JP2016168655A - Manufacturing method of electrodeposition grindstone - Google Patents
Manufacturing method of electrodeposition grindstone Download PDFInfo
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- JP2016168655A JP2016168655A JP2015050886A JP2015050886A JP2016168655A JP 2016168655 A JP2016168655 A JP 2016168655A JP 2015050886 A JP2015050886 A JP 2015050886A JP 2015050886 A JP2015050886 A JP 2015050886A JP 2016168655 A JP2016168655 A JP 2016168655A
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- 238000004070 electrodeposition Methods 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 104
- 238000007747 plating Methods 0.000 claims abstract description 65
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000006061 abrasive grain Substances 0.000 claims abstract description 18
- 239000000654 additive Substances 0.000 claims abstract description 14
- 230000000996 additive effect Effects 0.000 claims abstract description 14
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 238000000151 deposition Methods 0.000 claims abstract description 3
- 238000000227 grinding Methods 0.000 claims description 13
- 239000003788 bath preparation Substances 0.000 claims description 6
- 150000003868 ammonium compounds Chemical class 0.000 claims description 5
- 125000001165 hydrophobic group Chemical group 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 abstract description 7
- 239000010980 sapphire Substances 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000002791 soaking Methods 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 20
- 125000003118 aryl group Chemical group 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- GNPSDJOWGWWXSS-UHFFFAOYSA-M 1-benzylpyridin-1-ium;chloride Chemical compound [Cl-].C=1C=CC=C[N+]=1CC1=CC=CC=C1 GNPSDJOWGWWXSS-UHFFFAOYSA-M 0.000 description 1
- GKQHIYSTBXDYNQ-UHFFFAOYSA-M 1-dodecylpyridin-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+]1=CC=CC=C1 GKQHIYSTBXDYNQ-UHFFFAOYSA-M 0.000 description 1
- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006201 3-phenylpropyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- -1 4-phenylbutyl Chemical group 0.000 description 1
- RUPBZQFQVRMKDG-UHFFFAOYSA-M Didecyldimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCC[N+](C)(C)CCCCCCCCCC RUPBZQFQVRMKDG-UHFFFAOYSA-M 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- JBIROUFYLSSYDX-UHFFFAOYSA-M benzododecinium chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 JBIROUFYLSSYDX-UHFFFAOYSA-M 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- VJGNLOIQCWLBJR-UHFFFAOYSA-M benzyl(tributyl)azanium;chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CC1=CC=CC=C1 VJGNLOIQCWLBJR-UHFFFAOYSA-M 0.000 description 1
- OCBHHZMJRVXXQK-UHFFFAOYSA-M benzyl-dimethyl-tetradecylazanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 OCBHHZMJRVXXQK-UHFFFAOYSA-M 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229960004670 didecyldimethylammonium chloride Drugs 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- XKBGEWXEAPTVCK-UHFFFAOYSA-M methyltrioctylammonium chloride Chemical compound [Cl-].CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC XKBGEWXEAPTVCK-UHFFFAOYSA-M 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- SFVFIFLLYFPGHH-UHFFFAOYSA-M stearalkonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 SFVFIFLLYFPGHH-UHFFFAOYSA-M 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- MQAYPFVXSPHGJM-UHFFFAOYSA-M trimethyl(phenyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)C1=CC=CC=C1 MQAYPFVXSPHGJM-UHFFFAOYSA-M 0.000 description 1
- CEYYIKYYFSTQRU-UHFFFAOYSA-M trimethyl(tetradecyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCCC[N+](C)(C)C CEYYIKYYFSTQRU-UHFFFAOYSA-M 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
本発明は、ニッケルを含むめっき層で砥粒を固定した砥石部を備える電着砥石の製造方法に関する。 The present invention relates to a method for manufacturing an electrodeposition grindstone including a grindstone portion in which abrasive grains are fixed with a plating layer containing nickel.
