JP2010173015A - Nickel-plated film, cutting tool using the nickel-plated film, and method of forming the nickel-plated film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a nickel plated film used as a coupling member for an electrodeposition cutting tool, in particular, with the excellent retention power of abrasive grains, and to provide the cutting tool using such a nickel-plated film and a method of forming the nickel-plated film. <P>SOLUTION: By applying electroplating using a nickel plating solution as a plating liquid with a current density of 1.0-4.0 A/dm<SP>2</SP>to bring an average particle diameter of deposited nickel particles into a range of 0.009-0.5 μm. The cutting tool is constituted so as to have an abrasive grain layer 1 including abrasive grains 3 fixed by the nickel-plated film 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a nickel plating film used for electrodepositing abrasive grains in a grinding tool such as an electrodeposition bond wheel, an electrodeposition grindstone, and an electroformed blade, a grinding tool using the nickel plating film, and a nickel plating film. The present invention relates to a film forming method.

  A metal film formed by a plating method in which hard ceramic particles and the like are dispersed is used for the purpose of reducing wear at a machine sliding portion because of its excellent wear resistance. Electrodeposition grinding tools, etc., which are known as products that apply these excellent wear resistance effects, are used as fixed abrasive tools for grinding, cutting, etc. with ceramics, cemented carbide, and various electronics-related materials.

  For example, Patent Documents 1 to 3 describe electroformed blades used for ultraprecision cutting of semiconductor elements and electronic components. In other words, such an electroformed blade is a disc-shaped blade in which diamond abrasive grains are held by an ultra-thin nickel plating film. A base metal is placed in a nickel plating solution in which diamond abrasive grains are dispersed, and diamond Abrasive layer is formed by depositing a nickel plating film on the base metal by electrolytic plating while taking in the abrasive grains. is there.

  Further, in Patent Document 4, when polishing the surface of a semiconductor wafer or the like with a pad of a CMP apparatus, as a CMP conditioner for conditioning the polishing pad, diamond abrasive grains are also deposited on the surface of the conditioner body. There has been proposed one in which an abrasive layer fixed by the above is formed. In addition to processing such electronics-related materials, such grinding tools can be used for precision processing such as ferrite processing and lens centering processing, or groove processing of cemented carbide rolls. Also do.

JP 2002-187071 A JP 2003-225867 A JP 2005-288614 A JP 2004-66409 A

  By the way, in general, in such a grinding tool, a so-called self-sharpening action in which abrasive grains worn by processing fall off and new abrasive grains are sputtered by wearing the binding material holding the abrasive grains. To maintain a sharp sharpness. However, in such a self-generated blade, for example, when the progress of wear of the binding material is significant with respect to diamond abrasive grains that are hard and difficult to wear, the abrasive grains fall off together with the sharpness and sharpness. The tool life will be crushed in a short time.

  In particular, it is difficult to maintain the shape of the abrasive layer with such a binder that easily wears. For example, with an electroformed blade as described in Patent Documents 1 to 3, it is difficult to keep the edge of the cutting edge sharp. There is a risk that burrs may occur in the cut semiconductor element. Further, in the CMP conditioner described in Patent Document 4, if abrasive grains fall off due to wear of the binding material, this damages the surface of the semiconductor wafer to be polished by the CMP apparatus and causes so-called scratches, so that the dropout occurs. The conditioner must be changed at an early stage, and the tool life is further shortened.

  The present invention has been made under such a background. In particular, the present invention provides a nickel plating film excellent in holding power of abrasive grains as a binder for an electrodeposition grinding tool as described above. It aims at providing the grinding tool using a plating film, and the film-forming method of this nickel plating film.

  Here, the inventors of the present invention have made extensive studies on such nickel plating films. As a result, in order to extend the tool life as described above, the nickel particles after electrodeposition are made dense and the particle diameter is reduced. This has led to the finding that it is necessary to fix abrasive grains such as diamond with a high holding force. In other words, if the particle diameter of nickel particles deposited by electrolytic plating is small, the abrasive grains such as diamond can be held firmly with a larger contact area without gaps, and the nickel particles are in close contact with each other and bonded together. Since the material is formed, wear of the binding material can be suppressed.

