JP6650222B2 - Cutting blade and manufacturing method thereof - Google Patents

Description

  According to the present invention, the outer peripheral edge of a blade main body having a disk shape is a cutting edge, and a conductive phase is formed on a plating phase (a solid phase of a metal formed by plating; a plating layer; a plating film) of the blade main body. The present invention relates to a cutting blade in which diamond abrasive grains and a non-conductive diamond filler are dispersed, and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, an electroformed blade (blade for cutting) has been used for ultra-precision cutting of a material to be cut such as a semiconductor element or an electronic component. The electroformed blade has a blade main body in the shape of a disc, and the outer peripheral edge of the blade main body is a cutting edge, and the cutting edge cuts the workpiece. The blade main body is formed by holding abrasive grains such as diamond and cBN and fillers such as SiC smaller than the abrasive grains in a plating phase made of, for example, Ni. The abrasive grains mainly contribute to improving the workability, and the filler mainly contributes to improving the rigidity of the blade body.

For example, Patent Literature 1 below discloses a basic method for manufacturing an electroformed blade. In Patent Literature 1, a cathode (cathode electrode), which is a base metal for depositing a blade body, is arranged in a Ni plating solution in which abrasive grains are dispersed, and Ni is introduced onto the base metal by electrolytic plating while incorporating the abrasive grains. Deposit the plating phase. Then, when the Ni plating phase reaches a predetermined thickness, the Ni plating phase is peeled off from the base metal and subjected to electrolytic polishing, lapping, and the like to sharpen the abrasive grains.
Patent Literature 2 below discloses an electroformed blade in which a filler such as SiC or h-BN is co-deposited (precipitated) in a Ni plating phase together with abrasive grains in order to increase the rigidity of the blade body.

  In the cutting blade manufactured by electrolytic plating, in addition to the washer-type blade whose blade main body is attached to the main shaft of the cutting device via a flange, as in the above-described electroformed blade, the base metal during electroforming is used. There is known a hub type blade in which a plating phase (blade body) is kept fixed and the base metal is attached to a main shaft.

Japanese Patent No. 392168 JP-A-2002-187071

  By the way, with this type of cutting blade, the kerf width during dicing (the width of a cutting line formed on the material to be cut by cutting) is reduced as the material to be cut such as a semiconductor element or an electronic component becomes smaller. Therefore, it is necessary to make the blade thinner (thinner). However, in the conventional electroformed blade, if the blade body is simply made thinner, the hardness and rigidity of the blade body decrease, and the amount of chipping increases or meanders occur during the cutting process, thereby lowering the cutting accuracy. I do.

  The present invention has been made in view of such circumstances, and even if the blade main body is thinned, it is possible to sufficiently secure the hardness and rigidity of the blade main body, thereby improving the cutting accuracy. An object of the present invention is to provide a cutting blade capable of performing high-quality and stable cutting while suppressing a kerf width as a result of maintaining the calf width, and a method of manufacturing the same.

In order to solve such problems and achieve the above object, the present invention proposes the following means.
That is, the present invention is a cutting blade in which the outer peripheral edge of a blade body having a disk shape is a cutting edge, wherein the blade body has a plating phase, and diamond abrasive grains dispersed in the plating phase. A diamond filler dispersed in the plating phase and having an average particle diameter smaller than the diamond abrasive grains, wherein the diamond abrasive grains have a conductive portion different from the plating phase, and the diamond abrasive grains conductive portions of the Ri do from carbon graphite, the diamond filler is characterized by having no different conductive portion and said plating phase.
Further, the present invention is a cutting blade in which an outer peripheral edge of a disk-shaped blade main body is a cutting edge, wherein the blade main body includes a plating phase made of Ni, and a diamond abrasive dispersed in the plating phase. Grains, and a diamond filler dispersed in the plating phase and having a smaller average particle size than the diamond abrasive grains, wherein the diamond abrasive grains have a conductive portion different from the plating phase, and the diamond conductive portions of the abrasive grains, Ri do from high hardness Ni-based compounds than Ni, said diamond filler is characterized by having no different conductive portion and said plating phase.
Further, the present invention is a cutting blade in which the outer peripheral edge of a blade body having a disk shape is a cutting edge, wherein the blade body has a plating phase, and diamond abrasive grains dispersed in the plating phase, A diamond filler dispersed in the plating phase and having a smaller average particle size than the diamond abrasive grains, wherein the diamond abrasive grains have a conductive portion different from the plating phase , conductive portion, Ri Pd or Ti Tona, the diamond filler is characterized by having no different conductive portion and said plating phase.
Further, the present invention is a method for producing a cutting blade in which the outer peripheral edge of a disk-shaped blade main body is a cutting edge, comprising: a diamond abrasive grain having a conductive portion in a plating solution; By dispersing a diamond filler having an average particle size smaller than the grain and having no conductive portion, and disposing an anode and a cathode in the plating solution and performing electroplating, the base metal serving as the cathode is formed. Further, the diamond abrasive grains and the diamond filler are deposited together with a plating phase as the blade body.

Generally, in a cutting blade, in order to improve the hardness and rigidity of the blade main body, it is necessary to increase the eutectoid amount of a material having a higher hardness and a higher Young's modulus than, for example, Ni used for a plating phase. Diamond is most suitable as such a material. That is, it is preferable to use diamond as the abrasive and the filler dispersed in the plating phase.
However, in performing electrolytic plating, for example, even if the amount of diamond abrasive grains or diamond fillers added to the plating solution is simply increased or the stirring conditions are optimized, a large amount of diamond abrasive grains and diamond fillers are added to the plating phase. It is difficult to make eutectoids uniformly and uniformly.

Here, in order to facilitate understanding of the operation and effect of the present invention, first, problems and the like when electrolytic plating is performed with a configuration (conventional example) different from the present invention will be described. explain in detail.
That is, as a conventional example,
-When electroplating is performed by dispersing only non-conductive diamond abrasive grains in the plating solution.
-When only the non-conductive diamond filler is dispersed in the plating solution and electrolytic plating is performed.
-When electrolytic plating is carried out by dispersing non-conductive diamond abrasive grains and diamond filler in a plating solution.
Will be described first.

