CN105856078B - A kind of self-sharpening sintered abrasive grain preparation method and purposes - Google Patents
A kind of self-sharpening sintered abrasive grain preparation method and purposes Download PDFInfo
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- CN105856078B CN105856078B CN201610243158.0A CN201610243158A CN105856078B CN 105856078 B CN105856078 B CN 105856078B CN 201610243158 A CN201610243158 A CN 201610243158A CN 105856078 B CN105856078 B CN 105856078B
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- abrasive grain
- abrasive
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- 239000006061 abrasive grain Substances 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000002245 particle Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 42
- 239000003082 abrasive agent Substances 0.000 claims abstract description 28
- 238000005245 sintering Methods 0.000 claims abstract description 27
- 239000000203 mixture Substances 0.000 claims abstract description 22
- 238000012545 processing Methods 0.000 claims abstract description 21
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000010432 diamond Substances 0.000 claims description 18
- 229910003460 diamond Inorganic materials 0.000 claims description 17
- 239000000654 additive Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 238000009826 distribution Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 10
- 230000000996 additive effect Effects 0.000 claims description 9
- 238000009736 wetting Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 4
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 claims description 3
- 229920002367 Polyisobutene Polymers 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 3
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 3
- 239000011118 polyvinyl acetate Substances 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052810 boron oxide Inorganic materials 0.000 claims description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 2
- 239000000292 calcium oxide Substances 0.000 claims description 2
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- 230000005484 gravity Effects 0.000 claims description 2
- 229910000464 lead oxide Inorganic materials 0.000 claims description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001950 potassium oxide Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 2
- 229910001948 sodium oxide Inorganic materials 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- 235000013339 cereals Nutrition 0.000 claims 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims 1
- 229920001651 Cyanoacrylate Polymers 0.000 claims 1
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- -1 Pioloform Polymers 0.000 claims 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims 1
- 239000011354 acetal resin Substances 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 238000011049 filling Methods 0.000 claims 1
- 229920006324 polyoxymethylene Polymers 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 238000000227 grinding Methods 0.000 abstract description 32
- 230000008569 process Effects 0.000 abstract description 14
- 238000005498 polishing Methods 0.000 abstract description 10
- 239000007767 bonding agent Substances 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 5
- 229910001651 emery Inorganic materials 0.000 abstract description 2
- 238000012805 post-processing Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 10
- 239000003292 glue Substances 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003595 mist Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000003995 emulsifying agent Substances 0.000 description 2
- 239000010437 gem Substances 0.000 description 2
- 229910001751 gemstone Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000010334 sieve classification Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910019251 Sn—Cu—Fe Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A kind of preparation method and purposes of self-sharpening sintered abrasive grain, it is characterized in that the processes such as required raw material precentagewise metering, batch mixing, cementing, broken, classification, sintering and post processing are made into high-quality sintered abrasive grain.The sintered abrasive grain has appropriate self-sharpening, bulky grain is sintered in grinding process not to be whole and comes off, but the bonding agent fatigue rupture, failure inside sintered abrasive grain between raw material little particle then cause to crush, the original little particle abrasive particle of composition sintered abrasive grain comes off one by one.The sintered abrasive grain that the present invention is provided has good self-sharpening, is conducive to stablizing processing efficiency, improves abrasive material utilization rate；Available for being ground, grinding and polishing, honing, in the processing technology such as sawing, it may be made as the finished tools such as emery wheel, grinding pad, honing head, saw blade.The method that the present invention is provided has that technique is simple, high yield rate, low cost and other advantages.
Description
Technical field
The present invention relates to a kind of processing method of abrasive material, prepared by especially a kind of abrasive material, abrasive machining（Grinding, grinding, throwing
Light, honing, Cutting indexes）, the specifically a kind of preparation method and purposes of self-sharpening sintered abrasive grain.
