtained film (yarn 14) had a total film thickness of 25 μm, haze of 0.41%, total light transmittance of 88.2%, yellow index of 4.1, strength at break of 230 MPa, elongation at break of 13.1%, modulus of elasticity of 4.4 GPa, CTE of 29 ppm/K, and warpage of 0.1 mm or less. , the thickness of the transition layer was 0.9 μm.
(실시예 15)(Example 15)
25℃ 45%RH로 공조된 대기중에서, 롤투롤식의 콤마코터와 연속식 건조 로를 구비한 장치를 이용하여, 제조예 10에서 얻은 폴리아미드산 용액 Fs를, 가지지체인 PET 필름의 무활재면 상에 최종 막두께가 3 μm이 되도록 도포하고, 계속해서 10초후에 제조예 11에서 얻은 폴리아미드산 용액 F를 폴리아미드산 용액 Fs의 위에 최종 막두께가 19 μm이 되도록 다이코터에 의해 도포하고, 30초후에 또 1대의 다이코터로 폴리아미드산 용액 Fs를 최종 막두께가 3 μm이 되도록 더 도포하여, 이것을 110℃에서 10분간 건조시켰다. In an air-conditioned atmosphere at 25° C. and 45% RH, using an apparatus equipped with a roll-to-roll type comma coater and a continuous drying furnace, the polyamic acid solution Fs obtained in Production Example 10 was coated on the non-slip surface of a PET film as a temporary support. It was applied so that the final film thickness was 3 μm, and then, 10 seconds later, the polyamic acid solution F obtained in Production Example 11 was applied on top of the polyamic acid solution Fs by a die coater so that the final film thickness was 19 μm. A second later, the polyamic acid solution Fs was further applied with another die coater so that the final film thickness was 3 μm, and this was dried at 110° C. for 10 minutes.
건조후에 자기 지지성을 얻은 필름을 지지체로 하여 PET 필름으로부터 박리하고, 실시예 12와 마찬가지로 핀 텐터를 이용하여 200℃에서 3분, 250℃에서 3분, 300℃에서 3분, 400℃에서 3분의 조건으로 가열하여, 이미드화 반응을 진행시켰다. 이후 동일하게 조작하여, 폭 530 mm, 길이 80 m의 필름(실 15)의 롤을 얻었다. 얻어진 필름(실 15)은 Fs/F/Fs의 3층 구조이며, 필름 총 두께 25 μm, 헤이즈 0.43%, 전광선 투과율 88.1%, 옐로우 인덱스 4.1, 파단 강도 180 MPa, 파단 신도 12.5%, 탄성률 4.2 GPa, CTE 30 ppm/K, 휘어짐 0.1 mm 이하, 천이층 두께(에어면측/베이스면측) 1.2 μm/1.3 μm였다. After drying, the self-supporting film was used as a support and peeled from the PET film, using a pin tenter as in Example 12, at 200 ° C. for 3 minutes, at 250 ° C. for 3 minutes, at 300 ° C. for 3 minutes, at 400 ° C. for 3 minutes. By heating under the condition of 10 minutes, the imidation reaction proceeded. Thereafter, the same operation was performed to obtain a roll of film (yarn 15) having a width of 530 mm and a length of 80 m. The obtained film (yarn 15) has a three-layer structure of Fs/F/Fs, with a total film thickness of 25 μm, haze of 0.43%, total light transmittance of 88.1%, yellow index of 4.1, strength at break of 180 MPa, elongation at break of 12.5%, and modulus of elasticity of 4.2 GPa. , CTE of 30 ppm/K, warpage of 0.1 mm or less, and transition layer thickness (air side/base side) of 1.2 μm/1.3 μm.
