CN104760146B - A kind of compound fixed abrasive sawing wire for multi-wire saw and preparation method thereof - Google Patents
A kind of compound fixed abrasive sawing wire for multi-wire saw and preparation method thereof Download PDFInfo
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- CN104760146B CN104760146B CN201410008264.1A CN201410008264A CN104760146B CN 104760146 B CN104760146 B CN 104760146B CN 201410008264 A CN201410008264 A CN 201410008264A CN 104760146 B CN104760146 B CN 104760146B
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- abrasive material
- sawline
- main cutting
- bus
- cutting abrasive
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title claims description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 178
- 239000003082 abrasive agent Substances 0.000 claims abstract description 135
- 239000002245 particle Substances 0.000 claims abstract description 79
- 239000011347 resin Substances 0.000 claims abstract description 63
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 4
- 239000000956 alloy Substances 0.000 claims abstract description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 73
- 239000010432 diamond Substances 0.000 claims description 73
- 239000006061 abrasive grain Substances 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 15
- 238000013461 design Methods 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000007822 coupling agent Substances 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010953 base metal Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052580 B4C Inorganic materials 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 230000005518 electrochemistry Effects 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 238000013007 heat curing Methods 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- NIFIFKQPDTWWGU-UHFFFAOYSA-N pyrite Chemical compound [Fe+2].[S-][S-] NIFIFKQPDTWWGU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052683 pyrite Inorganic materials 0.000 claims description 2
- 239000011028 pyrite Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000004576 sand Substances 0.000 abstract description 25
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000033228 biological regulation Effects 0.000 abstract description 11
- 238000010276 construction Methods 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 abstract description 2
- 238000009418 renovation Methods 0.000 abstract description 2
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 26
- 230000008569 process Effects 0.000 description 21
- 235000013339 cereals Nutrition 0.000 description 12
- 229910000831 Steel Inorganic materials 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000007596 consolidation process Methods 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 239000011259 mixed solution Substances 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 239000004575 stone Substances 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 235000008216 herbs Nutrition 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 210000002268 wool Anatomy 0.000 description 2
- 241000430525 Aurinia saxatilis Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- -1 diadust Inorganic materials 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention relates to a kind of compound fixed abrasive sawing wire for multi-wire saw, at least being consolidated with one group of main cutting abrasive material G1(mean diameter on the bus of this kind of sawline is d1) and one group of auxiliary cutting abrasive material G2 (mean diameter is d2), d2 is 0.2 0.8 times of d1；G1 is consolidated on bus by least one of which high intensity medium bonding course, and G2 is consolidated in bus and/or high intensity dielectric surface by resin medium layer；On same unit length sawline, auxiliary cuts 2 times of the average bulk density >=main cutting abrasive material G1 average bulk density of abrasive material G2.The present invention is designed by sand on composite construction and secondary, self-defined arrangement at sawline surface construction difference in functionality abrasive particle, achieve main cutting, auxiliary cutting and the combination of synchronous surface Plastic renovation function, and the load balancing of abrasive particle and utilization ratio optimization.Regulation metal/alloy bonding course and the thickness of resin bonded layer can be customized simultaneously further, reach the manufacturing cost of complex optimum sawline.
Description
Technical field
The present invention relates to a kind of compound fixed abrasive sawing wire for multi-wire saw and preparation method thereof, it is adaptable to use is many
The hard materials such as wire cutting method processing crystal silicon, carborundum, crystal, sapphire.
Background technology
Currently marketed concretion abrasive cutting sawline, can be roughly divided into according to the abrasive material adhering mode of baseline surface
Plating fixed abrasive sawing wire and the big class of resin bonded abrasive material sawline two.
In terms of existing market practical function, the advantage of plating fixed abrasive sawing wire is that abrasive particle consolidation force is strong, brings sawline
Cutting power is relatively strong, when typical case is presented as that being applied to 8 inches of monocrystalline silicon pieces manufactures, can be reduced to easily by line amount 2 meters/sheet with
Under, its major defect is:
1. the production cost of sawline is higher, causes every harsh with the requirement of line amount, brings cutting equipment requirement
High, it is allowed to the drawbacks such as cutting technique window is little；
2. the finished product tangent plane after cutting often occurs that along sawline direction surface appearance differs from the belt-like zone of periphery, causes
Following process (such as the follow-up making herbs into wool of crystalline silicon wafer) cost at finished product increases and/or processing compatibility is poor；
It is limited to cutting mechanism and sediment outflow pattern the most simultaneously, is difficult to promote further cutting efficiency.In-depth study
Show, under identical cutting environment and object, electroplate fixed abrasive sawing wire surface abrasive increase in density, cutting effect can not be brought
Increasing on year-on-year basis of rate, surface abrasive density is too low, then the broken string risk in cutting process can be caused to dramatically increase.
And for resin bonded abrasive material sawline, it is limited to the intensity of resin itself, the intrinsic consolidation force for abrasive particle is remote
Being weaker than plating fixed abrasive sawing wire, simultaneously because the excellent thermal conductivity of diamond abrasive grain, the heat that cutting produces can be deposited in mill
Grain and the joint portion of resin so that resin bonded layer soften, reduce its hold to abrasive particle further, thus cause cutting
During abrasive particle constantly come off.Typically by improving the bulk density of abrasive particle in practicality, and the increase modes such as line amount, it is ensured that
Resin sawline maintains certain cutting force.
