TW200916262A - Contoured cmp pad dresser and associated methods - Google Patents

Abstract

CMP pad dressers with increased pad dressing work loads on the centrally located abrasive particles during dressing of a CMP pad, and methods associated therewith are disclosed and described. The increase in work load on centralized particles improves pad dressing performance and also extends the service life of the pad dresser.

Description

200916262 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to apparatus and methods for conditioning or conditioning chemical mechanical polishing imperfections, and the present invention relates to the fields of chemistry and materials. [Prior Art] Nowadays, the Huidu industry uses the chemical mechanical polishing (CMp) process to grind specific workpieces, especially in the computer manufacturing industry. In recent years, the industry is targeting = Tao Jing wafers, silicon wafers, glass wafers, quartz wafers. And when grinding metal wafers, etc. 'more and more reliance on CMP process, these processes generally will: round β and on the suspected pad'. The rotating pad is made of durable organic machine board (such as polyester) Fabricating and applying a chemical slurry having the chemical ability to damage the wafer substrate to the body and applying physics to the surface of the wafer

The broken abrasive particles 'continuously apply chemical polishing to the rotating CMP ’' allows chemical and mechanical forces to be applied to the wafer and allowed to be ground in the desired mode. In order to maintain the quality of the grinding, the most important thing is to consider the distribution of the abrasive particles on the grinding crucible. The top of the crucible is usually made of fibers and small pores to provide sufficient friction. When the grinding crucible is rotating, sufficient friction is required. It prevents the abrasive particles from coming off the grinding crucible due to centrifugal force. Therefore, it is important to maintain the elasticity of the top of the polishing pad as much as possible, and to make the fiber stand upright as much as possible, and to ensure that there are sufficient openings and small holes at the top of the polishing pad. Contains new abrasive particles. The difficulty in maintaining the top of the grinding crucible lies in the fact that the workpiece 'grinding slurry, and the cumulative grinding residue generated by the conditioning disc' causes the top of the grinding crucible to become smooth or hardened, and the fibers are entangled downward, thus causing grinding 200916262 The pad'', the method of grasping the abrasive grains in the slurry, significantly reduces the grinding results of the polishing pad. 'Furthermore', many small holes in the polishing pad used to hold the slurry are easy to be stoppered & The overall roughness of the abrasive surface of the mat will become poorer and covered by the fibers 'so that's cut by a variety of devices, the square, - Γ - ^ ^ ^ can restore the top of the polishing pad, the process is called For this, trimming, biting, "adjusting" coffee grinding, this purpose can be used in a variety of devices and processes / completion, one of the dreams, 曰 、, 疋 /, the disk with a plurality of super hard crystal abrasive grains For example, diamond abrasive particles attached to a flat surface or a substrate. However, "the prior art grinding disc has a number of disadvantages. Firstly, the abrasive particles may be separated from the substrate of the disc and fall into c:', causing the abrasive workpiece to be damaged by friction. Secondly, the prior art = garment tendency On the surface of the substrate, the abrasive particles which are unevenly spaced at the surface of the substrate are formed, and the abrasive grains which are unevenly spaced apart may cause excessive processing of the abrasive enamel region to form the wear mark 'and cause the CMP to be partially polished and smooth. The layer, in addition, the abrasive grain of the disk is not used to penetrate the pad to form a uniform depth of tH, which causes additional uneven processing on the polishing pad. 'Final' can be deformed according to the CMp polishing pad: angle, then Due to the downward pressure exerted by the dresser, the front end of the trimming guide edge is swollen or the palladium, and the #3 /·bubble* are passed through the material on the dresser to maintain the original shape. To make the grinding of the abrasive grains (especially the abrasive grains located in the center of the dresser) with a shallow depth, or even completely skip the grinding flaw, This imparts uneven processing on the abrasive pad of the polishing pad, causing the polishing pad to be non-uniformly processed' and at the same time causing wear of the trimming H unevenness hook, which is exhausted early. 200916262 Another prior art CMP pad dresser has other drawbacks. The prior art CMP pad dresser reduces the use of the pad conditioner, the useful life of the CMP pad regulator, depending on The number of processed abrasive particles, and the sum of the number of processed grains per abrasive, as previously described, was milled. The life of the perimeter is reduced by the non-uniform machining applied by the superabrasive (4). When the deformable CMP pad is pressed by the pressure of the trimming, it will guide the pad regulator. The edge of the 'B body is worn by the main load of the burning, and in addition, the centrally located abrasive particles will avoid bearing the same load, and the improper load increases the wear rate of the abrasive grains at the leading edge' and causes The dresser cannot be used until the central abrasive grain is exhausted. 'There are two factors that cause the prior art abrasive grain de-grinding particles to adhere to the disk body in a poor way. Regarding the retention force of the abrasive particles from the dresser disk, First, the abrasive particles are attached to the substrate by (4) or other money (4), and the abrasive particles are only attached to the substrate by weak mechanical force, and are not bonded by any form of chemical bonding force. Therefore, the abrasive particles are easily subjected to friction. If the force is strong and the mechanical force is detached, the electroplating material of the chemical polishing liquid will promote the falling off of the abrasive particles. 