JP7056646B2 - 電子部品内蔵基板 - Google Patents
電子部品内蔵基板 Download PDFInfo
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- JP7056646B2 JP7056646B2 JP2019509301A JP2019509301A JP7056646B2 JP 7056646 B2 JP7056646 B2 JP 7056646B2 JP 2019509301 A JP2019509301 A JP 2019509301A JP 2019509301 A JP2019509301 A JP 2019509301A JP 7056646 B2 JP7056646 B2 JP 7056646B2
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- electronic component
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- 239000010410 layer Substances 0.000 claims description 469
- 239000004020 conductor Substances 0.000 claims description 258
- 239000000758 substrate Substances 0.000 claims description 126
- 239000012790 adhesive layer Substances 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 239000011889 copper foil Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000011810 insulating material Substances 0.000 description 7
- 230000000644 propagated effect Effects 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000001902 propagating effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 and for example Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Ceramic Capacitors (AREA)
Description
次に、図6及び図7を参照しながら、変形例に係る電子部品内蔵基板について説明する。図6(A)~図6(C)は、電子部品内蔵基板の電子部品と他の導体層等の接続を変更した例である。また、図7は、電子部品及び第1導体層の配置に関する変形例である。
Claims (5)
- 第1絶縁層と、
前記第1絶縁層の一方側の主面である第1主面上に設けられた導体層と、
前記第1絶縁層の前記第1主面上に設けられ、一対の電極層と誘電体層とが積層された電子部品と、
前記第1絶縁層上に積層される第2絶縁層と、を有し、
前記第1絶縁層及び前記第2絶縁層の積層方向と、前記電子部品における前記電極層と前記誘電体層との積層方向が同じであり、
前記電子部品における前記一対の電極層は、どちらも、前記誘電体層の前記第1絶縁層から遠い側の主面上の互いに異なる位置に設けられていて、
前記積層方向において、前記電子部品における前記第1主面側とは逆側の主面の高さ位置と、前記電子部品に隣接する前記導体層における前記第1主面側とは逆側の主面の高さ位置と、が互いに異なる、電子部品内蔵基板。 - 前記電子部品は、前記第1絶縁層の前記第1主面上に設けられた接着層の上に設けられる、請求項1に記載の電子部品内蔵基板。
- 前記積層方向において、前記電子部品における前記第1主面側の主面の高さ位置と、前記電子部品に隣接する前記導体層における前記第1主面側の主面の高さ位置と、が互いに異なる、請求項1又は2に記載の電子部品内蔵基板。
- 前記導体層の厚さが略均一である、請求項1~3のいずれか一項に記載の電子部品内蔵基板。
- 前記電子部品の前記電極層の一部は、導電ペーストにより前記導体層と接続されている、請求項1~4のいずれか一項に記載の電子部品内蔵基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017070578 | 2017-03-31 | ||
JP2017070578 | 2017-03-31 | ||
PCT/JP2018/010552 WO2018180628A1 (ja) | 2017-03-31 | 2018-03-16 | 電子部品内蔵基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018180628A1 JPWO2018180628A1 (ja) | 2020-02-06 |
JP7056646B2 true JP7056646B2 (ja) | 2022-04-19 |
Family
ID=63677428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019509301A Active JP7056646B2 (ja) | 2017-03-31 | 2018-03-16 | 電子部品内蔵基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11367626B2 (ja) |
JP (1) | JP7056646B2 (ja) |
KR (1) | KR102356125B1 (ja) |
WO (1) | WO2018180628A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11476261B2 (en) * | 2019-02-27 | 2022-10-18 | Kepler Computing Inc. | High-density low voltage non-volatile memory with unidirectional plate-line and bit-line and pillar capacitor |
US11277917B2 (en) | 2019-03-12 | 2022-03-15 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure, embedded type panel substrate and manufacturing method thereof |
US10950551B2 (en) | 2019-04-29 | 2021-03-16 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure and manufacturing method thereof |