Background technology
Due to high rigidity, high intensity, high-wearing feature and a series of excellent physical chemistry such as linear expansion coefficient is small
Characteristic, the abrasive material such as diamond, carborundum, cerium oxide obtains being cured day in abrasive machining field to be widely applied.In process, mill
It is usually cast setting between abrasive material and bonding agent in tool, pulsating stress causes abrasive grain to crush under acting on, blunt, Yi Jiyi
The failure mode such as come off.Coming off too early for abrasive material, not only shortens the service life of grinding tool but also is unfavorable for the stability of processing；
Abrasive material after blunt can not come off in time, cause the decline of processing efficiency and the burn of workpiece, therefore improve the utilization rate of abrasive material
And stable processing efficiency becomes the hot issue of research.
Scholar both domestic and external has done substantial amounts of research since eighties of last century seventies, main to be modified skill using abrasive surface
Art, prepare polycrystalline grits to improve the performance of abrasive material, and then reach the purpose for improving its processing efficiency and service life.
During carrying out surface modification to abrasive material, the modifying agent and technique that people are used are also different, from initially single gold
Belong to element to alloying element, and later nonmetallic materials, also experienced on plating technic and be chemically plated to the micro- steaming of vacuum
The various ways such as hair plating.Due to the diversity of material property to be processed so that the research of abrasive material modified technique is particularly numerous and diverse.Using plating
Cover the grinding tool of diamond preparation, although grinding tool working life is improved, but easily cause the abrasive material of passivation not come off in time,
Cause processing characteristics drastically can not, after need to being repaired, can just be continuing with.During polycrystalline abrasive grit use, corner angle passivation
Abrasive material easily come off, with stronger self-sharpening.Existing polycrystalline diamond micro mist be using unique directional blasting method by
Graphite is made, and preparation technology is complicated, cost is high, and yield is limited.Therefore, a kind of preparation method is simple, cost is low, grinding force is suitable
When, the processing technique field such as self-sharpening is good, can be widely applied to be ground, grind and polish, honing abrasive material preparation method urgently
Exploitation.
The content of the invention
The purpose of the present invention is to occur that abrasive material comes off or easily ground in use for existing concretion abrasive instrument
It is blunt, it is impossible to the problem of realizing self-regeneration, a kind of sintering method for preparing the simple and good concretion abrasive of self-sharpening is proposed, it leads to
Preferred, the broken classification technique of supplementary material design, adhesive is crossed to improve, sinter and postprocessing working procedures temperature control series of processes,
The sintered abrasive grain of high-quality is obtained using high temperature sintering methods, the grinding, grinding and polishing, honing of various types of materials is can be widely applied to
In the processing technique field such as sawing.
The technical scheme is that：
A kind of preparation method of self-sharpening sintered abrasive grain, it is characterised in that it comprises the following steps：
（1）Abrasive grain, high-temperature agglomerant and auxiliary additive are measured by mass percentage, it is well mixed that mixing is made
Thing；The percentage by weight of abrasive grain is 50-70%, and the weight ratio of high-temperature agglomerant is 22-38%, the weight ratio of auxiliary additive
For 0.5 ~ 30%；Raw material abrasive grain, high-temperature agglomerant and the auxiliary additive of sintered abrasive grain, measured according to mass percent
And be well mixed；Abrasive grain can be the diamonds of monocrystalline or heteromorphs, aluminum oxide, carborundum, oxidation in the raw material
The abrasive materials such as cerium, particle diameter distribution is between 100 nanometers ~ 50 microns, the feed particles between especially 200 nanometers ~ 20 microns；It is described
High temperature adhesive can be silica, sodium oxide molybdena, aluminum oxide, lead oxide, zinc oxide, calcium oxide, potassium oxide, lanthana, oxygen
Change one or more mixtures in boron etc., content is about the 5 ~ 50% of abrasive particle, by change high-temperature agglomerant consumption and
Proportioning can control cementing bond strength；The auxiliary additive is that copper powder, iron powder, nickel etc. have preferable deformability and bonding
The powder auxiliary material of ability, is filled in abrasive particle space and is conducive to molding bonded is gentle to rush shattering process, content is preferably about
The 5-15% of abrasive grain.