(비교예 10)(Comparative Example 10)
25℃ 45%RH로 공조된 대기중에서, 롤투롤식의 콤마코터와 연속식 건조로를 구비한 장치를 이용하여, 제조예 2에서 얻은 폴리아미드산 용액 As를, 가지지체인 PET 필름의 무활재면 상에 최종 막두께가 20 μm이 되도록 도포했다. 이어서 연속식의 건조기에 의해, 1차 가열로서 110℃ 5분간 가열하고, 잔용제량이 28 질량%인 반건조 피막 Agfx를 얻어, 가지지체마다 롤형으로 감았다. In an air-conditioned atmosphere at 25° C. and 45% RH, using an apparatus equipped with a roll-to-roll comma coater and a continuous drying furnace, the polyamic acid solution As obtained in Production Example 2 was finally coated on the non-slip surface of the PET film as a temporary support. It applied so that the film thickness might become 20 micrometers. Next, by heating at 110° C. for 5 minutes as primary heating with a continuous drying machine, a semi-dried coating Agfx having a residual solvent amount of 28% by mass was obtained, and each temporary support was wound into a roll shape.
자기 지지성을 얻은 건조 피막 Agfx를 지지체로서 PET 필름으로부터 박리하고, 핀을 배치한 핀 시트를 갖는 핀 텐터에 통과시키고, 필름 단부를 핀에 삽입하는 것에 의해 파지하고, 필름이 파단되지 않도록, 또한 불필요한 이완이 생기지 않도록 핀 시트 간격을 조정하여 반송하고, 최종 가열로서, 200℃에서 3분, 250℃에서 3분, 300℃에서 6분의 조건으로 가열하여, 이미드화 반응을 진행시켰다. 그 후, 2분간 실온까지 냉각시키고, 필름의 양쪽 단부의 평면성이 나쁜 부분을 슬리터로 잘라내고, 롤형으로 감아, 폭 530 mm, 길이 50 m의 폴리이미드 필름(비 10a)의 롤을 얻었다. The dried film Agfx having self-supporting properties is peeled from the PET film as a support, passed through a pin tenter having a pin sheet on which pins are arranged, and gripped by inserting the ends of the film into pins so that the film does not break. The fin sheet interval was adjusted and conveyed so as not to cause unnecessary slack, and as the final heating, the imidation reaction proceeded by heating under the conditions of 200°C for 3 minutes, 250°C for 3 minutes, and 300°C for 6 minutes. Thereafter, it was cooled to room temperature for 2 minutes, and portions with poor flatness at both ends of the film were cut out with a slitter and wound into a roll to obtain a roll of polyimide film (ratio 10a) having a width of 530 mm and a length of 50 m.
얻어진 폴리이미드 필름(비 10a) 롤을 다시 전술한 장치에 셋팅하고, 폴리이미드 필름(비 10a)을 풀어내어, 그 위에 제조예 5에서 얻은 폴리이미드 용액 C를 최종 막두께가 5 μm이 되도록 콤마코터로 도포했다. 이것을 2차 가열로서 110℃에서 10분간 건조시켰다. The obtained roll of polyimide film (ratio 10a) was again set in the above-described apparatus, the polyimide film (ratio 10a) was unrolled, and polyimide solution C obtained in Production Example 5 was added thereon to a final film thickness of 5 µm. It was applied with a coater. This was dried at 110°C for 10 minutes as secondary heating.
건조후에 핀을 배치한 핀 시트를 갖는 핀 텐터에 통과시키고, 필름 단부를 핀에 삽입하는 것에 의해 파지하고, 필름이 파단되지 않도록, 또한 불필요한 이완이 생기지 않도록 핀 시트 간격을 조정하여 반송하고, 최종 가열로서, 200℃에서 3분, 250℃에서 3분, 300℃에서 6분의 조건으로 가열하여, 이미드화 반응을 진행시켰다. 그 후, 2분간 실온까지 냉각시키고, 필름의 양쪽 단부의 평면성이 나쁜 부분을 슬리터로 잘라내고, 롤형으로 감아, 폭 450 mm, 길이 30 m의 폴리이미드 필름(비 10b)의 롤을 얻었다. After drying, the film is passed through a pin tenter having a pin sheet on which pins are arranged, and the end of the film is inserted into the pin to hold the film. As heating, it heated on conditions of 3 minutes at 200 degreeC, 3 minutes at 250 degreeC, and 6 minutes at 300 degreeC, and imidation reaction was advanced. Thereafter, it was cooled to room temperature for 2 minutes, and portions with poor flatness at both ends of the film were cut out with a slitter and wound into a roll to obtain a roll of polyimide film (ratio 10b) with a width of 450 mm and a length of 30 m.