  Therefore, the nickel plating film of the present invention is made based on such knowledge, and the average particle diameter of nickel particles deposited by electrolytic plating is in the range of 0.009 to 0.5 μm. It is a nickel plating film, and the grinding tool of the present invention is a grinding tool using a nickel plating film characterized by having an abrasive layer to which abrasive grains are fixed by such a nickel plating film.

  That is, in the nickel plating film having the above-described structure, the nickel particles are densely joined to each other by making the average particle diameter of the nickel particles deposited by electrolytic plating as dense as 0.009 to 0.5 μm. Thus, the plating film itself can be formed with high hardness. In such a grinding tool in which the abrasive grains are fixed by the nickel plating film, the plating film itself has high hardness and its wear is suppressed, and since the abrasive grains and the nickel particles are in close contact, the contact area Can be secured, and an abrasive layer having high abrasive grain retention and less abrasive grains can be formed.

  Here, when the average particle diameter of the nickel particles is larger than 0.5 μm in the nickel plating film, the nickel particles are closely bonded as described above, or a sufficient contact area with the abrasive grains is ensured. In other words, it is impossible to suppress wear of the plating film and dropping off of the abrasive grains. In addition, it is desirable that the average particle size is smaller within the above range. However, if the average particle size is too small to be less than 0.009 μm, the electrodeposition rate of nickel particles by electroplating becomes too slow, and a significant time is required for film formation. In particular, even when trying to fix the abrasive grains as a grinding wheel, the abrasive grains move during the film formation, and a gap is formed between the deposited nickel particles, and the holding power is impaired. There is a possibility that the abrasive grains cannot be fixed.

Moreover, the film-forming method of the nickel plating film of the present invention for forming such a nickel plating film is electrolytic plating at a current density of 1.0 to 4.0 A / dm ² using a nickel plating solution as a plating solution. It is characterized by that.

That is, by performing electrolytic plating while gradually depositing nickel particles at such a small current density, dense nickel particles having a small average particle diameter as described above can be obtained. In this regard, for example, in Patent Documents 1 to 3, the current density at the time of electrolytic plating is 5.0 to 7.0 A / dm ² , and in Patent Document 4 is 30 A / dm ² , and such a large current density is Dense nickel particles cannot be deposited. On the other hand, if the current density is too small, the electrodeposition rate is too slow, requiring film formation time, or the function as an abrasive layer in the grinding wheel may be lost.

  As described above, according to the present invention, a hard nickel plating film can be obtained, and in particular, the abrasive grains are firmly held as a binder of the abrasive layer in the grinding wheel, and the strength and wear resistance are also improved. It can be greatly improved. For this reason, it is possible to provide a long-life grinding tool capable of high-precision and efficient machining by maintaining the shape of the cutting edge in an electroformed blade or the like, and preventing abrasive grains from falling off in a CMP conditioner. .

It is the schematic which shows one Embodiment of the grinding tool which has an abrasive grain layer using one Embodiment of the nickel plating film of this invention. It is a figure explaining the film-forming method of the nickel plating film of this invention. It is a figure which shows the structure | tissue of the nickel plating film formed into a film by the Example (Example ² of current density 2.0A / dm2) of this invention.

As shown in FIG. 1, the abrasive grain layer 1 in the grinding tool of one embodiment of the present invention is obtained by dispersing and fixing abrasive grains 3 such as diamond on the nickel plating film 2 of one embodiment of the present invention. In addition to the abrasive grains 3, hard ceramic particles such as Al ₂ O ₃ , SiC, ZrO ₂ , and Si ₃ N ₄ may be filled as the filler 4. When the grinding tool has a base metal (substrate) such as the above-described CMP conditioner, the abrasive layer 1 is used as it is formed on the base metal, and the grinding tool is used as the base metal. In the case of an electroformed blade with no blade, it is formed on the base metal until it has a predetermined thickness, and is then peeled off from the base metal.

  As shown in FIG. 2, such an abrasive grain layer 1 is disposed in the plating tank 11 through the non-conductive pedestal 12 so that the base metal 13 is horizontally disposed on the bottom of the plating tank 11 and serves as a cathode of the power source. At the same time, an anode plate 14 connected to the anode of the power source is disposed in parallel with the base metal 13, and the abrasive grains 3 and, if necessary, the filler 4 are dispersed in the plating tank 11. By holding the nickel plating solution M and immersing the base metal 13 and the anode plate 14 and energizing the nickel plating solution M with the power supply while stirring, the above-mentioned abrasive grains 3 and filler 4 are taken in on the base metal 13. The nickel plating film 2 is formed by depositing nickel particles by electrolytic plating.

