CN116670213A - 聚集氮化硼粒子、氮化硼粉末、导热性树脂组合物及散热片材 - Google Patents

聚集氮化硼粒子、氮化硼粉末、导热性树脂组合物及散热片材 Download PDF

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Publication number
CN116670213A
CN116670213A CN202180089437.5A CN202180089437A CN116670213A CN 116670213 A CN116670213 A CN 116670213A CN 202180089437 A CN202180089437 A CN 202180089437A CN 116670213 A CN116670213 A CN 116670213A
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CN
China
Prior art keywords
boron nitride
maximum point
nitride powder
aggregated
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180089437.5A
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English (en)
Chinese (zh)
Inventor
和田光祐
藤清隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority claimed from PCT/JP2021/048887 external-priority patent/WO2022149553A1/ja
Publication of CN116670213A publication Critical patent/CN116670213A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CN202180089437.5A 2021-01-06 2021-12-28 聚集氮化硼粒子、氮化硼粉末、导热性树脂组合物及散热片材 Pending CN116670213A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021000874 2021-01-06
JP2021-000874 2021-01-18
PCT/JP2021/048887 WO2022149553A1 (ja) 2021-01-06 2021-12-28 凝集窒化ホウ素粒子、窒化ホウ素粉末、熱伝導性樹脂組成物及び放熱シート

Publications (1)

Publication Number Publication Date
CN116670213A true CN116670213A (zh) 2023-08-29

Family

ID=82155955

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180089437.5A Pending CN116670213A (zh) 2021-01-06 2021-12-28 聚集氮化硼粒子、氮化硼粉末、导热性树脂组合物及散热片材

Country Status (4)

Country Link
US (1) US20240052226A1 (https=)
EP (1) EP4257545A4 (https=)
JP (2) JP7090831B1 (https=)
CN (1) CN116670213A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7796274B1 (ja) * 2025-03-31 2026-01-08 デンカ株式会社 窒化ホウ素粉末、及び無機フィラー
JP7804810B1 (ja) * 2025-03-31 2026-01-22 デンカ株式会社 窒化ホウ素粉末、無機フィラー及び窒化ホウ素粉末の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012046814A1 (ja) * 2010-10-06 2012-04-12 日立化成工業株式会社 多層樹脂シート及びその製造方法、樹脂シート積層体及びその製造方法、多層樹脂シート硬化物、金属箔付き多層樹脂シート、並びに半導体装置
JP6284019B2 (ja) 2014-04-03 2018-02-28 株式会社豊田中央研究所 窒化ホウ素ナノシート含有分散液及びその製造方法、窒化ホウ素ナノシート複合体及びその製造方法
JP6657616B2 (ja) * 2014-07-02 2020-03-04 住友ベークライト株式会社 熱伝導性シート、熱伝導性シートの硬化物および半導体装置
WO2016092951A1 (ja) * 2014-12-08 2016-06-16 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP6538337B2 (ja) * 2014-12-08 2019-07-03 昭和電工株式会社 樹脂組成物及びその製造方法
US11268004B2 (en) * 2016-10-07 2022-03-08 Denka Company Limited Boron nitride aggregated grain
JP6822836B2 (ja) * 2016-12-28 2021-01-27 昭和電工株式会社 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート
JP6296197B1 (ja) 2017-09-06 2018-03-20 東洋インキＳｃホールディングス株式会社 樹脂組成物、およびその成形体
KR20210142639A (ko) * 2019-03-27 2021-11-25 덴카 주식회사 괴상 질화붕소 입자, 열전도 수지 조성물 및 방열 부재
JP7273587B2 (ja) * 2019-03-29 2023-05-15 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Also Published As

Publication number Publication date
JPWO2022149553A1 (https=) 2022-07-14
JP2022125061A (ja) 2022-08-26
US20240052226A1 (en) 2024-02-15
JP7090831B1 (ja) 2022-06-24
EP4257545A4 (en) 2024-06-26
JP7362839B2 (ja) 2023-10-17
EP4257545A1 (en) 2023-10-11

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