ＬＥＤ等に代表される光デバイスの製造には、機械的・熱的特性、及び化学的安定性に優れたサファイア基板を使用することが多い。光デバイスを構成する各種機能膜が形成されたサファイア基板は、例えば、電着によって形成された環状のブレードで切削され、複数の光デバイスへと分割される（例えば、特許文献１参照）。 In the manufacture of optical devices typified by LEDs and the like, a sapphire substrate having excellent mechanical and thermal characteristics and chemical stability is often used. A sapphire substrate on which various functional films constituting an optical device are formed is cut by, for example, an annular blade formed by electrodeposition and divided into a plurality of optical devices (see, for example, Patent Document 1).
ところで、電着によって形成された上述のようなブレードでは、ニッケル等でなるめっき層によって砥粒が強く固定されている。そのため、サファイア基板のような難切削材を切削すると、古い砥粒が脱落して新たな砥粒が表出するいわゆる自生発刃が生じ難く、ブレードの加工能力を十分に発揮できないという問題が生じていた。 By the way, in the above-described blade formed by electrodeposition, abrasive grains are strongly fixed by a plating layer made of nickel or the like. Therefore, when cutting difficult-to-cut materials such as sapphire substrates, there is a problem that old abrasive grains fall off and new abrasive grains appear, so-called self-generated blades are not easily generated, and the blade's processing ability cannot be fully exhibited. It was.
本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、サファイア基板のような難切削材を加工する場合にも適切な自生発刃を生じ得る電着砥石の製造方法を提供することである。 The present invention has been made in view of such problems, and the object of the present invention is to provide a method for producing an electrodeposition grindstone capable of producing an appropriate self-generated blade even when a difficult-to-cut material such as a sapphire substrate is processed. Is to provide.
本発明によれば、ニッケルを含むめっき層で砥粒を固定した砥石部を備える電着砥石の製造方法であって、該砥粒を混入したニッケルめっき液が入っためっき浴槽を準備するめっき浴槽準備工程と、該砥石部を形成するための基台とニッケル電極とを該めっき浴槽内の該ニッケルめっき液に浸漬する浸漬工程と、該基台を陰極とし、該ニッケル電極を陽極として直流電流を流すことで、該基台の表面に該砥粒及び該めっき層を堆積させて該砥石部を形成する砥石部形成工程と、該基台の全部又は一部を除去して該砥石部の該基台で覆われていた領域の全部又は一部を露出させる基台除去工程と、を含み、該ニッケルめっき液には、該めっき層を多孔性構造とする添加剤を添加することを特徴とする電着砥石の製造方法が提供される。 According to the present invention, there is provided a method for manufacturing an electrodeposited grindstone comprising a grindstone portion in which abrasive grains are fixed with a plating layer containing nickel, and a plating bath for preparing a plating bath containing a nickel plating solution mixed with the abrasive grains. A preparatory step, a dipping step of immersing a base for forming the grindstone part and a nickel electrode in the nickel plating solution in the plating bath, a direct current using the base as a cathode and the nickel electrode as an anode The grinding wheel part forming step of forming the grinding wheel part by depositing the abrasive grains and the plating layer on the surface of the base, removing all or a part of the base and removing the grinding wheel part A base removal step for exposing all or part of the region covered with the base, and an additive for making the plating layer porous structure is added to the nickel plating solution. A method for producing an electrodeposition grindstone is provided.
本発明において、前記添加剤は、疎水性基を有する水溶性アンモニウム化合物を含むことが好ましい。 In the present invention, the additive preferably contains a water-soluble ammonium compound having a hydrophobic group.
また、本発明では、前記基台除去工程において前記基台の全部を除去することで、切削加工に用いるワッシャータイプの電着砥石を製造することができる。 Moreover, in this invention, the washer-type electrodeposition grindstone used for cutting can be manufactured by removing all the said bases in the said base removal process.
また、本発明では、前記基台除去工程において前記基台の一部を除去することで、切削加工に用いるハブタイプの電着砥石を製造することができる。 Moreover, in this invention, the hub type electrodeposition grindstone used for cutting can be manufactured by removing a part of said base in the said base removal process.