<Conventional example: Electroplating by dispersing only non-conductive diamond abrasive grains in plating solution>
When manufacturing a cutting blade, a cathode (cathode electrode), which is a base metal for depositing a blade body, is arranged in a plating solution, and diamond grains having a large average particle size and having no conductive portion are contained in the plating solution. Is dispersed, and a plating phase is precipitated while incorporating abrasive grains on the base metal by electrolytic plating. In this case, diamond abrasive grains having a large average particle diameter have a large mass and tend to receive a large force from the plating solution (Newtonian mechanics: F = ma (the second law of motion)). In addition, the abrasive grains are less likely to be trapped in the plating phase due to the strong force received from the plating solution. That is, the diamond abrasive grains continue to circulate in the plating solution and are less likely to be taken into the plating phase.
For diamond abrasive grains having a large average abrasive grain, therefore, as shown in FIG. 6, the plating solution is agitated very slightly or stopped, and the diamond abrasive grains are allowed to settle by their own weight, and the plating phase is reduced. It is preferable to precipitate them. In this case, since the diamond filler is not precipitated in the plating phase, there is a problem that the hardness and rigidity of the blade body cannot be sufficiently increased.

<Conventional example: Electroplating with only non-conductive diamond filler dispersed in plating solution>
Only a diamond filler having a small average particle size and having no conductive portion is dispersed in a plating solution, and a plating phase is precipitated while taking in the filler onto the base metal by electrolytic plating. In this case, the diamond filler having a small average particle diameter has a small mass and is unlikely to settle down due to its own weight in the plating solution, so it is difficult to precipitate the plating solution in the plating phase when the plating solution is agitated or stopped. Become.
Therefore, for a diamond filler having a small average particle size, as shown in FIG. 7, as shown in FIG. 7, by increasing the dispersibility of the diamond filler by vigorously stirring the plating solution and increasing the filler abundance near the base metal, Preferably, the filler is forcibly incorporated into the plating phase. In this case, since diamond abrasive grains are not precipitated in the plating phase, there is a problem that workability (sharpness) cannot be sufficiently improved.

<Conventional example: Electroplating by dispersing both non-conductive diamond abrasive grains and diamond filler in plating solution>
A non-conductive diamond abrasive and a non-conductive diamond filler are dispersed in a plating solution, and a plating phase is precipitated while incorporating the abrasive and the filler onto the base metal by electrolytic plating. In this case, the suitable conditions for stirring the plating solution are different between the diamond abrasive grains and the diamond fillers having different average particle diameters (sizes). It is difficult to sufficiently incorporate it into the plating phase.

Further, when electrolytic plating was actually performed, as shown in FIG. 8, even when the stirring conditions were weak stirring in accordance with the diamond abrasive grains, the eutectoid process of the diamond filler into the plating phase was not found. It was confirmed that the phenomenon became more dominant than the eutectoid process of diamond abrasive grains, and that only the diamond filler was eutectoid in the plating phase in a large amount.
In other words, it has been conventional practice to disperse diamond abrasive grains and diamond fillers of different sizes in a plating solution and perform electrolytic plating, and to deposit a large amount of the abrasive grains and filler in the plating phase evenly (simultaneous eutectoid). It was difficult with technology.

  Next, the operation and effect of the present invention made in view of the above problems will be described.

<The present invention: When electroconductive plating is performed by dispersing conductive diamond abrasive grains and nonconductive diamond filler in a plating solution>
In the present invention, conductive diamond abrasive grains and non-conductive diamond filler are dispersed in a plating solution, and a plating phase is precipitated while taking in the abrasive grains and filler onto a base metal by electrolytic plating. In addition, as a conductive part of diamond abrasive grains, for example, graphite carbon (conductive sp ² carbon), Ni-based compound, Ni-based compound, or the like may be formed on the surface of the diamond abrasive grains (non-conductive (insulating) sp ³ carbon). , Pd, Ti and the like are preferably provided.

  When the electrolytic plating is actually performed, as shown in FIGS. 4 and 5, the diamond grains provided with conductivity receive a force from an electric field between an anode (anode electrode) and a cathode (cathode electrode). , To the cathode side, and was confirmed to be sufficiently precipitated in the plating phase. This is probably because Coulomb force (F = QE) acted on the conductive diamond abrasive grains from the electric field.

  As a result, while dispersing both the diamond abrasive grains and the diamond filler in the plating solution, it is suppressed that the eutectoid process of the diamond filler becomes more dominant than the eutectoid process of the diamond abrasive grains. According to the method, the diamond abrasive grains and the diamond fillers having different sizes were both incorporated in the plating phase in a large amount and uniformly dispersed (co-eutectoid). In addition, in the example shown in FIG. 4, the stirring condition of the plating solution is set to weak stirring, but according to the present invention, regardless of the stirring condition, both the diamond abrasive grains and the diamond filler are uniformly and largely added to the plating phase. It is possible to capture.

Specifically, unlike the present invention, when electroplating was performed by dispersing only conductive diamond abrasive grains in the plating solution, the diamond abrasive grains precipitated in the plating phase aggregated, and the abrasive grains were dispersed. Sex decreased. When the diamond abrasive grains are aggregated in this way, the sharpness of the cutting edge varies, or voids (gaps) are formed between the abrasive grains, which affects the blade rigidity and the like.
Therefore, as in the present invention, a conductive diamond abrasive and a non-conductive diamond filler (non-conductive (insulating) sp ³ carbon) having an average particle diameter smaller than the diamond abrasive are mixed in a plating solution. When electroplating was carried out by dispersing in, it was confirmed that the non-conductive diamond filler intervened between the conductive diamond abrasive grains and functioned as a dispersant, and the aggregation of the abrasive grains did not occur. Was.
In other words, by adopting a special configuration in which conductive diamond abrasive grains and non-conductive diamond fillers are dispersed in the plating phase, these abrasive grains and fillers are dispersed in a large amount and evenly, and the plating phase is dispersed. At the same time.

