TWI306048B - - Google Patents

Description

, 1306048 nine, invention description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for hardening or processing a chemical mechanical polishing crucible. Accordingly, the present invention relates to the fields of chemistry and materials. [Previous technology] Chemical mechanicai pr〇cess (CMp) has become a common technical means for grinding workpieces, especially in computer manufacturing.

At the beginning, it relies heavily on the (3)p process to polish the wafer. The wafer consists of ceramic 〇σ矽, glass, quartz, and other metals. These grinding processes: the wafer is placed on a rotating polishing pad. The polishing pad is made of a durable stone-containing anti-material (such as polyurethane, p〇lyure1; hane), which is provided with a layer of chemical chemicai slurry capable of destroying the wafer material and is provided with equivalent The amount of honing, which is made by invading the surface of the wafer, placing the chemical slurry on a rotating CMp polishing crucible, applying the chemical and mechanical forces on the wafer to the wafer Grind in the desired manner.

/The distribution of abrasive grains on the polished crucible is the key point to achieve the research H. The top of the polishing pad is usually effectively grasped by the friction-increasing structure "column such as fiber structure, or pores" to effectively avoid the abrasive particles. It is thrown by the centrifugal force when the polishing crucible rotates. Therefore, it is equivalent to make the top of the polishing crucible as soft as possible and to make the fiber structure stand upright as much as possible, or to make the opening and the number of pores sufficient to accommodate new abrasive grains. Important. The accumulation of abrasive fragments from the workpiece, the slurry, and the processing disk 'causes the maintenance of the top of the polishing crucible, which makes the top of the polishing pad smooth. 5 1306048 r-~--月^j (吏) is replacing the page j to harden and wrap the fibers together, so that the polishing pad is less able to grasp the abrasive grains in the polishing liquid and reduce the polishing effect of the polishing pad, and therefore, by various devices, To "rewash," or "cut," to restore the top of the polishing pad, the process is called, processing, or, processing "CMp polishing pad, which can be accomplished using a device and process." One of the devices is A disk having a plurality of extremely hard crystalline abrasive grains thereon, such as diamond abrasive particles attached to a flat surface or a substrate.

Another disadvantage of the prior art CMP conditioner is that it reduces the weight of the CMp polishing pad. As mentioned above, when the abrasive grains are too deep to cut and consume the polishing pad, the abrasive grains and (10) are too early. Depletion, premature: Loss reduces the ability of the CMP dresser to effectively polish the workpiece. Ideally, the abrasive grain re-polishs the roughness of the CMP pad while providing the ideal drag environment. "The rate at which the CMP pad is affected affects the flatness of the surface of the pad' which limits the amount of slurry that is maintained on the surface, thus affecting

The rate of light, as well as the polishing rate of the crystal, is proportional to the dressing rate. However, if the trimming rate is too high, the surface of the pad will be too rough.