また、本発明では、前記基台除去工程において前記基台の一部を除去することで、研削加工に用いる電着砥石を製造することができる。 Moreover, in this invention, the electrodeposition grindstone used for a grinding process can be manufactured by removing a part of said base in the said base removal process.
本発明に係る電着砥石の製造方法では、添加剤をニッケルめっき液に添加してニッケルを含むめっき層を多孔性構造とするので、めっき層が適切に消耗し易くなり、自生発刃を促進できる。このように、本発明に係る電着砥石の製造方法によれば、サファイア基板のような難切削材を加工する場合にも適切な自生発刃を生じる電着砥石を製造できる。 In the electrodeposition grindstone manufacturing method according to the present invention, an additive is added to the nickel plating solution to make the plating layer containing nickel porous, so that the plating layer is easily consumed appropriately and promotes self-generated blades. it can. Thus, according to the method for producing an electrodeposition grindstone according to the present invention, it is possible to produce an electrodeposition grindstone that produces an appropriate self-generated blade even when processing a difficult-to-cut material such as a sapphire substrate.
添付図面を参照して、本発明の実施形態について説明する。なお、以下に示す実施形態１では、円環状の砥石部（切り刃）のみでなるワッシャータイプの電着砥石（ブレード）を製造する方法について説明し、実施形態２では、円盤状の基台（ハブ基台）の外周領域に円環状の砥石部が固定されたハブタイプの電着砥石を製造する方法について説明する。 Embodiments of the present invention will be described with reference to the accompanying drawings. In the first embodiment described below, a method for manufacturing a washer-type electrodeposition grindstone (blade) composed only of an annular grindstone portion (cutting blade) will be described. In the second embodiment, a disc-shaped base ( A method of manufacturing a hub-type electrodeposition grindstone in which an annular grindstone portion is fixed to the outer peripheral region of the hub base will be described.
（実施形態１）
本実施形態では、切削加工に用いるワッシャータイプの電着砥石（ブレード）を製造する方法について説明する。図１は、本実施形態に係る電着砥石の製造方法の概要を説明するための模式図である。
(Embodiment 1)
In this embodiment, a method for manufacturing a washer-type electrodeposition grindstone (blade) used for cutting will be described. Drawing 1 is a mimetic diagram for explaining an outline of a manufacturing method of an electrodeposition grindstone concerning this embodiment.
本実施形態に係る電着砥石の製造方法では、まず、図１に示すように、ニッケルめっき液Ａで満たしためっき浴槽２を準備するめっき浴槽準備工程を実施する。ニッケルめっき液Ａは、硫酸ニッケルや硝酸ニッケル等のニッケル（イオン）を含む電解液であり、ダイヤモンド等の砥粒が混入されている。なお、本実施形態では、硫酸ニッケルを２７０ｇ／Ｌ、塩化ニッケルを４５ｇ／Ｌ、ホウ酸を４０ｇ／Ｌ含むニッケルめっき液Ａ（ワット浴）を６Ｌ使用している。ただし、ニッケルめっき液Ａの構成や使用量は任意に設定できる。 In the method for producing an electrodeposition grindstone according to the present embodiment, first, as shown in FIG. 1, a plating bath preparation step for preparing a plating bath 2 filled with a nickel plating solution A is performed. The nickel plating solution A is an electrolytic solution containing nickel (ions) such as nickel sulfate and nickel nitrate, and is mixed with abrasive grains such as diamond. In this embodiment, 6 L of nickel plating solution A (Watt bath) containing 270 g / L of nickel sulfate, 45 g / L of nickel chloride, and 40 g / L of boric acid is used. However, the structure and usage amount of the nickel plating solution A can be arbitrarily set.
このニッケルめっき液Ａには、図１に示すように、多孔質化を促進するための添加剤Ｂがさらに添加される。添加剤Ｂとしては、アルキル基、アリール基、アラルキル基等の疎水性基を有する水溶性のアンモニウム化合物を含むもの用いることが好ましい。 As shown in FIG. 1, an additive B for promoting the porous formation is further added to the nickel plating solution A. The additive B preferably contains a water-soluble ammonium compound having a hydrophobic group such as an alkyl group, an aryl group, or an aralkyl group.