1 The opposite of the core, when the abrasive grains are welded to the substrate, the chemical bonding force makes the abrasive grain weight U solid & On it, 'However, the acidic substance in the chemical polishing liquid can reduce the chemical bonding force of the welded solid particles at a constant speed, and the abrasive particles are detached by the friction force of the polishing pad. Therefore, "the reduction of the weld and the chemical substance" Contact 'and in order to extend the service life of the dresser, the grinding process must be terminated when the processing starts, so that the grinding and adding X can not be performed at the same time, which wastes processing time and is inefficient. 200916262 During the welding process, The bending of the surface of the bamboo I will be scratched. The bending of the surface will also cause the abrasive particles to fall off. When the welding process is carried out, the gentleman, the 裎f乜 must be exposed to the high temperature environment, and the south temperature causes the repairer to work. However, U is used as the surface phase, so the damage of tnnu is smooth and planar. The 坏·民蛀卞曲ί生 will become rough and have high and low spots, which is bad. — Than the JU Ma δHai spot will cause the weld to peel off and form a slight scratch on the grinding surface of the workpiece. “The unevenness: affects the process after the dresser and affects the stagnation of the abrasive grain. / In summary, the CMP pad dresser should pursue optimal processing results with optimum efficiency and continuation of life. [Invention] Accordingly, the present invention provides a method and a CMP pad. The structure of the dresser: to increase the load of the central superabrasive grains during processing of the CMp polishing pad by the method of the present invention, each of the best abrasive grains on the CMp pad dresser is paired on the sigh substrate 'and according to the preset The pattern is placed on a specific area. 'The superabrasive grain can be formed into a pattern that reduces the penetration of the peripheral abrasive particles of the S CMP grinding 塾 trimming H and increases the wear of the central abrasive grain located at the (10) polishing pad conditioner. Through-force, the best load is located in the central superabrasive grain, one + JJ. The 5' abrasive grain consists of a superhard substrate, such as diamond, or cubic nitride, which is a single crystal or Polymorph Form β In one embodiment of the present invention, a method for loading a centrally located superabrasive and abrasive particles, comprising using a -CMP pad dresser, the = substrate is provided with a construction - Round superabrasive The pattern mentions that the abrasive grains located at the periphery are gradually inclined upward to the grinding center located at the center, and in addition, the a-angle of the sloping surface can control the load of the abrasive grains located at the center, and the inclined surface 200916262 can be formed in various ways, for example, super The abrasive particles are arranged on a substantially flat base: on or in, in which case the superabrasive grains are increased from the periphery by the periphery: the height of the working surface is reversed, and in some cases, the optimum angle of the bevel can be measured by grinding Known by the rate and elasticity of the mat. In another embodiment of the present invention, the method for increasing the centrally located super load comprises using a CMp pad dresser having a superabrasive particle constructed in pairs in a pattern. The superabrasive grain of the pattern is similar to that of the central superabrasive grain. When the abrasive grain is relatively '", when the aggregate is integrated, the abrasive grain cannot be as deep as the abrasive grain of the abrasive grain: Thus, by changing the maleness of the abrasive particles on the substrate to transfer the load from one block to another. In yet another embodiment of the invention, to increase the load of the centrally located superabrasive particles. The method 'is by positioning the centrally located abrasive particles in a specific shape (atttted), providing a centrally located abrasive grain having a greater penetration force against the CMP abrasive, as compared to the morphology of the peripheral abrasive particles. In the consistent application mode in the basin, the shape of the central abrasive grain exhibits a tip end point. The shape of the peripheral abrasive grain exhibits a working point with a plane or a seed line, and another solid silk side *4'accounting in the 'this bit The morphology of the central abrasive grain exhibits a working end point having a ridge line and the morphology of the peripheral abrasive grain exhibits a planar working end, and in yet another embodiment, the morphology of the central abrasive grain exhibits a pointed shape The shape of the working end point granules exhibits a planar working end peripheral grinding point and a point, and the shape of the abrasive grains between the two presents a working end with ridge lines. In addition to the above-mentioned methods of use, The invention also includes a method of making a CM® 200916262 pad dresser for increasing the load of the centrally located superabrasive particles. Generally, the method comprises the steps of: 1 preparing a substrate; A plurality of superabrasive particles are attached to the substrate in a pattern. The pattern reduces the penetration of the peripheral abrasive particles to the CMP abrasive crucible, and the pattern increases the penetration of the central abrasive particles to the CMP polishing pad. Method, the CMP pad dresser has considerable advantages. For example, the working plane of the CMP pad dresser is constructed to increase the contact of the central portion of the dresser, rather than The outside or, the leading edge, 'over-contact, increasing the contact at the center position, transferring the load from the peripheral area of the dresser to the central area of the dresser, thus extending the use of the dresser and making the dresser more efficient The CMP polishing pad is incorporated and trimmed, and the present invention comprises a CMp pad conditioner incorporating such a structure, including the particular configuration supporting the above method. The features and advantages of the present invention described above will be detailed in the following embodiments. The method is described. [Embodiment] Polishing pad dresser and related