Therefore, reducing the wafer's insult P •" degree of the most effective trim rate can increase the polishing rate without affecting the quality of the wafer. = As described above, the object of the present invention is to obtain a "(10) dresser and method, which has the effect of controlling the trimming performance and the longest service life in order to achieve the rational effect of repairing the body. I /, have the best [invention] The present invention provides a method for controlling the effect of the CMP dresser and the form of 6 1306048 CMP dressing g 'further provided - (10) dresser, which uses a plurality of super abrasive grains 'per An abrasive grain is coupled to a substrate and positioned to a height which provides a prior effect characteristic as a manufacturing effect of the CMp dresser. The prior effect characteristics of the present invention can optimize the trimming rate and the trimming loss. The effect characteristics make the dressing rate and dressing loss ideally balanced' by pre-arranging superabrasive grains into preset patterns or heights to enhance and idealize dressing rate and dresser wear. In addition, use molding as a preset The method of f-high super-abrasive grain can be used to control the effect characteristics of the yttrium. The method of the present invention provides a substrate 'and then a plurality of superabrasive grains are disposed on the substrate. The superabrasive particles are set to a height which provides ideal trimming characteristics, and the superabrasive particles can be substantially set to a height. The height has substantially a tip portion that is shaped to face the polishing pad to be trimmed. Further, the superabrasive grain is formed into a high height, and the height has a - ridge portion or a surface portion. The ridgeline or surface portion is shaped to face the polished enamel to be trimmed, and these settings change the effect of the finisher to provide a trimmer with an ideal trim rate and trim loss. The superabrasive in the central portion is set to have a height of a tip portion which is formed to face the polishing crucible to be trimmed, and the superabrasive particles located at the ridge line are exposed to the substrate or surface at a specific height, the height system With a surface or ridge line facing the polishing pad to be trimmed, a variety of patterns can be formed on the (10) (five) light pad, which is provided by a rough surface that provides increased wafer polishing rate and reduced abrasive wear. To provide a versatile effect of the trimmer', for example, by forming the central abrasive grain 1306048 into a tip portion, forming the peripheral abrasive grain into a flat surface, and molding the abrasive grains located at both gates into a ridge height and Towards the polishing 塾, the rate and dresser wear are ideal. The present invention is another method for idealizing the effect of the dresser, which may include a CMP dresser having a plurality of super abrasive grains respectively disposed at the central portion and the peripheral portion, the central portion The abrasive grain has lower quality than the abrasive grain of the circumferential edge. The lower quality can be exemplified by various stipulations, §, lower internal quality, lower shape quality, etc. The abrasive grain has a lower shape quality, for example, when it is an irregular shape, it can produce an aggressive repair effect on the light-removing raft compared to other shapes of abrasive grains, however, due to its oblique orientation Cutting and breaking, so lower quality abrasive grains have a slower dressing rate. On the other hand, higher shapes, shells such as octahedrons or cubes are less aggressive, but they are more durable and allow for comparison. A fast dressing rate that assists in protecting the internal or central abrasive particles from excessive wear and, therefore, is provided in the center of the dresser. The lower-grained abrasive grains and the high-quality abrasive grains on the periphery ensure a balance between the dressing rate and the dresser wear. In order to achieve the above-described method of use, the present invention also includes a method of manufacturing a cMp trimming effect which is obtained by forming a superabrasive grain into a predetermined pattern to obtain an ideal trimming effect. Generally, the method includes A substrate is provided, the set height of the superabrasive particles is selected to provide pre-effect characteristics, the superabrasive particles are placed on the substrate, and the superabrasive particles are fixed to the substrate