얻어진 폴리이미드 필름(비 10b)은 As(20 μm)/C(5 μm)의 2층 구조이며, 필름 총 두께 25 μm, 헤이즈 0.63%, 전광선 투과율 86.9%, 옐로우 인덱스 4.3, 파단 강도 154 MPa, 파단 신도 18%, 탄성 3.9 GPa, CTE 19.6 ppm/K, 휘어짐 2.8 mm 이하, 천이층 두께 0.0 μm였다. 필름의 휘어짐량이 실시예에 비교하면 크다. The obtained polyimide film (ratio 10b) has a two-layer structure of As (20 μm) / C (5 μm), and has a total film thickness of 25 μm, haze of 0.63%, total light transmittance of 86.9%, yellow index of 4.3, breaking strength of 154 MPa, Elongation at break was 18%, elasticity was 3.9 GPa, CTE was 19.6 ppm/K, deflection was 2.8 mm or less, and the thickness of the transition layer was 0.0 μm. The amount of warping of the film is large compared to that of Examples.
(비교예 11)(Comparative Example 11)
25℃ 45%RH로 공조된 대기중에서, 제조예 2에서 얻은 폴리아미드산 용액 As를, 어플리케이터를 이용하여 유리 기판 상에 최종 막두께가 3 μm이 되도록 도포하고, 계속해서 60초후에 제조예 5에서 얻은 폴리이미드 용액 C를 폴리아미드산 용액 As의 위에 최종 막두께가 31 μm이 되도록 어플리케이터에 의해 도포했다. 60초후에, 어플리케이터를 이용하여 폴리아미드산 용액 As를 최종 막두께가 3 μm이 되도록 더 도포했다. 한편, 본 비교예에서의 최종 막두께는 별도로 각각의 용액을 유리 기판에 단독으로 도포하여 얻어진 필름 두께로부터 구한 값이다. In an air-conditioned atmosphere at 25°C and 45% RH, the polyamic acid solution As obtained in Production Example 2 was applied onto a glass substrate using an applicator so that the final film thickness was 3 μm, and then, after 60 seconds, Production Example 5 The polyimide solution C obtained in was applied on the polyamic acid solution As with an applicator so that the final film thickness was 31 μm. After 60 seconds, the polyamic acid solution As was further applied using an applicator so that the final film thickness was 3 mu m. On the other hand, the final film thickness in this comparative example is a value obtained from the film thickness obtained by separately applying each solution to a glass substrate alone.
이것을 이너트 오븐으로 110℃에서 20분간 건조시키고, 이어서 진공 건조기로 200℃에서 10분, 250℃에서 10분, 또한 머플 로를 이용하여 350℃에서 5분의 조건으로 가열하고, 이미드화 반응을 진행시키고, 유리 기판으로부터 박리하여 폴리이미드 필름(비 11)을 얻었다. This was dried at 110 ° C. for 20 minutes in an inert oven, then heated at 200 ° C. for 10 minutes and 250 ° C. for 10 minutes with a vacuum dryer, and at 350 ° C. for 5 minutes using a muffle furnace, and the imidation reaction It progressed, and it peeled from the glass substrate and obtained the polyimide film (ratio 11).
