DE112020000705T5 - Markierungssystem, Markierungsvorrichtung, Markierungsverfahren und Programm - Google Patents

Markierungssystem, Markierungsvorrichtung, Markierungsverfahren und Programm Download PDF

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Publication number
DE112020000705T5
DE112020000705T5 DE112020000705.7T DE112020000705T DE112020000705T5 DE 112020000705 T5 DE112020000705 T5 DE 112020000705T5 DE 112020000705 T DE112020000705 T DE 112020000705T DE 112020000705 T5 DE112020000705 T5 DE 112020000705T5
Authority
DE
Germany
Prior art keywords
marker
marking
workpiece
information
dimensional shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020000705.7T
Other languages
German (de)
English (en)
Inventor
Tatsunori SAKAMOTO
Fumitaka Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of DE112020000705T5 publication Critical patent/DE112020000705T5/de
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/475—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material for heating selectively by radiation or ultrasonic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B41J3/4073—Printing on three-dimensional objects not being in sheet or web form, e.g. spherical or cubic objects

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Electronic Switches (AREA)
DE112020000705.7T 2019-02-05 2020-01-22 Markierungssystem, Markierungsvorrichtung, Markierungsverfahren und Programm Pending DE112020000705T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019018678A JP7047790B2 (ja) 2019-02-05 2019-02-05 印字システム、印字装置、印字方法およびプログラム
JP2019-018678 2019-02-05
PCT/JP2020/002040 WO2020162171A1 (ja) 2019-02-05 2020-01-22 印字システム、印字装置、印字方法およびプログラム

Publications (1)

Publication Number Publication Date
DE112020000705T5 true DE112020000705T5 (de) 2021-10-21

Family

ID=71947575

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020000705.7T Pending DE112020000705T5 (de) 2019-02-05 2020-01-22 Markierungssystem, Markierungsvorrichtung, Markierungsverfahren und Programm

Country Status (4)

Country Link
JP (1) JP7047790B2 (zh)
CN (1) CN113348088B (zh)
DE (1) DE112020000705T5 (zh)
WO (1) WO2020162171A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7248170B2 (ja) * 2019-02-05 2023-03-29 オムロン株式会社 印字システム、印字装置、印字方法およびプログラム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016036840A (ja) 2014-08-08 2016-03-22 株式会社キーエンス 読取機能付きレーザ印字装置及びワークに印字したキャラクタの読取方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198682A (ja) * 1984-10-19 1986-05-16 Mazda Motor Corp 車両の車体番号打刻方法
US4745857A (en) * 1986-02-28 1988-05-24 Markem Corporation Programmable pad printing apparatus and method
JPH08297298A (ja) * 1995-04-25 1996-11-12 A G Technol Kk 近赤外光変調装置
JP2000238254A (ja) * 1999-02-25 2000-09-05 Tenryu Ind Co Ltd 物品表面への模様形成方法及び装置
JP3074382B1 (ja) * 1999-03-18 2000-08-07 セイコー精機株式会社 トラッキング搬送によるマーキング装置
CN100439117C (zh) * 2005-11-29 2008-12-03 武汉矽感科技有限公司 自动生产线的激光打标系统及其方法
DE102012006371A1 (de) * 2012-03-29 2012-07-05 Heidelberger Druckmaschinen Aktiengesellschaft Verfahren zum Bedrucken eines Objekts
JP2012139732A (ja) * 2012-04-26 2012-07-26 Keyence Corp レーザ加工装置、レーザ加工条件設定装置、レーザ加工方法、レーザ加工条件設定方法、レーザ加工条件設定プログラム、コンピュータで読み取り可能な記録媒体及び記録した機器
DE102014221103A1 (de) * 2013-11-19 2014-12-18 Heidelberger Druckmaschinen Ag Verfahren zum Erzeugen eines Aufdrucks auf einem Objekt mit einer gekrümmten Oberfläche
CN105150693B (zh) * 2015-09-09 2017-10-27 上海有立信息科技有限公司 一种激光打标机
JP6259796B2 (ja) * 2015-10-09 2018-01-10 紀州技研工業株式会社 印刷方法および印刷装置
CN106183439A (zh) * 2016-08-31 2016-12-07 无锡富瑞德测控仪器股份有限公司 一种活塞销激光打标装置
CN108161241A (zh) * 2018-02-26 2018-06-15 长沙八思量信息技术有限公司 激光打标机控制方法、装置以及可读存储介质

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016036840A (ja) 2014-08-08 2016-03-22 株式会社キーエンス 読取機能付きレーザ印字装置及びワークに印字したキャラクタの読取方法

Also Published As

Publication number Publication date
CN113348088A (zh) 2021-09-03
JP7047790B2 (ja) 2022-04-05
JP2020124854A (ja) 2020-08-20
CN113348088B (zh) 2022-10-04
WO2020162171A1 (ja) 2020-08-13

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