アルキル基としては、例えば、メチル、エチル、ｎ−プロピル、イソプロピル、ｎ−ブチル、イソブチル、ｓｅｃ−ブチル、ｔｅｒｔ−ブチル、ペンチル、ヘキシル、ヘプチル、オクチル、ノニル、デシル、ウンデシル、ドデシル、トリデシル、テトラデシル、ペンタデシル、ヘキサデシル、ヘプタデシル、オクタデシル等の直鎖又は分枝を有する炭素数が１〜２０のアルキル基を挙げることができる。 Examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl , Pentadecyl, hexadecyl, heptadecyl, octadecyl and the like, and straight chain or branched alkyl groups having 1 to 20 carbon atoms.
アリール基としては、例えば、フェニル基、ナフチル基等を挙げることができる。また、アリール基には、フッ素原子、塩素原子等のハロゲン原子、メチル、エチル等のアルキル基、トリフルオロメチル等のハロアルキル基、メトキシ、エトキシ等のアルコキシ基、フェニル等のアリール基等の置換基が結合していてもよい。 Examples of the aryl group include a phenyl group and a naphthyl group. In addition, the aryl group includes a substituent such as a halogen atom such as a fluorine atom and a chlorine atom, an alkyl group such as methyl and ethyl, a haloalkyl group such as trifluoromethyl, an alkoxy group such as methoxy and ethoxy, and an aryl group such as phenyl. May be combined.
アラルキル基としては、例えば、２−フェニルエチル、ベンジル、１−フェニルエチル、３−フェニルプロピル、４−フェニルブチル等の炭素数が７〜１０のアラルキル基等を挙げることができる。アラルキル基には、アリール基と同様の置換基が結合していても良い。 Examples of the aralkyl group include aralkyl groups having 7 to 10 carbon atoms such as 2-phenylethyl, benzyl, 1-phenylethyl, 3-phenylpropyl, 4-phenylbutyl, and the like. A substituent similar to the aryl group may be bonded to the aralkyl group.
アンモニウム化合物としては、ドデシルトリメチルアンモニウムクロライド、テトラデシルトリメチルアンモニウムクロライド、ヘキサデシルトリメチルアンモニウムクロライド、オクタデシルトリメチルアンモニウムクロライド、フェニルトリメチルアンモニウムクロライド、ベンジルトリメチルアンモニウムクロライド、ベンジルトリエチルアンモニウムクロライド、ベンジルトリブチルアンモニウムクロライド、ジデシルジメチルアンモニウムクロライド、ドデシルジメチルベンジルアンモニウムクロライド、テトラデシルジメチルベンジルアンモニウムクロライド、オクタデシルジメチルベンジルアンモニウムクロライド、トリオクチルメチルアンモニウムクロライド、ドデシルピリジニウムクロライド、ベンジルピリジニウムクロライド、これらの臭化物、硫酸塩等を挙げることができる。なお、これらのアンモニウム化合物は、単独で用いても良いし、２種類以上を混合して用いても良い。 As ammonium compounds, dodecyltrimethylammonium chloride, tetradecyltrimethylammonium chloride, hexadecyltrimethylammonium chloride, octadecyltrimethylammonium chloride, phenyltrimethylammonium chloride, benzyltriethylammonium chloride, benzyltriethylammonium chloride, benzyltributylammonium chloride, didecyldimethyl Ammonium chloride, dodecyldimethylbenzylammonium chloride, tetradecyldimethylbenzylammonium chloride, octadecyldimethylbenzylammonium chloride, trioctylmethylammonium chloride, dodecylpyridinium chloride, benzylpyridinium chloride Id, these bromides, may be mentioned sulfates. In addition, these ammonium compounds may be used independently and may be used in mixture of 2 or more types.