at a selected height. By the above method, the Cmp dresser of the present invention has several advantages, 1306048 and 5, the finishing effect of the CMP polishing pad can be controlled to idealize the dressing rate of the cMp polishing pad and the dresser wear, which is idealized. The effect is to balance the dresser wear and dressing rate, thus extending the life of the dresser while maximizing the rate at which the dresser is used to trim the polishing pad. The technical features and advantages of the present invention will be described in detail in the following embodiments. [Embodiment] In the disclosure of the CMp dresser of the present invention and related methods, it is to be understood that the present invention is not limited to the specific method steps and materials disclosed below, but extends to the equivalent of the technical field. The related art, while using the proper terminology, is used to describe a particular embodiment, and is not intended to be a limitation. In addition, the singular forms used in the specification and claims are intended to include the plural referents, and, by way of example,,,,,,,,,,,,,,,, One or more of the abrasive grains or sand particles. Definitions In describing and claiming the present invention, the following proper nouns are used in the definitions described below. As used herein, "superabrasive grains, and, superabrasive grit," are used interchangeably and mean that the abrasive particles are composed of non-artificial or synthetic diamonds, hardest crystals, polycrystalline materials, or hybrid materials, and It includes not only diamonds, polycrystalline diamonds (PCD), cubic boron nitride (CBN), polycrystalline cubic boron nitride (PCBN), but also, "9 1306048 abrasive grains,", "sand,", "diamonds", Polycrystalline diamonds,,, boron-nitrogen compounds, and "polycrystalline boron-nitrogen compounds," can be used interchangeably. As used herein, it is extremely hard, and superabrasive, can be used interchangeably, and refers to a crystalline or polycrystalline material, or a mixed material, and the material thereof has a Vickers hardness of 40 00 kg/mm2, which may include Without limitation to diamonds, cubic boron nitride, and materials known to those of ordinary skill in the art, when superabrasives are inactivated and difficult to form chemical bonds, then particular reactive materials such as chromium or titanium, It can produce chemical reaction with the superabrasive at a specific temperature. As used herein, "substrate" means a portion of a CMP conditioner that is used to support abrasive particles and where the abrasive particles are fixed, the substrate of the present invention may be shaped and thicknessed. Or a material that has the ability to support abrasive particles in a manner that effectively provides a tool for achieving an effect. The substrate may be composed of a strong material, a powdery material that forms a solid in the process, or has elasticity. The material composition, typical examples of substrate materials include metals, metal alloys, ceramics, and mixtures thereof, and the substrate may include a solder alloy material. The "guide edge" as used herein means a CMP conditioner. The edge is the edge in front of the moving direction of the CMP pad, or the direction in which the CMP polishing pad moves. In some cases, the leading edge may be considered as not including the edge of the trimmer, but also includes The portion of the edge of the dresser that extends inwardly from the edge of the dresser can be regarded as the outer side of the c-health trimmer. The CMP can be formed into a pattern-like abrasive grain, and the abrasive grain provides cMp '1 At least one effective guiding edge 10 1306048 edge of the center or inner portion of the working surface, in other words, the _, ^, Λμ times of the trimmer can provide a structure in the inner portion, and the far structure function is outside the trimmer The leading edge of the edge. As used herein, the sharp portion, #曰, any niche located in the narrow body of the crystal, including but not limited to corners, other convex portions. The ridgeline, the apex portion, and the central portion of the abrasive grains, as described herein, ^ ^ ^ ^ 私 在 in the general processing environment know: upper, compared to the peripheral abrasive particles, to withstand Less loaded abrasive particles, central or "central", means a specific area on the g & L, ^ 蹩 state, which extends from the center point of the dresser to the trimmer, which can be approximately Trimming ^9_range' or the area can be an oversize trimmer.