얻어진 폴리이미드 필름(비 11)은 As(3 μm)/C(31 μm)/As(3 μm)의 3층 구조를 의도하여 제작한 필름이라는 평가이다. 폴리이미드 필름 비 11의 특성은 필름 총 두께 37 μm, 헤이즈 5.2%, 전광선 투과율 83.9%, 옐로우 인덱스 1.8, 파단 강도 130 MPa, 파단 신도 5.8%, 탄성 3.9 GPa, CTE 37 ppm/K, 휘어짐 3.5 mm, 천이층 두께(에어면측/베이스면측) 3.5 μm/5.6 μm였다. 필름의 휘어짐량이 실시예 5에 비교하면 크고, 헤이즈값도 높아졌다. 천이층 두께는, 도포시에 의도한 As층보다 두껍게 되어 있고, 다층 구조라고 하기보다는, 조성이 절반 혼합되어 버린 상태에 가깝고, 강도, 신도 모두 저하되어 기대한 기능 분리가 발현하지 않은 것으로 짐작된다. The obtained polyimide film (ratio 11) is evaluated as a film intended to have a three-layer structure of As (3 µm)/C (31 µm)/As (3 µm). The characteristics of the polyimide film ratio 11 were: total film thickness 37 μm, haze 5.2%, total light transmittance 83.9%, yellow index 1.8, strength at break 130 MPa, elongation at break 5.8%, elasticity 3.9 GPa, CTE 37 ppm/K, warpage 3.5 mm , the thickness of the transition layer (air side/base side) was 3.5 µm/5.6 µm. Compared with Example 5, the warp amount of the film was large, and the haze value was also high. The thickness of the transition layer is thicker than the intended As layer at the time of application, and rather than a multilayer structure, it is close to a state in which the composition is half mixed, and both strength and elongation are reduced, so it is assumed that the expected functional separation did not occur .
[표 1] [Table 1]
[표 2] [Table 2]
[표 3] [Table 3]
[표 4] [Table 4]
[표 5] [Table 5]
[표 6] [Table 6]
[표 7] [Table 7]
이상 설명한 바와 같이, 본 발명의 다층 폴리이미드 필름은, 상이한 조성의 폴리이미드를, 각각을 단독으로 필름화한 경우에 비교하여 양호한 광학 특성과 기계 특성을 갖는 것이 나타났다. 또한 본 발명의 제조 방법에 의하면, 다층으로 분리되어 기능 분담한 상이한 조성의 층간에 특정한 두께의 조성 경사진 천이층을 형성할 수 있고, 그 때문에 균형잡힌 필름을 형성하는 것이 가능해진다. As described above, it was found that the multilayer polyimide film of the present invention has better optical properties and mechanical properties than when polyimides of different compositions were formed into films independently. Further, according to the manufacturing method of the present invention, it is possible to form a transitional layer having a specific thickness and a composition gradient between layers of different compositions separated into multiple layers and functionally divided, thereby making it possible to form a well-balanced film.
본 발명의 다층 폴리이미드 필름은 우수한 광학 특성, 무색 투명성을 가지며, 또한 기계 특성이 우수하고, 비교적 낮은 CTE를 나타내기 때문에, 플렉시블하고 경량인 표시 장치의 부재로서, 혹은 투명성이 필요한 터치패널 등의 스위치 소자, 포인팅 디바이스 등에 이용할 수 있다. Since the multilayer polyimide film of the present invention has excellent optical properties, colorless transparency, excellent mechanical properties, and a relatively low CTE, it can be used as a member of a flexible and lightweight display device or as a touch panel requiring transparency. It can be used for switch elements, pointing devices, and the like.
Claims (9)
상기 다층 폴리이미드층을 구성하는 (a)층과 상기 (a)층에 인접하는 (b)층 사이에 존재하고, 화학 조성이 경사를 갖고 변화하는 천이층
을 가지며,
상기 천이층의 두께는, 하한이 필름 총 두께의 3%, 또는 1 μm 중 어느 하나이며, 상한이 필름 총 두께의 10%, 또는 3 μm 중 어느 하나이며,
필름 전체의 두께가 3 μm 이상 120 μm 이하이며,
필름 전체의 옐로우 인덱스가 5 이하이며,
필름 전체의 전광선 투과율이 86% 이상인
것을 특징으로 하는 다층 폴리이미드 필름. A multilayer polyimide layer in which at least two types of polyimide layers having different compositions are laminated in the thickness direction;
A transition layer in which the chemical composition changes with an inclination, which exists between the (a) layer constituting the multi-layer polyimide layer and the (b) layer adjacent to the (a) layer.
has,
The thickness of the transition layer has a lower limit of 3% of the total film thickness or 1 μm, and an upper limit of 10% of the total film thickness or 3 μm,
The thickness of the entire film is 3 μm or more and 120 μm or less,
The yellow index of the entire film is 5 or less,
The total light transmittance of the entire film is 86% or more.