（2）Adhesive wetting is added into said mixture to stir evenly, and is dried in the range of 50 DEG C ~ 150 DEG C；Adhesive plus
Enter the 0.1-50% that amount is aforementioned mixture；Adhesive is added in raw material to after being well mixed, wetting is stirred evenly, low temperature drying.Institute
It can be polyvinyl acetate, Vinylidene Chloride, polyisobutene, polyvinyl alcohol, polyacrylate, a- alpha-cyanoacrylates to state adhesive
One or more mixtures in ester, Pioloform, polyvinyl acetal, epoxy resin etc., content is about the 0.1-35% of mixture, most preferably
10-20%；Gluing agent content is about the 15-35% of abrasive particle；
（3）By the cake broke after drying；It can be rolled, ground with mortar.Powder after broken is classified on request, can use rule
Determine the sieved through sieve of mesh number, obtain the bulky grain abrasive compact of appropriate particle size distribution, it is also possible to gravity classification method, centrifugal classification
Etc. the little particle abrasive compact for obtaining appropriate particle size distribution.
（4）Broken powder is classified on request, the bonded particulate of different-grain diameter is obtained；
（5）The bonded particulate of selected particle diameter is subjected to high temperature sintering and obtains sintered abrasive grain, it is real during high temperature sintering
Show automatically removing for adhesive；Blank after classification carries out high temperature removing glue, sintering in batches, is made by the effect of high-temperature agglomerant
Appropriate bond strength is obtained between raw material abrasive grain；Sintering temperature is adjusted according to the component of high-temperature agglomerant, temperature
It can change in the range of 500 DEG C ~ 1000 DEG C, furnace cooling after sintering；It is strong by controlling sintering temperature to obtain different combinations
The sintered abrasive grain of degree.Abrasive grain after high temperature removing glue, sintering circuit meets the requirement of actual use, with certain cutting energy
Power and bond strength.
（6）It is classified again, obtains the sintered abrasive grain of the present invention.Abrasive material after sintering Accurate Classification again, obtains appropriate grain
The high-quality sintered abrasive grain of distribution is spent, in favor of the surface quality and processing efficiency of rapidoprint.The particle size range of sintered abrasive grain is 1
The particle diameter of micron -150 microns, especially sintered abrasive grain is at 2 microns ~ 100 microns.
The self-sharpening sintered abrasive grain of the present invention, it is characterised in that described sintered abrasive grain is for being ground, grinding and polishing, the top gem of a girdle-pendant
Mill or Cutting indexes occasion, sintered abrasive grain are free between machined surface and instrument, and it is not whole failure in process
Destruction, but the bonding agent fatigue rupture, failure between sintered abrasive grain then cause to crush, original small of composition sintered abrasive grain
Grain abrasive particle comes off one by one；This process is conducive to the self-sharpening of abrasive particle, and can stable processing efficiency, the matter of raising surface to be machined
Amount.Described sintered abrasive grain with consolidate, weld or plating mode be made abrasive grinding wheel, pellet, grinding pad, polishing pad, honing head,
Saw blade is as machining tool, and the concretion abrasive for workpiece is processed.
The sintered abrasive grain that sintered abrasive grain is made up of raw material abrasive grain at a certain temperature is full with certain bond strength
Sufficient actual cut requirement, and adhesion suitably can guarantee that the self-sharpening of abrasive particle.It is not whole failure damage in process, and
It is that bonding agent fatigue rupture, failure inside sintered abrasive grain between raw material little particle then causes to crush, composition sintered abrasive grain
Original little particle abrasive particle comes off one by one.This process is conducive to the self-sharpening of abrasive particle, and can stablize processing efficiency, improves and is processed
The quality on surface.The processing occasion such as the sintered abrasive grain that the present invention is provided can be used for being ground, grind and polish, honing, sawing, trip
From between machined surface and instrument；Abrasive grinding wheel, pellet, grinding pad, throwing can be made with modes such as consolidation, welding, plating
The machining tools such as light pad, honing head, saw blade, the concretion abrasive for workpiece is processed.The sintered abrasive grain preparation side that the present invention is provided
Method is simple, cost is low, suitable for industrialized production, and with high in machining efficiency, processing characteristics stabilization and abrasive material utilization rate
High the features such as.
