JP7072655B2 - バックライトモジュール - Google Patents
バックライトモジュール Download PDFInfo
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- JP7072655B2 JP7072655B2 JP2020532895A JP2020532895A JP7072655B2 JP 7072655 B2 JP7072655 B2 JP 7072655B2 JP 2020532895 A JP2020532895 A JP 2020532895A JP 2020532895 A JP2020532895 A JP 2020532895A JP 7072655 B2 JP7072655 B2 JP 7072655B2
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- backlight module
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0051—Diffusing sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0003—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being doped with fluorescent agents
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Planar Illumination Modules (AREA)
Description
11 LEDユニット
12 蛍光膜
20 背面板
21 基板
22 発光ダイオード
23 蛍光膜層
24 光学膜材
25 膜層
30 背面板
31 基板
32 発光ダイオード
33 蛍光膜層
34 光学膜材
35 膜層
40 背面板
41 基板
42 発光ダイオード
43 蛍光膜層
44 光学膜材
45 第1膜層
46 第2膜層
Claims (6)
- バックライトモジュールであって、
背面板と、複数の基板と、複数の蛍光膜層と、光学膜材とを含み、
前記複数の基板は、前記背面板の上に設置され、
前記基板は互いに隣接して設置され、
前記基板は前記基板の上に設置され且つアレイを形成する複数の発光ダイオードをさらに含み、
前記複数の蛍光膜層は、前記基板の上に設置され且つ前記複数の発光ダイオードを被覆し、
前記光学膜材は、前記蛍光膜層の上に設置され、
前記バックライトモジュールは、前記光学膜材の底部に、隣接する前記蛍光膜層の間の隙間に対応して設置される少なくとも1つの膜層をさらに含み、
前記膜層の幅は隣接する前記蛍光膜層の間の隙間の幅よりも大きく、
前記膜層は多数のライトガイドドット又は1層の光拡散粒子薄膜であるバックライトモジュール。 - 前記光学膜材は光拡散板又は光拡散膜である請求項1に記載のバックライトモジュール。
- 前記光拡散粒子薄膜の材料はポリメチルメタクリレート、ポリカーボネート及びポリスチレンのうちの1種又は複数種を含む請求項1に記載のバックライトモジュール。
- バックライトモジュールであって、
背面板と、複数の基板と、複数の蛍光膜層と、光学膜材とを含み、
前記複数の基板は、前記背面板上に設置され、
前記基板は互いに隣接して設置され、
前記基板は前記基板の上に設置され且つアレイを形成する複数の発光ダイオードをさらに含み、
前記複数の蛍光膜層は、前記基板の上に設置され且つ前記複数の発光ダイオードを被覆し、
前記光学膜材は、前記蛍光膜層の上に設置され、
前記バックライトモジュールは、前記光学膜材の底部に、隣接する前記蛍光膜層の間の隙間に対応して設置される少なくとも1つの第1膜層をさらに含み、
前記バックライトモジュールは、前記背面板の上に、隣接する前記蛍光膜層の間の隙間に対応して設置される少なくとも1つの第2膜層をさらに含み、
前記第1膜層の幅は隣接する前記蛍光膜層の間の隙間の幅よりも大きく、
前記第2膜層の幅は隣接する前記蛍光膜層の間の隙間の幅よりも大きく、
前記第1膜層は多数のライトガイドドット又は1層の光拡散粒子薄膜であり、
前記第2膜層は1層の高反射率の白色インク又は高反射率の白色テープであるバックライトモジュール。 - 前記光学膜材は光拡散板又は光拡散膜である請求項4に記載のバックライトモジュール。
- 前記光拡散粒子薄膜の材料はポリメチルメタクリレート、ポリカーボネート及びポリスチレンのうちの1種又は複数種を含む請求項4に記載のバックライトモジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910757700.8 | 2019-08-16 | ||
CN201910757700.8A CN110610929B (zh) | 2019-08-16 | 2019-08-16 | 背光模组 |
PCT/CN2019/107942 WO2021031292A1 (zh) | 2019-08-16 | 2019-09-25 | 背光模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022501760A JP2022501760A (ja) | 2022-01-06 |
JP7072655B2 true JP7072655B2 (ja) | 2022-05-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020532895A Active JP7072655B2 (ja) | 2019-08-16 | 2019-09-25 | バックライトモジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US11391881B2 (ja) |
JP (1) | JP7072655B2 (ja) |
CN (1) | CN110610929B (ja) |
WO (1) | WO2021031292A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111816091A (zh) * | 2020-07-06 | 2020-10-23 | 深圳市华星光电半导体显示技术有限公司 | Led显示面板 |
CN112086014B (zh) * | 2020-09-16 | 2022-03-08 | 武汉华星光电技术有限公司 | 背光模组及显示装置 |
CN113050327A (zh) * | 2021-03-10 | 2021-06-29 | 武汉天马微电子有限公司 | 背光模组和显示装置 |
WO2024020957A1 (zh) * | 2022-07-28 | 2024-02-01 | 京东方科技集团股份有限公司 | 背光模组及其制造方法、显示装置 |
CN115657366A (zh) * | 2022-09-26 | 2023-01-31 | 惠科股份有限公司 | 光学膜片、显示模组及显示屏 |
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JP2005031247A (ja) * | 2003-07-09 | 2005-02-03 | Seiko Epson Corp | 画像表示装置 |
JP5158472B2 (ja) * | 2007-05-24 | 2013-03-06 | スタンレー電気株式会社 | 半導体発光装置 |
CN201103850Y (zh) * | 2007-11-05 | 2008-08-20 | 崴强科技股份有限公司 | 背光模块 |
KR101471945B1 (ko) * | 2008-10-01 | 2014-12-12 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 |
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CN110061116B (zh) * | 2019-04-29 | 2020-10-30 | 惠州市华星光电技术有限公司 | Mini-LED背光及其制作方法 |
-
2019
- 2019-08-16 CN CN201910757700.8A patent/CN110610929B/zh active Active
- 2019-09-25 US US16/630,903 patent/US11391881B2/en active Active
- 2019-09-25 WO PCT/CN2019/107942 patent/WO2021031292A1/zh active Application Filing
- 2019-09-25 JP JP2020532895A patent/JP7072655B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007180005A (ja) | 2005-12-28 | 2007-07-12 | Lg Phillips Lcd Co Ltd | バックライトアセンブリ及びこれを利用した液晶表示装置モジュール |
WO2011004625A1 (ja) | 2009-07-09 | 2011-01-13 | シャープ株式会社 | 照明装置、表示装置、及びテレビジョン受像器 |
CN107610596A (zh) | 2017-09-26 | 2018-01-19 | 深圳英伦科技股份有限公司 | 基于lcd、oled、qled器件的2d、3d的超大尺寸极高清无缝拼接显示屏 |
CN109270738A (zh) | 2018-10-31 | 2019-01-25 | 厦门天马微电子有限公司 | 一种背光模组及显示装置 |
CN109656058A (zh) | 2019-01-14 | 2019-04-19 | 惠州市华星光电技术有限公司 | 一种背光模组及其显示装置 |
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Publication number | Publication date |
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US11391881B2 (en) | 2022-07-19 |
WO2021031292A1 (zh) | 2021-02-25 |
US20210405279A1 (en) | 2021-12-30 |
CN110610929A (zh) | 2019-12-24 |
JP2022501760A (ja) | 2022-01-06 |
CN110610929B (zh) | 2021-12-03 |
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