For plating fixed abrasive sawing wire, the main advantage of resin bonded abrasive material sawline is the system of unit length
Make low cost, bring cutting equipment relatively low with the requirement of cutting technique, and the surface conformance of cutting finished product is preferable.But
When being because using resin bonded abrasive material sawline, every also needs relatively to electroplate fixed abrasive sawing wire by line amount and improves with becoming several times, uses
Can family gather in the crops on overall cutting cost and still become to doubt, and causes the Technology Ways battle of plating/resinous abrasive materials sawline extremely
The present is the most in the ascendant.It addition, the structural weakness of resinous abrasive materials sawline itself, the most seriously limit it and be applied to cut more brilliant
The feasibility of the material (such as sapphire etc.) that silicon is harder.
Summary of the invention
The technical problem to be solved in the present invention is: overcome/alleviate the following problem in existing concretion abrasive technology:
1, plating fixed abrasive sawing wire cost is high, and cutting equipment and technique for applying require the finished product after harshness, and cutting
Tangent plane often occurs that along sawline direction surface appearance differs from the belt-like zone of periphery, causes the following process at finished product (such as crystal silicon
The follow-up making herbs into wool of silicon chip) cost increases and/or processing compatibility is poor；
2, electroplate the abrasive particle spacing of fixed abrasive sawing wire in the market about at 2 ~ 4 times of Abrasive Particle Size, be limited to cut
The impact of the cutting output that sheet surfacing removing speed and the size of abrasive particle own cause, promotes the arrangement density of abrasive particle further
It is helpless to the raising of cutting efficiency, has reduced arrangement density and then can bring dramatically increasing, in general of cutting broken string risk
Technological improvement space has met with bottleneck；
Although 3, resin bonded abrasive particle sawline manufacturing cost is relatively low, for cutting equipment and cutting technique requirement also
Relatively low, and slice surface concordance is relatively good, but this loss during cutting uses of sawline is big, and cutting force is weak and declines
Subtracting fast, cutting efficiency is low, and same shortage the most constantly helps client to reduce overall line and is cut into this Technology Potential.
The present invention solves the innovation means of above-mentioned technical problem: a kind of compound consolidation mud saw for multi-wire saw
Line, (a) bus is at least fixed with one group of main cutting abrasive material G1 and one group of auxiliary cutting abrasive material G2, and main cutting abrasive material G1's is average
Particle diameter is d1, auxiliary cutting abrasive material G2 mean diameter be d2, d2 be 0.2-0.8 times of d1, described bus for for fix cut
Cut the base metal silk of abrasive material；B () main cutting abrasive material G1 is consolidated on bus by least one of which high intensity medium bonding course, institute
Stating high intensity medium is tensile strength at the metal of more than 100Mpa and/or metal alloy；Auxiliary cutting abrasive material G2 passes through resin
Dielectric layer is consolidated in bus and/or high intensity dielectric surface；Auxiliary cutting abrasive material G2 average body on (c) same unit length sawline
2 times of long-pending density >=main cutting abrasive material G1 average bulk density, described bulk density refers to the abrasive material that unit length sawline comprises
Grain number.
In cutting process, after surface of the work is cut by main cutting abrasive material G1, a certain amount of cutting area material can be removed
Material, and form the roughness Ra 1 relevant to main cutting abrasive material G1 particle diameter at slice surface.Select the particle diameter of auxiliary cutting abrasive material G2
Roughness Ra 1 that d2 is formed close to main cutting abrasive material G1 cutting process, the auxiliary cutting abrasive material G2 followed closely can be to before
The cutting work face that main cutting abrasive material G1 is formed carries out the further material of more efficient and removes/assist cutting, reduces rapidly Ra1, with
Time reduce the live load of main cutting abrasive material G1 of follow-up follow-up:
A () compares the situation that there is (namely conventional plating fixed abrasive sawing wire) without auxiliary cutting abrasive material G2, main cutting is ground
The cutting efficiency of material G1 is improved, and the passivation speed of main cutting abrasive material G1 is also eased, and the abrasive material G2 of auxiliary cutting simultaneously exists
Gradually peeling in cutting process, is taken away by coolant, and the space vacateed, for accepting new sawdust, so constitutes efficiently and holds
" the dynamic chip removal of grinding " mechanism that continuous property is strong, helps dynamically to remove the sawdust heap on saw kerf and sawline surface and blocks up, change further
Cooler environment arround kind cutting efficiency and sawline；
B (), because main cutting abrasive material G1 cuts removal quantity greatly, auxiliary cutting abrasive material G2 is main only to main abrasive particle group generation
Matsurface carries out secondary cutting, compare dereliction cutting abrasive material G1(namely usual resins fixed abrasive sawing wire) situation, auxiliary is cut
The live load cutting abrasive material G2 declines to a great extent, and main cutting abrasive material G1 system is consolidated in bus by metal/alloy and is distributed in auxiliary
In the middle of cutting abrasive material G2, can simultaneously work as helping the effect of heat radiation, resin medium layer and auxiliary cutting abrasive material G2 to collectively constitute
Life-span of mixed layer be therefore greatly improved；
C () meanwhile, cuts the assistant grinding of abrasive material G2, the final rough surface of finished product through auxiliary in cutting process
Degree Ra2 ＜ Ra1, the surface smoothness of finished work-piece have also been obtained corresponding raising to concordance.
In order to reach the basic matching effect of cause, i.e. auxiliary cutting abrasive material between main cutting abrasive material G1 and auxiliary cutting abrasive material G2
The roughness Ra 1 that the particle diameter d2 of G2 substantially can be formed close to main cutting abrasive material G1 cutting process, selecting d2 is d1's
0.2-0.8 times, on same unit length sawline, auxiliary cutting abrasive material G2 average bulk density is more than main cutting abrasive material G1 average body
2 times of long-pending density.