The range of _, or the area may be approximately the range of the trimmer's coffee, or the current area may be approximately 33% of the trimmer. A. As used herein, the term 'external' means 'on the general processing ring dresser' compared to the central part of the abrasive grain and t, which is subjected to more load of abrasive particles, 'peripheral,,," Peripheral, or, 'located on the periphery, means a specific area on the dresser'. The shawched area extends from the leading edge of the dresser or the center of the dresser, which can be large (4) or The area may occupy approximately 9_ of the dresser, or approximately 50% of the station's trimmer t, or the area may cover approximately 33% of the range (out of 66% of the center). As described herein, the working end, ', means the end point of the training, the abrasive grain is positioned toward the CMP polishing pad' and in the processing process, the end point is in contact with the _ polishing pad, in general, the abrasive grain The working end point is the end furthest from the base. 11 1306048 "°σ" as used herein means the degree of excellence 'each, sign or characteristic of superabrasive grains' such as internal crystal integrity, Shapes, etc., can be used as a basis for determining the quality of abrasive grains. Super abrasive tool

Existing quality products, 々, 丨Λ S ^ 1U, Ride, such as the Gemological Association of America (GIA) developed a diamond grade report or called GIA Jin, 匕® u _ 丄 and this is the usual knowledge in the technology Well known. As used herein, "non-address ,@ , , ^ 非 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , There is a non-eutectic phase, which is non-uniform when it is added. Since it is difficult to determine the exact alloy composition, the amorphous alloy used here should be considered to exhibit a consistent melting state over a limited temperature range. The alloy described herein means a solid or liquid mixture of a metal with another material. The material may be a non-metal, such as carbon, or a metal: or an alloy that enhances or improves the properties of the metal. The ''metal welding alloy',, welding alloy, and/or, welding material" may be used interchangeably, and means that it can be used to form chemical bonds with superabrasive particles, with supporting materials, lu or with substrates. The metal alloy of the junction is such that the two are firmly bonded. The components and compositions of the particular solder alloy disclosed herein are not intended to be limited to the particular embodiments disclosed herein, and may be used in any other embodiment disclosed herein. In the example, "welding, process" means forming a chemical bond between a carbon atom of a superabrasive particle and a material of a bond, and further, "chemical bonding," means covalent bonding, such as carbide. Or a boride bond, rather than a mechanical force or a weaker interatomic attraction, so when, when, welding, superabrasive, a true 12 1306048 chemical bond 1 is formed and 'as it is mentioned, , welding, metal, is meant to form a metallurgical bond, so when welding superabrasive grains to the workpiece, it is not necessary to first extract the material. In the welding process, as described herein, directly, means borrowing From a single welding material or alloy, and to form a chemical bond between the superabrasive particles and the material. As used herein, ceramics, meaning, meaning hard, generally crystalline, and inherently rich in heat and resistance The eroded material 'can be reduced by firing a non-metallic material, and sometimes a metal-containing material can be added, and the material, the nitride, and the carbide material can be regarded as ceramics, including but not Limited to the examples given below, such as oxidation Oxide oxide, nitrite, tantalum nitride, tantalum carbide, tungsten carbide, etc. As used herein, metal-containing, meaning various metals, alloys, or mixtures thereof, and specifically includes but not Limited to steel, iron, and stainless steel / as described herein, the grid, means that the wire is formed into a plurality of square patterns. As described herein, for the distance and size, a pair, thinking Means that the difference between the dimensions is less than about 75 microns. The term "height" as used herein refers to the position and arrangement of superabrasive particles on the surface, such as a fixed substrate, or a polishing pad in a process. For example, a superabrasive grain can be formed to have a height of a further portion and polished toward the CMP. As used herein, "working end point" means the point of the abrasive particles, which is oriented toward the CMP pad and is in contact with the CMP polishing pad during processing. In other words, the working end of the abrasive grain is the farthest end from the substrate. 13 1306048 The plural categories, structural elements, composite elements or materials described herein will list a common list, however, each part of the list should be considered as a separate and unique part, therefore, When the same is present and the difference is not indicated, any part of the soap should not be considered equal to the rest of the list.浓度 Concentration, total, and other data values are expressed here in range values. The range values are expressed only for convenience and shorten the value to be expressed. Therefore, the numerical range should be explained flexibly. It should not only contain the value, if When the singular value and the numerical range thereof are recited, all the singular values of the For example, a value range "about 1 micrometer to 5 micrometers" should be interpreted to include not only between about 1 and 5 micrometers, but also all single values in the range or ranges of values contained therein, and therefore, the range of values The performance also includes single-value values such as 2, 3, 4, and numerical ranges in which 1-3, 2~4, 3-5, etc. are used. The same principle applies to only a single numerical value, and further 3 ' Regardless of the breadth of the range or the characteristics described, the principle of interpretation. The present invention provides a device and method for optimizing the dressing effect by using super abrasive particles on the eMp dresser. By adjusting the dressing rate and dresser wear at a specific height = the abrasive grains, by maintaining the dressing rate of the CMP polishing =, by increasing the life of the superabrasive of the dresser and the CMP pad The height of the service life makes the effect 14 146048. The first figure is the first embodiment of the CMP conditioner of the present invention, and the cmp tone is (100) comprising a substantially flat substrate (1〇1) on which Have multiple Grade abrasive grains (] _ i 〇) (丄2 〇) (Work 3 〇), each super abrasive grain is set at a specific height, which provides the desired work. P-position, such as tip, ridgeline or plane, In contact with the C-healed sputum during the dressing process.