And in this embodiment of the film-forming method of this invention when forming the nickel plating film 2 of the said embodiment, the current density at the time of performing electrolytic plating in this way is 1.0-4.0 A / dm < ² >. Further, in the nickel plating film 2 of the present embodiment formed in this way, the average particle diameter of nickel particles deposited by electrolytic plating is in the range of 0.009 to 0.5 μm as shown in FIG. Has been.

  In the nickel plating film 2 configured as described above, the nickel particles thus precipitated are densely bonded to each other by making the average particle diameter of the nickel particles as dense as 0.009 to 0.5 μm. The plating film 2 can be formed with high hardness. For this reason, in the abrasive grain layer 1 in which the abrasive grains 3 are held by the nickel plating film 2, the wear of the nickel plating film 2 can be suppressed, and the precipitated nickel particles have an extremely smaller average than the abrasive grains 3. Because of the particle size, the nickel particles can be tightly bonded to the abrasive grains 3 and a large contact area can be secured, thereby suppressing the wear of the abrasive grain layer 1 itself and It is possible to improve the mechanical holding force to suppress and prevent dropping, and to obtain a long-life abrasive layer 1 having a high grinding ratio and the like.

  Therefore, in a grinding tool provided with such an abrasive grain layer 1, when this is an electroformed blade, the cutting edge shape (edge) can be kept sharp over a long period of time, and cutting As a result, it is possible to prevent burrs from being generated in the semiconductor element or the like, and to achieve high-precision and high-quality cutting. Further, when the grinding tool is a CMP conditioner, it is possible to prevent scratches from occurring on the surface of the semiconductor wafer polished by the CMP apparatus by preventing the abrasive grains from falling off as described above. Furthermore, even with grinding tools other than these electroformed blades and CMP conditioners, it is possible to provide a long-life grinding tool by suppressing the wear of the abrasive grain layer 1.

  Here, in the said nickel plating film 2, when the average particle diameter of the deposited nickel particle becomes larger than 0.5 micrometer, nickel particles or nickel particles and the abrasive grain 3 can be closely joined as mentioned above. There is a possibility that the gap becomes larger and the wear of the abrasive grain layer 1 and the dropping of the abrasive grain 3 cannot be sufficiently suppressed. On the other hand, if nickel particles having an average particle diameter that is smaller than 0.009 μm are deposited, it takes a long time to form the nickel plating film 2 having a required film thickness.

  Further, particularly when the abrasive grains 3 are fixed by the nickel plating film 2 to form the abrasive grain layer 1 as in the grinding wheel of the above-described embodiment, the time required for the film formation is thus increased. The abrasive grains 3 adhered to the base metal by 2 may shift while the nickel plating film 2 grows, and a gap may be formed between the deposited nickel particles. And when a clearance gap arises between the abrasive grain 3 and the nickel particle in this way, the holding force of the abrasive grain 3 will be impaired and the abrasive grain 3 cannot be held but the required number of abrasive grains in the abrasive layer 1 There is a possibility that the grains 3 can be fixed and the grinding performance such as the grinding ratio is lowered.

Furthermore, even in the film forming method of the present embodiment, when the current density at the time of electrolytic plating is less than 1.0 A / dm ² , the average particle diameter of the deposited nickel particles becomes less than 0.009 μm, while the current density If it exceeds 4.0 A / dm ² , the average particle size becomes larger than 0.5 μm, and the same problem as described above may occur. In addition, if it is in these ranges, the one where the average particle diameter of nickel particle | grains and the current density in the case of electroplating are both smaller is desirable.

  Moreover, although this embodiment demonstrated the case where the nickel plating film of this invention and its film-forming method were applied to form the abrasive grain layer 1 of the grinding tool which disperse | distributed the abrasive grain 3, nickel plating film itself has been demonstrated. Utilizing the high hardness and high wear resistance, the wear-resistant nickel plating film not containing the abrasive grains 3 can be used for coating various members.