Research shows, in most cases, main cutting abrasive material G1 produce surface roughness between 0.3-0.6 times of d1,
Therefore preferably d2 is 0.3-0.6 times of d1.
Because the subjective role of auxiliary cutting abrasive material G2, it is that the surface of the work opening up main cutting abrasive material G1 is carried out quite
In the effect of " sanding and polishing ", introduce conventional grinding tools engineering experience, simultaneously take account of the abrasive grain volume density that resin bonded allows
Limiting, auxiliary cutting abrasive material G2 may be multilamellar arrangement at resin bonded layer, and auxiliary cutting abrasive material G2 can select with main
Materials (such as auxiliary cutting abrasive material G2 selects carborundum, and main cutting abrasive material G1 selects diamond) different for cutting abrasive material G1, excellent
Being selected on same unit length sawline auxiliary cutting abrasive material G2 average bulk density is main cutting abrasive material G1 average bulk density
3-20 times, to reaching better balance on main cutting abrasive material G1 and the live load of auxiliary cutting abrasive material G2 and complementary effect.
The present invention by the design that sawline structure and sand grains are arranged and high intensity medium bonding course and resin medium layer,
Consolidation different size and the main cutting abrasive material G1 of bulk density and auxiliary cutting abrasive material G2 respectively.Main cutting abrasive material G1 is close to bus
Side be consolidated in the first high intensity medium bonding course；Then along bus radially outward, main cutting abrasive material G1 is consolidated in second
High intensity medium bonding course；Then close to sawline surface, main cutting abrasive material G1 is consolidated in resin medium layer；Auxiliary cutting mill
Material G2 is consolidated in resin medium layer.
A) cost can be controlled, at certain process conditions and yield by controlling the thickness of high intensity medium bonding course
Under restriction, minimize the thickness of high intensity medium bonding course, use the resin medium layer of low cost to carry out completion high intensity medium solid
The filling of knot layer.
B) in practical process, auxiliary cutting the coming off at random of abrasive material G2, also assist in dynamically remove sawdust at saw kerf and
The heap on sawline surface blocks up, and improves the cooler environment arround cutting efficiency and sawline further.
C) main cutting abrasive material G1 is incorporated into bus by high duty metal dielectric layer, and mixed distribution is in by resin bonded
In the middle of auxiliary cutting abrasive material G2, be conducive to alleviating auxiliary cutting abrasive material G2 and lead because the heat produced at working angles cannot dredge
Cause resin medium layer to soften, bring abrasive particle to hold caducous phenomenon, improve resin medium layer and auxiliary cutting abrasive material G2 further
The life-span of the mixed layer collectively constituted.
For ensureing that main abrasive particle group possesses enough attachment spaces on bus surface, it is provided simultaneously with enough cutting powers, one
As select d1 be the 1/5 ~ 1/20 of bus diameter.
The bus surface that the present invention uses can be from coating, and described coating is the one in zinc, stannum, copper, pyrite, nickel
Or it is several.
Main cutting abrasive material G1 of the present invention and auxiliary cutting abrasive material G2 is diamond, carborundum, aluminium nitride, oxidation
Aluminum, boron carbide, boron nitride, zirconium oxide, the combination of one or more of zirconic acid aluminum.
The material of described main cutting abrasive material G1 and auxiliary cutting abrasive material G2 can be different, on the one hand can reduce cost, separately
On the one hand the different distributions density realizing abrasive material in unit volume it is beneficial to.
Described resin medium layer is used for consolidating auxiliary cutting abrasive material G2, is the most also consolidated with filler particles, helps dynamically row
Bits and heat conduction, mean diameter d2 of the mean diameter d3 ＜ auxiliary cutting abrasive material G2 of described filler particles.
Described filler particles is the combination of one or more of aluminium oxide, carborundum, diadust, graphite.
Mean diameter d3 of described filler particles is 0.1-0.5 times of d1.
The grain surface of described main cutting abrasive material G1 and auxiliary cutting abrasive material G2 is by chemistry, electrochemistry, vacuum or protection
Gas sintered, mode coated metal, alloy and/or the ceramic metal of coupling agent treatment, with strengthen/regulate main cutting abrasive material G1 and
Bond strength between auxiliary cutting abrasive material G2 and high intensity medium bonding course and/or resin medium layer.Heretofore described mill
The thickness that the particle diameter of material, mean diameter increase after the most not including pretreatment.
The preparation method of sawline of the present invention, at least comprises the steps: the pretreatment of (a) bus: make bus surface
Possesses the condition of fixed grain；The attachment of (b) main cutting abrasive material G1: the bus through pretreatment is immersed containing main cutting abrasive material
The electroplating bath of G1 so that main cutting abrasive material G1 is attached to surface conductance region, shape by plating mode according to certain distribution density
Become the first high intensity medium bonding course with main cutting abrasive material G1；(c) auxiliary cutting abrasive material G2 attachment: use coating or
The mode molded is blended with the manufactured goods assisting the resin of cutting abrasive material G2 or monomer prepolymer slurry to be attached to step (b)
Surface, uses the mode of heated drying, heat cure or ultra-violet curing to consolidate auxiliary cutting abrasive material G2.
The step that coating thickeies also is included: further to the manufactured goods of step (b) between described step (b) and step (c)
Plating, at least forms a floor height strength media bonding course, so that coating is thickeied design thickness.
Described resin or monomer prepolymer slurry comprise filler.