The beneficial effects of the invention are as follows：
The method that the present invention is provided has that technique is simple, high yield rate, low cost and other advantages.
Have the advantages that grinding force is appropriate, self-sharpening is good using the instrument of the abrasive machining of the present invention, can be widely applied to
The processing technique fields such as grinding, grinding and polishing, honing.
Brief description of the drawings
Fig. 1 schemes for the bulky grain abrasive material SEM of sinter molding.
Fig. 2 is the abrasive material state on solidified abrasive grinding pad surface.
Embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples.
Example 1：A kind of self-sharpening sintered abrasive grain preparation method, sintered abrasive grain by 5-7 μm of aluminum oxide, vitrified bond and
Nickel powder is made, and its preparation method is：500 aluminum oxide, 380 vitrified bond and 120 nickel powder are sufficiently mixed and obtained
1000 grams of mixtures, with 100 grams of polyvinyl acetate, Vinylidene Chloride, polyisobutene, polyvinyl alcohol, polyacrylate, a- cyano group
One or more mixing in acrylate, Pioloform, polyvinyl acetal, epoxy resin etc.（Similarly hereinafter）After being stirred evenly as adhesive wetting
Dried at 120 DEG C.Solid abrasive after drying is crossed into sieve classification, obtain particle diameter be 325 ~ 400 mesh micro mist, with 900 DEG C ~
1100 DEG C carry out 3 hours removing glues of high temperature sintering to the abrasive compact after classification, obtain the sintered abrasive grain shown in Fig. 1.Sintering process
Middle adhesive can natural evaporation or decomposition.Then it is classified again, particle diameter needed for obtaining and the sintered alumina of adhesion.
Embodiment 2：A kind of self-sharpening sintered abrasive grain preparation method, diadust, knot of the sintered abrasive grain by 3-5 μm of particle diameter
Mixture, copper powder are mixed, and wherein bonding agent is the mixture of silica and boron oxide.Its preparation method is：By 650 gold
Hard rock micro mist, 220 bonding agent, 130 copper powder are well mixed, and are stirred evenly after adding appropriate 10 grams of wettings of adhesive, at 50 DEG C
Drying.Caking grinding after drying is broken, and go out blank of the particle diameter distribution in 60-80 with the sieved through sieve of 200/230 mesh.
High temperature removing glue, sintering are carried out at 750 DEG C to blank 4 hours, furnace cooling.Accurate screening, obtains particle diameter distribution at 70 μm again
The high-quality sintered abrasive grain of left and right.
The high-quality sintered abrasive grain obtained after high temperature sintering, with Sn-Cu-Fe tyings mixture to be ground suitable for optical glass
Ratio be sufficiently mixed, diamond pellet is made after vacuum-sintering hot press forming technology.Using sintered abrasive grain as active grain
Pellet is pasted onto on pedestal, and the grinding and polishing available for materials such as ceramics, K9, fused quartzs is processed.In this example, for K9 glass
During attrition process, material removal rate has reached that the surface roughness Ra of workpiece after 50 μm/min, processing has reached 8.64nm.
Embodiment 3：A kind of self-sharpening sintered abrasive grain preparation method, sintered abrasive grain by 10-14 μm of particle diameter diadust,
Low-temperature vitrified bond and copper powder are made, and its preparation method is：By 600 diamond, 250 Low-temperature vitrified bond and 150
Copper powder be well mixed, the drying at 150 DEG C after mixture is stirred evenly with the wetting of 350 grams of adhesives.By the caking grinding after drying
Sieving, is met the micro mist that cutting requires particle diameter, and selection carries out 950 DEG C of high temperature removing glues, sintering 5 hours.Then sieve again,
Obtain required particle diameter (200/230) and the sintered diamond of bond strength.