A multilayer polyimide film, characterized in that.
상기 (a)층은, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 10 이하이며, 전광선 투과율이 85% 이상인 폴리이미드로 주로 구성되고,
상기 (b)층은, 단독으로 두께 25±2 μm의 필름으로 했을 때에 옐로우 인덱스가 5 이하이며, 전광선 투과율이 90% 이상인 폴리이미드로 주로 구성되어 있는
것을 특징으로 하는 다층 폴리이미드 필름.According to claim 1,
The (a) layer is mainly composed of polyimide having a yellow index of 10 or less and a total light transmittance of 85% or more when used alone as a film having a thickness of 25 ± 2 μm,
The (b) layer is mainly composed of polyimide having a yellow index of 5 or less and a total light transmittance of 90% or more when used alone as a film having a thickness of 25 ± 2 μm.
A multilayer polyimide film, characterized in that.
상기 (a)층은, 상기 (b)층의 한쪽 면측과 다른쪽 면측의 양쪽에 존재하고,
상기 천이층은, 상기 (b)층의 한쪽 면측의 (a)층과 상기 (b)층의 사이, 및, 상기 (b)층의 다른쪽 면측의 (a)층과 상기 (b)층의 사이에 존재하고,
상기 (a)층, 상기 천이층, 상기 (b)층, 상기 천이층, 상기 (a)층의 순으로 적층된 층구성을 갖고 있는
것을 특징으로 하는 다층 폴리이미드 필름. According to claim 1 or 2,
The (a) layer is present on both one side and the other side of the (b) layer,
The transition layer is between the (a) layer and the (b) layer on one side of the (b) layer, and between the (a) layer and the (b) layer on the other side of the (b) layer. exist between
The (a) layer, the transition layer, the (b) layer, the transition layer, and the (a) layer are laminated in this order.
A multilayer polyimide film, characterized in that.
상기 (a)층의 폴리이미드가,
지환족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 분자 내에 아미드 결합을 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드,
또는
지환족 테트라카르복실산무수물을 30 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드
인 것을 특징으로 하는 다층 폴리이미드 필름. According to any one of claims 1 to 3,
The polyimide of the layer (a),
A polyimide having a chemical structure obtained by condensation polymerization of a tetracarboxylic acid anhydride containing 70% by mass or more of an alicyclic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having an amide bond in the molecule,
or
Polyi comprising a chemical structure obtained by condensation polymerization of a tetracarboxylic acid anhydride containing 30% by mass or more of an alicyclic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having a trifluoromethyl group in a molecule mid
A multilayer polyimide film, characterized in that.
상기 (b)층의 폴리이미드가,
방향족 테트라카르복실산무수물을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 분자 내에 황 원자를 갖는 디아민을 70 질량% 이상 함유하는 디아민으로부터 얻어지는 화학 구조를 포함하는 폴리이미드,
또는
트리플루오로메틸기를 분자 내에 함유하는 테트라카르복실산을 70 질량% 이상 함유하는 테트라카르복실산무수물과, 트리플루오로메틸기를 분자 내에 갖는 디아민을 70 질량% 이상 함유하는 디아민의 축중합에 의해 얻어지는 화학 구조를 포함하는 폴리이미드
인 것을 특징으로 하는 다층 폴리이미드 필름. According to any one of claims 1 to 4,
The polyimide of the layer (b),
A polyimide comprising a chemical structure obtained from a tetracarboxylic acid anhydride containing 70% by mass or more of an aromatic tetracarboxylic acid anhydride and a diamine containing 70% by mass or more of a diamine having a sulfur atom in the molecule;
or
Obtained by condensation polymerization of a tetracarboxylic acid anhydride containing 70% by mass or more of a tetracarboxylic acid containing a trifluoromethyl group in a molecule and a diamine containing 70% by mass or more of a diamine having a trifluoromethyl group in a molecule Polyimide Containing Chemical Structure
A multilayer polyimide film, characterized in that.