The beneficial effects of the present invention is: designed by sand on composite construction and secondary, in sawline surface construction difference merit
Can the self-defined arrangement of abrasive particle, abrasive particle size and bulk density are the most independently adjustable, it is achieved that main cutting, auxiliary cutting and
The combination of synchronous surface Plastic renovation function, and the load balancing of abrasive particle and utilization ratio optimization.Simultaneously can be for
Specific application apparatus/process environments and yield requirement, further customization regulation high intensity medium bonding course and resin medium layer
Thickness, reach the manufacturing cost of complex optimum sawline.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of a kind of embodiment of compound fixed abrasive sawing wire for multi-wire saw of the present invention.
Fig. 2 is the cross-section structure signal of a kind of embodiment of compound fixed abrasive sawing wire for multi-wire saw of the present invention
Figure.
Fig. 3 is the incision principle schematic diagram of the compound fixed abrasive sawing wire for multi-wire saw of the present invention.
Fig. 4 is the structure that the compound consolidation mud saw tape for multi-wire saw of the present invention has the embodiment of filler abrasive material
Schematic diagram.
Fig. 5 is the structural representation of the compound fixed abrasive sawing wire another kind embodiment for multi-wire saw of the present invention.
In figure 1, bus, 2, resin medium layer, 3, high intensity medium bonding course, the 31, first high intensity medium bonding course,
32, the second high intensity medium bonding course, 4, section, 5, filler particles.
Detailed description of the invention
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, only with
The basic structure of the illustration explanation present invention, therefore it only shows the composition relevant with the present invention.
Embodiment one
As shown in Figure 1-2, a kind of compound fixed abrasive sawing wire, can be to sapphire slices.Sapphire hardness is high, it is desirable to sawline
There is higher cutting force, and control the quality on surface simultaneously.One group of main cutting abrasive material G1 and one group at least it is fixed with on bus 1
Auxiliary cutting abrasive material G2, described bus 1 is the base metal silk for fixing cutting abrasive material；Main cutting abrasive material G1 passes through two floor heights
Strength media bonding course 3 is consolidated on bus 1；Auxiliary cutting abrasive material G2 is consolidated in bus 1 and/or height by resin medium layer 2
Strength media surface.High intensity medium bonding course 3 is by the first high intensity medium bonding course 31 and the second high intensity medium bonding course
32 compositions, main cutting abrasive material G1 is consolidated in the first high intensity medium bonding course 31 close to the side of bus 1；Then along bus 1
Radially outward, main cutting abrasive material G1 is consolidated in the second high intensity medium bonding course 32；Then close to sawline surface, main cutting
Abrasive material G1 is consolidated in resin medium layer 2；Auxiliary cutting abrasive material G2 is consolidated in resin medium layer 2.
Above-mentioned compound fixed abrasive sawing wire is manufactured by following steps:
(1) 0.35mm diameter steel wire substrate surface with by plating nickel plating process deposits apparent size for 30 ~ 40
The diamond particles G1 of micron, regulates nickel plating technology, controls the diamond particles spacing along bus 1 axial direction left in 50 μm
Right；
(2) thicken electrodeposited coating, reach the metal layer thickness requirement of design, micro-for 30 ~ 40 described in consolidation step (1)
The diamond particles G1 of rice apparent size；
(3) the diamond particles G2 that apparent size is 15 ~ 25 microns is carried out Silica hydrogel pretreatment；Diamond particles G2 does
Carry out vacuum atmosphere sintering after dry, form Si-C on diamond particles G2 surface；
(4) it is that once to go up gold dust firm by 15 ~ 25 μm diamond abrasive grain G2(mean particle size d2 through surface preparation
0.6 times of mean diameter d1 of stone grinder grain G1) and acrylic resin be blended, formed homogeneous phase solution, control bulk density be above-mentioned
2 times of step (1) abrasive material bulk density；
(5) sawline is carried out sand on secondary by the mixed solution of step (4)；
(6) sawline is passed through the tubular type kiln of constant temperature 220 DEG C, resin medium layer 2 is solidified；
(7) cleaning sawline, complete the final manufacture of sawline, the structural representation of this sawline is shown in Fig. 1 and Fig. 2.
The sawline obtained according to this case study on implementation, compares, between main cutting abrasive material G1 with tradition electroplated diamond sawline
Space is assisted cutting abrasive material G2 to make full use of, and has shared load, and the service life of sawline improves 5%, and the particle diameter of G2 sets simultaneously
Meter improves surface quality, and the fraction defective that final section causes due to roughness fluctuation reduces 2%.Described tradition plating Buddha's warrior attendant
Stone saw line refers to, uses 0.35mm steel wire as bus 1, bus 1 has been consolidated by electrodeposited coating the Buddha's warrior attendant of a layer 30 ~ 40 microns
Stone, the spacing of diamond particles is in 30 ~ 60 μm.
