JP7047790B2 - 印字システム、印字装置、印字方法およびプログラム - Google Patents

印字システム、印字装置、印字方法およびプログラム Download PDF

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Publication number
JP7047790B2
JP7047790B2 JP2019018678A JP2019018678A JP7047790B2 JP 7047790 B2 JP7047790 B2 JP 7047790B2 JP 2019018678 A JP2019018678 A JP 2019018678A JP 2019018678 A JP2019018678 A JP 2019018678A JP 7047790 B2 JP7047790 B2 JP 7047790B2
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Japan
Prior art keywords
printing
marker
print
information
work
Prior art date
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Active
Application number
JP2019018678A
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English (en)
Japanese (ja)
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JP2020124854A (ja
Inventor
達典 阪本
文崇 大田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2019018678A priority Critical patent/JP7047790B2/ja
Priority to CN202080010407.6A priority patent/CN113348088B/zh
Priority to DE112020000705.7T priority patent/DE112020000705T5/de
Priority to PCT/JP2020/002040 priority patent/WO2020162171A1/ja
Publication of JP2020124854A publication Critical patent/JP2020124854A/ja
Priority to JP2022048799A priority patent/JP7248170B2/ja
Application granted granted Critical
Publication of JP7047790B2 publication Critical patent/JP7047790B2/ja
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355Texturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/475Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material for heating selectively by radiation or ultrasonic waves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B41J3/4073Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Electronic Switches (AREA)
JP2019018678A 2019-02-05 2019-02-05 印字システム、印字装置、印字方法およびプログラム Active JP7047790B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019018678A JP7047790B2 (ja) 2019-02-05 2019-02-05 印字システム、印字装置、印字方法およびプログラム
CN202080010407.6A CN113348088B (zh) 2019-02-05 2020-01-22 打印系统、打印装置、打印方法以及存储介质
DE112020000705.7T DE112020000705T5 (de) 2019-02-05 2020-01-22 Markierungssystem, Markierungsvorrichtung, Markierungsverfahren und Programm
PCT/JP2020/002040 WO2020162171A1 (ja) 2019-02-05 2020-01-22 印字システム、印字装置、印字方法およびプログラム
JP2022048799A JP7248170B2 (ja) 2019-02-05 2022-03-24 印字システム、印字装置、印字方法およびプログラム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019018678A JP7047790B2 (ja) 2019-02-05 2019-02-05 印字システム、印字装置、印字方法およびプログラム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022048799A Division JP7248170B2 (ja) 2019-02-05 2022-03-24 印字システム、印字装置、印字方法およびプログラム

Publications (2)

Publication Number Publication Date
JP2020124854A JP2020124854A (ja) 2020-08-20
JP7047790B2 true JP7047790B2 (ja) 2022-04-05

Family

ID=71947575

Family Applications (1)

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JP2019018678A Active JP7047790B2 (ja) 2019-02-05 2019-02-05 印字システム、印字装置、印字方法およびプログラム

Country Status (4)

Country Link
JP (1) JP7047790B2 (zh)
CN (1) CN113348088B (zh)
DE (1) DE112020000705T5 (zh)
WO (1) WO2020162171A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7248170B2 (ja) * 2019-02-05 2023-03-29 オムロン株式会社 印字システム、印字装置、印字方法およびプログラム

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4745857A (en) 1986-02-28 1988-05-24 Markem Corporation Programmable pad printing apparatus and method
JP2000238254A (ja) 1999-02-25 2000-09-05 Tenryu Ind Co Ltd 物品表面への模様形成方法及び装置
JP2000263475A (ja) 1999-03-18 2000-09-26 Seiko Seiki Co Ltd トラッキング搬送によるマーキング装置
JP2012139732A (ja) 2012-04-26 2012-07-26 Keyence Corp レーザ加工装置、レーザ加工条件設定装置、レーザ加工方法、レーザ加工条件設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器
US20150138275A1 (en) 2013-11-19 2015-05-21 Heidelberger Druckmaschinen Ag Method for generating a printed image on an object having a curved surface
JP2015520011A (ja) 2012-03-29 2015-07-16 ハイデルベルガー ドルツクマシーネン アクチエンゲゼルシヤフトHeidelberger Druckmaschinen AG 物体の印刷方法
JP2017071173A (ja) 2015-10-09 2017-04-13 紀州技研工業株式会社 印刷方法および印刷装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198682A (ja) * 1984-10-19 1986-05-16 Mazda Motor Corp 車両の車体番号打刻方法
JPH08297298A (ja) * 1995-04-25 1996-11-12 A G Technol Kk 近赤外光変調装置
CN100439117C (zh) * 2005-11-29 2008-12-03 武汉矽感科技有限公司 自动生产线的激光打标系统及其方法
JP6321485B2 (ja) 2014-08-08 2018-05-09 株式会社キーエンス 読取機能付きレーザ印字装置及びワークに印字したキャラクタの読取方法
CN105150693B (zh) * 2015-09-09 2017-10-27 上海有立信息科技有限公司 一种激光打标机
CN106183439A (zh) * 2016-08-31 2016-12-07 无锡富瑞德测控仪器股份有限公司 一种活塞销激光打标装置
CN108161241A (zh) * 2018-02-26 2018-06-15 长沙八思量信息技术有限公司 激光打标机控制方法、装置以及可读存储介质

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4745857A (en) 1986-02-28 1988-05-24 Markem Corporation Programmable pad printing apparatus and method
JP2000238254A (ja) 1999-02-25 2000-09-05 Tenryu Ind Co Ltd 物品表面への模様形成方法及び装置
JP2000263475A (ja) 1999-03-18 2000-09-26 Seiko Seiki Co Ltd トラッキング搬送によるマーキング装置
JP2015520011A (ja) 2012-03-29 2015-07-16 ハイデルベルガー ドルツクマシーネン アクチエンゲゼルシヤフトHeidelberger Druckmaschinen AG 物体の印刷方法
JP2012139732A (ja) 2012-04-26 2012-07-26 Keyence Corp レーザ加工装置、レーザ加工条件設定装置、レーザ加工方法、レーザ加工条件設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器
US20150138275A1 (en) 2013-11-19 2015-05-21 Heidelberger Druckmaschinen Ag Method for generating a printed image on an object having a curved surface
JP2017071173A (ja) 2015-10-09 2017-04-13 紀州技研工業株式会社 印刷方法および印刷装置

Also Published As

Publication number Publication date
WO2020162171A1 (ja) 2020-08-13
DE112020000705T5 (de) 2021-10-21
JP2020124854A (ja) 2020-08-20
CN113348088B (zh) 2022-10-04
CN113348088A (zh) 2021-09-03

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