Prior to the disclosure and description of the CMP method of the present invention, the required steps and materials are used, and the proper nouns used herein are used merely as a limitation. In addition, unless the singular form used in the range of g is used to include the plural, otherwise in the specification and the patent application, the "a grain,, or, one" indicator is therefore ''Grit'' contains one or more of the abrasive grains or sand 10 200916262 pellets. Definitions In describing and claiming the present invention, the following proper nouns are used in the definitions described below. As used herein, abrasive grain or 'sand,' or the same word means super hard crystal, or polycrystalline substrate, or hybrid substrate 'which includes, but is not limited to, diamond, polycrystalline diamond (PCD) , Cubic Boron Nitride, Polycrystalline Cubic Nitride Butterfly (PCBN), In addition,, Abrasive, "Grit" Diamond, "Polycrystalline Diamond (PCD)", "Cubic Boron Nitride," Polycrystalline Cubic boron nitride (PCBN), 'can be used interchangeably. As used herein, "substrate" means a portion of the CMP pad dresser that is used to support the abrasive particles, and where the abrasive particles are fixed, the substrate of the present invention can be any shape or thickness. Or material, which has the ability to select abrasive grains in one way. This method can effectively provide a tool for achieving the effect, and the substrate can be composed of a solid material, a powdery material which forms a solid material in the process, and Or consisting of a material having elasticity, a typical example of a substrate material comprising a metal, a metal alloy, a ceramic, and a mixture thereof, and the substrate may comprise a solder alloy material. As used herein, the working surface means CMp The pad conditioner is 'facing or contacting the surface of the CMP pad during operation. As used herein, "guide edge" means the edge of a CMp pad dresser that is in front of the direction of motion, in the direction of motion, or both, when the CMP pad is moving, and in some cases visible For the sake of not σ 4 kή, the edge of the W-defense, including the edge of the benefit, and also the part that extends inward by the trimming section 11 200916262 edge #, guiding the edge to trim the piano outside #丨, Jia as CMP polishing pad Grinding: Grinding 塾 dresser can be shaped into a pattern: in the center of the working surface of the CMp grinding 塾 dresser provided by the honing machine or at least one effective guiding edge, inner or inner part of the 4th position can be said to be trimmed The function of the leading edge of the middle edge of the device is equivalent to that of the dresser described herein, "sharp portion", meaning any position in the crystallization, including but not limited to, other convex portions. Phase, square tip The part, and :::, the central part of the abrasive grain 'means that in the general processing compared to the peripheral abrasive grain, the grinding with less load: the gas is located in the center, meaning the dresser Specific area, the central area of the 兮巴域The Ε 9. . 22,% (four) circumference, or the area may account for approximately 2 of the dresser. %_ 兮 area: *, or the area can be approximately 5% of the trimmer, or the '" area can be approximately 33% of the trimmer. The term "in the periphery" means that in the case of abrasive particles in the central part of the environment, the specific edge of the load, which is subjected to a large load, is peripheral, or "is located at the periphery. , means the trimmer feeds the cry: the middle (four) domain is from the leading edge or the outermost edge of the trimmer or the (four) domain can == domain can account for about 9% of the trimmer, about 2% The scope of the blessing, or the range in which the area can be >50% of the i-be, or the range of the area that can be trained (outside the 66% of the center) β Μ “益之12 200916262 "Load", the sound and the total force of the abrasive particles applied to the dresser when using the dresser. At the end of the '' working end, the end of the abrasive grain, the abrasive grain is positioned toward the CMP pad, day

In the processing process, the end is in contact with the CMP pad. In general, the working end of the abrasive lamp position is the farthest end from the substrate. As used herein, the gentleman's Β, 卜日, , . . . means a homogenous welded composition having an amorphous structure having a non-eutectic phase, which is not uniform when added. Owe, since it is difficult to determine the exact alloy composition, use here

The non-crystalline solder alloy, which is considered to be in a finite temperature range, exhibits a uniform melting state. As used herein, an alloy, means that the metal is mixed with another material rnt liquid. The material may be a non-metal, such as charcoal, or a metal, or an alloy that enhances or improves the properties of the metal. . "Metal welding alloys," "welding alloys", and "welding alloys", and "welding materials" may be used interchangeably, and may be used to form chemical bonds with superabrasive grains, with support materials, or with substrates. Metal alloys for the firm combination of the two, the compositions and compositions of the particular solder alloys disclosed herein are not limited to the embodiments of the shirts disclosed at the same time, and can be used in any of the other embodiments disclosed herein. The "welding" process as used herein means the formation of a chemical bond between the carbon atoms of the superabrasive particles and the solder material. Further, "chemical bonding, meaning covalent bonding" such as carbide or boride bonds. The knot 'rather than mechanical force or weaker interatomic attraction', therefore, when "welding" superabrasive grains, a true 13 200916262 chemical bond 1 is formed, and t is generally mentioned, '烊接,, metal When it is meant to form a metallurgical bond, it is not necessary to form a superabrasive when it is welded to a workpiece. In the above, super abrasive grains, and "superabrasive grit, can be used interchangeably, and means that the abrasive particles are composed of non-artificial or synthetic diamonds, superhard crystals, polycrystalline materials, or mixed materials. And not only diamonds, polycrystalline diamonds (ah, cubic nitride butterfly (CBN), polycrystalline cubic nitride:::, ',, 'sand,,,,,,,,,,,,,,, For the welding process, as described herein, the straight i α 〜 and the thinking refers to the formation of chemical bonds in the super-grinding. The welding metal or alloy is the medium in the bond... as described herein, Rough" means that a plane is a concave in a different plane, and the different features of the ant τ are 葫&--the index of the rough plane, for example, the depth of the concave portion is the depth or depression of the concave portion. , L or forked, and 1 concave 1 ^, in addition, the rough calculated value includes the flat and the convex portion of the set area and the concave 3 has a thousand degrees), and the convex or concave department Phase / (for example, the density of the convex or concave portion | the distance between the feet W 4 . "described herein." Porcelain,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,枓, in