Embodiment two
As shown in Figure 1-2, a kind of compound fixed abrasive sawing wire, can cut single crystal silicon wafer.This product Surface Quality
Yield require higher, thus on design secondary, the Abrasive Particle Size of sand is little, and bulk density is high to realize stronger surface reconditioning merit
Energy.The sawline structure of the present embodiment is roughly the same with embodiment one, manufactures compound fixed abrasive sawing wire by following technique:
(1) the diamond particles G1 that apparent size is 8 ~ 14 μm is carried out surface vacuum titanizing process, at diamond surface
Form the chemical bonds of C-Ti；
(2) by electroplating technology, 8 ~ 14 μm diamond particles G1 carrying out titanizing process being deposited to line footpath is 0.12mm
Steel wire on；The regulation by electroplating parameter of the spacing between abrasive particle, controls at spacing 50 microns；
(3) thicken electrodeposited coating, reach the metal layer thickness requirement of design, for the carrying out described in consolidation step (1)
The diamond abrasive grain of 8 ~ 14 μm apparent sizes that titanizing processes；
(4) be equivalent to once go up the average of grain of sand by silicon carbide abrasive particles G2(mean diameter d2 that apparent size is 2 microns
0.2 times of particle diameter d1) carry out pretreatment with coupling agent KH570；
(5) above-mentioned silicon carbide abrasive particles G2 through surface preparation and acrylic resin are blended, form homogeneous mixing molten
Liquid；
(6) sawline is carried out sand on secondary by the mixed solution of step (5), by regulation silicon carbide abrasive particles G2 at resin
The concentration of mixed liquor, the bulk density controlling silicon carbide abrasive particles G2 is once go up sand diamond abrasive grain 20 times；
(7) sawline is passed through the tubular type kiln of constant temperature 220 DEG C, resin medium layer 2 is solidified；
(8) cleaning sawline, complete the final manufacture of sawline, the structural representation of this sawline is shown in Fig. 1 and Fig. 2.
The sawline obtained according to this case study on implementation, compares, at the diamond of 8-14 μm with tradition electroplated diamond sawline
Grain central filler is with the highdensity 2 micrometer silicon carbide silicon abrasive material G2 of resin bonded, and the raising of this design Surface Quality is outstanding
For substantially, and chip removal effect is obvious, contributes to reducing outage.The surface roughness of single crystal silicon wafer is than tradition plating Buddha's warrior attendant
Roughness after the cutting of stone saw line have dropped 7%, and outage also reduced 2% simultaneously, and on secondary, sand small particle abrasive particle is to silicon chip table
Face quality has clear improvement.Described traditional electroplated diamond sawline refers to, employing 0.12mm steel wire is as bus 1, on bus 1
Consolidated the diamond of a layer 8 ~ 14 microns by electrodeposited coating, the spacing of diamond particles is in 50 ~ 100 μm.
Embodiment three
As shown in Figure 1-2, a kind of compound fixed abrasive sawing wire, can cut monocrystal silicon.Client's production capacity has more than needed, it is desirable to cut
Cutting efficiency high, surface quality is good simultaneously, thus on design secondary, sand considers cutting efficiency and the balance of surface quality.The present embodiment
Sawline structure roughly the same with embodiment one, manufacture compound fixed abrasive sawing wire by following technique:
(1) the diamond particles G1 that apparent size is 8 ~ 14 μm is carried out surface vacuum titanizing process, at diamond surface
Form the chemical bonds of C-Ti；
(2) by electroplating technology, 8 ~ 14 μm diamond particles G1 carrying out titanizing process being deposited to line footpath is 0.12mm
Steel wire on；The regulation by electroplating parameter of the spacing between abrasive particle, controls at spacing 200 microns；
(3) thicken electrodeposited coating, reach the metal layer thickness requirement of design, for the carrying out described in consolidation step (1)
The diamond abrasive grain of 8 ~ 14 μm apparent sizes that titanizing processes；
(4) be equivalent to once go up grain of sand G1 by diamond abrasive grain G2(mean diameter d2 that apparent size is 6-10 micron
0.8 times of mean diameter d1) carry out pretreatment with coupling agent KH570；
(5) the above-mentioned diamond abrasive grain G2 through surface preparation and acrylic resin are blended, form homogeneous mixing molten
Liquid；
(6) sawline is carried out sand on secondary by the mixed solution of step (5), mixed at resin by regulation diamond abrasive grain
Closing the concentration of liquid, controlling diamond abrasive grain bulk density is once go up sand diamond abrasive 15 times；
(7) sawline is passed through the tubular type kiln of constant temperature 220 DEG C, resin medium layer 2 is solidified；
(8) cleaning sawline, complete the final manufacture of sawline, the structural representation of this sawline is shown in Fig. 1 and Fig. 2.
The sawline obtained according to this case study on implementation, compares with conventional resins diamond saw wires, main cutting abrasive material G1 8-14 μm
Being consolidated by high duty metal, cutting force significantly promotes, at the gap central filler higher density of the diamond particles of G1
The diamond abrasive G2's of 6-10 μm.Comparing with conventional resins diamond saw wires, abrasive material load collocation equilibrium, stock-removing efficiency promotes
3 times, improve 5 times service life, and surface roughness have dropped 2%, yield improves 1%.Described conventional resins gold
Hard rock sawline refers to, uses 0.12mm steel wire as bus 1, bus 1 passes through the resin bonded Buddha's warrior attendant of a layer 8 ~ 14 microns
Stone, the spacing of diamond particles is in 5 ~ 50 μm.
