JP7098231B2 - Electroplated whetstone - Google Patents

Electroplated whetstone Download PDF

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JP7098231B2
JP7098231B2 JP2018033503A JP2018033503A JP7098231B2 JP 7098231 B2 JP7098231 B2 JP 7098231B2 JP 2018033503 A JP2018033503 A JP 2018033503A JP 2018033503 A JP2018033503 A JP 2018033503A JP 7098231 B2 JP7098231 B2 JP 7098231B2
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grindstone
talc
electrodeposited
electrodeposition
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JP2019147221A (en
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和寛 山本
毅 林
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Disco Corp
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Priority to TW108106102A priority patent/TWI781293B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0018Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12Cut-off wheels
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated

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  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
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Description

本発明は、めっき層で砥粒を固定した砥石部を備える電着砥石に関する。 The present invention relates to an electrodeposition grindstone including a grindstone portion in which abrasive grains are fixed by a plating layer.

切削装置は、様々な被加工物の切削加工に広く用いられている。例えば、半導体ウェーハを複数のデバイスチップに分割する際の切削加工は切削装置を用いて実施される。また、LED(Light Emitting Diode)パッケージには、ガラス繊維にエポキシ樹脂を含侵させて形成したガラスエポキシ基板などが用いられており、このガラスエポキシ基板を分割してデバイスパッケージを得る際にも切削装置による切削加工が行われる。 Cutting devices are widely used for cutting various workpieces. For example, a cutting process for dividing a semiconductor wafer into a plurality of device chips is performed using a cutting device. In addition, a glass epoxy board formed by impregnating glass fiber with an epoxy resin is used for the LED (Light Emitting Diode) package, and the glass epoxy board is also cut when the device package is obtained by dividing the glass epoxy board. Cutting is performed by the device.

切削加工は、切削装置に備えられたスピンドルの先端部に装着される円環状の砥石(切削ブレード)を用いて実施される。この砥石は、例えば、ダイヤモンド等でなる砥粒をニッケル等を含むめっき層で固定することにより形成される。特許文献1には、ダイヤモンド等の砥粒が混入された硫酸ニッケル等の電解液に電着用の基盤を浸漬し、該基盤に砥粒を含むめっき層を成長させて円環状の砥石を製造する方法が開示されている。 The cutting process is performed using an annular grindstone (cutting blade) mounted on the tip of a spindle provided in the cutting device. This grindstone is formed, for example, by fixing abrasive grains made of diamond or the like with a plating layer containing nickel or the like. In Patent Document 1, an electrolytically-worn substrate is immersed in an electrolytic solution such as nickel sulfate mixed with abrasive grains such as diamond, and a plating layer containing the abrasive grains is grown on the substrate to manufacture an annular grindstone. The method is disclosed.

切削装置のスピンドルを回転させ、円環状の砥石を回転させながら被加工物に切り込ませると、砥石のめっき層から露出した砥粒が被加工物と接触して被加工物が切削される。そして、切削加工を続けるとめっき層が摩耗して露出していた砥粒が脱落し、新たな砥粒がめっき層から露出する。この作用は自生発刃と呼ばれており、自生発刃により砥石の切削機能が維持される。 When the spindle of the cutting device is rotated and the annular grindstone is rotated to cut into the workpiece, the abrasive grains exposed from the plating layer of the grindstone come into contact with the workpiece and the workpiece is cut. Then, when the cutting process is continued, the plating layer is worn and the exposed abrasive grains fall off, and new abrasive grains are exposed from the plating layer. This action is called a self-generated blade, and the self-generated blade maintains the cutting function of the grindstone.

特開2000-87282号公報Japanese Unexamined Patent Publication No. 2000-87282

ニッケルを含むめっき層で砥粒を固定した砥石では、砥粒が比較的強くめっき層に固定される。そのため、被加工物を切削しても砥粒がめっき層から脱落しにくく、自生発刃が生じにくい。自生発刃が適度に発生しないと、例えば露出した砥粒間に切削屑が蓄積して切削抵抗が増大したり(目詰まり)、露出した砥粒が摩耗により平滑化され砥石の切れ味が低下する(目つぶれ)などの現象が生じる。このような状態の砥石で切削加工を行うと、被加工物にチッピングと呼ばれる欠けが形成される等の加工不良が生じる。 In a grindstone in which the abrasive grains are fixed by a plating layer containing nickel, the abrasive grains are relatively strongly fixed to the plating layer. Therefore, even if the workpiece is cut, the abrasive grains are less likely to fall off from the plating layer, and spontaneous blade formation is less likely to occur. If the self-generated blade is not generated appropriately, for example, cutting chips may accumulate between the exposed abrasive grains and the cutting resistance may increase (clogging), or the exposed abrasive grains may be smoothed by wear and the sharpness of the grindstone may decrease. Phenomena such as (blinding) occur. When cutting is performed with a grindstone in such a state, processing defects such as chipping, which is called chipping, occur in the workpiece.

また、特にガラス、セラミックス、ガラスエポキシ樹脂や、樹脂と電極との複合材料などの、難削材と呼ばれる切削加工が困難な材料の切削加工では、自生発刃が生じにくい。そのため、ニッケルを含むめっき層で砥粒を固定した砥石を用いると、元来切削しにくい難削材の切削加工がますます困難になるという問題がある。 Further, in particular, in the cutting process of a material called a difficult-to-cut material, which is difficult to cut, such as glass, ceramics, glass epoxy resin, and a composite material of a resin and an electrode, spontaneous blade generation is unlikely to occur. Therefore, if a grindstone in which the abrasive grains are fixed with a plating layer containing nickel is used, there is a problem that it becomes more difficult to cut a difficult-to-cut material that is originally difficult to cut.

本発明はかかる問題に鑑みてなされたものであり、加工不良の発生を抑制することが可能な電着砥石を提供することを課題とする。 The present invention has been made in view of such a problem, and an object of the present invention is to provide an electrodeposition grindstone capable of suppressing the occurrence of processing defects.