The idealization of both the wear of the dresser and the dressing rate of the CMP pad depends on several factors 'including the set height of the superabrasive particles, which in the present invention can be set with several different superabrasives, the material comprising However, the materials listed below, such as polycrystalline diamond, cubic nitride side, and polycrystalline cubic boron nitride 'superabrasive grains, may also contain diamonds. The diamond superabrasive grains can be presented in a combination of cubic and octahedral shapes. In addition, the superabrasive particles may be provided with a preset (four). For example, the super-grain may be a natural crystal, an eight-sided: a cubic or a cubic and an eight-sided mixed shape, although almost any shape of the superabrasive is regarded as The scope of the invention is protected, but the size of the abrasive particles can be between about 100-350 micrometers, and the super-grinding is set in many directions, but there are three kinds of the most optical mats facing the text 07° and the orientation is straight. The effect of the cutting or dressing of the shadow-shaped abrasive grain, the degree of the i 为 “ “ “ “ “ “ “ “ “ “ “ “ “ “ 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 超级 CMP CMP CMP Polished mat surface Different types of flat production, because of the back, the mat of the mat, XF! A has thus changed the CMP polishing grinding stone "circle:: 虔 flatness can retain the degree of the slurry is different, so the different depths of the round, Width and density form different 15 1306048 grinding effects, narrow and deep flatness has the advantage that the polishing enamel can retain the polishing liquid, thus increasing the polishing rate of the wafer, however, increasing the grinding rate may increase the super The wear rate of the abrasive particles, therefore, the wear rate is greatly affected by the height of the superabrasive particles. When designing a device with the desired effect characteristics, the height of each superabrasive grain must be considered. f 'can provide a high degree of dressing rate at the height of the superabrasive (ie, deeper penetration of the polishing pad), which also wears the abrasive particles at a higher rate. Conversely, if the superabrasive grains are formed into a flat surface toward the polishing pad, it will result in a slower polishing rate. The plane of the abrasive grains is generally more durable, but a deeper and narrower surface is cut on the polishing crucible, but will be Formed into a shallow and wide surface, due to &, compared to the tip portion of the abrasive grain, the plane portion of the abrasive grain is thrown at a slower rate (10) (four), but the super-reading slow rate of abrasive grain ridgeline Part of the trimming and grinding & characteristics are between the flat and tip portions. If the CMp polishing pad is trimmed with a ridgeline, the surface is not as deep or f as the surface formed by the tip portion, but provides a more moderate characteristic. The surface of the 'other' abrasive grain (four) wire portion wear: consumption rate, therefore, the use of all or part of the CMP dresser with ridgeline = super abrasive grain provides several advantages. Please refer to the figure - figure, a plurality of substrates (the abrasive grains are set at different heights, and the heights may include a water super-grain 1 η η, a door and a 1 匕 3 as a central part grinding) Towards the tip end portion of the polishing pad, and the abrasive particles (formed to be the ridgeline portion toward the polishing pad, or as a peripheral abrasive grain (formed as a planar material toward the polishing #, this embodiment 16 of the present invention is trimmed at 1306048 ==) The advantage of rate and dresser wear, which provides a more aggressive trimming characteristic for the two central abrasive particles', then the peripheral abrasive particles can be more durable and set inward while the central abrasive particles can avoid excessive wear. The implementation is as shown in the second figure, the CMP repair: two have a plurality of substrates disposed on the substrate (101... superabrasive, : the central super-grind, (11〇) is formed into the tip portion toward the polishing 4 / while the remaining super abrasive particles (1 3 0) is formed into a flat portion facing the polishing pad. ' i