this technical field, Xu Rong ~ ▲, and carbide materials can be regarded as Tao Kong b. In the following examples, we have 3 but not limited cut, carbon cut, carbonized town, oxidation, oxygen cut, nitrogen Chemical collar, nitrogen 14 200916262 As used herein, metal-containing, meaning various metals, alloys, or mixtures thereof, and specifically includes, but not limited to, steel, iron, and non-ferrous steel. The "grid," means that the wire is formed into a plurality of square patterns. As described herein, the distance, the size, and the consistency, mean that the difference between the sizes is less than about 75 microns. As used herein, "Ra," means measuring the height difference between the convex portion and the concave portion when measuring the plane roughness, and further, "Rmax" is the highest amount of "measurement" when measuring a plane roughness. The height of the convex portion is different from the ancient one of the lowest concave portion. n Concentration, total number, and others The value of the data is expressed here as a range value. The performance of the value is only for convenience and shortens the value to be expressed. Therefore, the deer has a flexible interpretation of the range of values. It should not only include the range of values. If there is = - The value and the range of values in it shall include all the single-values in the range or the range of values contained therein. For example, the '-value range' is approximately ! microns to 5 microns". 5 micrometers' while including all single-values in the range or ranges of values contained therein, such that the performance also includes a single value such as 2, 3, 4, etc., and Μ:: 3-5, etc. The range of values, the same principle when transporting a single value, enters the singularity and the singularity of the singularity of the singularity and the characteristics of the description. this invention

For improving the efficiency and quality of the processing or processing of the CMP pad by using the device for the device and method of the CMP applicant, 15 200916262 When the grinding crucible is processed or processed, the CMp grinding crucible can be extended. The life span makes it possible to keep the CMP grinding crucible and, therefore, to increase the working speed that the device can achieve. ° Month> As shown in the figure, the prior art CMP pad dresser (10) has a plurality of abrasive grains (5q) on the substrate (10), and the plating material (60) is generally an acidic solution. Nickel precipitated in the middle. The CMP abrasive 塾 dresser (10) uses only the electro-mineral material (10) to attach the abrasive particles (5 〇) to the substrate, which has many disadvantages and is clearly shown in the first figure. First, the key material cannot be combined with the grinding The chemical bond is formed between the particles, so that the abrasive grains are only maintained on the substrate by weak mechanical force, and when the dresser is rotated against the CMp, the friction acting on the abrasive particles can overcome the mechanical force. Therefore, the abrasive grains are easily separated from the electro-mineral materials. The holes in the electric money materials will leave holes such as the door and the gap (70), except for the chemical substances in the chemical polishing liquid. The residue generated after the workpiece is ground will quickly fill the hole, and the substance* chemically damages the electro-mineral material and further weakens the plating material. Because the mechanical force formed by (4) material (10) can only be used to polish the particles (10) on the substrate (40), then the part of the abrasive grains exposed to the outside of the electro-mineral material must be in a minimum value, as far as '/ 匕'It is still not possible to avoid contact between the CMP pad of the plating material disc. In addition, during the f 1 & process, the plating material tends to foam around the abrasive grains, such as the convex portion, 'f L , ' [very little exposure and kidney In addition to the abrasive grains of the array, the convex portions make the respective tightness of the entanglement from the fibers of the CMP polishing pad, and the lack of the hexagram force is not conducive to the processing process. Effectiveness. Referring to the second figure, the CMP pad 16 200916262 dresser (20) having a substrate (40) is soldered to the substrate by soldering material (9〇) in a conventional vacuum high temperature manner. The abrasive grains (50) and the welding material (9〇) generally have a metal alloy mixed with a carbide, which forms a chemical bond between the abrasive grains and the welding material, and is consolidated with the substrate, and the consolidation is effectively enhanced. The overall strength of the CMp pad dresser, but with other adverse effects. The solder material (90) must be maintained at a minimum to avoid completely covering the abrasive particles (50). Therefore, the abrasive particles are coated in a thin coating of the solder material, which causes problems and the mechanical strength of the solder material itself. Under the weak problem, the extremely weak mechanical force and the chemical bonding force formed between the abrasive grains and the welding material cancel each other out. In fact, when the displacement occurs, the strength of the chemical bonding force between the abrasive grains and the welding material is sufficient for welding. The material itself is cut away along with the separated abrasive particles. The splicing material (90) is also very susceptible to the chemical attack of the polishing liquid, which causes the abrasive grains (50) to detach, and the welding material is further weakened in the case where the mechanical force is already weak, and therefore, in order to reduce the CMp grinding The area of the pad conditioner (20) exposed to the chemical slurry must be suspended, and the chemical slurry is separated from the cMp pad before the dresser is attached to the CMP pad. The grinding process is stopped and the CMp pad is severely reduced. The constantity increases the time required to manufacture a finished product and is inefficient. The abrasive particles (5〇) are combined with the substrate (4〇) by a conventional soldering method. When the abrasive grains are attached to the substrate, there is another disadvantage that the surface tension of the molten metal alloy promotes the abrasive grains. Producing a clustering phenomenon, which is shown in (100) in the figure, and forms an undesired gap (11〇) whose overall effect is a non-uniform distribution of abrasive grains, which causes trimming to be inefficient and, in addition, 