CN110945720B - 各向异性导电膜 - Google Patents

各向异性导电膜 Download PDF

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Publication number
CN110945720B
CN110945720B CN201880054523.0A CN201880054523A CN110945720B CN 110945720 B CN110945720 B CN 110945720B CN 201880054523 A CN201880054523 A CN 201880054523A CN 110945720 B CN110945720 B CN 110945720B
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insulating resin
resin layer
conductive particles
anisotropic conductive
conductive film
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Chinese (zh)
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CN110945720A (zh
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梶谷太一郎
塚尾怜司
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Dexerials Corp
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Dexerials Corp
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    • H01L2224/29364—Palladium [Pd] as principal constituent
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    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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    • H01L2224/29499—Shape or distribution of the fillers
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75261—Laser
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/8322—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/83224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064324A (ja) * 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
JP2006032335A (ja) * 2005-07-06 2006-02-02 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP2014044947A (ja) * 2012-08-01 2014-03-13 Dexerials Corp 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体
CN104541411A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
CN104541416A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
CN105940564A (zh) * 2014-02-04 2016-09-14 迪睿合株式会社 各向异性导电膜及其制造方法
CN106939146A (zh) * 2012-09-18 2017-07-11 迪睿合电子材料有限公司 各向异性导电膜及其制法、连接体及其制法以及连接方法
CN108475558A (zh) * 2016-02-15 2018-08-31 迪睿合株式会社 各向异性导电膜、其制造方法和连接结构体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010008169A1 (en) 1998-06-30 2001-07-19 3M Innovative Properties Company Fine pitch anisotropic conductive adhesive
JP2003045236A (ja) * 2001-08-03 2003-02-14 Nec Kagoshima Ltd 異方性導電フイルムおよびこれを用いた集積回路デバイスの接続方法
JP5388572B2 (ja) * 2006-04-27 2014-01-15 デクセリアルズ株式会社 導電粒子配置シート及び異方導電性フィルム
JP5145110B2 (ja) * 2007-12-10 2013-02-13 富士フイルム株式会社 異方導電性接合パッケージの製造方法
CN104508064B (zh) * 2012-08-03 2016-10-12 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
JP6428325B2 (ja) * 2014-02-04 2018-11-28 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6217422B2 (ja) * 2014-02-04 2017-10-25 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6409281B2 (ja) * 2014-02-04 2018-10-24 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6260312B2 (ja) * 2014-02-04 2018-01-17 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
TWI787601B (zh) * 2015-01-13 2022-12-21 日商迪睿合股份有限公司 異向導電性膜
JP6750197B2 (ja) * 2015-07-13 2020-09-02 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064324A (ja) * 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
JP2006032335A (ja) * 2005-07-06 2006-02-02 Hitachi Chem Co Ltd 異方導電性接着フィルム
JP2014044947A (ja) * 2012-08-01 2014-03-13 Dexerials Corp 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体
CN104541411A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
CN104541416A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜的制造方法和各向异性导电膜
CN106939146A (zh) * 2012-09-18 2017-07-11 迪睿合电子材料有限公司 各向异性导电膜及其制法、连接体及其制法以及连接方法
CN105940564A (zh) * 2014-02-04 2016-09-14 迪睿合株式会社 各向异性导电膜及其制造方法
CN108475558A (zh) * 2016-02-15 2018-08-31 迪睿合株式会社 各向异性导电膜、其制造方法和连接结构体

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