本実施形態では、添加剤Ｂとして奥野製薬工業株式会社製の「トップポーラスニッケルＲＳＮ」を用い、ニッケルめっき液Ａに対して１ｍＬ/Ｌ以上１０ｍＬ/Ｌ以下となるように添加する。 In the present embodiment, “Top Porous Nickel RSN” manufactured by Okuno Pharmaceutical Co., Ltd. is used as the additive B, and is added to the nickel plating solution A so as to be 1 mL / L or more and 10 mL / L or less.
めっき浴槽準備工程を実施した後には、電着により砥石部が形成される基台４とニッケル電極６とをめっき浴槽２内のニッケルめっき液Ａに浸漬する浸漬工程を実施する。基台４は、例えば、ステンレスやアルミニウム等の金属材料で円盤状に形成されており、その表面には、所望の砥石部の形状に対応したマスク４ａが形成されている。なお、本実施形態では、円環状の砥石部を形成できるようなマスク４ａが形成される。 After performing the plating bath preparation step, an immersion step is performed in which the base 4 on which the grindstone portion is formed by electrodeposition and the nickel electrode 6 are immersed in the nickel plating solution A in the plating bath 2. The base 4 is formed in a disk shape with a metal material such as stainless steel or aluminum, for example, and a mask 4a corresponding to a desired shape of the grindstone is formed on the surface thereof. In the present embodiment, the mask 4a that can form an annular grindstone is formed.
基台４は、スイッチ８を介して直流電源１０のマイナス端子（負極）に接続される。一方、ニッケル電極６は、直流電源１０のプラス端子（正極）に接続される。ただし、スイッチ８は、ニッケル電極６と直流電源１０との間に配置されても良い。 The base 4 is connected to the negative terminal (negative electrode) of the DC power supply 10 via the switch 8. On the other hand, the nickel electrode 6 is connected to the plus terminal (positive electrode) of the DC power supply 10. However, the switch 8 may be disposed between the nickel electrode 6 and the DC power supply 10.
浸漬工程を実施した後には、基台４を陰極、ニッケル電極６を陽極としてニッケルめっき液Ａに直流電流を流し、マスク４ａで覆われていない基台４の表面に砥粒及びめっき層を堆積させて砥石部を形成する砥石部形成工程を実施する。図２（Ａ）は、砥石部形成工程を模式的に示す断面図である。 After performing the dipping process, direct current is passed through the nickel plating solution A using the base 4 as a cathode and the nickel electrode 6 as an anode, and abrasive grains and plating layers are deposited on the surface of the base 4 not covered with the mask 4a. The grindstone part forming step of forming the grindstone part is performed. FIG. 2A is a cross-sectional view schematically showing the grinding wheel portion forming step.
具体的には、図１に示すように、モータ等の回転駆動源１２でファン１４を回転させてニッケルめっき液Ａを攪拌しながら、基台４と直流電源１０との間に配置されたスイッチ８を短絡させる。これによって、図２（Ａ）に示すように、ニッケルを含むめっき層中に砥粒が概ね均等に分散された砥石部１６を形成できる。所望の厚さの砥石部１６が得られると、砥石部形成工程は終了する。 Specifically, as shown in FIG. 1, a switch disposed between the base 4 and the DC power source 10 while rotating the fan 14 with a rotational drive source 12 such as a motor and stirring the nickel plating solution A. 8 is short-circuited. Thereby, as shown in FIG. 2 (A), the grindstone portion 16 in which the abrasive grains are substantially uniformly dispersed in the plating layer containing nickel can be formed. When the grindstone part 16 having a desired thickness is obtained, the grindstone part forming process is completed.