The third figure is a third embodiment of the present invention, wherein the CMP conditioner (300) has a plurality of superabrasive grains disposed on the substrate (!0 i), wherein the central super-grain (11 〇) is formed The tip portion is oriented toward the polishing crucible' while the remaining superabrasive particles (12 0) are formed into a ridge portion toward the polishing pad. As shown in the fourth figure, a fourth embodiment of the present invention, the CMP conditioner (4 〇0) has a plurality of superabrasive grains disposed on the substrate (i0i), wherein the centrally-clamped superabrasive grains (丄2) 〇) Formed as a ridge line toward the CMp polishing pad, the superabrasive grains (i 3 〇) at the periphery are formed into a flat portion toward the CMPM塾, and all the superabrasive grains on the f-shape are formed into a tip shape toward the CMP pad, or substantially All of the superabrasive grains are formed into a ridgeline shape toward the CMP pad, and a variety of surfaces are contemplated to be formed, wherein substantially all of the superabrasive particles can be formed into a planar shape toward the CMP pad (not shown). In another embodiment, the present invention discloses a method for idealizing the effect of a CMP conditioner by using abrasive grains of different qualities, the 1306048 quality including the shape of the superabrasive particles, and the super In the nature of abrasive grains, irregularly shaped abrasive grains (natural crystalline forms) usually have a tip portion to cause aggressive dressing, however, because irregular abrasive grains have a lower nature, they are inclined when cut. Will cause scratches on the wafer. Conversely, it provides higher shape quality or higher quality for octagonal or cubic-octagonal abrasive grains. This higher quality abrasive grain is compared to no The regular abrasive grains lack the tip portion. Therefore, the inclination is small when cutting and breaking, and it is difficult to damage the wafer. The invention further provides a method of using super-abrasive grains of different qualities. For example, the present invention discloses a CMP conditioner having a plurality of superabrasive grains disposed on a substrate, wherein a superabrasive phase at a central portion Compared with the superabrasive particles in the peripheral part, it has lower quality, in other words, the superabrasive grains in the peripheral part have higher quality, and the lower quality may include lower essence, lower shape quality, etc., lower The essence consists of superabrasive grains with a plurality of crucibles or small abrasive grains. The lower shape quality contains superabrasive grains with irregular shapes, and the high shape quality contains superabrasive grains for octahedron or cubic-octagonal In the present invention, the super abrasive grain arrangement is arranged such that the high-quality super abrasive grains are close to the periphery of the dresser to form a warning, and the lower-quality abrasive grains in the center are prevented from being cut and destroyed, and the setting can be controlled. The effect of the cMp dresser, thus making the dresser wear and dressing rate ideal. The present invention further includes a method of fabricating the CMP conditioner, the method comprising: providing a substrate, selecting a set height of the superabrasive particles to achieve the effect as described above, and disposing the superabrasive particles on the substrate at the selected height And the abrasive particles are fixed on the substrate at a selected height, and the substrate of the present invention can be composed of 18 1306048, such as metal, ceramics, powder, metal powder or 5 early materials, and the substrate can be further Made of stainless steel. Methods and materials for setting superabrasive grains have been disclosed in the prior art, and are known in the U.S. Patent No. 6, ,39,641, No. 6,286,498, No. 8, (10), and In the present invention, the applicant can be informed of the application of U.S. Patent No. 9,531, which was filed on March 27, 2013. The superabrasive particles may be disposed on a substrate made of metal powder for forming a powder... a plurality of materials known, and further, the gold process: forming a superabrasive splicing, firstly setting a superabrasive grain in the In the metal powder, in the process of making and curing, the chemical bond is formed between the abrasive particles and the substrate, and the CMP dressing which is durable but less resistant to the cutting and removal of the abrasive grains is set at 1匕1. , abrasive grains can be solidified by electricity money method