Embodiment four
As shown in Figure 1-2, a kind of compound fixed abrasive sawing wire, can be used for monocrystal silicon evolution, this sawline requires strong cutting
Cut ability, solve the problem that the yield that causes greatly of evolution sawline size fluctuation is low simultaneously.The sawline structure of the present embodiment and enforcement
Example one is roughly the same, manufactures compound fixed abrasive sawing wire by following technique:
(1) the diamond particles G1 that apparent size is 30 ~ 40 μm is carried out surface vacuum titanizing process, at diamond surface
Form the chemical bonds of C-Ti；
(2) by electroplating technology, 30 ~ 40 μm diamond particles G1 carrying out titanizing process being deposited to line footpath is
On the steel wire of 0.35mm；The regulation by electroplating parameter of the spacing between abrasive particle, controls at spacing 50 microns；
(3) thicken electrodeposited coating, reach the metal layer thickness requirement of design, for the carrying out described in consolidation step (1)
The diamond abrasive grain of 30 ~ 40 μm apparent sizes that titanizing processes；
(4) diamond particles G2(mean diameter d2 that apparent size is 8 ~ 12 microns is equivalent to once go up sand milling material put down
All 0.3 times of particle diameter d1), carry out surface vacuum titanizing process, form the chemical bonds of C-Ti at diamond surface；
(5) described for step (4) the diamond abrasive grain G2 through surface preparation and acrylic resin are blended, are formed homogeneous
Mixed solution；
(6) sawline is carried out sand on secondary by the mixed solution of step (5), because the thickness of resin medium layer 2, mill
Material G2 can arrange with multilamellar in resin medium layer 2, and the concentration adjusting resin mixture liquor abrasive particle controls the flat of 8 ~ 12 microns of abrasive particles
All bulk densities are once go up sand milling material bulk density 6 times；
(7) sawline is passed through the tubular type kiln of constant temperature 220 DEG C, resin medium layer 2 is solidified；
(8) cleaning sawline, complete the final manufacture of sawline, the structural representation of this sawline is shown in Fig. 1 and Fig. 2.Real according to this
Execute the sawline that case obtains, compare with tradition electroplated diamond sawline, size fluctuation the fraction defective caused greatly reduces 5%.Institute
State tradition electroplated diamond sawline to refer to, use 0.35mm steel wire as bus 1, bus 1 has consolidated one layer by electrodeposited coating
The diamond of 30 ~ 40 microns, the spacing of diamond particles is in 30 ~ 60 μm.
Embodiment five
As shown in Figure 4, a kind of compound fixed abrasive sawing wire, can cut monocrystal silicon.Cutting efficiency is high, and surface quality is good,
Outage is low simultaneously, thus on design secondary, sand considers cutting efficiency and the balance of surface quality.The sawline structure of the present embodiment
Roughly the same with embodiment one, except for the difference that the resin medium layer 2 of the present embodiment is also consolidated with filler particles 5, by following work
Skill manufactures compound fixed abrasive sawing wire:
(1) the diamond particles G1 that apparent size is 15 ~ 25 μm is carried out surface vacuum titanizing process, at diamond surface
Form the chemical bonds of C-Ti；
(2) by electroplating technology, 15 ~ 25 μm diamond particles G1 carrying out titanizing process being deposited to line footpath is
On the steel wire of 0.12mm；The regulation by electroplating parameter of the spacing between abrasive particle, controls at spacing 90 microns；
(3) thicken electrodeposited coating, reach the metal layer thickness requirement of design, for the carrying out described in consolidation step (1)
The diamond abrasive grain of 15 ~ 25 μm apparent sizes that titanizing processes；
(4) be equivalent to once go up grain of sand G1 by diamond abrasive grain G2(mean diameter d2 that apparent size is 8-14 micron
0.6 times of mean diameter d1) carry out pretreatment with coupling agent KH570；
(5) be equivalent to alumina packing 5(mean diameter d3 that apparent size is 2 microns once go up the flat of grain of sand G1
All 0.1 times of particle diameter d1) carry out pretreatment with coupling agent KH570；
(6) the above-mentioned diamond abrasive grain G2 through surface preparation, alumina packing 5 and acrylic resin are blended, shape
Become homogeneous mixed solution；
(7) sawline is carried out sand on secondary by the mixed solution of step (5), by regulation diamond abrasive grain G2 at resin
The concentration of mixed liquor, the bulk density controlling diamond abrasive grain G2 is once go up sand diamond abrasive 3 times；Alumina packing accounts for
Weight resin ratio 20%；
(8) sawline is passed through the tubular type kiln of constant temperature 220 DEG C, resin medium layer 2 is solidified；
(9) cleaning sawline, complete the final manufacture of sawline, the structural representation of this sawline is shown in Fig. 4.
Tradition diamond electroplating sawline only exists the cutting abrasive material of one layer of 15 ~ 25 μm, electrodeposited coating consolidate, spacing 60 ~
80 μm, the sawline obtained according to this case study on implementation, compare with tradition electroplated diamond sawline, the spacing between main cutting abrasive particle G1
Expand 20%, and main cutting abrasive particle G1 bulk density decline the cutting efficiency loss caused and undertaken by the G2 abrasive particle of 3 double densities,
G2 abrasive material reduces roughness simultaneously, has repaired surface quality, and filler serves dynamic chip removal, increases the work in resin bed life-span
With.The stock-removing efficiency of final compound sawline improves 4%, and surface roughness have dropped 2%, Yield lmproved 2%.
Embodiment six
As it is shown in figure 5, a kind of compound fixed abrasive sawing wire, monocrystal silicon can be cut.Client's production capacity has more than needed, it is desirable to cutting
Efficiency is high, and surface quality is good simultaneously, thus on design secondary, sand considers cutting efficiency and the balance of surface quality.The present embodiment
Sawline structure is roughly the same with embodiment one, and except for the difference that the main cutting abrasive material G1 of the present embodiment is only by a floor height strength media
Bonding course 3 is consolidated on bus 1.