砥石部形成工程を実施した後には、基台４を除去して、砥石部１６の基台４で覆われていた領域を露出させる基台除去工程を実施する。図２（Ｂ）は、基台除去工程を模式的に示す断面図であり、図２（Ｃ）は、完成した電着砥石を模式的に示す斜視図であり、図３は、電着砥石の砥石部１６を走査型電子顕微鏡で撮影した写真である。 After carrying out the grinding wheel portion forming step, the base 4 is removed, and a base removing step is performed to expose the region covered with the base 4 of the grinding stone portion 16. 2B is a cross-sectional view schematically showing the base removal process, FIG. 2C is a perspective view schematically showing the completed electrodeposition grindstone, and FIG. 3 is an electrodeposition grindstone. It is the photograph which image | photographed the grindstone part 16 of this with the scanning electron microscope.
図２（Ｂ）に示すように、本実施形態では、基台４から砥石部１６を剥離させる。すなわち、砥石部１６から基台４をすべて除去する。これにより、円環状の砥石部１６のみでなるワッシャータイプの電着砥石１が完成する。 As shown in FIG. 2B, in the present embodiment, the grindstone portion 16 is peeled from the base 4. That is, the entire base 4 is removed from the grindstone portion 16. As a result, the washer-type electrodeposition grindstone 1 including only the annular grindstone portion 16 is completed.
本実施形態に係る電着砥石の製造方法では、添加剤Ｂをニッケルめっき液Ａに添加してニッケルを含むめっき層を多孔性構造とするので、めっき層が適切に消耗し易くなり、自生発刃を促進できる。よって、サファイア基板のような難切削材を加工する場合にも適切な自生発刃を生じ得る電着砥石１を製造できる。 In the method for producing an electrodeposition grindstone according to this embodiment, the additive layer B is added to the nickel plating solution A to make the plating layer containing nickel a porous structure. You can promote the blade. Therefore, even when processing difficult-to-cut materials such as a sapphire substrate, it is possible to manufacture the electrodeposition grindstone 1 that can produce an appropriate self-generated blade.
なお、本実施形態に係る電着砥石１では、多孔性構造ではない従来の電着砥石に比べて、めっき層の消耗度が約３０パーセント向上した。 In addition, in the electrodeposition grindstone 1 which concerns on this embodiment, the wear degree of the plating layer improved about 30% compared with the conventional electrodeposition grindstone which is not a porous structure.
（実施形態２）
本実施形態では、切削加工に用いるハブタイプの電着砥石（ブレード）を製造する方法について説明する。なお、本実施形態に係る電着砥石の製造方法の大部分は、実施形態１に係る電着砥石の製造方法と同じである。よって、本実施形態では、実施形態１との相違点について主に説明する。
(Embodiment 2)
In the present embodiment, a method for manufacturing a hub-type electrodeposition grindstone (blade) used for cutting will be described. In addition, most of the manufacturing method of the electrodeposition grindstone which concerns on this embodiment is the same as the manufacturing method of the electrodeposition grindstone which concerns on Embodiment 1. FIG. Therefore, in the present embodiment, differences from the first embodiment will be mainly described.
図４は、本実施形態に係る電着砥石の製造方法の概要を説明するための模式図である。本実施形態に係る電着砥石の製造方法では、まず、ニッケルめっき液Ａで満たしためっき浴槽２を準備するめっき浴槽準備工程を実施する。なお、本実施形態でも、ニッケルめっき液Ａに添加剤Ｂを添加する。詳細については、実施形態１の記載を参酌できる。 FIG. 4 is a schematic view for explaining the outline of the method for producing an electrodeposited grindstone according to the present embodiment. In the method for producing an electrodeposition grindstone according to the present embodiment, first, a plating bath preparation step for preparing the plating bath 2 filled with the nickel plating solution A is performed. Also in this embodiment, the additive B is added to the nickel plating solution A. For details, the description of Embodiment 1 can be referred to.
