JP7062389B2 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

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Publication number
JP7062389B2
JP7062389B2 JP2017160630A JP2017160630A JP7062389B2 JP 7062389 B2 JP7062389 B2 JP 7062389B2 JP 2017160630 A JP2017160630 A JP 2017160630A JP 2017160630 A JP2017160630 A JP 2017160630A JP 7062389 B2 JP7062389 B2 JP 7062389B2
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Japan
Prior art keywords
resin layer
conductive particles
insulating resin
anisotropic conductive
conductive film
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JP2017160630A
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English (en)
Japanese (ja)
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JP2019040703A5 (cg-RX-API-DMAC7.html
JP2019040703A (ja
Inventor
太一郎 梶谷
怜司 塚尾
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Dexerials Corp
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Dexerials Corp
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Priority to JP2017160630A priority Critical patent/JP7062389B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to PCT/JP2018/028623 priority patent/WO2019039210A1/ja
Priority to CN201880054523.0A priority patent/CN110945720B/zh
Priority to KR1020207004220A priority patent/KR20200022510A/ko
Priority to US16/640,461 priority patent/US20200215785A1/en
Priority to KR1020227044578A priority patent/KR102675438B1/ko
Priority to TW107128572A priority patent/TWI781213B/zh
Priority to TW111136753A priority patent/TWI855387B/zh
Publication of JP2019040703A publication Critical patent/JP2019040703A/ja
Publication of JP2019040703A5 publication Critical patent/JP2019040703A5/ja
Application granted granted Critical
Publication of JP7062389B2 publication Critical patent/JP7062389B2/ja
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/832—Applying energy for connecting
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    • H01L2224/832—Applying energy for connecting
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    • H01L2224/832—Applying energy for connecting
    • H01L2224/8322—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/83224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser

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KR1020207004220A KR20200022510A (ko) 2017-08-23 2018-07-31 이방성 도전 필름
US16/640,461 US20200215785A1 (en) 2017-08-23 2018-07-31 Anisotropic conductive film
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TW107128572A TWI781213B (zh) 2017-08-23 2018-08-16 異向性導電膜、連接結構體及彼等之製造方法
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JP2003064324A (ja) 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
JP2014044947A (ja) 2012-08-01 2014-03-13 Dexerials Corp 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体

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