本発明の一態様によれば、ニッケルを含むめっき層で砥粒を固定した砥石部を備え、該砥石部には、該砥石部の2.2体積%以上15.0体積%以下のタルクが含有されている電着砥石が提供される。 According to one aspect of the present invention, a grindstone portion in which abrasive grains are fixed by a plating layer containing nickel is provided, and the grindstone portion contains 2.2% by volume or more and 15.0% by volume or less of talc of the grindstone portion. The contained electrodeposition grindstone is provided.

また、本発明の一態様において、該砥石部には、該砥石部の2.2体積%以上6.2体積%以下のタルクが含有されていてもよい。また、本発明の一態様において、該砥石部に含有されているタルクの平均粒径は、0.6μm以上10.0μm以下であってもよい。 Further, in one aspect of the present invention, the grindstone portion may contain talc of 2.2% by volume or more and 6.2% by volume or less of the grindstone portion. Further, in one aspect of the present invention, the average particle size of talc contained in the grindstone portion may be 0.6 μm or more and 10.0 μm or less.

また、本発明の一態様において、該電着砥石は、円環状の該砥石部のみによって構成されていてもよい。また、本発明の一態様において、該電着砥石は、把持部を有する円環状の基台と、該基台の外縁部に形成された該砥石部と、によって構成されていてもよい。 Further, in one aspect of the present invention, the electrodeposited grindstone may be composed of only the annular grindstone portion. Further, in one aspect of the present invention, the electrodeposited grindstone may be composed of an annular base having a grip portion and the grindstone portion formed on the outer edge portion of the base.

本発明の一態様に係る電着砥石は、ニッケルよりも硬度が低く潤滑性を有する材料であるタルクが含有された砥石部を備える。この電着砥石を用いて切削加工を行うことにより、電着砥石の自生発刃が促されるとともに電着砥石と被加工物との間の摩擦が低減され、加工不良の発生を抑制することが可能となる。 The electrodeposited grindstone according to one aspect of the present invention includes a grindstone portion containing talc, which is a material having a hardness lower than that of nickel and having lubricity. By performing cutting using this electrodeposition grindstone, the self-generated blade of the electrodeposition grindstone is promoted, the friction between the electrodeposition grindstone and the workpiece is reduced, and the occurrence of machining defects can be suppressed. It will be possible.

図1(A)は砥石部からなる電着砥石の構成例を示す斜視図であり、図1(B)は基台及び砥石部を備える電着砥石の構成例を示す斜視図である。FIG. 1A is a perspective view showing a configuration example of an electrodeposition grindstone including a grindstone portion, and FIG. 1B is a perspective view showing a configuration example of an electrodeposition grindstone including a base and a grindstone portion. ワッシャータイプの電着砥石の製造に用いられる製造装置の構成例を模式的に示す断面図である。It is sectional drawing which shows typically the structural example of the manufacturing apparatus used for manufacturing a washer type electrodeposition grindstone. 図3(A)は基台の表面に砥石部が形成された状態を示す断面図であり、図3(B)は砥石部が基台から剥離される様子を示す断面図である。FIG. 3A is a cross-sectional view showing a state in which the grindstone portion is formed on the surface of the base, and FIG. 3B is a cross-sectional view showing how the grindstone portion is peeled off from the base. ハブタイプの電着砥石の製造に用いられる製造装置の構成例を模式的に示す断面図である。It is sectional drawing which shows schematically the structural example of the manufacturing apparatus used for manufacturing a hub type electrodeposition grindstone. 図5(A)は基台の表面に砥石部が形成された状態を示す断面図であり、図5(B)は基台に覆われた砥石部の一部を露出させた状態を示す断面図である。FIG. 5A is a cross-sectional view showing a state in which the grindstone portion is formed on the surface of the base, and FIG. 5B is a cross-sectional view showing a state in which a part of the grindstone portion covered with the base is exposed. It is a figure. 電着砥石の砥石部に含有されたタルクの量と最大チッピングサイズの比率との関係を示すグラフである。It is a graph which shows the relationship between the amount of talc contained in the grindstone part of an electrodeposition grindstone, and the ratio of the maximum chipping size. 電着砥石の砥石部に含有されたタルクの量と電着砥石の弾性率の比率との関係を示すグラフである。It is a graph which shows the relationship between the amount of talc contained in the grindstone part of an electrodeposition grindstone, and the ratio of the elastic modulus of an electrodeposition grindstone.

以下、添付図面を参照して本発明の実施形態を説明する。本実施形態は、電着によって形成された砥石(電着砥石)に関する。図1(A)及び図1(B)に、本実施形態で用いることが可能な電着砥石の構成例を示す。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The present embodiment relates to a grindstone (electroplated grindstone) formed by electrodeposition. 1 (A) and 1 (B) show a configuration example of an electrodeposition grindstone that can be used in this embodiment.

図1(A)は、砥石部3からなる電着砥石1の構成例を示す斜視図である。電着砥石1は、中央部に貫通孔3aを有する円環状の砥石部3のみによって構成され、その全体が電着によって形成された切刃となっている。砥石部3は、例えばニッケルを含むめっき層でダイヤモンド等の砥粒を固定することにより形成される。円環状の砥石部3によって構成される電着砥石1は、ワッシャータイプと呼ばれる。 FIG. 1A is a perspective view showing a configuration example of an electrodeposited grindstone 1 including a grindstone portion 3. The electrodeposition grindstone 1 is composed of only an annular grindstone portion 3 having a through hole 3a in the central portion, and the entire electrodeposition grindstone 1 is a cutting edge formed by electrodeposition. The grindstone portion 3 is formed by fixing abrasive grains such as diamond with a plating layer containing nickel, for example. The electrodeposited grindstone 1 composed of the annular grindstone portion 3 is called a washer type.