めっき浴槽準備工程を実施した後には、電着により砥石部が形成される基台１８とニッケル電極６とをめっき浴槽２内のニッケルめっき液Ａに浸漬する浸漬工程を実施する。基台１８は、例えば、ステンレスやアルミニウム等の金属材料で円盤状に形成されており、その表面には、所望の砥石部の形状に対応したマスク１８ａが形成されている。なお、本実施形態では、この基台１８が電着砥石の一部となる。 After performing the plating bath preparation step, an immersion step is performed in which the base 18 on which the grindstone portion is formed by electrodeposition and the nickel electrode 6 are immersed in the nickel plating solution A in the plating bath 2. The base 18 is formed in a disk shape from a metal material such as stainless steel or aluminum, and a mask 18a corresponding to the shape of a desired grindstone is formed on the surface thereof. In this embodiment, the base 18 becomes a part of the electrodeposition grindstone.
基台１８は、スイッチ８を介して直流電源１０のマイナス端子（負極）に接続される。一方、ニッケル電極６は、直流電源１０のプラス端子（正極）に接続される。ただし、スイッチ８は、ニッケル電極６と直流電源１０との間に配置されても良い。 The base 18 is connected to the negative terminal (negative electrode) of the DC power supply 10 via the switch 8. On the other hand, the nickel electrode 6 is connected to the plus terminal (positive electrode) of the DC power supply 10. However, the switch 8 may be disposed between the nickel electrode 6 and the DC power supply 10.
浸漬工程を実施した後には、基台１８を陰極、ニッケル電極６を陽極としてニッケルめっき液Ａに直流電流を流し、マスク１８ａで覆われていない基台１８の表面に砥粒及びめっき層を堆積させて砥石部を形成する砥石部形成工程を実施する。 After performing the dipping process, a direct current is passed through the nickel plating solution A using the base 18 as a cathode and the nickel electrode 6 as an anode, and abrasive grains and plating layers are deposited on the surface of the base 18 not covered with the mask 18a. The grindstone part forming step of forming the grindstone part is performed.
具体的には、図４に示すように、モータ等の回転駆動源１２でファン１４を回転させてニッケルめっき液Ａを攪拌しながら、基台１８と直流電源１０との間に配置されたスイッチ８を短絡させる。これによって、ニッケルを含むめっき層中に砥粒が概ね均等に分散された砥石部２０（図５（Ａ）参照）を形成できる。所望の厚さの砥石部２０が得られると、砥石部形成工程は終了する。 Specifically, as shown in FIG. 4, a switch disposed between the base 18 and the DC power source 10 while the fan 14 is rotated by a rotational drive source 12 such as a motor to stir the nickel plating solution A. 8 is short-circuited. Thereby, the grindstone part 20 (refer FIG. 5 (A)) by which the abrasive grain was disperse | distributed substantially uniformly in the plating layer containing nickel can be formed. When the grindstone portion 20 having a desired thickness is obtained, the grindstone portion forming step is completed.
砥石部形成工程を実施した後には、基台１８の一部を除去して、砥石部２０の基台１８で覆われていた領域を露出させる基台除去工程を実施する。図５（Ａ）は、基台除去工程を実施する前の基台１８の状態を模式的に示す断面図であり、図５（Ｂ）は、基台除去工程を模式的に示す断面図であり、図５（Ｃ）は、完成した電着砥石を模式的に示す斜視図である。 After carrying out the grindstone part forming step, a part of the base 18 is removed, and a base removal process for exposing the region covered with the base 18 of the grindstone part 20 is carried out. FIG. 5A is a cross-sectional view schematically showing the state of the base 18 before the base removal process is performed, and FIG. 5B is a cross-sectional view schematically showing the base removal process. FIG. 5C is a perspective view schematically showing the completed electrodeposition grindstone.
図５（Ａ）に示すように、基台除去工程を実施する前には、マスク１８ａを除去しておく。基台除去工程では、図５（Ｂ）に示すように、基台１８において砥石部２０が形成されていない側の外周領域を部分的にエッチングして、基台１８に覆われていた砥石部２０の一部を露出させる。これにより、円盤状の基台１８の外周領域に円環状の砥石部２０が固定されたハブタイプの電着砥石３が完成する。本実施形態でも、実施形態１と同様の効果を得ることができる。 As shown in FIG. 5A, the mask 18a is removed before the base removal process. In the base removal process, as shown in FIG. 5 (B), the outer peripheral region on the side where the grindstone portion 20 is not formed in the base 18 is partially etched to cover the grindstone portion covered with the base 18. A portion of 20 is exposed. Thus, the hub type electrodeposition grindstone 3 in which the annular grindstone portion 20 is fixed to the outer peripheral region of the disk-shaped base 18 is completed. In this embodiment, the same effect as that of the first embodiment can be obtained.