17 200916262 The gap makes the CMP polishing pad uneven, which eventually causes the specific area of the CMp polishing pad to wear faster than other areas. Because the grinding efficiency of the wear area is worse than other areas, the grinding process of the workpiece is inconsistent. Since the abrasive grain cluster region forms a buildup in the solder material (9〇), another disadvantage is caused, and the buildup formation causes a portion of the abrasive grains to be lifted to a specific degree on the substrate (4〇), which is higher than the south degree. The height of the other abrasive particles, therefore, the highest abrasive particles can penetrate deep into the fibers of the CMP polishing pad, allowing less abrasive particles to contact the CMP polishing pad or to form an effective trim effect. In contrast, the present invention can provide a CMP polishing pad flat processing process, as shown in the third figure, the CMp polishing pad conditioner (3_ is manufactured according to the present invention, the CMP pad dresser has a plurality of abrasive grains ( 5〇), 'The abrasive grain (5〇) is fixed to the substrate (40) by the solder material (90). 磨 The abrasive grain (50) can be several super-hard materials, which can be the following examples. Not limited to this, for example, the material may be polycrystalline diamond: (PCD) cubic nitride shed (CBN), polycrystalline cubic nitride butterfly (pcBN). Please refer to the third figure... covering material (12G) The surface layer, which is applied after the final splicing process, as described above, 'the cover layer substantially smoothes the surface of the work surface provided by the abrasive alloy, and the smoothness and flat twist form many benefits' including reduction The micro-friction caused by the soldering sheet is preferably combined with the anti-corrosion layer. In addition, the Ra of the covering material has a Ra value of less than ! micron. A plurality of suitable covering materials can be used, ..., 丨|, 竣Cover material sentence SI not brocade, ", chrome, and other alloy examples If the error is 'μ after the material can be attached to it in many ways, for example, 18 200916262, but not limited to the proposed (PVD) 'the cover material: such as plating and physical vapor deposition specific effects, but in In the present invention, the Y degree is to reach a meter. In the present invention, the surface layer is also 7 degrees thick, and the ',".1 to 50 micro-degrees may also be about 0.1 to 5 micrometers. Λ之Λ 1 ' (〇) 5 ^ 塾修修W"方: The humus layer is formed in CMP grinding (3) amorphous diamond, abrasive material, such as diamond-like carbon atoms, in addition, although corrosion-resistant; has at least, about 8〇% The carbon can be of any thickness to achieve a specific effect. 3 its thickness is between 〇.5 and the thickness can be small...m. The thickness of the anti-corrosion _ 塾 塾 的 的 的 的 工作 = = = = = = = = = = = = = = = = = = = = = Without reducing the processing capacity of the abrasive particles for CMP abrasive crucibles, the anti-corrosion layer is formed by physical vapor deposition (PVD), and the physical vapor deposition method (for example, cathode ray by using a graphite cathode) is a common prior art. .

A. Anti-corrosion (4) (10)) provides the advantages of _, for effective "sealing, work surface" while sealing the remaining CMP pad dresser (10) susceptible to chemical attack (four) table ® 'sin this sealed state, anti-corrosion (four) protective welding material枓(90)' is not eroded by the chemical polishing liquid in the CMP pad, which allows the CMP pad dresser to properly process the CMp pad and eliminates the CMp pad dresser for extending the prior art. The use of Shoulun to suspend the process of 'continued', (10) grinding 塾 force: work' to produce better manufacturing results, and increase (10) the life and efficiency of the grinding raft. 19 200916262 Despite several implementations of the invention The example has an anti-corrosion layer (130), but the surface layer material (120) itself already contains anti-corrosion properties, so that when only the surface layer material is used without the anti-corrosion layer, many manufacturing advantages can still be achieved. The method of fixing the abrasive grains (180) on the substrate is as shown in the fourth to sixth figures. First, a template (14〇) having a hole (15〇) is placed on the layer of the solder alloy (1卯). welding It may be a solder alloy powder fixed to each other by a fixing material. The solder alloy powder may include other gold (four) ends, and the other powder may be a main material constituting the solder layer, and the template is formed into holes of a predetermined pattern by the template. So that each abrasive grain is located at a specific position. When the template (14G) is located behind the solder alloy layer (19G), the hole (150) is filled with abrasive particles (18〇). The hole has a preset size to Each hole can only accommodate - abrasive particles, the abrasive particles or sand particles can be of any size, and in the present invention, the diameter of the abrasive particles can be between about 1 〇〇 and 35 〇 microns. In another embodiment, in order to obtain the pattern of the abrasive grains in the same size range, the size of the hole of the template can be customized, and in the embodiment - the hole of the template is sufficient to select only in a specific size range. For grit, the size range is only 5 μm, so the size of the grit makes the #CMp polishing pad flat and evenly distributes the workload of each grit. At the same time, the work load distribution of the Hook reduces the single grit. Stress and extend the useful life of the CMP pad dresser. When the hole in the template (10) is filled with sand (18〇), more: the abrasive particles are removed and the flat surface (10) is applied to the abrasive particles. The flat surface (which must be a very strong and hard material) can therefore push the abrasive particles into the welder's gold layer 20 200916262 (190) 'this material is not limited but may be steel, iron, or alloys thereof and the like. The abrasive grains (180) are embedded in the solder alloy layer (丨9〇) as shown in the sixth figure. Since the surface (160) is flat, the abrasive grains will extend out of the substrate surface at a preset and uniform height, the uniform height. Determined by the thickness of the stencil (140), in the preferred embodiment, the height of each abrasive granule will extend within 5 〇 microns, so each abrasive granule is trimmed at the same depth to the CMP polishing pad, however, In application, the height of the sand grains is not necessarily uniform. Therefore, it is understood by those