図1(B)は、基台7及び砥石部9を備える電着砥石5の構成例を示す斜視図である。電着砥石5は、中央部に貫通孔7aを有する円環状の基台7と、基台7の外縁部に電着によって形成された砥石部9とによって構成されている。砥石部9は、例えばニッケルを含むめっき層でダイヤモンド等の砥粒を固定することにより形成される。基台7の外縁部に砥石部9を電着した電着砥石5は、ハブタイプと呼ばれる。 FIG. 1B is a perspective view showing a configuration example of an electrodeposited grindstone 5 including a base 7 and a grindstone portion 9. The electrodeposition grindstone 5 is composed of an annular base 7 having a through hole 7a in the central portion and a grindstone portion 9 formed by electrodeposition on the outer edge portion of the base 7. The grindstone portion 9 is formed by fixing abrasive grains such as diamond with a plating layer containing nickel, for example. The electrodeposited grindstone 5 in which the grindstone portion 9 is electrodeposited on the outer edge portion of the base 7 is called a hub type.

また、基台7は幅方向に突出した円環状の把持部7bをその中央部に有する。切削装置を用いて切削加工を行う際、切削装置の使用者(オペレータ)は把持部7bを持って電着砥石5を切削装置に装着することができる。 Further, the base 7 has an annular grip portion 7b protruding in the width direction at the center thereof. When performing cutting using a cutting device, the user (operator) of the cutting device can attach the electrodeposited grindstone 5 to the cutting device by holding the grip portion 7b.

電着砥石1,5は、切削装置に備えられたスピンドルの先端部に装着される。この状態でスピンドルを回転させると、電着砥石1,5はスピンドルの軸心を回転軸として回転する。そして、電着砥石1,5を回転させた状態で被加工物に切り込ませることにより、被加工物の切削加工が実施される。 The electrodeposition grindstones 1 and 5 are attached to the tip of a spindle provided in the cutting device. When the spindle is rotated in this state, the electrodeposited grindstones 1 and 5 rotate with the axis of the spindle as the axis of rotation. Then, by cutting the electrodeposited grindstones 1 and 5 into the workpiece in a rotated state, the workpiece is cut.

なお、電着砥石1,5を用いて切削される被加工物の材料に制限はない。例えば、シリコンやSiC等の半導体材料、ガラス、セラミックス、ガラスエポキシ樹脂や、樹脂と電極との複合材料など、種々の材料の切削加工に用いることができる。 There are no restrictions on the material of the workpiece to be cut using the electrodeposited grindstones 1 and 5. For example, it can be used for cutting various materials such as semiconductor materials such as silicon and SiC, glass, ceramics, glass epoxy resins, and composite materials of resins and electrodes.

被加工物の切削は、砥石部3,9のめっき層から露出した砥粒が被加工物に接触することによって行われる。そして、切削加工を続けるとめっき層が摩耗して露出していた砥粒が脱落し、新たな砥粒がめっき層から露出される。この作用は自生発刃と呼ばれており、自生発刃により砥石の切削機能が維持される。 The work piece is cut by the abrasive grains exposed from the plating layers of the grindstone portions 3 and 9 coming into contact with the work piece. Then, when the cutting process is continued, the plating layer is worn and the exposed abrasive grains fall off, and new abrasive grains are exposed from the plating layer. This action is called a self-generated blade, and the self-generated blade maintains the cutting function of the grindstone.

しかしながら、ニッケルを含むめっき層で砥粒を固定した砥石部3,9では、砥粒が比較的強くめっき層に固定される。そのため、被加工物を切削しても砥粒がめっき層から脱落しにくく、自生発刃が生じにくい。特に、ガラス、セラミックス、ガラスエポキシ樹脂や、樹脂と電極との複合材料など、切削加工が困難な材料(難削材)を切削する場合、自生発刃はより生じにくくなる。このような状態の砥石部3,9で切削加工を行うと、被加工物にチッピングと呼ばれる欠けが形成される等の加工不良が生じる。 However, in the grindstone portions 3 and 9 in which the abrasive grains are fixed by the plating layer containing nickel, the abrasive grains are relatively strongly fixed to the plating layer. Therefore, even if the workpiece is cut, the abrasive grains are less likely to fall off from the plating layer, and spontaneous blade formation is less likely to occur. In particular, when cutting a material (difficult-to-cut material) that is difficult to cut, such as glass, ceramics, glass epoxy resin, and a composite material of resin and electrode, spontaneous blade generation is less likely to occur. When cutting is performed on the grindstone portions 3 and 9 in such a state, processing defects such as chipping, which is called chipping, are formed on the workpiece.

そこで、本実施形態では、電着砥石1の砥石部3、電着砥石5の砥石部9にタルク(含水珪酸マグネシウム(MgSi10(OH)))を含有させる。タルクはニッケルよりも硬度が低く(モース硬度1)、砥石部3,9にタルクを含有させるとめっき層が脆弱化して摩耗しやすくなり、自生発刃が促されることが期待できる。自生発刃を適度に発生させることにより電着砥石1,5の切削機能を維持し、切削加工時の加工不良の発生を抑制できる。 Therefore, in the present embodiment, talc (hydrous magnesium silicate (Mg 3 Si 4 O 10 (OH) 2 )) is contained in the grindstone portion 3 of the electrodeposition grindstone 1 and the grindstone portion 9 of the electrodeposition grindstone 5. Talc has a lower hardness than nickel (Mohs hardness 1), and if talc is contained in the grindstone portions 3 and 9, the plating layer becomes weak and easily wears, and it can be expected that spontaneous blade generation is promoted. By appropriately generating spontaneous blades, the cutting functions of the electrodeposited grindstones 1 and 5 can be maintained, and the occurrence of machining defects during cutting can be suppressed.