Next, the effect of the present invention will be demonstrated with examples of the present invention. In this example, the current density during electrolytic plating was changed by 1.0 A / dm ^{2 in} the range of 1.0 to 4.0 A / dm ² , and nickel having an average particle size of 0.009 μm to 0.5 μm. Four types of grinding tools on which particles were deposited were produced. These are shown in Table 1 as Examples 1 to 4 together with the current density, nickel particle diameter, and average particle diameter.

Further, as Comparative Examples 1 to 4, 4 in the range where the current density is less than 1.0 A / dm ² and greater than 4.0 A / dm ² and the average particle size is less than 0.009 μm and greater than 0.5 μm. A kind of grinding tool was manufactured. These are also shown in Table 1 as Comparative Examples 1 to 4. And the grinding test was done with the grinding tool of these Examples 1-4 and Comparative Examples 1-4, and the grinding ratio was measured. The results are also shown in Table 1.

In Examples 1 to 4 and Comparative Examples 1 to 4, a nickel sulfamate plating solution M in which diamond abrasive grains having a particle size # 400 and Al ₂ O ₃ filler having a particle size # 2000 are dispersed is shown in FIG. So that the pH is adjusted to 3 to 4 by adding a brightener, boric acid, and a surfactant, and electrolytic plating is performed at the current densities shown in Table 1, respectively. An abrasive layer was formed on the base metal.

Moreover, the abrasive grain layer thus formed is an annular one having an outer diameter of 200 mm, an inner diameter of 50.8 mm, and a thickness of 7 mm in each of Examples 1 to 4 and Comparative Examples 1 to 4. Incidentally, the content of the diamond abrasive grains in the abrasive grain layer is about 20 vol% with the exception of Comparative Example 1, the content of Al ₂ O ₃ filler was about 10 vol%. Furthermore, the conditions of the grinding test are according to the reciprocating grinding method, the work material is glass, wet grinding, the peripheral speed of the grinding tool is 1500 m / min, the feed speed is 5 m / min, and the cutting depth is 0.01 mm. .

From the results of Table 1, when the current density is 1.0 A / dm ² or more and the average particle diameter of the nickel particles is 0.009 μm or more, the grinding ratio is improved as the current density and the average particle diameter are decreased. In particular, in Examples 1 to 4, it can be seen that superior results are obtained as compared with Comparative Examples 2 to 4.

Further, similarly Among these Examples 1 to 4, the current density and the average particle size of each even 0.009μm or more 1.0A / dm ² or more, 4.0A / dm ² or less 0. Example 3 of 3.0 A / dm ² or less and 0.100 μm or less than Example 4 of 500 μm or less, and Example of 2.0 A / dm ² or less and 0.050 μm or less than Example 3 It can be seen that the grinding ratio of Example 2 is 1.0 A / dm ² and 0.100 μm or less is higher than that of Example 2.

However, in Comparative Example 1 in which both the current density and the average particle diameter are smaller than those in Example 1, the grinding ratio is significantly lower than those in Examples 1 to 4. Here, the content rate of the diamond abrasive grains in the abrasive layer of Comparative Example 1 is 10 vol%, and the content rate of the Al ₂ O ₃ filler is 5 vol%, which is less than those in Examples 1 to 4 and Comparative Examples 2 to 4. I understood. This is because if the current density is too small as in Comparative Example 1, the electrodeposition rate of nickel particles is slowed as described above, and the function of fixing diamond abrasive grains and fillers is weakened, and the abrasive layer is used as a grinding tool. This is considered to be because it was impossible to secure the required number of abrasive grains, and it was considered that this reduced the grinding ratio.

DESCRIPTION OF SYMBOLS 1 Abrasive grain layer 2 Nickel plating film 3 Abrasive grain 4 Filler M Nickel plating solution

Claims (3)

  A nickel plating film, wherein an average particle diameter of nickel particles deposited by electrolytic plating is in a range of 0.009 to 0.5 μm.   A grinding tool using a nickel plating film, comprising an abrasive layer in which abrasive grains are fixed by the nickel plating film according to claim 1. The nickel plating film forming method according to claim 1, wherein the electroplating is performed at a current density of 1.0 to 4.0 A / dm ² using a nickel plating solution as a plating solution. The film forming method.

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