skilled in the art that the template (140) and the plane (16〇) of the special contour can be constructed to form the sand pattern of the various heights, for example, the plane. (16〇) may have a hole shape to further the abrasive grains located at the periphery Into the center of the abrasive grain, the shape of the hole will make the abrasive particles 'Therefore, the shape of the hole will cause the abrasive grains to form a bevel, the lowest point of the bevel is formed at the working end of the peripheral abrasive particles' And gradually inclined upward toward the working end of the central abrasive grain. The abrasive grains (180) shown in the fourth to sixth figures are spherical, however, in the third figure, they are points R'. The range protected by the abrasive grains of the present invention includes any shape including positive polyhedron, octahedron, Cubes, or natural crystalline abrasive grains. However, in one embodiment, the abrasive particles have a predetermined frequency that includes a tip or sharp apex that extends away from the substrate (4 turns). In another embodiment, the abrasive particles (18 〇) are not pressed into the welded alloy:: square, and the adhesive is fixed on the stencil to the splicing. Preset position, the present invention

The middle slab (140) can be placed on a transfer layer having a thin adhesive layer (Fig. _J, in this embodiment, the abrasive particles can be adhered to by the template process described above) 21 200916262 On the transfer layer, the template is then applied Removal, the transfer layer and the grinding layer facing the soldering layer are disposed on the soldering layer (19〇), and the bonding layer is provided on the soldering 4: the adhesive layer is stronger than the adhesive layer on the transfer layer Therefore, the preset pattern on the abrasive system is fixed to the solder alloy. When the abrasive grain (180) is partially embedded or adhered to the solder alloy layer (19〇), the gas layer is fixed to the substrate (40) as shown in the third figure, and in another embodiment, the solder alloy layer may be first The substrate is fixed to each other, and then the abrasive grains are added thereto by the aforementioned template. The solder alloy may be any material known in the art. In a specific case, T is a nickel alloy having at least 2% by weight of chromium. The solder alloy having this composition is extremely hard and relatively difficult to be chemically invaded by the chemical polishing liquid. Therefore, the anti-corrosion rice layer (13〇) and the coating layer (12〇) are optional features. Since the abrasive grains (50) are firmly embedded or welded to the alloy layer (9 〇), the surface tension of the liquefied welding alloy is insufficient to cause the abrasive grains to form a cluster as shown in the second figure, and further, the weld thickening causes a smaller angle. And less or even no buildup, the weld instead forms a dimple surface between each abrasive grain to provide additional structural strength. In another embodiment, the weld alloy layer (state thickness is preset) So that at least about 10% to about 9% of the abrasive particles pass through the outer surface or the working surface of the solder material. When the cladding layer (120) is used, it is selected or "grabbed again to make at least about 1 〇 %_9〇% of the abrasive grains penetrate the outer surface or the working surface of the coating layer (1 2〇). By the method, the abrasive grains (50) are maintained in the process, and a uniform gap can be formed between the abrasive grains. The abrasive particles can extend out of the substrate (40) at a uniform height or distance, meaning that when disposed on the CMp polishing pad, the abrasive particles are passed through the CMP polishing pad at a uniform depth of 22 200916262. The uniform gap and uniform protrusions in the fiber make the CMP pad Shuo Λ2 two

The technique is uniformly processed, and the CMP grinding, grinding efficiency and life are increased. The abrasive particles are embedded or adhered to the welding alloy in a specific way. Those skilled in the art will understand other alternative methods. The abrasive particles are fixed on the substrate, and then the solder is disposed. In this case, the abrasive particles can be fixed on the substrate by the method of the foregoing template, and fixed by glue or other suitable fixing material, and then the solder material is set on the substrate. The substrate is surrounded by the abrasive grains, and a coating material may be added. Although the present invention includes a plurality of patterns for setting abrasive grains, which can be formed by a method of the present invention, the present invention can also form a specific predetermined pattern which is more suitable for the requirements of the CMP pad dresser. In order to form the pattern, each of the abrasive grains is fixed to a specific position according to the pattern, and the pattern can be placed into a special CMP grinding machine processing effect, and can be changed to achieve a special finishing effect. For example, the tailoring effect of many conventional CMP polishing pads can be improved by the special abrasive particle arrangement, especially when the CMP polishing is elastic, the grinding pressure of the polishing machine causes the CMP polishing pad to rise or The stacking causes it to contact the leading edge of the dresser to create an angle of spear. Since the dresser forms a full contact with the abrasive particles, the lifting process improves the processing of the CMP pad on the leading edge of the dresser. The effect is that the CMP polishing pad has a sinking effect on the area of the leading edge of the dresser, even if the sinking action does not occur, since the CMP pad cannot be raised again under the dresser, the rest of the dresser is located The processing performed in the area after the edge is produced with less processing effect than the leading edge (in other words, 2009, 200926262, the first row of abrasive grains meets the CMp polishing pad with the directional movement of the dresser, and the CMP polishing pad is rotated. Or both, so the main processing load falls on the abrasive particles at the leading edge of the dresser and creates uneven abrasive wear. The penetration depth of each abrasive grain is mainly controlled by two factors, the distance between the abrasive grains and the protrusion height, and the sparsely disposed abrasive grains have better processing effects than the densely disposed abrasive grains, and therefore, one embodiment of the present invention Thus, the pattern of the abrasive particles can be shaped such that the CMP polishing pad is lifted