さらに、タルクは潤滑性を有する材料であるため、砥石部3,9にタルクを含有させると切削加工時に電着砥石1,5と被加工物との間の摩擦が低減されることが期待できる。この摩擦の低減により、切削加工時に被加工物の欠け(チッピング)などの切削不良の発生が抑制される。 Further, since talc is a material having lubricity, it can be expected that if talc is contained in the grindstone portions 3 and 9, the friction between the electrodeposited grindstones 1 and 5 and the workpiece during cutting is reduced. .. By reducing this friction, the occurrence of cutting defects such as chipping of the workpiece during cutting is suppressed.

砥石部3,9に含有されるタルクの量は、めっき層の材料、砥粒の材料及び粒径、被加工物の材料などに応じて適宜設定することができるが、加工不良を低減し、且つ電着砥石1,5の強度が一定以上に保たれる範囲に設定することが好ましい。 The amount of talc contained in the grindstone portions 3 and 9 can be appropriately set according to the material of the plating layer, the material and particle size of the abrasive grains, the material of the workpiece, etc., but it reduces processing defects and reduces processing defects. Moreover, it is preferable to set the strength of the electrodeposition grindstones 1 and 5 within a range in which the strength is maintained above a certain level.

例えば、砥石部3,9に対するタルクの含有量が、2.0体積%以上15.0体積%以下、好ましくは2.2体積%以上15.0体積%以下、より好ましくは2.2体積%以上6.2体積%以下となるように、砥石部3,9にタルクを含有させることができる。このタルクの含有量は、例えばアルキメデス法によって測定することができる。 For example, the content of talc with respect to the grindstone portions 3 and 9 is 2.0% by volume or more and 15.0% by volume or less, preferably 2.2% by volume or more and 15.0% by volume or less, and more preferably 2.2% by volume or less. The talc can be contained in the grindstone portions 3 and 9 so as to be 6.2% by volume or less. The content of this talc can be measured, for example, by the Archimedes method.

また、タルクの粒径もタルクの含有量と同様に適宜設定できる。例えば、レーザー回折法で測定したときの平均粒径が0.6μm以上10.0μm以下であるタルクを用いることができる。 Further, the particle size of talc can be appropriately set in the same manner as the content of talc. For example, talc having an average particle size of 0.6 μm or more and 10.0 μm or less as measured by a laser diffraction method can be used.

以上のように、ニッケルを含むめっき層で砥粒を固定した砥石部3,9にタルクを含有させることにより、切削加工時の加工不良を抑制できる。 As described above, by containing talc in the grindstone portions 3 and 9 in which the abrasive grains are fixed by the plating layer containing nickel, it is possible to suppress processing defects during cutting.

次に、砥石部にタルクが含有された電着砥石の製造方法の例について説明する。図1(A)に示す電着砥石1、図1(B)に示す電着砥石5はそれぞれ、電解めっき等を用いて製造できる。 Next, an example of a method for manufacturing an electrodeposited grindstone containing talc in the grindstone portion will be described. The electrodeposition grindstone 1 shown in FIG. 1A and the electrodeposition grindstone 5 shown in FIG. 1B can be manufactured by using electrolytic plating or the like, respectively.

図2は、ワッシャータイプの電着砥石1の製造に用いられる製造装置2の構成例を模式的に示す断面図である。図2に示すように、電着砥石1を製造する際はまず、ダイヤモンド等の砥粒が混入されたニッケルめっき液16が収容されためっき浴槽4を準備する。ニッケルめっき液16の材料は任意に選択でき、例えば、硫酸ニッケルや硝酸ニッケル等のニッケルを含む電解液を用いることができる。 FIG. 2 is a cross-sectional view schematically showing a configuration example of a manufacturing apparatus 2 used for manufacturing a washer-type electrodeposition grindstone 1. As shown in FIG. 2, when manufacturing the electrodeposited grindstone 1, first, a plating bath 4 containing a nickel plating solution 16 mixed with abrasive grains such as diamond is prepared. The material of the nickel plating solution 16 can be arbitrarily selected, and for example, an electrolytic solution containing nickel such as nickel sulfate or nickel nitrate can be used.

また、ニッケルめっき液16には電着砥石1の砥石部3に含有させるタルクが添加される。具体的には、図2に示すように、タルクと界面活性剤とを混合して生成した混合液18がニッケルめっき液16に添加される。この界面活性剤は、タルクをニッケルめっき液16中に分散させる機能を有する。なお、界面活性剤の材料は任意に選択できる。ニッケルめっき液16に混合液18を添加すると、ニッケルめっき液16中にタルクが概ね均等に分散される。 Further, talc contained in the grindstone portion 3 of the electrodeposition grindstone 1 is added to the nickel plating solution 16. Specifically, as shown in FIG. 2, a mixed liquid 18 produced by mixing talc and a surfactant is added to the nickel plating liquid 16. This surfactant has a function of dispersing talc in the nickel plating solution 16. The material of the surfactant can be arbitrarily selected. When the mixed solution 18 is added to the nickel plating solution 16, talc is substantially evenly dispersed in the nickel plating solution 16.

次に、ステンレスやアルミニウム等の金属材料で形成された円盤状の基台20とニッケル電極6とを、めっき浴槽4内のニッケルめっき液16に浸漬する。基台20の表面には、所望の砥石部3の形状に対応したマスク22が形成されている。例えば、図1(A)に示すような円環状の砥石部3を形成する場合には、上面視で円環状の開口部を有するマスク22が形成される。 Next, the disk-shaped base 20 and the nickel electrode 6 made of a metal material such as stainless steel or aluminum are immersed in the nickel plating solution 16 in the plating bath 4. A mask 22 corresponding to the desired shape of the grindstone portion 3 is formed on the surface of the base 20. For example, when the annular grindstone portion 3 as shown in FIG. 1A is formed, the mask 22 having the annular opening is formed when viewed from above.