According to the present invention, a large amount of diamond abrasive grains having a large average particle diameter is incorporated into the plating phase, whereby the diamond abrasive grains contribute to improvement in workability, and sharpness is enhanced, and cutting speed is increased. It becomes possible.
In addition, when a large amount of a diamond filler having a small average particle diameter is incorporated into the plating phase, the diamond filler effectively contributes to improvement in hardness and rigidity of the blade body. According to the present invention, any blade rigidity can be obtained by adjusting the amount of non-conductive diamond filler (content in the plating solution).

  As described above, according to the present invention, even if the blade main body is thinned, the hardness and rigidity of the blade main body can be sufficiently ensured, whereby the cutting accuracy is maintained well, and the kerf width is reduced. In addition, high-quality and stable cutting can be performed.

It is to be noted that, for example, unlike the present invention, a method in which diamond abrasive grains and diamond filler are simultaneously co-deposited in the plating phase by applying only a chemical force can be considered. In other words, by using a cationic surfactant or the like, diamond abrasive grains and diamond fillers having different sizes are simultaneously precipitated in the plating phase. However, when co-depositing the abrasive grains and the filler simultaneously only by the chemical force, the growth of the plating phase composed of Ni or the like is hindered, and the plating phase itself may be embrittled.
In this regard, in the present invention, since the diamond abrasive grains and the diamond filler can be simultaneously co-deposited by applying an electric force, there is no influence on the plating phase (the risk of embrittlement or the like). In the present invention, the use of a cationic surfactant or the like (together with the addition of a chemical force) may be used to such an extent that the embrittlement of the plating phase is not affected.
Further, in the cutting blade of the present invention, the conductive portion of the diamond abrasive grains is made of carbon graphite.
In this case, for example, the conductive portion (carbon graphite) can be provided by a simple method such as carbonizing the surface of the diamond abrasive. Further, in this case, since the conductive portion is made of carbon graphite which is more brittle than the diamond abrasive main body, the conductive portion functions as a sliding layer during cutting, and the slidability of the cut material with respect to the cut surface is improved. As a result, the processing load is reduced, and an effect of further improving the cutting accuracy and an effect of further extending the life of the blade are obtained.
In the cutting blade of the present invention, the plating phase is made of Ni, and the conductive portion of the diamond abrasive is made of a Ni-based compound having a higher hardness than Ni.
In this case, as the conductive portion, a Ni-based compound such as Ni-P (nickel-phosphorus), Ni-B (nickel-boron), or Ni-W (nickel-tungsten) having a higher hardness than Ni in the plating phase is used. Since it is used, the effect of increasing the rigidity of the blade can also be obtained by the conductive portion.
In the cutting blade of the present invention, the conductive part of the diamond abrasive grains is made of Pd or Ti.
In this case, since the conductive part of the diamond abrasive grains is made of Pd or Ti, a commercial product such as a Pd-coated diamond or a Ti-coated diamond can be used as the diamond abrasive grain having the conductive part. When a Ti-coated diamond is used, the conductive portion (Ti) functions as a sliding layer during cutting, and the slidability of the material to be cut on the cut surface is improved. As a result, the processing load is reduced, and an effect of further improving the cutting accuracy and an effect of further extending the life of the blade are obtained.

  Further, in the cutting blade of the present invention, it is preferable that the conductive portion of the diamond abrasive is provided on a surface of the diamond abrasive.

  In this case, during electrolytic plating, the diamond abrasive grains are easily attracted to the cathode due to Coulomb force (electrostatic attraction), and the diamond abrasive grains are easily taken in by the plating phase together with the diamond filler. The effect is particularly remarkable.

  Further, in the cutting blade of the present invention, the average particle diameter of the diamond abrasive grains is preferably 5 μm or more, and the average particle diameter of the diamond filler is preferably not more than half the average particle diameter of the diamond abrasive grains. .

In this case, since the average particle diameter of the diamond abrasive grains is 5 μm or more, the effect of improving the above-described workability (sharpness) by the diamond abrasive grains becomes particularly remarkable.
Further, since the average particle diameter of the diamond filler is not more than half of the average particle diameter of the diamond abrasive grains, the effect of increasing the blade rigidity described above becomes particularly remarkable.

  The “average particle size” in the present specification refers to the average value of the particle size of a large number of abrasive grains and the average value of the particle size of a large number of fillers, and may also be referred to as “particle size”. Actually, since these abrasive grains and fillers are not perfect spheres, the “particle size” referred to in this specification is selected by sizing (sieving, classification) at the time of manufacturing the abrasive grains and filler. Particle size.

  In the cutting blade of the present invention, it is preferable that the average particle size of the diamond filler is 2 μm or less.

  In this case, the effect that the rigidity of the blade is increased becomes particularly remarkable.

  ADVANTAGE OF THE INVENTION According to the cutting blade of this invention and its manufacturing method, even if the blade main body is thinned, the hardness and rigidity of this blade main body can be sufficiently ensured, and as a result, the cutting precision is maintained favorably. In addition, high quality and stable cutting can be performed while suppressing the calf width.

It is a perspective view showing the cutting blade concerning one embodiment of the present invention. It is sectional drawing which shows the outer peripheral edge part (around cutting edge) of a blade main body. It is sectional drawing which shows the part of the blade main body at the time of the completion of electrolytic plating. It is a figure explaining the principle which a diamond abrasive grain and a diamond filler are taken in with a plating phase into a cathode (cathode electrode) at the time of electrolytic plating. It is a figure explaining the principle which diamond abrasive grains are drawn to a cathode at the time of electrolytic plating. It is a figure explaining the conventional electrolytic plating. It is a figure explaining the conventional electrolytic plating. It is a figure explaining the conventional electrolytic plating.

Hereinafter, a cutting blade 10 according to an embodiment of the present invention will be described with reference to the drawings.
The cutting blade 10 of the present embodiment is used for ultra-precision cutting of a material to be cut such as a semiconductor element or an electronic component. The cutting blade 10 is an electroformed blade produced by electrolytic plating (electroplating).