in the inner or center of the underside of the dresser (in other words, the area immediately after the leading edge), so that it is subjected to abrasive grain processing after the leading edge, actually The upper form provides a plurality of guiding edges on the working surface of the dresser, in other words, the density of the abrasive grains located at the periphery is higher than that of the central abrasive grains, and the density of the peripheral abrasive grains may be at least 1.25, 2, or 5. In contrast to the density of the central abrasive particles, the peripheral abrasive particles can be more progressively inclined to be relatively higher than the central abrasive particles. In this case, the change in the initial degree causes the CMP polishing pad to lie down relative to the central portion of the dresser. Lifting and increasing the effectiveness of the process, several abrasive morphologies or patterns provide the desired alignment of the abrasive particles 'this action has been achieved and the desired desired processing effect is achieved. As in the seventh embodiment of the invention, the abrasive particles may be arranged 'in order to allow the abrasive particles to be disposed only along the leading edge (2〇〇) of the dresser, see the eighth embodiment of the present invention. In another embodiment, the abrasive particles can be arranged such that the leading edge (200) is denser (compared to the central portion (21〇)), and conversely, in the further embodiment of the invention, the abrasive particles can be arranged In order to make the abrasive particles densely located in the center (not shown in the figure, compared to the leading edge), in another 24 200916262 - in the embodiment, the abrasive particles can be arranged to make the abrasive grains in the central part of the dresser The density of the abrasive grains is higher than that of the peripheral portion. Therefore, the density of the abrasive grains between the central portion and the peripheral portion is also between the two. Please refer to FIG. 9 for another implementation of the present invention. In the case of the towel, the abrasive particles may be arranged so as to form a gap between the abrasive grains and each of the abrasive grains, which can effectively transmit the CMP abrasive flaw to produce the aforementioned lifting effect, and the uniform abrasive grain distribution can be formed. Out of the grille' and can form about _5_ι〇 times the size of the abrasive grains between each abrasive grain The gap, in the technical field, can be further inferred that the abrasive grains can be arranged at different inclinations from the leading edge of the polishing pad dresser to the central portion. In another embodiment, the present invention provides a method for reinforcing the center of the CMp grinding 当 when the CMp: honing dresser is used for processing. The working load of the abrasive particles in the position, the method forms the abrasive grains into a pattern minus/the CMP pad dresser, and the peripheral abrasive grains are disposed in the polishing crucible, and the central abrasive grains of the CMP pad dresser are added to In the CMp polishing pad, the super abrasive particles are set in a special position on the cMp grinding nail according to the preset pattern, and the abrasive grains in the central portion can increase the working load of the peripheral abrasive grains within at least 3% of the impurities. The workload is further the same as the peripheral abrasive or all abrasive particles. It is possible to increase the workload of the central abrasive particles in an evening manner. For example, the superabrasive grains can be arranged in a pattern, as shown in the tenth figure, the pattern is from the working end of the peripheral abrasive grains to the central abrasive grains. The embodiment of the guarding end is inclined upwards. Another embodiment for increasing the workload is to arrange the superabrasive grains into a pattern which is such that the density of the peripheral grinding 25 200916262 is greater than that of the central grinding. "The grain is dense", the pattern can also make the central abrasive grain into a height, as shown in the eleventh figure, the height of the fhai makes the central abrasive grain penetrate deeper into the Cmp than the peripheral abrasive grain. In the middle. Referring to the tenth figure, the present invention provides a CMp polishing pad conditioner which provides a working load of a central portion of abrasive grains by providing a substrate (3 turns) connected to the superabrasive particles, the super abrasive particles having self The inclination of the outer superabrasive grain (32〇) to the central superhard abrasive grain (3 10) is inclined upward (3〇5), and the inclination of the upward inclination can be increased by the height from the peripheral abrasive grain to the central abrasive grain Formed out, therefore, the upwardly inclined slope provides overall contact between the central abrasive particles and the cMP polishing pad to transfer the peripheral abrasive work load to the central abrasive particles, which increases the processing of the CMP polishing pad. And the processing wear of the overall cMp polishing pad, which is determined by the speed and elasticity of the CMp polishing pad. - Generally speaking, when the CMp grinding 接触 is in contact with the abrasive grains of the leading edge, a concave deformation occurs. The strength of the concave deformation of the CMp abrasive crucible depends on the elasticity and rotational speed of the CMP pad. In a preferred embodiment of the invention, the slope is approximately 0.2% of 〇1%_〇5%. In another embodiment, the slope can be formed by another form of the substrate, as in the tenth figure, the substrate of the CMp abrasive 塾 conditioner is substantially flat '35, and in some aspects The substrate can be designed as a recess 33 corresponding to a %-turn CMP abrasive crucible that provides the desired slope of the abrasive particles (3 10) (320) at the working end, which is located on the working surface of the substrate. The height of the substrate is substantially uniform. The substrate is generally made of metal, ceramic or elastic material. In one embodiment, the substrate is made of stainless steel, and the substrate may be powder 26 200916262. The material is made into a powder material. Curable, the powder may additionally comprise a solder alloy which, for example, is a combination of nickel and carbide, or has at least 2% by weight of chromium, and the substrate may additionally have a solder material. The tenth picture shows the surface of the CMP pad dresser, which increases the workload of