また、基台20はスイッチ8を介して直流電源10のマイナス端子(負極)に接続され、ニッケル電極6は直流電源10のプラス端子(正極)に接続される。なお、スイッチ8はニッケル電極6と直流電源10との間に配置されてもよい。 Further, the base 20 is connected to the negative terminal (negative electrode) of the DC power supply 10 via the switch 8, and the nickel electrode 6 is connected to the positive terminal (positive electrode) of the DC power supply 10. The switch 8 may be arranged between the nickel electrode 6 and the DC power supply 10.

次に、モータ等の回転駆動源12によってファン14を回転させてニッケルめっき液16を攪拌しながら、基台20と直流電源10との間に配置されたスイッチ8を短絡させる。これにより、基台20を陰極、ニッケル電極6を陽極としてニッケルめっき液16に直流電流が流れ、基台20の表面のマスク22で覆われていない領域にニッケルを含むめっき層が電着され、タルク及び砥粒を含む砥石部3が形成される。 Next, the fan 14 is rotated by a rotary drive source 12 such as a motor to stir the nickel plating solution 16, and the switch 8 arranged between the base 20 and the DC power supply 10 is short-circuited. As a result, a direct current flows through the nickel plating solution 16 with the base 20 as the cathode and the nickel electrode 6 as the anode, and the plating layer containing nickel is electrodeposited on the region of the surface of the base 20 that is not covered with the mask 22. A grindstone portion 3 containing talc and abrasive grains is formed.

図3(A)は、基台20の表面に砥石部3が形成された状態を示す断面図である。図3(A)に示すように、基台20の表面のマスク22で覆われていない領域には、ニッケルを含むめっき層中にタルク及び砥粒が概ね均等に分散された円環状の砥石部3が形成される。 FIG. 3A is a cross-sectional view showing a state in which the grindstone portion 3 is formed on the surface of the base 20. As shown in FIG. 3A, in the region of the surface of the base 20 not covered by the mask 22, the annular grindstone portion in which talc and abrasive grains are substantially evenly dispersed in the plating layer containing nickel. 3 is formed.

その後、基台20の表面に形成された砥石部3を基台20から剥離する。図3(B)は、砥石部3が基台20から剥離される様子を示す断面図である。これにより、砥石部3が基台20から分離され、砥石部3から構成されるワッシャータイプの電着砥石1が得られる。 After that, the grindstone portion 3 formed on the surface of the base 20 is peeled off from the base 20. FIG. 3B is a cross-sectional view showing how the grindstone portion 3 is peeled off from the base 20. As a result, the grindstone portion 3 is separated from the base 20, and a washer-type electrodeposited grindstone 1 composed of the grindstone portion 3 is obtained.

なお、図1(B)に示す電着砥石5も電着砥石1と同様の方法で製造することができる。図4は、ハブタイプの電着砥石5の製造に用いられる製造装置24の構成例を模式的に示す断面図である。なお、以下で説明する構成以外については、製造装置2(図2)の説明を参酌できる。 The electrodeposition grindstone 5 shown in FIG. 1B can also be manufactured by the same method as the electrodeposition grindstone 1. FIG. 4 is a cross-sectional view schematically showing a configuration example of a manufacturing apparatus 24 used for manufacturing a hub type electrodeposition grindstone 5. The description of the manufacturing apparatus 2 (FIG. 2) can be referred to except for the configurations described below.

まず、電着砥石1の製造方法と同様に、ダイヤモンド等の砥粒が混入されたニッケルめっき液16が収容されためっき浴槽4を準備する。そして、タルクと界面活性剤とを混合して生成した混合液18をニッケルめっき液16に添加する。ニッケルめっき液16及び混合液18に用いることができる材料は、電着砥石1の製造方法と同様であるため説明を省略する。 First, similarly to the method for manufacturing the electrodeposited grindstone 1, a plating bath 4 containing a nickel plating solution 16 mixed with abrasive grains such as diamond is prepared. Then, the mixed liquid 18 produced by mixing talc and the surfactant is added to the nickel plating liquid 16. Since the materials that can be used for the nickel plating solution 16 and the mixed solution 18 are the same as the manufacturing method of the electrodeposition grindstone 1, the description thereof will be omitted.

次に、ステンレスやアルミニウム等の金属材料で形成された基台26とニッケル電極6とを、めっき浴槽4内のニッケルめっき液16に浸漬する。なお、基台26は後の工程を経て電着砥石5の砥石部9を支持する基台7(図1(B)参照)となるため、基台26の形状は基台7に対応した形状とする。 Next, the base 26 made of a metal material such as stainless steel or aluminum and the nickel electrode 6 are immersed in the nickel plating solution 16 in the plating bath 4. Since the base 26 becomes the base 7 (see FIG. 1 (B)) that supports the grindstone portion 9 of the electrodeposition grindstone 5 through a later process, the shape of the base 26 corresponds to the base 7. And.

具体的には、図5(A)に示すように、基台26は電着砥石5の基台7の形状に対応して円環状に形成されており、その中心部には貫通孔26aが設けられている。この貫通孔は、基台7の中央部に設けられる貫通孔7a(図1(B)参照)に相当する。 Specifically, as shown in FIG. 5A, the base 26 is formed in an annular shape corresponding to the shape of the base 7 of the electrodeposition grindstone 5, and a through hole 26a is formed in the center thereof. It is provided. This through hole corresponds to the through hole 7a (see FIG. 1 (B)) provided in the central portion of the base 7.

基台26の表面には、所望の砥石部9の形状に対応したマスク28が形成されている。例えば、図1(B)に示すように基台7の外縁部に沿って円環状の砥石部9を形成する場合は、上面視で基台26の外縁部に沿って形成された円環状の開口部を有するマスク28が形成される。そして、電着砥石1の製造方法と同様にして、基台26の表面のマスク28で覆われていない領域にニッケルを含むめっき層が電着され、タルク及び砥粒を含む砥石部9が形成される。 A mask 28 corresponding to the desired shape of the grindstone portion 9 is formed on the surface of the base 26. For example, when the annular grindstone portion 9 is formed along the outer edge portion of the base 7 as shown in FIG. 1 (B), the annular grindstone portion 9 formed along the outer edge portion of the base 26 is viewed from above. A mask 28 with an opening is formed. Then, in the same manner as in the method for manufacturing the electrodeposited grindstone 1, a plating layer containing nickel is electrodeposited on a region of the surface of the base 26 that is not covered with the mask 28, and a grindstone portion 9 containing talc and abrasive grains is formed. Will be done.