As shown in FIG. 1, the cutting blade 10 includes a blade main body 1 having a disk shape, and a cutting edge 1 </ b> A formed on an outer peripheral edge of the blade main body 1.
The cutting blade 10 of the present embodiment is a washer-type (flat disc-shaped) blade in which the blade main body 1 is attached to a main shaft of a cutting device (not shown) via a flange.

At the time of electroforming of the cutting blade 10, as shown in FIG. 3, a cathode (cathode electrode) serving as a base metal 11 for depositing the blade body 1 in the plating solution P is arranged, and the base metal 11 is electrolytically plated. A plating phase 2 is deposited thereon while taking in abrasive grains 3 and fillers 5 described later. Then, when the plating phase 2 reaches a predetermined thickness, the plating phase 2 is peeled off from the base metal 11 and subjected to electrolytic polishing, lapping or the like to sharpen the abrasive grains 3. A method for manufacturing the cutting blade 10 of the present embodiment will be described later in detail separately.
The present invention is not limited to the washer type blade. That is, the cutting blade 10 is a hub-type blade (a blade with a hub) in which the blade main body 1 deposited on the base metal 11 during electroforming is kept fixed, and the base metal 11 is attached to the main shaft. You may.

In FIG. 1, the cutting blade 10 is moved in a direction perpendicular to the central axis O with respect to the material to be cut while the blade main body 1 is rotated around the central axis O by the main shaft of the cutting device. The material to be cut is cut at the outer peripheral edge (cutting edge 1A) of the main body 1 protruding radially outward from the flange.
In this specification, a direction along the direction of the central axis O of the blade main body 1 is referred to as a thickness direction, a direction perpendicular to the central axis O is referred to as a radial direction, and a direction around the central axis O is referred to as a circumferential direction. That.

  The thickness (length in the thickness direction) of the blade main body 1 is, for example, 0.020 to 0.150 mm, that is, the blade main body 1 has an extremely thin circular plate shape. In FIG. 1, the thickness of the blade main body 1 is shown to be larger than the actual thickness in order to facilitate understanding of the configuration of the blade main body 1.

  At a radially central portion (on the central axis O) of the blade main body 1, a mounting hole 4 which has a circular hole shape centered on the central axis O and penetrates the blade main body 1 in the thickness direction is formed. . For this reason, the blade main body 1 is specifically in the shape of a circular ring plate. That is, the "disk-shaped blade body 1" in the present specification includes the blade body 1 having a circular ring plate shape.

  As shown in FIG. 2, the cutting edge 1 </ b> A of the blade main body 1 has a width substantially equal to the thickness of the blade main body 1 and an outer peripheral surface of the blade main body 1 extending in the circumferential direction, and a thickness of the blade main body 1. The outer peripheral edges of a pair of side surfaces 1B facing in the vertical direction, and an edge portion forming an intersection ridge line between the outer peripheral edges of these side surfaces 1B and the outer peripheral surface.

  The blade body 1 includes a plating phase 2 made of Ni, diamond abrasive grains 3 dispersed in the plating phase 2, and a diamond filler 5 dispersed in the plating phase 2 and having a smaller average particle size than the diamond abrasive grains 3. Have. That is, in the cutting blade 10 of the present embodiment, the abrasive grains 3 and the filler 5 dispersed in the plating phase 2 are both formed of diamond.

The plating phase 2 is a metal binding phase (matrix material) made of Ni. The plating phase 2 is a solid phase of a metal formed by plating, and since it is formed in a thin plate shape, it can be called a plating layer or a plating film.
In the plating phase 2, the plurality of diamond abrasive grains 3 are dispersed so that the intervals between them are equal, and the plurality of diamond fillers 5 are also dispersed such that the intervals between the diamond abrasive grains 3 are even. And between the adjacent diamond abrasive grains 3 in the plating phase 2, the plating phase 2 and the diamond filler 5 are interposed.

The average particle size of the diamond abrasive grains 3 is 5 μm or more. In the present embodiment, the average particle size of the diamond abrasive grains 3 is in a distribution range of, for example, 6 to 12 μm.
The content of the diamond abrasive grains 3 dispersed in the plating phase 2 is, for example, 5 to 15%. Specifically, the content indicates the ratio of the volume of the diamond abrasive grains 3 to the volume of the entire blade body 1.

The average particle size of the diamond filler 5 is not more than half of the average particle size of the diamond abrasive particles 3. Specifically, the average particle size of the diamond filler 5 of the present embodiment is 2 μm or less, for example, a distribution range of 1 to 2 μm. The particle size of the diamond filler 5 is preferably from 0/1 to 1/2.
The content of the diamond filler 5 dispersed in the plating phase 2 is, for example, 35 to 45%. Specifically, the content indicates the ratio of the volume of the diamond filler 5 to the volume of the entire blade body 1.

  Here, the “average particle size” referred to in the present specification refers to the average value of the particle size of a large number of diamond abrasive grains 3 and the average value of the particle size of a large number of diamond fillers 5. Sometimes called. In practice, since the abrasive grains 3 and the fillers 5 are not perfect spheres, the “particle size” in the present specification refers to the sizing (sieving, classification) at the time of manufacturing the abrasive grains 3 and the fillers 5. )).

The diamond abrasive grains 3 have a conductive portion 6. On the other hand, the diamond filler 5 has no conductive part.
In the present embodiment, the conductive portions 6 of the diamond abrasive grains 3 are provided on the surface (surface layer) of the diamond abrasive grains 3. The conductive portion 6 is provided on at least a part of the surface of the diamond abrasive grains 3. Further, conductive portion 6 may cover the entire surface of diamond abrasive grains 3.

  The conductive portion 6 is exposed to the outside on the surface of the diamond abrasive grains 3. In addition, when the action of attracting the diamond abrasive grains 3 to the cathode (cathode electrode) at the time of electrolytic plating (action by Coulomb force) is obtained favorably, the conductive portion 6 is not exposed on the surface of the diamond abrasive grains 3. You may.