Solidified abrasive grinding pad for grinding is made using above-mentioned sintered diamond as abrasive material, the grinding pad is by sintered gold
Hard rock, carborundum, copper powder, resin and multiple additives uniformly mix by quality proportioning, solidify after formed, as shown in Figure 2.Grind
Grinding process parameter is set to：Pressure 20kPa, rotating speed 85rpm, lapping liquid are that deionized water adds appropriate triethanolamine and OP-10
Emulsifying agent.Grind after 50min, the material removing rate for obtaining sapphire wafer is 220 ~ 250nm/min, and surface roughness Ra is 80
~ 110nm, and without obvious cut, the preceding road grinding step that can be polished as sapphire.
Example 4：A kind of sintered diamond abrasive material suitable for concretion abrasive polishing, it by 3 ~ 5 μm of particle diameters Buddha's warrior attendant
Stone, Low-temperature vitrified bond and copper powder are made, and its preparation method is：By 700 diamond, 250 Low-temperature vitrified bond and
50 copper powder is sufficiently mixed, and mixture is dried after being stirred evenly with 150 grams of adhesive wettings at 100 DEG C.Solid after drying is ground
Honed sieve, then 1000 DEG C of high temperature removing glues, sintering are carried out with suitable temperature to powder 2 hours.Then sieve again, needed for obtaining
The sintered diamond of particle diameter (170/230) and adhesion.
The solidified abrasive grinding pad for polishing is made in the above-mentioned sintered diamond prepared, it is by diamond, carbonization
The uniform mixing cured rear formation of silicon, copper powder, resin and multiple additives.Glossing parameter is set to：Pressure 15kPa, turns
Fast 30rpm, polishing fluid is that deionized water adds appropriate triethanolamine and OP-10 emulsifying agents.Grind after 30min, obtain quartzy glass
The material removing rate of glass is 2.5 μm/min, and surface average roughness Ra reaches below 10nm, and without obvious cut.
After being ground 30 minutes in the case that above-mentioned polish pressure is increased into 30kPa, other conditions and parameter constant, obtain
Material removing rate to quartz glass is 2 ~ 3 μm/min, and surface average roughness value Ra is 12.5nm, and without obvious cut.
Example 5：A kind of self-sharpening sintered abrasive grain preparation method, diamond, vitrified bond of the sintered abrasive grain by 14-20 μm
It is made with iron powder, its preparation method is：680 diamond, 250 Low-temperature vitrified bond and 70 iron powder are sufficiently mixed,
Mixture is dried after being stirred evenly with 200 grams of adhesive wettings at 85 DEG C.Solid abrasive after drying is crossed into sieve classification, particle diameter is obtained
For the micro mist of 120/170 mesh, high temperature removing glue, sintering are carried out to the abrasive compact after classification 5 hours with 550 DEG C ~ 620 DEG C.Then
It is classified again, particle diameter 120/170 needed for obtaining and the sintered diamond abrasive material of adhesion.
The working lining particle of sintered diamond abrasive material as hone stone is pressed into the preforming top gem of a girdle-pendant together with transition zone particle
Abrasive stick, and it is hot-forming obtain hone stone, for the Honing process of aluminum cylinder body, processing efficiency is stable, and surface roughness Ra reaches
To below 300nm.
There is sintered abrasive grain produced by the present invention sintering bulky grain in appropriate self-sharpening, grinding process not to be whole de-
Fall, but the bonding agent fatigue rupture, failure inside sintered abrasive grain between raw material little particle then cause to crush, composition sintering mill
The original little particle abrasive particle of material comes off one by one.
Implement processing to show, the sintered abrasive grain that provides of the present invention has good self-sharpening, be conducive to stablizing processing efficiency,
Improve abrasive material utilization rate；Available for being ground, grinding and polishing, honing, in the processing technology such as sawing, may be made as emery wheel, grinding pad,
The finished tools such as honing head, saw blade.
Part that the present invention does not relate to is same as the prior art or can be realized using prior art.