その後、マスク28を基台26から除去する。これにより、表面に砥石部9が形成された基台26が得られる。図5(A)は、基台26の表面に砥石部9が形成された状態を示す断面図である。 After that, the mask 28 is removed from the base 26. As a result, the base 26 having the grindstone portion 9 formed on the surface is obtained. FIG. 5A is a cross-sectional view showing a state in which the grindstone portion 9 is formed on the surface of the base 26.

そして、基台26の外縁部をエッチングすることにより、基台26に覆われた砥石部9の一部を露出させる。これにより、図5(B)に示すように基台7の外縁部に砥石部9が形成されたハブタイプの電着砥石5が得られる。また、上記のエッチングによって把持部7bの形状を調整してもよい。 Then, by etching the outer edge portion of the base 26, a part of the grindstone portion 9 covered with the base 26 is exposed. As a result, as shown in FIG. 5B, a hub-type electrodeposited grindstone 5 in which the grindstone portion 9 is formed on the outer edge portion of the base 7 is obtained. Further, the shape of the grip portion 7b may be adjusted by the above etching.

以上の製造方法を用いることにより、タルクが含有された砥石部3,9を備えた電着砥石1,5を製造することができる。 By using the above manufacturing method, the electrodeposited grindstones 1 and 5 provided with the grindstone portions 3 and 9 containing talc can be manufactured.

次に、タルクが含有された砥石部を備える電着砥石の評価結果について説明する。ここでは、砥石部に含有されたタルクの量が異なる複数の電着砥石でそれぞれ被加工物を切削し、切削によって被加工物に生じた欠け(チッピング)のサイズを測定することにより加工の精度を評価した。また、砥石部に含有されたタルクの量が異なる複数の電着砥石の弾性率を測定し、この弾性率から電着砥石の強度を評価した。 Next, the evaluation result of the electrodeposition grindstone including the grindstone portion containing talc will be described. Here, the machining accuracy is measured by cutting the workpiece with multiple electrodeposited grindstones containing different amounts of talc in the grindstone and measuring the size of the chipping (chipping) generated in the workpiece by cutting. Was evaluated. In addition, the elastic moduli of a plurality of electrodeposited grindstones having different amounts of talc contained in the grindstone portion were measured, and the strength of the electrodeposited grindstone was evaluated from this elastic modulus.

評価には、上述の製造方法に従って製造した、砥石部にタルクが含有されたワッシャータイプ(図1(A)参照)の電着砥石を用いた。電着砥石の外径は53.4mm、内径は40mm、厚さは0.10mmであり、砥粒にはふるいで分級されたときの平均粒径が9μmであるダイヤモンド粒を用いた。なお、砥粒の集中度は50(12.5体積%)であった。 For the evaluation, a washer-type (see FIG. 1 (A)) electrodeposited grindstone having talc contained in the grindstone portion manufactured according to the above-mentioned manufacturing method was used. The outer diameter of the electrodeposited grindstone was 53.4 mm, the inner diameter was 40 mm, the thickness was 0.10 mm, and diamond grains having an average particle size of 9 μm when classified by sieving were used as the abrasive grains. The concentration ratio of the abrasive grains was 50 (12.5% by volume).

また、タルクの含有量による影響を評価するため、砥石部に含まれるタルクの量が異なる7種類の電着砥石を作製した。電着砥石の作製には、レーザー回折法で測定したときの平均粒径が0.8μmのタルクを用いた。作製された7種類の電着砥石の砥石部に含有されたタルクの量をアルキメデス法を用いて測定したところ、7種類の砥石部にはそれぞれ、砥石部に対して0.0体積%(タルクを添加していない電着砥石)、1.0体積%、2.2体積%、6.2体積%、11.4体積%、15.0体積%、17.5体積%のタルクが含有されていた。 Further, in order to evaluate the influence of the talc content, seven types of electrodeposited grindstones having different amounts of talc contained in the grindstone portion were prepared. To prepare the electrodeposited grindstone, talc having an average particle size of 0.8 μm as measured by a laser diffraction method was used. When the amount of talc contained in the grindstone portion of the seven types of electrodeposited grindstones produced was measured using the Archimedes method, each of the seven types of grindstone portions was 0.0% by volume (talc) with respect to the grindstone portion. , 1.0% by volume, 2.2% by volume, 6.2% by volume, 11.4% by volume, 15.0% by volume, 17.5% by volume of talc. Was there.

次に、7種類の電着砥石をそれぞれ整形し、目立て及び真円出しを行った。その後、被加工物を切削装置のチャックテーブルによって吸引保持し、電着砥石に切削水(水温20℃の純水)を供給しながら電着砥石を被加工物に切り込ませて該被加工物を切削する加工を、7種類の電着砥石それぞれについて行った。 Next, each of the seven types of electrodeposited grindstones was shaped, and sharpened and rounded. After that, the workpiece is sucked and held by the chuck table of the cutting device, and the electrodeposited grindstone is cut into the workpiece while supplying cutting water (pure water at a water temperature of 20 ° C.) to the electrodeposited grindstone. Was cut for each of the seven types of electrodeposited grindstones.

