JP7090831B1 - 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート - Google Patents

凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート Download PDF

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JP7090831B1
JP7090831B1 JP2022521044A JP2022521044A JP7090831B1 JP 7090831 B1 JP7090831 B1 JP 7090831B1 JP 2022521044 A JP2022521044 A JP 2022521044A JP 2022521044 A JP2022521044 A JP 2022521044A JP 7090831 B1 JP7090831 B1 JP 7090831B1
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boron nitride
particle size
nitride powder
point
maximum point
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Japanese (ja)
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JPWO2022149553A1 (https=
JPWO2022149553A5 (https=
Inventor
光祐 和田
清隆 藤
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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Priority claimed from PCT/JP2021/048887 external-priority patent/WO2022149553A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2022521044A 2021-01-06 2021-12-28 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート Expired - Fee Related JP7090831B1 (ja)

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JP2022095599A JP7362839B2 (ja) 2021-01-06 2022-06-14 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート

Applications Claiming Priority (3)

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JP2021000874 2021-01-06
JP2021000874 2021-01-06
PCT/JP2021/048887 WO2022149553A1 (ja) 2021-01-06 2021-12-28 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート

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JP2022095599A Division JP7362839B2 (ja) 2021-01-06 2022-06-14 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート

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JP7090831B1 true JP7090831B1 (ja) 2022-06-24
JPWO2022149553A1 JPWO2022149553A1 (https=) 2022-07-14
JPWO2022149553A5 JPWO2022149553A5 (https=) 2022-12-13

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JP2022521044A Expired - Fee Related JP7090831B1 (ja) 2021-01-06 2021-12-28 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート
JP2022095599A Active JP7362839B2 (ja) 2021-01-06 2022-06-14 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート

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US (1) US20240052226A1 (https=)
EP (1) EP4257545A4 (https=)
JP (2) JP7090831B1 (https=)
CN (1) CN116670213A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7796274B1 (ja) * 2025-03-31 2026-01-08 デンカ株式会社 窒化ホウ素粉末、及び無機フィラー
JP7804810B1 (ja) * 2025-03-31 2026-01-22 デンカ株式会社 窒化ホウ素粉末、無機フィラー及び窒化ホウ素粉末の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016027144A (ja) * 2014-07-02 2016-02-18 住友ベークライト株式会社 熱伝導性シート、熱伝導性シートの硬化物および半導体装置
WO2016092951A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2016108457A (ja) * 2014-12-08 2016-06-20 昭和電工株式会社 樹脂組成物及びその製造方法
JP2020164365A (ja) * 2019-03-29 2020-10-08 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012046814A1 (ja) * 2010-10-06 2012-04-12 日立化成工業株式会社 多層樹脂シート及びその製造方法、樹脂シート積層体及びその製造方法、多層樹脂シート硬化物、金属箔付き多層樹脂シート、並びに半導体装置
JP6284019B2 (ja) 2014-04-03 2018-02-28 株式会社豊田中央研究所 窒化ホウ素ナノシート含有分散液及びその製造方法、窒化ホウ素ナノシート複合体及びその製造方法
US11268004B2 (en) * 2016-10-07 2022-03-08 Denka Company Limited Boron nitride aggregated grain
JP6822836B2 (ja) * 2016-12-28 2021-01-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP6296197B1 (ja) 2017-09-06 2018-03-20 東洋インキＳｃホールディングス株式会社 樹脂組成物、およびその成形体
KR20210142639A (ko) * 2019-03-27 2021-11-25 덴카 주식회사 괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016027144A (ja) * 2014-07-02 2016-02-18 住友ベークライト株式会社 熱伝導性シート、熱伝導性シートの硬化物および半導体装置
WO2016092951A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP2016108457A (ja) * 2014-12-08 2016-06-20 昭和電工株式会社 樹脂組成物及びその製造方法
JP2020164365A (ja) * 2019-03-29 2020-10-08 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

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JPWO2022149553A1 (https=) 2022-07-14
CN116670213A (zh) 2023-08-29
JP2022125061A (ja) 2022-08-26
US20240052226A1 (en) 2024-02-15
EP4257545A4 (en) 2024-06-26
JP7362839B2 (ja) 2023-10-17
EP4257545A1 (en) 2023-10-11

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