JP7089656B2 - ナノワイヤ又はナノシートトランジスタデバイスのトランジスタ遅延を制御する方法 - Google Patents
ナノワイヤ又はナノシートトランジスタデバイスのトランジスタ遅延を制御する方法 Download PDFInfo
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- JP7089656B2 JP7089656B2 JP2020548890A JP2020548890A JP7089656B2 JP 7089656 B2 JP7089656 B2 JP 7089656B2 JP 2020548890 A JP2020548890 A JP 2020548890A JP 2020548890 A JP2020548890 A JP 2020548890A JP 7089656 B2 JP7089656 B2 JP 7089656B2
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- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
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- H10D84/0193—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices the components including FinFETs
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762594352P | 2017-12-04 | 2017-12-04 | |
| US62/594,352 | 2017-12-04 | ||
| PCT/US2018/063623 WO2019112954A1 (en) | 2017-12-04 | 2018-12-03 | Method for controlling transistor delay of nanowire or nanosheet transistor devices |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021506141A JP2021506141A (ja) | 2021-02-18 |
| JP2021506141A5 JP2021506141A5 (enExample) | 2021-04-01 |
| JP7089656B2 true JP7089656B2 (ja) | 2022-06-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020548890A Active JP7089656B2 (ja) | 2017-12-04 | 2018-12-03 | ナノワイヤ又はナノシートトランジスタデバイスのトランジスタ遅延を制御する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10714391B2 (enExample) |
| JP (1) | JP7089656B2 (enExample) |
| KR (2) | KR102550501B1 (enExample) |
| CN (1) | CN111566803B (enExample) |
| TW (1) | TWI775995B (enExample) |
| WO (1) | WO2019112954A1 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11404325B2 (en) * | 2013-08-20 | 2022-08-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Silicon and silicon germanium nanowire formation |
| KR102434993B1 (ko) * | 2015-12-09 | 2022-08-24 | 삼성전자주식회사 | 반도체 소자 |
| US12408431B2 (en) * | 2018-04-06 | 2025-09-02 | International Business Machines Corporation | Gate stack quality for gate-all-around field-effect transistors |
| US10825933B2 (en) * | 2018-06-11 | 2020-11-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gate-all-around structure and manufacturing method for the same |
| US20200295127A1 (en) * | 2019-03-13 | 2020-09-17 | Intel Corporation | Stacked transistors with different crystal orientations in different device strata |
| US11037905B2 (en) * | 2019-04-26 | 2021-06-15 | International Business Machines Corporation | Formation of stacked vertical transport field effect transistors |
| US11069679B2 (en) | 2019-04-26 | 2021-07-20 | International Business Machines Corporation | Reducing gate resistance in stacked vertical transport field effect transistors |
| US11355397B2 (en) * | 2019-05-13 | 2022-06-07 | Board Of Regents, The University Of Texas System | Catalyst influenced chemical etching for fabricating three-dimensional SRAM architectures |
| US11710667B2 (en) * | 2019-08-27 | 2023-07-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gate-all-around device with trimmed channel and dipoled dielectric layer and methods of forming the same |
| US11557655B2 (en) | 2019-10-11 | 2023-01-17 | Tokyo Electron Limited | Device and method of forming with three-dimensional memory and three-dimensional logic |
| CN112951912B (zh) * | 2019-12-10 | 2024-05-14 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
| US11302692B2 (en) * | 2020-01-16 | 2022-04-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor devices having gate dielectric layers of varying thicknesses and methods of forming the same |
| US11664656B2 (en) | 2020-03-18 | 2023-05-30 | Mavagail Technology, LLC | ESD protection for integrated circuit devices |
| US11837280B1 (en) * | 2020-05-20 | 2023-12-05 | Synopsys, Inc. | CFET architecture for balancing logic library and SRAM bitcell |
| CN116325174A (zh) * | 2020-09-29 | 2023-06-23 | 华为技术有限公司 | 晶体管及其制作方法、集成电路、电子设备 |
| US20240004381A1 (en) | 2020-11-20 | 2024-01-04 | Drovid Technologies Spa | METHOD TO TRANSMIT AND TRACK PARAMETERS DETECTED BY DRONES USING (PaaS) WITH (AI) |
| WO2022109762A1 (zh) * | 2020-11-24 | 2022-06-02 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及半导体结构的形成方法 |
| US11527535B2 (en) | 2021-01-21 | 2022-12-13 | International Business Machines Corporation | Variable sheet forkFET device |
| US11424120B2 (en) | 2021-01-22 | 2022-08-23 | Tokyo Electron Limited | Plasma etching techniques |
| CN115050646B (zh) * | 2021-03-08 | 2025-05-27 | 北方集成电路技术创新中心(北京)有限公司 | 半导体结构及其形成方法 |
| CN113130489A (zh) * | 2021-03-12 | 2021-07-16 | 中国科学院微电子研究所 | 一种半导体器件的制造方法 |
| CN115347043A (zh) * | 2021-05-14 | 2022-11-15 | 三星电子株式会社 | 纳米片晶体管器件及其形成方法 |
| CN115425076A (zh) * | 2021-05-14 | 2022-12-02 | 三星电子株式会社 | 纳米片晶体管器件及其形成方法 |
| US11843001B2 (en) | 2021-05-14 | 2023-12-12 | Samsung Electronics Co., Ltd. | Devices including stacked nanosheet transistors |
| US12170322B2 (en) * | 2021-05-14 | 2024-12-17 | Samsung Electronics Co., Ltd. | Devices including stacked nanosheet transistors |
| US12087770B2 (en) | 2021-08-05 | 2024-09-10 | International Business Machines Corporation | Complementary field effect transistor devices |
| KR102877120B1 (ko) * | 2021-08-13 | 2025-10-27 | 삼성전자주식회사 | 반도체 소자 |
| US12166037B2 (en) * | 2021-08-27 | 2024-12-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Isolation layers in stacked semiconductor devices |
| US12113067B2 (en) | 2021-09-13 | 2024-10-08 | International Business Machines Corporation | Forming N-type and P-type horizontal gate-all-around devices |
| US11837604B2 (en) | 2021-09-22 | 2023-12-05 | International Business Machine Corporation | Forming stacked nanosheet semiconductor devices with optimal crystalline orientations around devices |
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| JP2021506141A (ja) | 2021-02-18 |
| KR102550501B1 (ko) | 2023-06-30 |
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| US10714391B2 (en) | 2020-07-14 |
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| WO2019112954A1 (en) | 2019-06-13 |
| US10991626B2 (en) | 2021-04-27 |
| KR20220137168A (ko) | 2022-10-11 |
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