被加工物には、長さ100mm、幅100mm、厚さ0.4mmのホウケイ酸ガラスを用いた。そして、電着砥石を30000回転/minの速度で回転させ、電着砥石をその下端が被加工物の下端よりも下側に位置するように配置し、被加工物の長さ方向と概ね平行な方向に沿って被加工物と電着砥石とを5mm/sの速度で相対的に移動させることにより被加工物を切削した。この切削加工を被加工物の幅方向に5.0mm間隔で19回行うことにより、被加工物を20の小片に分割した。 As the work piece, borosilicate glass having a length of 100 mm, a width of 100 mm, and a thickness of 0.4 mm was used. Then, the electrodeposition grindstone is rotated at a speed of 30,000 rpm, and the electrodeposition grindstone is arranged so that the lower end thereof is located below the lower end of the workpiece, and is substantially parallel to the length direction of the workpiece. The workpiece was cut by relatively moving the workpiece and the electrodeposited grindstone at a speed of 5 mm / s along the same direction. By performing this cutting process 19 times at intervals of 5.0 mm in the width direction of the workpiece, the workpiece was divided into 20 small pieces.

その後、チャックテーブルを水平方向に90°回転させ、同様の条件で被加工物をその幅方向と概ね平行な方向に沿って切削することにより、各小片をさらに20分割した。このようにして、被加工物を400個のチップに分割した。 Then, the chuck table was rotated by 90 ° in the horizontal direction, and the workpiece was cut along a direction substantially parallel to the width direction under the same conditions, so that each small piece was further divided into 20 pieces. In this way, the workpiece was divided into 400 chips.

その後、得られた400個のチップから5個のチップを選択し、5個のチップそれぞれについて、切削加工によって切削面に生じたチッピングの、被加工物の厚さ方向と垂直な方向における長さを測定した。そして、チッピングの最大の長さをチッピングサイズとし、5個のチップのチッピングサイズの平均値(平均チッピングサイズ)を算出した。 After that, 5 chips were selected from the obtained 400 chips, and for each of the 5 chips, the length of the chipping generated on the cutting surface by the cutting in the direction perpendicular to the thickness direction of the workpiece. Was measured. Then, the maximum length of chipping was set as the chipping size, and the average value (average chipping size) of the chipping sizes of the five chips was calculated.

上記の平均チッピングサイズの算出を、タルクの含有量が異なる7種類の電着砥石を用いて得たチップそれぞれについて行った。図6は、電着砥石の砥石部に含有されたタルクの量と平均チッピングサイズとの関係を示すグラフである。なお、図6では、タルクが含有されていない電着砥石(タルクの含有量が0.0体積%の電着砥石)を用いて得たチップの平均チッピングサイズを基準(100%)として、他の電着砥石を用いて得たチップの平均チッピングサイズの比率を示している。 The above average chipping size was calculated for each of the chips obtained by using seven types of electrodeposited grindstones having different talc contents. FIG. 6 is a graph showing the relationship between the amount of talc contained in the grindstone portion of the electrodeposited grindstone and the average chipping size. In FIG. 6, the average chipping size of the tip obtained by using an electrodeposition grindstone containing no talc (an electrodeposition grindstone having a talc content of 0.0% by volume) is used as a reference (100%). The ratio of the average chipping size of the chips obtained by using the electrodeposition grindstone of No. 1 is shown.

図6に示すように、タルクの含有量が2.2体積%以上となると平均チッピングサイズが大幅に低減されている。これは、タルクの含有量が2.2体積%以上となると、砥石部に含まれるめっき層がタルクにより脆弱化して自生発刃が適度に生じるとともに、タルクの潤滑性によって電着砥石と被加工物との間の摩擦が低減され、加工の精度が向上したためと推察される。従って、電着砥石の砥石部に含有されるタルクの量は、特に2.2体積%以上とすることが好ましい。 As shown in FIG. 6, when the talc content is 2.2% by volume or more, the average chipping size is significantly reduced. This is because when the content of talc is 2.2% by volume or more, the plating layer contained in the grindstone is weakened by the talc and spontaneous blades are generated appropriately, and the lubricity of the talc causes the electrodeposited grindstone and the workpiece to be processed. It is presumed that the friction with the object was reduced and the processing accuracy was improved. Therefore, the amount of talc contained in the grindstone portion of the electrodeposition grindstone is particularly preferably 2.2% by volume or more.

また、タルクの含有量が異なる7種類の電着砥石の強度を評価するため、各電着砥石の弾性率を測定した。弾性率は、切削加工後の電着砥石の先端部に所定の荷重を負荷して得た応力-歪み曲線から算出した。そして、弾性率が高い電着砥石ほど変形しにくく強度が高いとして、電着砥石の強度を評価した。 Further, in order to evaluate the strength of seven types of electrodeposited grindstones having different talc contents, the elastic modulus of each electrodeposited grindstone was measured. The elastic modulus was calculated from the stress-strain curve obtained by applying a predetermined load to the tip of the electrodeposited grindstone after cutting. Then, the strength of the electrodeposited grindstone was evaluated, assuming that the electrodeposited grindstone having a higher elastic modulus is less likely to be deformed and has higher strength.

図7は、電着砥石の砥石部に含有されたタルクの量と電着砥石の弾性率との関係を示すグラフである。なお、図7では、タルクが含有されていない電着砥石(タルクの含有量が0.0体積%の電着砥石)の弾性率を基準(100%)として、他の電着砥石の弾性率の比率を示している。 FIG. 7 is a graph showing the relationship between the amount of talc contained in the grindstone portion of the electrodeposited grindstone and the elastic modulus of the electrodeposited grindstone. In FIG. 7, the elastic modulus of the other electrodeposited grindstone is based on the elastic modulus (100%) of the electrodeposited grindstone containing no talc (electroplated grindstone having a talc content of 0.0% by volume). Shows the ratio of.