In the present embodiment, the conductive portions 6 of the diamond abrasive grains 3 are made of carbon graphite. That is, the main body portion (the portion other than the conductive portion 6) of the diamond abrasive grains 3 is made of non-conductive (insulating) sp ³ carbon, and the conductive portion 6 is made of conductive sp ² carbon.
Also, the sum of the weight of the carbon graphite (conductive portion 6) attached to the diamond abrasive grains 3 with respect to the sum of the weight of the diamond abrasive grains 3 and the weight of the diamond filler 5 (total diamond weight) used for the entire cutting blade 10. Is, for example, 0.1 to 20 wt%.

  Further, the ratio of the diamond abrasive grains 3 and the diamond filler 5 co-deposited in the plating phase 2 is, for example, 1.5 to 4 when the amount of the abrasive grains 3 is 1 (100%). . Note that this ratio is obtained by observing the side surface 1B of the blade main body 1 with an SEM or the like, and obtaining the ratio of the sum of the area of the abrasive grains 3 per unit area on the side surface 1B and the sum of the area of the filler 5.

Next, a method for manufacturing the cutting blade 10 of the present embodiment will be described.
As shown in FIGS. 3 to 5, the blade main body 1 of the cutting blade 10 of the present embodiment is manufactured by an electroforming method using a plating solution P containing Ni as a main component.
A predetermined additive (for example, including a surfactant), diamond abrasive grains 3 and diamond filler 5 are mixed with the plating solution P as components other than Ni. That is, the diamond abrasive grains 3 having the conductive parts 6 and the diamond filler 5 having an average particle diameter smaller than the diamond abrasive grains 3 and having no conductive parts are dispersed in the plating solution P.

  The Ni plating bath may be a sulfamic acid bath, a Watts bath, or a citric acid bath (in which boric acid used as a conventional pH buffer is replaced with citric acid). If necessary, a brightener, a pit preventive agent, and the like may be added to the plating solution P.

  In the plating solution P, an anode (anode electrode) and a cathode (cathode electrode) are arranged separately from each other. The base metal 11 on which the blade body 1 is deposited is used as the cathode. Since the cutting blade 10 of the present embodiment is a washer-type blade, the base metal 11 may be formed of a SUS material or the like in consideration of the ease of peeling of the blade body 1 deposited on the base metal 11. preferable.

Then, by subjecting the plating solution P to electroplating while stirring, the diamond abrasive grains 3 and the diamond filler 5 are deposited together with the plating phase 2 as the blade body 1 on the base metal 11 serving as the cathode. The current density at the time of electrolytic plating is, for example, 3 to 20 A / dm ² .

When the plating phase 2 reaches a predetermined thickness, the blade body 1 is peeled off from the base metal 11 and subjected to electrolytic polishing or lapping to sharpen the abrasive grains 3 so that the outer shape of the blade body 1 has a desired shape. Trim (shape outer and inner diameters to desired dimensions).
Thus, the cutting blade 10 is manufactured.

  When the cutting blade 10 is a hub-type blade, masking is performed on a predetermined region (a region where the blade main body 1 is not manufactured) of the hub base (not shown), and the blade is applied to a portion other than the masked predetermined region. The main body 1 may be deposited.

  According to the cutting blade 10 and the method of manufacturing the same according to the embodiment described above, both the diamond abrasive grains 3 and the diamond filler 5 are dispersed in the plating phase 2 in a large amount and evenly. Therefore, even if the blade main body 1 is thinned, the hardness and rigidity of the blade main body 1 can be sufficiently ensured, whereby the cutting accuracy can be maintained satisfactorily. Stable cutting can be performed.

Here, in order to facilitate understanding of the operation and effect of the present embodiment, first, problems and the like when electrolytic plating is performed with a configuration (conventional example) different from the embodiment will be described. The effect will be described in detail.
That is, as a conventional example,
-When only the non-conductive diamond abrasive grains 30 are dispersed in the plating solution P and electrolytic plating is performed.
When only the non-conductive diamond filler 5 is dispersed in the plating solution P and electrolytic plating is performed.
A case in which the diamond abrasive grains 30 and the diamond filler 5 both made non-conductive are dispersed in the plating solution P and electrolytic plating is performed.
Will be described first.

<Conventional example: Electroplating by dispersing only non-conductive diamond abrasive grains 30 in plating solution P>
As shown in FIG. 6, at the time of manufacturing a cutting blade, a cathode (cathode electrode), which is a base metal 11 for depositing a blade main body, is disposed in a plating solution P, and the average particle diameter in the plating solution P is reduced. Only the diamond abrasive grains 30 having no large conductive portion are dispersed, and the plating phase 2 is precipitated while taking in the abrasive grains 30 on the base metal 11 by electrolytic plating. In this case, the diamond abrasive grains 30 having a large average particle diameter have a large mass and tend to receive a large force from the plating solution P (Newtonian mechanics: F = ma (second law of motion)). With high-speed stirring, the abrasive grains 30 are less likely to be trapped in the plating phase 2 by the strong force received from the plating solution P. That is, the diamond abrasive grains 30 continue to circulate in the plating solution P and are less likely to be taken into the plating phase 2.
For this reason, as shown in FIG. 6, for the diamond abrasive grains 30 having a large average abrasive grain, as shown in FIG. 6, the plating solution P is agitated very slightly or stopped, and the diamond abrasive grains 30 are settled by their own weight. , Is preferably deposited on the plating phase 2. In this case, since the diamond filler is not precipitated in the plating phase 2, there is a problem that the hardness and rigidity of the blade body cannot be sufficiently increased.

<Conventional example: When only non-conductive diamond filler 5 is dispersed in plating solution P and electrolytic plating is performed>
As shown in FIG. 7, only the diamond filler 5 having a small average particle size and having no conductive portion is dispersed in the plating solution P, and the filler 5 is taken up on the base metal 11 by electrolytic plating. 2 is deposited. In this case, since the diamond filler 5 having a small average particle diameter has a small mass and hardly sediments in the plating solution P due to its own weight, when the plating solution P is agitated very slightly or the stirring is stopped, the diamond filler 5 precipitates in the plating phase 2. It becomes difficult to make it.
For this reason, for the diamond filler 5 having a small average particle diameter, as shown in FIG. 7, the plating solution P is vigorously stirred to enhance the dispersibility of the diamond filler 5, and the filler abundance near the base metal 11 is reduced. It is preferable that the filler 5 be forcibly taken into the plating phase 2 by increasing the height. In this case, since diamond abrasive grains are not precipitated in the plating phase 2, there is a problem that workability (sharpness) cannot be sufficiently enhanced.