In the invention, the number of you J> Μ I-class abrasive grain is set to - specific ancient = in the case 'the fine can be refined by magnetic field or vacuum, and the super abrasive grain can be set by magnetic force ==,=869 No. 5,203,881, the patent is known, and the example can be designed in the US Patent No. 4, _, 199, which has a chuck in the vacuum. (chuck) is disposed on the substrate: the vacuum squeezing head tube that passes through the vacuum device and the abrasive granule opening in the collet can be formed with the open r-stage abrasive particles set by the mechanical process to be selected Height, once under conditions. The singer' vacuum device fixes the superabrasive particles on the substrate without disturbing or changing the abrasive grain height, thereby forming a CMP conditioner capable of achieving an idealized trimming effect of 19 1306048. In the technical field, people can modify the arrangement of m, -r ^ 来 to achieve the 5th revision and arrangement according to the present invention.

It is included in the scope of the present invention. Therefore, the present invention can be used in the field of the invention, and it is a preferred embodiment. Slightly positive 'The present invention includes the specific implementation state of the sentence ν, +, μ ,, 3 the above dimensions, materials, and shapes.戍戍私私,组合,和用

BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a side view of a first embodiment of a CMp dresser of the present invention. Figure 2 is a side view of a second embodiment of the CMP conditioner of the present invention. = The second figure is a side view of the mMP trimmer m example of the present invention. The four figures are side views of the fourth embodiment of the (10) dresser of the present invention. [Main component symbol description] (1 〇〇) CMP regulator (1 ο 1 ) Substrate (1 1 〇) Super abrasive grain (1 2 0 ) Super abrasive grain (1 3 〇) Super abrasive grain (2 0 〇) cMp Dresser (3 ◦ 〇) CMP Dresser (40 〇) CMP Dresser 20

Claims (1)