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정,
3 : 전층을 가열하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 적층체를 얻는 공정,
을 적어도 포함하는 제1항, 제2항, 제4항 또는 제5항에 기재된 다층 폴리이미드 필름의 제조 방법. 1: (a) Step of applying a polyimide solution or polyimide precursor solution for layer formation to a temporary support to obtain a coated film a1;
2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
3: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
The manufacturing method of the multilayer polyimide film of Claim 1, Claim 2, Claim 4, or Claim 5 containing at least.
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정,
3 : 전층을 가열하여, 전층 기준의 잔용제량이 5 질량% 이상 40 질량%인 적층체를 얻은 후, 가지지체로부터 박리하여, 자기 지지성이 있는 필름을 얻는 공정,
5 : 상기 자기 지지성이 있는 필름의 양쪽 단부를 파지하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 필름을 더 얻는 공정,
을 적어도 포함하는 제1항, 제2항, 제4항 또는 제5항에 기재된 다층 폴리이미드 필름의 제조 방법. 1: (a) Step of applying a polyimide solution or polyimide precursor solution for layer formation to a temporary support to obtain a coated film a1;
2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
Step 3: Heating all layers to obtain a laminate having a residual solvent amount of 5% by mass or more and 40% by mass based on all layers, and then peeling from the temporary support to obtain a self-supporting film;
5: A step of gripping both ends of the self-supporting film to further obtain a film having a residual solvent amount of 0.5% by mass or less based on the entire layer;
The manufacturing method of the multilayer polyimide film of Claim 1, Claim 2, Claim 4, or Claim 5 containing at least.
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정,
3 : 도포막 ab1 제작후 100초 이내에, (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 ab1에 도포하여, 도포막 aba1을 얻는 공정,
4 : 전층을 가열하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 적층체를 얻는 공정,
을 적어도 포함하는 제1항 내지 제5항 중 어느 한 항에 기재된 다층 폴리이미드 필름의 제조 방법. 1: (a) Step of applying a polyimide solution or polyimide precursor solution for layer formation on a temporary support to obtain a coating film a1;
2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
Step 3: Within 100 seconds after the formation of the coating film ab1, (a) a step of applying a polyimide solution for layer formation or a polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4: A step of heating all layers to obtain a laminate having a residual solvent amount of 0.5% by mass or less based on all layers;
The manufacturing method of the multilayer polyimide film as described in any one of Claims 1-5 containing at least.
2 : 도포막 a1 제작후 100초 이내에, (b)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 a1에 도포하여, 도포막 ab1을 얻는 공정,
3 : 도포막 ab1 제작후 100초 이내에, (a)층 형성용의 폴리이미드 용액 또는 폴리이미드 전구체 용액을 도포막 ab1에 도포하여, 도포막 aba1을 얻는 공정,
4 : 전층을 가열하여, 전층 기준의 잔용제량이 8 질량% 이상 40 질량%인 적층체를 얻은 후, 가지지체로부터 박리하여, 자기 지지성이 있는 필름을 얻는 공정,
5 : 상기 자기 지지성이 있는 필름의 양쪽 단부를 파지하여, 전층 기준의 잔용제량이 0.5 질량% 이하인 필름을 더 얻는 공정,
을 적어도 포함하는 제1항 내지 제5항 중 어느 한 항에 기재된 다층 폴리이미드 필름의 제조 방법. 1: (a) Step of applying a polyimide solution or polyimide precursor solution for layer formation to a temporary support to obtain a coated film a1;
2: within 100 seconds after the coating film a1 is formed, (b) a step of applying a polyimide solution or a polyimide precursor solution for layer formation to the coating film a1 to obtain the coating film a1;
Step 3: Within 100 seconds after the formation of the coating film ab1, (a) a step of applying a polyimide solution for layer formation or a polyimide precursor solution to the coating film ab1 to obtain the coating film aba1;
4: step of heating all layers to obtain a laminate having a residual solvent amount of 8% by mass or more and 40% by mass based on all layers, then peeling from the temporary support to obtain a self-supporting film;
5: A step of gripping both ends of the self-supporting film to further obtain a film having a residual solvent amount of 0.5% by mass or less based on the entire layer;
The manufacturing method of the multilayer polyimide film as described in any one of Claims 1-5 containing at least.
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