<Conventional example: A case where both non-conductive diamond abrasive grains 30 and diamond filler 5 are dispersed in a plating solution P and electrolytic plating is performed>
As shown in FIG. 8, the non-conductive diamond abrasive grains 30 and the non-conductive diamond filler 5 are dispersed in the plating solution P, and the abrasive grains 30 and the filler 5 are placed on the base metal 11 by electrolytic plating. While taking in, the plating phase 2 is precipitated. In this case, the diamond abrasive grains 30 and the diamond filler 5 having different average particle diameters (sizes) have different agitating conditions of the plating solution P suitable for each other. It is difficult to incorporate the diamond filler 5 into the plating phase 2 sufficiently.

In addition, when electrolytic plating was actually performed, as shown in FIG. 8, even when the stirring conditions were weak stirring in accordance with the diamond abrasive grains 30, the diamond filler 5 was not applied to the plating phase 2. It was confirmed that the precipitation process became more dominant than the eutectoid process of the diamond abrasive grains 30 and that only the diamond filler 5 co-deposited in the plating phase 2 in a large amount.
In other words, the diamond abrasive grains 30 and the diamond fillers 5 having different sizes are dispersed in the plating solution P to perform electrolytic plating, and the abrasive grains 30 and the fillers 5 are both deposited in the plating phase 2 in a large amount and evenly (simultaneous eutectoid). ) Was difficult with the prior art.

  Next, the operation and effect of the present embodiment made in view of the above problems will be described.

<Embodiment: In the case where the conductive diamond abrasive grains 3 and the non-conductive diamond filler 5 are dispersed in the plating solution P and electrolytic plating is performed>
As shown in FIG. 4, in the present embodiment, the conductive diamond abrasive grains 3 and the non-conductive diamond filler 5 are dispersed in the plating solution P, and the abrasive grains 3 and The plating phase 2 is precipitated while taking in the filler 5.

  When electrolytic plating is actually performed, as shown in FIGS. 4 and 5, diamond abrasive grains 3 imparted with conductivity apply a force from an electric field E between an anode (anode electrode) and a cathode (cathode electrode). As a result, it was confirmed that the film moved to the cathode side and was sufficiently deposited on the plating phase 2. This is probably because Coulomb force (F = QE) acted on the conductive diamond abrasive grains 3 from the electric field E.

  As a result, while dispersing both the diamond abrasive grains 3 and the diamond filler 5 in the plating solution P, it is suppressed that the eutectoid process of the diamond filler 5 becomes more dominant than the eutectoid process of the diamond abrasive grains 3. According to this embodiment, the diamond abrasive grains 3 and the diamond fillers 5 having different sizes were both dispersed and taken into the plating phase 2 in a large amount and uniformly (co-eutectoid). In the example shown in FIG. 4, the stirring condition of the plating solution P is weak stirring. However, according to the present embodiment, the diamond abrasive grains 3 and the diamond filler 5 are both added to the plating phase 2 regardless of the stirring conditions. It is possible to take in a large amount and evenly.

Specifically, unlike the present embodiment, when only the conductive diamond abrasive grains 3 are dispersed in the plating solution P and electrolytic plating is performed, aggregation of the diamond abrasive grains 3 precipitated in the plating phase 2 occurs. And the dispersibility of the abrasive grains 3 was reduced. When the diamond abrasive grains 3 aggregate as described above, the sharpness of the cutting edge 1A varies, and voids (gap) are generated between the abrasive grains 3 and affect the blade rigidity or the like, which is not preferable.
Therefore, as in the present embodiment, a conductive diamond abrasive grain 3 and a non-conductive diamond filler (non-conductive (insulating) sp ³ carbon) 5 having a smaller average particle diameter than the diamond abrasive grain 3 are used. Was dispersed in the plating solution P and electroplating was performed. As a result, the non-conductive diamond filler 5 was interposed between the conductive diamond abrasive grains 3 and functioned as a dispersant, and the abrasive grains 3 aggregated. No longer occur.
In other words, by adopting a special configuration in which the conductive diamond abrasive grains 3 and the non-conductive diamond filler 5 are dispersed in the plating phase 2, these abrasive grains 3 and fillers 5 are uniformly and abundantly dispersed. It is possible to disperse and coeutect the plating phase 2 simultaneously.

According to this embodiment, the diamond abrasive grains 3 having a large average particle diameter are incorporated into the plating phase 2 in a large amount, so that the diamond abrasive grains 3 contribute to the improvement of workability and the sharpness is enhanced. The cutting speed can be increased.
In addition, a large amount of the diamond filler 5 having a small average particle size is incorporated into the plating phase 2 so that the diamond filler 5 effectively contributes to the improvement of the hardness and rigidity of the blade body 1. According to the present embodiment, an arbitrary blade rigidity can be obtained by adjusting the input amount (content in the plating solution P) of the non-conductive diamond filler 5.

  As described above, according to the present embodiment, even if the blade main body 1 is thinned, the hardness and rigidity of the blade main body 1 can be sufficiently ensured, whereby the cutting accuracy can be maintained satisfactorily. High quality and stable cutting can be performed while suppressing the width.

It is to be noted that, for example, unlike the present embodiment, a method is conceivable in which the diamond abrasive grains 30 and the diamond filler 5 are simultaneously co-deposited with the plating phase 2 by applying only a chemical force. In other words, the use of a cationic surfactant or the like causes the diamond abrasive grains 30 and the diamond fillers 5 having different sizes to be simultaneously precipitated on the plating phase 2. However, if the abrasive grains 30 and the filler 5 are co-deposited only by the chemical force, the growth of the plating phase 2 made of Ni is hindered, and the plating phase 2 itself may be embrittled.
In this regard, in the present embodiment, since the diamond abrasive grains 3 and the diamond filler 5 can be simultaneously co-deposited by applying an electric force, there is no influence on the plating phase 2 (the fear of embrittlement or the like). In the present embodiment, the use of a cationic surfactant or the like (together with the addition of a chemical force) may be used to such an extent that the embrittlement of the plating phase 2 is not affected.