図7より、タルクの含有量が1.0体積%以上6.2体積%以下の電着砥石の弾性率は、タルクが含有されていない電着砥石の弾性率よりも高く、強度が向上している。このようにタルクを少量添加した際に電着砥石の弾性率が上昇する理由は必ずしも明らかではないが、タルクの添加量が少量である場合、タルクの粒子がめっき層の内部に均等に分散し、めっき層の転移を抑制するためと推察される。 From FIG. 7, the elastic modulus of the electrodeposited grindstone having a talc content of 1.0% by volume or more and 6.2% by volume or less is higher than the elastic modulus of the electrodeposited grindstone containing no talc, and the strength is improved. ing. The reason why the elastic modulus of the electrodeposited grindstone increases when a small amount of talc is added in this way is not always clear, but when the amount of talc added is small, the talc particles are evenly dispersed inside the plating layer. It is presumed that this is to suppress the transition of the plating layer.

タルクの含有量が1.0体積%から増加すると、弾性率は徐々に低下する。これは、タルクの含有量の増加によって砥石部に含まれるめっき層が脆弱化したことに起因すると推察される。しかしながら、いずれの電着砥石でも切削加工時に電着砥石が変形して蛇行する様子は観察されず、各電着砥石は被加工物の切削に必要な強度を備えていることが確認できた。 As the talc content increases from 1.0% by volume, the modulus of elasticity gradually decreases. It is presumed that this is because the plating layer contained in the grindstone portion became weak due to the increase in the talc content. However, it was not observed that the electrodeposited grindstone deformed and meandered during cutting with any of the electrodeposited grindstones, and it was confirmed that each electrodeposited grindstone had the strength required for cutting the workpiece.

但し、タルクの含有量が17.5体積%に達すると弾性率の比率が30%程度となり、弾性率が急激に低下していることが分かる。この電着砥石では、特に難削材などの加工が困難になる場合がある。そのため、電着砥石の強度を大きく低下させることなく平均チッピングサイズを低減するためには、特にタルクの含有量を2.2体積%以上15.0体積%以下とすることが好ましい。 However, when the talc content reaches 17.5% by volume, the elastic modulus ratio becomes about 30%, and it can be seen that the elastic modulus sharply decreases. With this electrodeposition grindstone, it may be particularly difficult to process difficult-to-cut materials. Therefore, in order to reduce the average chipping size without significantly reducing the strength of the electrodeposited grindstone, it is particularly preferable that the talc content is 2.2% by volume or more and 15.0% by volume or less.

また、特にタルクの含有量が6.2体積%以下の電着砥石は、タルクが含有されていない電着砥石と比較して弾性率が高く、電着砥石の強度が向上している。そのため、タルクの含有量を2.2体積%以上6.2体積%以下とすると、電着砥石の強度を向上させつつチッピングの発生を抑制できる。 Further, in particular, the electrodeposited grindstone having a talc content of 6.2% by volume or less has a high elastic modulus as compared with the electrodeposited grindstone containing no talc, and the strength of the electrodeposited grindstone is improved. Therefore, when the content of talc is 2.2% by volume or more and 6.2% by volume or less, the occurrence of chipping can be suppressed while improving the strength of the electrodeposited grindstone.

以上の評価結果より、砥石部にタルクを含有させた電着砥石を用いることにより、切削加工時のチッピングを低減し、精度の高い切削加工を行うことが可能となる。 From the above evaluation results, by using an electrodeposited grindstone containing talc in the grindstone portion, it is possible to reduce chipping during cutting and perform highly accurate cutting.

その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented as long as they do not deviate from the scope of the object of the present invention.

1 電着砥石
3 砥石部
3a 貫通孔
5 電着砥石
7 基台
7a 貫通孔
7b 把持部
9 砥石部
2 製造装置
4 めっき浴槽
6 ニッケル電極
8 スイッチ
10 直流電源
12 回転駆動源
14 ファン
16 ニッケルめっき液
18 添加剤
20 基台
22 マスク
24 製造装置
26 基台
28 マスク
1 Electroplated whetstone 3 Whetstone part 3a Through hole 5 Electroplated whetstone 7 Base 7a Through hole 7b Grip part 9 Whetstone part 2 Manufacturing equipment 4 Plating bath 6 Nickel electrode 8 Switch 10 DC power supply 12 Rotating drive source 14 Fan 16 Nickel plating solution 18 Additives 20 Bases 22 Masks 24 Manufacturing equipment 26 Bases 28 Masks

Claims (5)

ニッケルを含むめっき層で砥粒を固定した砥石部を備え、
該砥石部には、該砥石部の2.2体積%以上15.0体積%以下のタルクが含有されていることを特徴とする電着砥石。
Equipped with a grindstone part where the abrasive grains are fixed with a plating layer containing nickel,
The electrodeposition grindstone is characterized in that the grindstone portion contains talc of 2.2% by volume or more and 15.0% by volume or less of the grindstone portion.
該砥石部には、該砥石部の2.2体積%以上6.2体積%以下のタルクが含有されていることを特徴とする請求項1に記載の電着砥石。 The electrodeposition grindstone according to claim 1, wherein the grindstone portion contains talc of 2.2% by volume or more and 6.2% by volume or less of the grindstone portion. 該砥石部に含有されているタルクの平均粒径は、0.6μm以上10.0μm以下であることを特徴とする請求項1又は2に記載の電着砥石。 The electrodeposition grindstone according to claim 1 or 2, wherein the average particle size of talc contained in the grindstone portion is 0.6 μm or more and 10.0 μm or less. 該電着砥石は、円環状の該砥石部のみによって構成されていることを特徴とする請求項1乃至3のいずれか一項に記載の電着砥石。 The electrodeposition grindstone according to any one of claims 1 to 3, wherein the electrodeposition grindstone is composed of only the annular grindstone portion. 該電着砥石は、把持部を有する円環状の基台と、該基台の外縁部に形成された該砥石部と、によって構成されていることを特徴とする請求項1乃至3のいずれか一項に記載の電着砥石。 One of claims 1 to 3, wherein the electrodeposited grindstone is composed of an annular base having a grip portion and the grindstone portion formed on the outer edge portion of the base. The electrodeposition grindstone described in item 1.
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