the central abrasive grain when processing the CMp pad, and wears it at different speeds depending on its height, in general, The central end can penetrate the penetration force in the CMp grinding boring and produce better trimming than the other P-positions. The flat abrasive grains provide less penetration into the CMp grinding boring, with edges. The abrasive grain provides medium trim and wear 'month'. As shown in the eleventh figure, the substrate (4〇〇) is provided with a plurality of superabrasive grains (410) (42〇) in a preset pattern (43〇). ), the pattern is used to make the center of the dresser and the outer abrasive particles, and can penetrate deeper into the cMp grinding. The 'the + super hard abrasive grain _ can be designed to provide - the tip is at the working end (10)) 'The abrasive grain trimming CMP polishing pad is better, and has higher penetrating power than other grinding (4) 'peripheral abrasive grains (10)) can be designed to provide a ridge line or - plane (43G) in Wei At the end (405), as in the embodiment of the eleventh embodiment, when the central abrasive grain is formed to provide a tip at the working end ( 405) Upper and peripheral granules (42 〇) are formed to provide - ridge or - plane (430) on the working end (4G5) k 'any abrasive grain between the two (formed to provide a ridge line at work) Her μ address is γ, and in other embodiments, any abrasive particles between the central abrasive grain and the peripheral abrasive #工土> ηη _ pull, which can be other heights as well In one embodiment, in the figure f, the central abrasive grain is formed to provide a ridge line at the working end, and the peripheral abrasive grain is formed to provide a plane for the work 27 200916262 On the end. In addition to the apparatus and method described above, the present invention provides a method of fabricating the above-described CMP pad dresser, the method comprising a plurality of steps including providing a substrate and providing a superabrasive particle on the substrate in a pattern, the pattern being reduced Peripheral abrasive particles penetrate the penetration force in the CMP pad and increase the penetration of the central abrasive particles into the CMP pad. The present invention may be embodied in a variety of modifications and alternative arrangements. The modifications and permutations are in accordance with the spirit and scope of the present invention and are therefore included in the scope of the present invention. , which is a preferred embodiment, and may be slightly modified by those skilled in the art, and the present invention includes, but is not limited to, the specific implementation states described above, including the dimensions, materials, shapes, methods, processes, combinations, and uses described above. 0 [Simple Description of the Drawings] The first figure is a side view of a conventional CMP pad dresser in which abrasive grains are fixed by electroplating on the disk substrate of the present invention. The first figure is a side view of a conventional CMp pad dresser that secures abrasive particles to a disk substrate in a conventional soldering process. BRIEF DESCRIPTION OF THE DRAWINGS A side view of a Cmp grinding 塾 dresser of one embodiment of the present invention. The Fig. 4 is a side view of one embodiment of the present invention, which is a template for arranging abrasive grains on the surface of the surface + θ + m Α $ with a known bonding gold layer. Figure 8 is a side elevational view of one embodiment of the present invention having a template having a weld bond gold layer on its surface, with abrasive particles filled into the pores of the template, 28 200916262 pressing the abrasive particles into the weld alloy layer. Figure 6 is a side elevational view of one embodiment of the present invention, the gold layer having a press-fitted abrasive grain, and the joining of the seventh embodiment of the present invention is a top view of one embodiment of the present invention, which is a working plane for grinding and repairing There is a pair of abrasive plates disposed on the substrate such that the abrasive particles are only present substantially along the leading edge of the trimmer. Figure 8 is a top view of one embodiment of the present invention, which has a pair of abrasive grains disposed on the substrate in a plane of the CMP abrasive dresser so that the abrasive grains located at the leading edge are more than the center Abrasive grain. Figure 9 is a top plan view of one embodiment of the present invention having a pair of abrasive particles disposed on a substrate in a working plane of a CMp abrasive dresser such that the abrasive particles are evenly distributed thereon. Figure 11 is a side elevational view of a CMp polishing pad conditioner manufactured in accordance with one embodiment of the present invention. Figure 11 is a side elevational view of a CMP abrasive trowel trimmer made in accordance with one embodiment of the present invention. [Main component symbol description] (10) CMP polishing 塾 dresser (40) substrate (50) abrasive grain (60) plating material (70) gap (80) convex portion (90) welding material 29 200916262 (100) cluster (110 ) Gap (120) Cover Material (130) Anti-corrosion Layer (140) Template (150) Hole (160) Flat Surface (180) Abrasive Grain (190) Welding Alloy (200) Guide Edge (210) Central Part (300) Substrate (305) Tilt (3 10) Central Super Hard Abrasive (320) Peripheral Super Hard Abrasive (400) Substrate (405) Working End (410) Super Abrasive Grain (420) Super Abrasive Grain (430) Super Abrasive Grain

Claims (1)

200916262 X. Patent application scope: 1 · A method for increasing the penetration force of the central superabrasive grain of the CMP pad dresser, the central superabrasive system is used for trimming the CMP pad, the method includes: providing ~welding An alloy layer; an enamel layer is coated on the solder alloy layer; the super abrasive grain is fixed in a pattern of the solder alloy layer in a pattern, and the pattern is used to reduce the penetration of the peripheral abrasive grains into the CMP pad. Penetration force, and used to increase the penetrating power of the central abrasive grains penetrating into the CMP polishing pad; and welding the 6-abrasion particles and the solder alloy on the substrate to form a trimmer. 2. The method of claim 1, wherein the superabrasive is directly applied to the solder alloy layer using a template. 3. The method of claim 1, wherein the super transfer layer is disposed on a solder alloy layer, and the transfer layer has a ruthenium adhesion layer coated on the ruthenium W. 1 Use the template to hold the superabrasive grains in the pattern. Figure 11: Page 31