1306048 X. Patent application scope: 1. The method for controlling the effect of the chemical mechanical polishing dresser in the process of the chemical mechanical polishing dresser, the chemical mechanical polishing dresser with a plurality of super abrasive grains comprises: Superabrasives are placed thereon at a height that provides a preset effect, wherein the superabrasives in the center of the dresser are formed to have a pointed height and toward the polishing pad to be trimmed, and the remaining superabrasives are formed to have a flat surface. Or the height of the ridgeline and toward the polishing pad to be trimmed. 2 The method of claim 1, wherein the effect is an ideal polishing rate. 3. The method of claim 1, wherein the effect is an ideal finisher wear. 4. The method of claim 2, wherein the effect is an ideal balance of maintenance rate and dresser wear. 5. The method of claim 1, wherein the superabrasive particles are selected from the following materials: diamond, polycrystalline diamond (), cubic nitride (cBN), and polycrystalline cubic boron nitride. (pCBN). 6. The method of claim 5, wherein the superabrasive grain comprises a diamond. 7. The method of claim 1, wherein the superabrasive grains are arranged in a predetermined pattern. 8. The method of claim 7, wherein the predetermined pattern is a grid. 9. The method of claim 1, wherein the super-milled l3〇6〇48 particles have a predetermined shape. The method of the item, wherein the preset value is 10. The shape of the first application form is a natural crystal form. 1. The method of claim 9, wherein the pattern of the pre-dip in the bean is an octahedron or a cubic-octahedral crystal. The method of claim 1, wherein the superabrasive: granule-stabilized substrate is composed of the following materials: a metallic material, an elastic material, a ceramic material, and a mixture thereof. The method of claim 12, wherein the superabrasive particles form a chemical bond with the substrate to be fixed to the substrate. The method of claim 12, wherein the superabrasive is electroplated on the substrate. The method of claim 1, wherein the superabrasive system located at the periphery of the dresser is formed into a polishing pad having a flat height and trimmed toward the right person, and a super between the two The abrasive grain is formed to have a ridgeline height and toward the polishing pad to be trimmed. The method of claim 1, wherein the superabrasive grains located in the center of the dresser have lower quality than the superabrasive grains located on the periphery of the dresser. 3 1 7. The method of claim 16, wherein the lower quality is of a lower nature. 4 1 8 . The method of claim 6, wherein the lower mouth has a lower shape quality. 1 9 . The method described in claim i of item i, wherein Low quality rabbit head +, horse /, has an irregular shape. 2 〇 If the method described in the scope of patent application is given in item i6, the surrounding super-grinding is in the shape of an octahedron or a cubic-octahedron. 2 1. The method of claim 9, wherein the irregular shape provides a more aggressive modification than the shape of the octahedron. 2. The method of claim 1, wherein the superabrasive grain has a size between about 100 and 350 microns. 23 kinds of chemical mechanical polishing dressers, comprising: a substrate; a plurality of super abrasive grains fixed on the substrate, the super abrasive grains being formed into a height to control the effect of the chemical mechanical polishing dresser, wherein the center of the dresser is located The superabrasive system is formed to have a pointed height and toward the polishing pad to be trimmed, and the remaining superabrasives are formed to have a flat or ridged height and toward the polishing pad to be trimmed. 2 4. The chemical mechanical polishing dresser of claim 2, wherein the superabrasive particles are selected from the following materials: diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), And polycrystalline cubic boron nitride (PCBN). 2 5. The chemical mechanical polishing dresser of claim 24, wherein the superabrasive grains comprise diamonds. The chemical mechanical polishing dresser of claim 25, wherein the superabrasive particles have a predetermined shape. 2 7. Chemical mechanical grinding as described in Clause 2 of the patent application 23 1306048 · A trimmer in which the preset shape is a natural crystal form. 2 8. The chemical mechanical polishing dresser of claim 26, wherein the predetermined shape is an octahedron or a cubic-octahedral crystal. 2 9. The chemical mechanical polishing modification described in claim 23, wherein the super abrasive grains are arranged in a predetermined pattern. The chemical mechanical polishing dresser of claim 29, wherein the preset pattern is a grid. The chemical mechanical polishing dresser of claim 2, wherein the superabrasive particles form a chemical bond with the substrate to be fixed to the substrate. 2. The CMP polishing process as described in claim 2, wherein the superabrasive is electroplated on the substrate. 2 3 · The CMP apparatus as described in claim 2, wherein the superabrasive system located on the periphery of the dresser is formed to have a flat Adu and is oriented toward the polishing pad to be trimmed, and located in both The super φ abrasive grain between is formed to have a ridgeline height and toward the polishing pad to be trimmed. 4. The chemical mechanical polishing trimming state as described in claim 2, wherein the superabrasive grains in the center of the dresser have lower quality than the superabrasive grains located on the periphery of the dresser. . / 正 2 5 . The chemical mechanical polishing dresser described in claim 4, wherein the lower quality is of a lower nature. Table 2 6. Chemical mechanical polishing as described in item 34 of the patent application, wherein the lower quality is lower in shape quality. 3 7. Chemical machinery as described in claim 36. Grinding 24 1306048 . Dresser, 3 8 dresser, shape. Among them, the lower quality has an irregular shape. For example, the chemical mechanical grinding described in the patent application No. 34, wherein the higher shape quality is octahedron or cubic-octahedron 敕=3. The chemical mechanical grinding G-positor described in the scope of item 37, wherein the irregular shape provides a more aggressive dressing than the shape of the octahedron. 4 〇 The chemical mechanical polishing conditioner as described in claim 2, wherein the size of the superabrasive particles is between about 100 and 350 microns. 4 1. A method for manufacturing a chemical mechanical polishing conditioner as described in claim 2, which comprises: providing a substrate; selecting a set height of the superabrasive particles to achieve a preset effect; The pellets are disposed on the substrate at a selected height; the abrasive particles are fixed to the substrate at a selected height. XI. Schema: as the next page 25