In addition, the conductive part 6 of the diamond abrasive 3 is provided on the surface of the diamond abrasive 3.
Therefore, at the time of electrolytic plating, the diamond abrasive grains 3 are easily attracted to the cathode by Coulomb force (electrostatic attraction), and the diamond abrasive grains 3 are easily taken in by the plating phase 2 together with the diamond filler 5. The above-mentioned effects are particularly remarkable.

As a result of actual confirmation, when the conductive portion 6 is provided on the surface of the diamond abrasive grains 3, the amount of eutectoid deposited on the plating phase 2 may increase irrespective of the additive (surfactant) in the plating solution P. all right. This is not because the additive such as a cation type adheres to the surface of the diamond abrasive grain 3 and thus the diamond abrasive grain 3 does not obtain the surface charge (+ Q). As shown in FIG. It is considered that the surface charge was obtained by the occurrence of polarization inside the grain 3.
Specifically, the diamond abrasive grains 3 contain an impurity metal such as iron, nickel, manganese, or cobalt as a catalyst at the time of manufacturing the abrasive grains. For this reason, it is presumed that polarization occurs between the impurity metal and the conductive portion 6 on the surface of the abrasive grains 3, and the charge (−Q) and the surface charge (+ Q) of the impurity metal are obtained. Although not shown, the potential of the impurity metal is 0 with respect to the potential V of the conductive portion 6.

Further, since the average particle diameter of the diamond abrasive grains 3 is 5 μm or more, and the average particle diameter of the diamond filler 5 is not more than half of the average particle diameter of the diamond abrasive grains 3, the following operation and effect can be obtained.
That is, since the average particle size of the diamond abrasive grains 3 is 5 μm or more, the effect of improving the above-described workability (sharpness) by the diamond abrasive grains 3 becomes particularly remarkable.
In addition, since the average particle diameter of the diamond filler 5 is equal to or less than half the average particle diameter of the diamond abrasive grains 3, the above-described effect of increasing the blade rigidity becomes particularly remarkable.
Specifically, since the average particle size of the diamond filler 5 is 2 μm or less, the effect of increasing the blade rigidity becomes particularly remarkable.

  Further, in the present embodiment, since the conductive portion 6 of the diamond abrasive 3 is made of carbon graphite, the conductive portion 6 can be provided by a simple method such as carbonizing the surface of the diamond abrasive 3. Further, in this case, since the conductive portion 6 is made of carbon graphite which is more brittle than the diamond abrasive 3 main body, the conductive portion 6 functions as a sliding layer during cutting, and the slidability of the cut material with respect to the cut surface is improved. I do. As a result, the processing load is reduced, and an effect of further improving the cutting accuracy and an effect of further extending the life of the blade are obtained.

In order to confirm that carbon graphite is provided as the conductive portion 6 on the surface of the diamond abrasive grains 3, for example, X-ray photoelectron spectroscopy (XPS) can be used. According to the X-ray photoelectron spectroscopy, the type of the carbon film such as diamond or carbon graphite can be determined by analyzing the shape (half width, peak symmetry) of the inner shell C1s spectrum.
Although not specifically shown, a so-called graph specifically showing a spectrum shape of C1s (horizontal axis: energy of photoelectrons based on irradiated X-rays, vertical axis: number of observed photoelectrons) In the XPS analysis diagram), the diamond abrasive grains 30 (non-conductive (insulating) sp ³ carbon) before carbonizing the surface have a peak at around 285 eV, and the crystallinity is good. The half-value width also becomes narrow. On the other hand, when the surface of the diamond abrasive grains 30 (3) starts to carbonize (that is, when conductive sp ² carbon is formed), the peak position shifts to a lower energy side, and the symmetry of the peak is lost, The half width tends to increase.

In the present embodiment, the current density is set to 3 to 20 A / dm ² at the time of electroforming (at the time of electrolytic plating) for manufacturing the cutting blade 10.
According to the present embodiment, since the current density is 3 A / dm ² or more, the electric field E can be prevented from becoming too small, and the eutectoid amount of the diamond abrasive grains 3 to the plating phase 2 can be stably secured. . In addition, since the current density is 20 A / dm ² or less, product failure due to plating burn or the like hardly occurs.

  Note that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the spirit of the present invention.

For example, in the above-described embodiment, carbon graphite is provided as the conductive portion 6 of the diamond abrasive grains 3, but the present invention is not limited to this.
Specifically, the plating phase 2 may be made of Ni, and the conductive portions 6 of the diamond abrasive grains 3 may be made of a Ni-based compound having a higher hardness than Ni.
In this case, the conductive portion 6 has a hardness higher than that of Ni of the plating phase 2, such as Ni-P (nickel-phosphorus), Ni-B (nickel-boron), or Ni-W (nickel-tungsten). Since the compound is used, the effect of increasing the blade rigidity can be obtained by the conductive portion 6.

Further, the conductive portion 6 of the diamond abrasive grains 3 may be made of Pd or Ti.
In this case, since the conductive portion 6 of the diamond abrasive 3 is made of Pd or Ti, a distribution product such as a Pd-coated diamond or a Ti-coated diamond can be used as the diamond abrasive 3 having the conductive portion 6. When a Ti-coated diamond is used, the conductive portion (Ti) 6 functions as a sliding layer at the time of cutting, and the slidability of the material to be cut on the cut surface is improved. As a result, the processing load is reduced, and an effect of further improving the cutting accuracy and an effect of further extending the life of the blade are obtained.

  In addition, the configurations (components) described in the above-described embodiments, modifications, and the like may be combined without departing from the spirit of the present invention. Changes are possible. The present invention is not limited by the above-described embodiments, but is limited only by the scope of the claims.