Compound fixed abrasive sawing wire is manufactured by following technique:
(1) the diamond particles G1 that apparent size is 8 ~ 14 μm is carried out surface vacuum titanizing process, at diamond surface
Form the chemical bonds of C-Ti；
(2) by electroplating technology, 8 ~ 14 μm diamond particles G1 carrying out titanizing process being deposited to line footpath is 0.12mm
Steel wire on；The regulation by electroplating parameter of the spacing between abrasive particle, controls at spacing 200 microns；
(3) be equivalent to once go up grain of sand G1 by diamond abrasive grain G2(mean diameter d2 that apparent size is 6-10 micron
0.8 times of mean diameter d1) carry out pretreatment with coupling agent KH570；
(4) the above-mentioned diamond abrasive grain G2 through surface preparation and acrylic resin are blended, form homogeneous mixing molten
Liquid；
(5) sawline is carried out sand on secondary by the mixed solution of step (4), mixed at resin by regulation diamond abrasive grain
Closing the concentration of liquid, controlling diamond abrasive grain bulk density is once go up sand diamond abrasive 17 times；
(6) sawline is passed through the tubular type kiln of constant temperature 220 DEG C, resin medium layer 2 is solidified；
(7) cleaning sawline, complete the final manufacture of sawline, the structural representation of this sawline is shown in Fig. 5.
The sawline obtained according to this case study on implementation, compares with conventional resins diamond saw wires, main cutting abrasive material G1 8-14 μm
Being consolidated by high duty metal, cutting force significantly promotes, at the gap central filler higher density of the diamond particles of G1
The diamond abrasive G2's of 6-10 μm.Comparing with conventional resins diamond saw wires, abrasive material load collocation equilibrium, stock-removing efficiency promotes
3 times, improve 5.5 times service life, and surface roughness have dropped 2%, yield improves 1%.Described conventional resins
Diamond saw wires refers to, uses 0.12mm steel wire as bus 1, bus 1 passes through the resin bonded gold of a layer 8 ~ 14 microns
Hard rock, the spacing of diamond particles is in 5 ~ 50 μm.
With the above-mentioned desirable embodiment according to the present invention for enlightenment, by above-mentioned description, relevant staff is complete
Entirely can carry out various change and amendment in the range of without departing from this invention technological thought.The technology of this invention
The content that property scope is not limited in description, it is necessary to determine its technical scope according to right.
Claims (15)
1. the compound fixed abrasive sawing wire for multi-wire saw, it is characterised in that:
One group of main cutting abrasive material (G1) and one group of auxiliary cutting abrasive material (G2), main cutting abrasive material at least it is fixed with on (a) bus (1)
(G1) mean diameter is d1, auxiliary cutting abrasive material (G2) mean diameter be d2, d2 be 0.2-0.8 times of d1, described bus
(1) for the base metal silk for fixing cutting abrasive material；
B () main cutting abrasive material (G1) is consolidated on bus (1) by least one of which high intensity medium bonding course (3), described high-strength
Degree medium is tensile strength at the metal of more than 100Mpa and/or metal alloy；Auxiliary cutting abrasive material (G2) passes through resin medium
Layer (2) is consolidated in bus (1) and/or high intensity dielectric surface；
C on () same unit length sawline, the average bulk density >=main cutting abrasive material (G1) of auxiliary cutting abrasive material (G2) is average
2 times of bulk density, described bulk density refers to the abrasive grain number that unit length sawline comprises.
2. compound fixed abrasive sawing wire as claimed in claim 1, it is characterised in that: d2 is 0.3-0.6 times of d1.
3. compound fixed abrasive sawing wire as claimed in claim 1, it is characterised in that: same unit length sawline auxiliary cutting mill
3-20 times of the average bulk density that average bulk density is main cutting abrasive material (G1) of material (G2).
4. compound fixed abrasive sawing wire as claimed in claim 1 or 2, it is characterised in that: described high intensity medium bonding course (3)
Being made up of the first high intensity medium bonding course (31) and the second high intensity medium bonding course (32), main cutting abrasive material (G1) is close to female
The side of line (1) is consolidated in the first high intensity medium bonding course (31)；Then along bus (1) radially outward, main cutting abrasive material
(G1) the second high intensity medium bonding course (32) it is consolidated in；Then close to sawline surface, main cutting abrasive material (G1) is consolidated in
Resin medium layer (2)；Auxiliary cutting abrasive material (G2) is consolidated in resin medium layer (2).
5. compound fixed abrasive sawing wire as claimed in claim 1, it is characterised in that: d1 is the 1/5 ~ 1/20 of bus (1) diameter.
6. compound fixed abrasive sawing wire as claimed in claim 1, it is characterised in that: bus (1) surface is from coating, described
Coating is one or more in zinc, stannum, copper, pyrite, nickel.
7. compound fixed abrasive sawing wire as claimed in claim 1, it is characterised in that: described main cutting abrasive material (G1) and auxiliary are cut
Cutting abrasive material (G2) is diamond, carborundum, aluminium nitride, aluminium oxide, boron carbide, boron nitride, zirconium oxide, the one of zirconic acid aluminum or several
The combination planted.
8. compound fixed abrasive sawing wire as claimed in claim 1, it is characterised in that: described main cutting abrasive material (G1) is cut with auxiliary
The material cutting abrasive material (G2) is different.
9. compound fixed abrasive sawing wire as claimed in claim 1, it is characterised in that: described resin medium layer (2) is used for consolidating
Auxiliary cutting abrasive material (G2), is the most also consolidated with filler particles (5), and the mean diameter d3 ＜ auxiliary of described filler particles (5) is cut
Cut mean diameter d2 of abrasive material (G2).
10. fixed abrasive sawing wire as claimed in claim 9 compound, it is characterised in that: described filler particles (5) be aluminium oxide,
Carborundum, diadust, the combination of one or more of graphite.
11. the most compound fixed abrasive sawing wires, it is characterised in that: the mean diameter of described filler particles (5)
D3 is 0.1-0.5 times of d1.