Claims (12)
1. a kind of preparation method of self-sharpening sintered abrasive grain, it is characterised in that it comprises the following steps：
（1）Abrasive grain, high-temperature agglomerant and auxiliary additive are measured by mass percentage, it is well mixed that mixture is made；
The percentage by weight of abrasive grain is 50-70%, and the weight ratio of high-temperature agglomerant is 22-38%, and the weight ratio of auxiliary additive is
0.5~30%；
（2）Adhesive wetting is added into said mixture to stir evenly, and is dried in the range of 50 DEG C ~ 150 DEG C；
（3）By the cake broke after drying；
（4）Broken powder is classified on request, the bonded particulate of different-grain diameter is obtained；
（5）The bonded particulate of selected particle diameter is subjected to high temperature sintering and obtains sintered abrasive grain within 1-5 hours, during high temperature sintering
Realize automatically removing for adhesive；
（6）It is classified again, obtains the sintered abrasive grain of the present invention.
2. according to the method described in claim 1, it is characterised in that：Described step（1）In, abrasive material raw material is diamond, oxygen
Change aluminium, carborundum or cerium oxide abrasives particle, particle is monocrystalline or heteromorphs, and the particle diameter distribution of abrasive grain is received 100
Rice ~ 50 microns between.
3. method according to claim 2, it is characterised in that：The particle diameter of described abrasive grain is at 200 nanometers ~ 20 microns
Between.
4. according to the method described in claim 1, it is characterised in that：Described step（1）In, described auxiliary additive filling
Make sintering bulky grain that there is preferable deformability and cementitiousness in abrasive particle space, auxiliary additive is copper powder, iron
Powder or nickel powder, content are the 0.5 ~ 30% of abrasive grain.
5. according to the method described in claim 1, it is characterised in that：Described step（1）In, high temperature adhesive is titanium dioxide
One or more mixing in silicon, sodium oxide molybdena, aluminum oxide, lead oxide, zinc oxide, calcium oxide, potassium oxide, lanthana and boron oxide
Thing.
6. according to the method described in claim 1, it is characterised in that：Described step（2）Middle adhesive be polyvinyl acetate,
In Vinylidene Chloride, polyisobutene, polyvinyl alcohol, polyacrylate, a- cyanoacrylates, Pioloform, polyvinyl acetal and epoxy resin
One or more mixtures；The addition of adhesive is the 0.1-35% of mixture weight.
7. method according to claim 6, it is characterised in that the addition of the adhesive is the 10- of mixture weight
20%。
8. according to the method described in claim 1, it is characterised in that：Described step（4）In, the powder after crushing divides on request
Level, with regulation mesh number sieved through sieve, obtain appropriate particle size distribution bulky grain abrasive compact, or with gravity classification method, from
Heart staging obtains the little particle abrasive compact of appropriate particle size distribution.
9. the method according to claims 1, it is characterised in that：Mill after described step (5) high temperature sintering circuit
Expect that particle meets the requirement of actual use, with certain cutting power and bond strength, high temperature sintering temperature is viscous according to high temperature
The component of knot agent is adjusted, and temperature changes in the range of 500 DEG C ~ 1000 DEG C.
10. according to the method described in claim 1, it is characterised in that：Described step（6）In, by the abrasive grain after sintering
It is classified again, obtains the high-quality sintered abrasive grain of appropriate particle diameter distribution, in favor of the surface quality and processing efficiency of rapidoprint；Burn
The particle size range of abrasive material is tied at 1 micron ~ 150 microns.
11. method according to claim 10, it is characterised in that：The particle size range of described sintered abrasive grain 2 microns ~
100 microns.
12. according to the method described in claim 1, it is characterised in that：The weight ratio of described auxiliary additive is 5-15%.
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Application publication date: 20160817 Assignee: ECO POWER (WUXI) Co.,Ltd. Assignor: Nanjing University of Aeronautics and Astronautics Contract record no.: X2022320000012 Denomination of invention: A preparation method and application of self sharpening sintered abrasive Granted publication date: 20171107 License type: Common License Record date: 20220112 |
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