  Hereinafter, the present invention will be described specifically with reference to examples. However, the present invention is not limited to this embodiment.

[Example of manufacturing cutting blade]
As a production example of the cutting blade 10 described in the above embodiment, production of a washer-type Ni electroformed blade will be described below with reference to an example.
This cutting blade 10 can be made of a plating solution P in which conductive diamond abrasive grains 3 and nonconductive diamond fillers 5 are dispersed in a Ni bath. Since the cutting blade 10 is an electroformed blade that uses the plating phase 2 itself as a blade, it is required that good detachability from the base metal 11 serving as the cathode be obtained. For this reason, SUS material was used for the base metal 11.

  As the Ni plating bath, there is no problem even if a sulfamic acid bath, a Watt bath, or the like is used. If a sulfamic acid bath is used, for example, based on a Ni concentration of 0.1 to 2.0 mol / L and a boric acid concentration of 0.1 to 1.0 mol / L, additives such as a brightener and a pit inhibitor are added. An appropriate amount can be used. The pH is preferably 4 to 4.5, and the plating temperature is preferably 45 to 55C. When plating is performed with the pH outside the above numerical range, oxygen is generated from the anode side and hydrogen is generated from the cathode side. Therefore, adjustment is performed using sulfamic acid.

  As the conductive diamond abrasive grains 3, for example, diamond particles coated with any of Ni, Ti, Pd, and carbon graphite can be used. As the nonconductive diamond filler 5, a metal or the like can be used. Unused diamond particles (normal diamond) can be used.

  Plating (electrolytic plating) is carried out while charging the conductive diamond abrasive grains 3 and the non-conductive diamond filler 5 into the Ni plating solution P and stirring them. The stirring may be arbitrarily selected, such as stirrer stirring or ultrasonic stirring. For example, some diamond abrasive grains 3 such as Pd coating may peel off the coating depending on ultrasonic conditions. It is preferable to select an agitation method that does not easily exert an effect according to the type and properties (characteristics) of.

The current density was 3 to 7 A / dm ² . When the current density is too high, the electric field E applied to the bath increases, so that the amount of eutectoids of the conductive diamond abrasive grains 3 deposited on the plating phase 2 is improved, but on the other hand, the area near the cathode is reduced. There is a possibility that the Ni concentration gradually decreases and plating burn occurs. When it is desired to keep the current density high, it is preferable to perform optimization such as increasing the stirring and increasing the Ni concentration.

  After forming a Ni film (plating phase 2) containing conductive diamond abrasive grains 3 and non-conductive diamond filler 5 on a cathode (base metal 11) made of SUS material by plating, Ni Remove the film. Since the plated surface (electrode surface) of the Ni film that has been in contact with the cathode is in a state in which the diamond abrasive grains 3 are buried, the plated surface (growth surface) of the Ni film is opposite to the plated surface (growth surface). The protrusion amount of the abrasive grains 3 is small.

When cutting is performed in this state, a difference in friction occurs between one side surface 1B and the other side surface 1B of the pair of side surfaces 1B of the blade body 1 and meandering or the like occurs. Electropolishing is performed with an etching solution containing phosphoric acid or the like.
After the etching, mechanical processing such as polishing is performed to obtain a desired blade size, and the cutting blade 10 can be obtained.

DESCRIPTION OF SYMBOLS 1 Blade main body 1A Cutting edge 2 Plating phase 3 Diamond abrasive grain 5 Diamond filler 6 Conductive part 10 Cutting blade 11 Base metal (cathode)
P plating solution

Claims (7)

A cutting blade in which the outer peripheral edge of a blade main body having a disk shape is a cutting edge,
The blade body,
A plating phase,
Diamond abrasive grains dispersed in the plating phase,
A diamond filler having a smaller average particle size than the diamond abrasive grains, dispersed in the plating phase,
The diamond abrasive grains have a conductive portion different from the plating phase ,
Conductive portions of the diamond abrasive grains, Ri Do from carbon graphite,
The cutting blade , wherein the diamond filler does not have a conductive part different from the plating phase . A cutting blade in which the outer peripheral edge of a blade main body having a disk shape is a cutting edge,
The blade body,
A plating phase made of Ni;
Diamond abrasive grains dispersed in the plating phase,
A diamond filler having a smaller average particle size than the diamond abrasive grains, dispersed in the plating phase,
The diamond abrasive grains have a conductive portion different from the plating phase ,
Conductive portions of the diamond abrasive grains, Ri Do from high hardness Ni-based compounds than Ni,
The cutting blade , wherein the diamond filler does not have a conductive part different from the plating phase . A cutting blade in which the outer peripheral edge of a blade main body having a disk shape is a cutting edge,
The blade body,
A plating phase,
Diamond abrasive grains dispersed in the plating phase,
A diamond filler having a smaller average particle size than the diamond abrasive grains, dispersed in the plating phase,
The diamond abrasive grains have a conductive portion different from the plating phase ,
Conductive portions of the diamond abrasive grains, Ri Pd or Ti Tona,
The cutting blade , wherein the diamond filler does not have a conductive part different from the plating phase . The cutting blade according to any one of claims 1 to 3,
A conductive blade of the diamond abrasive grains is provided on a surface of the diamond abrasive grains. A cutting blade according to any one of claims 1 to 4,
The average particle size of the diamond abrasive grains is 5 μm or more,
A cutting blade, wherein the average particle diameter of the diamond filler is not more than half of the average particle diameter of the diamond abrasive grains. The cutting blade according to claim 5, wherein
A cutting blade characterized in that the average particle size of the diamond filler is 2 μm or less. A method for manufacturing a cutting blade in which the outer peripheral edge of a blade main body having a disc shape is a cutting edge,
In the plating solution, diamond abrasive grains having a conductive part, and a diamond filler having an average particle diameter smaller than the diamond abrasive grains and having no conductive part,
By disposing an anode and a cathode in the plating solution and performing electroplating, on the base metal serving as the cathode, as the blade body, depositing the diamond abrasive grains and the diamond filler together with a plating phase. A method for producing a cutting blade, which is a feature of the present invention.

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