12. the most compound fixed abrasive sawing wires, it is characterised in that: described main cutting abrasive material (G1) and auxiliary
The grain surface of cutting abrasive material (G2) wraps up by the way of chemistry, electrochemistry, vacuum or protective gas sintering, coupling agent treatment
Metal, alloy and/or ceramic metal.
The preparation method of 13. 1 kinds of compound fixed abrasive sawing wires as described in claim 1-12, it is characterised in that at least include
Following steps: (a) bus pretreatment: make bus surface possess the condition of fixed grain；(b) main cutting abrasive material (G1) attached
: the bus through pretreatment is immersed the electroplating bath containing main cutting abrasive material (G1) so that main cutting abrasive material (G1) is by electricity
Plating mode is attached to surface conductance region according to certain distribution density, forms the high intensity medium with main cutting abrasive material (G1) solid
Knot layer；The attachment of (c) auxiliary cutting abrasive material (G2): use the mode of coating or mold pressing to be blended with auxiliary cutting abrasive material (G2)
Resin or monomer prepolymer slurry be attached to the manufactured goods surface of step (b), use heated drying, heat cure or ultraviolet solid
The mode changed consolidates auxiliary cutting abrasive material (G2).
The preparation methoies of 14. as claimed in claim 13 compound fixed abrasive sawing wires, it is characterised in that: described step (b) with
Also include the step that coating thickeies between step (c): the manufactured goods of step (b) are electroplated further, at least form a floor height strong
Degree medium bonding course, to thicken design thickness by coating.
The preparation method of the 15. compound fixed abrasive sawing wires as described in claim 13 or 14, it is characterised in that: described resin or
Person's monomer prepolymer slurry comprises filler.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410008264.1A CN104760146B (en) | 2014-01-08 | 2014-01-08 | A kind of compound fixed abrasive sawing wire for multi-wire saw and preparation method thereof |
| PCT/CN2014/093142 WO2015103911A1 (en) | 2014-01-08 | 2014-12-05 | Combined consolidation grinding material saw line used for multi-line cutting, and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410008264.1A CN104760146B (en) | 2014-01-08 | 2014-01-08 | A kind of compound fixed abrasive sawing wire for multi-wire saw and preparation method thereof |
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| CN104760146A CN104760146A (en) | 2015-07-08 |
| CN104760146B true CN104760146B (en) | 2016-08-17 |
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| WO (1) | WO2015103911A1 (en) |
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| JP6650222B2 (en) * | 2015-07-21 | 2020-02-19 | 株式会社東京精密 | Cutting blade and manufacturing method thereof |
| CN105479608A (en) * | 2015-12-01 | 2016-04-13 | 苏州市汇峰机械设备有限公司 | High-hardness cutting metal wire |
| CN105797664B (en) * | 2016-04-28 | 2019-03-08 | 广东烯王科技有限公司 | A kind of method that microwave-ultraviolet combination solidifies diamond resin line |
| CN109290970B (en) * | 2018-10-31 | 2021-06-01 | 张家港智慧清洁技术研究院有限公司 | Preparation method of electroplated diamond abrasive belt with mixed particle size |
| CN110883947A (en) * | 2019-12-27 | 2020-03-17 | 长沙百川超硬材料工具有限公司 | Superfine diamond wire saw for stone plate-cutting forming and manufacturing method thereof |
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|---|---|---|---|---|
| CN102294518A (en) * | 2011-08-05 | 2011-12-28 | 浙江工业大学 | Multistrand compound wire saw |
| CN102481647A (en) * | 2009-08-14 | 2012-05-30 | 圣戈班磨料磨具有限公司 | Abrasive Articles Including Abrasive Particles Bonded To An Elongated Body |
| CN103372921A (en) * | 2012-04-27 | 2013-10-30 | 铼钻科技股份有限公司 | Composite wire saw with electroplated layer and manufacturing method thereof |
| CN203726643U (en) * | 2014-01-08 | 2014-07-23 | 蒙特集团（香港）有限公司 | Combined consolidation grinding material saw line used for multi-line cutting |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129506C (en) * | 1997-02-14 | 2003-12-03 | 住友电气工业株式会社 | Wire-saw and its mfg. method |
| JP2006007387A (en) * | 2004-06-29 | 2006-01-12 | Allied Material Corp | Super-abrasive grain wire saw |
| JP2007268627A (en) * | 2006-03-30 | 2007-10-18 | Noritake Super Abrasive:Kk | Electro-deposited wire saw |
| CN103100987B (en) * | 2013-01-14 | 2015-12-09 | 南京航空航天大学 | The electroplating diamond wire saw of abrasive material controllable arrangement and preparation method |
-
2014
- 2014-01-08 CN CN201410008264.1A patent/CN104760146B/en not_active Expired - Fee Related
- 2014-12-05 WO PCT/CN2014/093142 patent/WO2015103911A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102481647A (en) * | 2009-08-14 | 2012-05-30 | 圣戈班磨料磨具有限公司 | Abrasive Articles Including Abrasive Particles Bonded To An Elongated Body |
| CN102294518A (en) * | 2011-08-05 | 2011-12-28 | 浙江工业大学 | Multistrand compound wire saw |
| CN103372921A (en) * | 2012-04-27 | 2013-10-30 | 铼钻科技股份有限公司 | Composite wire saw with electroplated layer and manufacturing method thereof |
| CN203726643U (en) * | 2014-01-08 | 2014-07-23 | 蒙特集团（香港）有限公司 | Combined consolidation grinding material saw line used for multi-line cutting |
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