US11296030B2 (en) | 2019-04-29 | 2022-04-05 | Advanced Semiconductor Engineering, Inc. | Embedded component package structure and manufacturing method thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002260960A (ja) | 2001-03-01 | 2002-09-13 | Shinko Electric Ind Co Ltd | キャパシタ、キャパシタ内蔵回路基板及びそれらの製造方法 |
WO2003028418A1 (fr) | 2001-09-21 | 2003-04-03 | Sony Corporation | Systeme de carte a circuits imprimes a couche mince et son procede de realisation |
JP2003152340A (ja) | 2001-11-12 | 2003-05-23 | Shinko Electric Ind Co Ltd | 多層配線基板の製造方法 |
JP2007517385A (ja) | 2003-12-15 | 2007-06-28 | モトローラ・インコーポレイテッド | プリント回路埋め込みコンデンサ |
US20080030965A1 (en) | 2006-08-04 | 2008-02-07 | Phoenix Precision Technology Corporation | Circuit board structure with capacitors embedded therein and method for fabricating the same |
JP2010251530A (ja) | 2009-04-16 | 2010-11-04 | Cmk Corp | キャパシタ内蔵型多層プリント配線板及びその製造方法 |
US20150195905A1 (en) | 2014-01-03 | 2015-07-09 | Samsung Electro-Mechanics Co., Ltd. | Package board, method of manufacturing the same, and semiconductor package using the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008159820A (ja) | 2006-12-22 | 2008-07-10 | Tdk Corp | 電子部品の一括実装方法、及び電子部品内蔵基板の製造方法 |
JP2014045092A (ja) | 2012-08-27 | 2014-03-13 | Fujikura Ltd | 部品内蔵基板 |
KR102235811B1 (ko) | 2014-02-27 | 2021-04-02 | 가부시키가이샤 앰코테크놀로지재팬 | 반도체 장치, 반도체 적층모듈구조, 적층모듈구조 및 이들의 제조방법 |
JP6462480B2 (ja) | 2015-04-28 | 2019-01-30 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
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2018
- 2018-03-16 WO PCT/JP2018/010552 patent/WO2018180628A1/ja active Application Filing
- 2018-03-16 KR KR1020197031907A patent/KR102356125B1/ko active IP Right Grant
- 2018-03-16 JP JP2019509301A patent/JP7056646B2/ja active Active
- 2018-03-16 US US16/499,501 patent/US11367626B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002260960A (ja) | 2001-03-01 | 2002-09-13 | Shinko Electric Ind Co Ltd | キャパシタ、キャパシタ内蔵回路基板及びそれらの製造方法 |
WO2003028418A1 (fr) | 2001-09-21 | 2003-04-03 | Sony Corporation | Systeme de carte a circuits imprimes a couche mince et son procede de realisation |
JP2003152340A (ja) | 2001-11-12 | 2003-05-23 | Shinko Electric Ind Co Ltd | 多層配線基板の製造方法 |
JP2007517385A (ja) | 2003-12-15 | 2007-06-28 | モトローラ・インコーポレイテッド | プリント回路埋め込みコンデンサ |
US20080030965A1 (en) | 2006-08-04 | 2008-02-07 | Phoenix Precision Technology Corporation | Circuit board structure with capacitors embedded therein and method for fabricating the same |
JP2010251530A (ja) | 2009-04-16 | 2010-11-04 | Cmk Corp | キャパシタ内蔵型多層プリント配線板及びその製造方法 |
US20150195905A1 (en) | 2014-01-03 | 2015-07-09 | Samsung Electro-Mechanics Co., Ltd. | Package board, method of manufacturing the same, and semiconductor package using the same |
Also Published As
Publication number | Publication date |
---|---|
US20200043751A1 (en) | 2020-02-06 |
KR102356125B1 (ko) | 2022-01-28 |
JPWO2018180628A1 (ja) | 2020-02-06 |
WO2018180628A1 (ja) | 2018-10-04 |
KR20190133037A (ko) | 2019-11-29 |
US11367626B2 (en) | 2022-06-21 |
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