なお、本発明は上記実施形態の記載に限定されず、種々変更して実施可能である。例えば、上記実施形態では、めっき浴槽準備工程でニッケルめっき液Ａに添加剤Ｂを添加しているが、本発明はこの態様に限定されない。添加剤Ｂは、少なくとも、砥石部形成工程の前に添加されれば良い。 In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the said embodiment, although the additive B is added to the nickel plating liquid A at the plating bath preparation process, this invention is not limited to this aspect. Additive B should just be added at least before a whetstone part formation process.
また、上記実施形態では、切削加工に用いるワッシャータイプ又はハブタイプの電着砥石（ブレード）を製造する例について説明しているが、例えば、実施形態２と同様の方法で研削加工に用いる電着砥石（研削砥石）を製造することもできる。 Moreover, although the said embodiment demonstrated the example which manufactures the washer type or hub type electrodeposition grindstone (blade) used for cutting, for example, the electrodeposition used for grinding by the method similar to Embodiment 2 A grindstone (grinding grindstone) can also be manufactured.
その他、上記実施形態に係る構成、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the configurations, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.
２ めっき浴槽
４，１８ 基台
６ ニッケル電極
８ スイッチ
１０ 直流電源
１２ 回転駆動源
１４ ファン
１６，２０ 砥石部
１，３ 電着砥石
Ａ ニッケルめっき液
Ｂ 添加剤
2 Plating bath 4,18 Base 6 Nickel electrode 8 Switch 10 DC power supply 12 Rotation drive source 14 Fan 16, 20 Grinding wheel part 1,3 Electrodeposition grindstone A Nickel plating solution B Additive
Claims (5)
該砥粒を混入したニッケルめっき液が入っためっき浴槽を準備するめっき浴槽準備工程と、
該砥石部を形成するための基台とニッケル電極とを該めっき浴槽内の該ニッケルめっき液に浸漬する浸漬工程と、
該基台を陰極とし、該ニッケル電極を陽極として直流電流を流すことで、該基台の表面に該砥粒及び該めっき層を堆積させて該砥石部を形成する砥石部形成工程と、
該基台の全部又は一部を除去して該砥石部の該基台で覆われていた領域の全部又は一部を露出させる基台除去工程と、を含み、
該ニッケルめっき液には、該めっき層を多孔性構造とする添加剤を添加することを特徴とする電着砥石の製造方法。 A method for producing an electrodeposition grindstone comprising a grindstone portion in which abrasive grains are fixed with a plating layer containing nickel,
A plating bath preparation step of preparing a plating bath containing a nickel plating solution mixed with the abrasive grains;
An immersion step of immersing the base for forming the grinding wheel portion and the nickel electrode in the nickel plating solution in the plating bath;
A grindstone part forming step of forming the grindstone part by depositing the abrasive grains and the plating layer on the surface of the base by passing a direct current using the base as a cathode and the nickel electrode as an anode;
A base removing step of removing all or a part of the base to expose all or a part of the region covered with the base of the grindstone part,
An electrodeposition grindstone manufacturing method, wherein an additive for making the plating layer porous structure is added to the nickel plating solution.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109465760A (en) * | 2018-12-24 | 2019-03-15 | 重庆新腾源环保科技有限公司 | A kind of Carborundum wheel plant sand nickel plating production line |
| JP2019130649A (en) * | 2018-02-02 | 2019-08-08 | 株式会社ディスコ | Annular grindstone, and method for manufacture of annular grindstone |
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| JP2020151835A (en) * | 2019-03-22 | 2020-09-24 | 株式会社ディスコ | Manufacturing method for annular grindstone |
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