JP7042979B2 - 銅合金板材およびその製造方法 - Google Patents

銅合金板材およびその製造方法 Download PDF

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Publication number
JP7042979B2
JP7042979B2 JP2021535177A JP2021535177A JP7042979B2 JP 7042979 B2 JP7042979 B2 JP 7042979B2 JP 2021535177 A JP2021535177 A JP 2021535177A JP 2021535177 A JP2021535177 A JP 2021535177A JP 7042979 B2 JP7042979 B2 JP 7042979B2
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Prior art keywords
copper alloy
less
alloy plate
mass
plate material
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JP2021535177A
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Japanese (ja)
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JPWO2021199848A1 (ko
Inventor
俊太 秋谷
宏和 佐々木
優 樋口
紳悟 川田
翔一 檀上
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
JP2021535177A 2020-03-31 2021-03-02 銅合金板材およびその製造方法 Active JP7042979B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020062622 2020-03-31
JP2020062622 2020-03-31
PCT/JP2021/007905 WO2021199848A1 (ja) 2020-03-31 2021-03-02 銅合金板材およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021199848A1 JPWO2021199848A1 (ko) 2021-10-07
JP7042979B2 true JP7042979B2 (ja) 2022-03-28

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ID=77930295

Family Applications (1)

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JP2021535177A Active JP7042979B2 (ja) 2020-03-31 2021-03-02 銅合金板材およびその製造方法

Country Status (5)

Country Link
JP (1) JP7042979B2 (ko)
KR (1) KR20220155977A (ko)
CN (1) CN114729422B (ko)
TW (1) TW202140806A (ko)
WO (1) WO2021199848A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115044800B (zh) * 2022-06-02 2023-03-24 浙江大学 一种高强高导铜合金及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012162782A (ja) 2011-02-09 2012-08-30 Hitachi Cable Ltd 高強度銅合金材及びその製造方法
JP2013104068A (ja) 2011-11-10 2013-05-30 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP2016176106A (ja) 2015-03-19 2016-10-06 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
WO2020004034A1 (ja) 2018-06-28 2020-01-02 古河電気工業株式会社 銅合金板材及び銅合金板材の製造方法並びに銅合金板材を用いたコネクタ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006460B1 (ja) * 2006-05-26 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法
JP5261122B2 (ja) * 2008-10-03 2013-08-14 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP6045635B2 (ja) * 2010-04-05 2016-12-14 Ｄｏｗａメタルテック株式会社 銅合金板材の製造方法
JP6219070B2 (ja) * 2012-06-15 2017-10-25 古河電気工業株式会社 銅合金板材の製造方法
CN105829556B (zh) * 2013-12-27 2018-02-06 古河电气工业株式会社 铜合金板材、连接器以及铜合金板材的制造方法
JP6317967B2 (ja) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造方法並びに通電部品
JP2016211054A (ja) 2015-05-12 2016-12-15 株式会社神戸製鋼所 銅合金
CN107406915B (zh) * 2015-05-20 2019-07-05 古河电气工业株式会社 铜合金板材及其制造方法
JP6573503B2 (ja) 2015-08-24 2019-09-11 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系高強度銅合金薄板材およびその製造方法並びに導電ばね部材
JP6799933B2 (ja) * 2016-03-28 2020-12-16 古河電気工業株式会社 銅合金板材およびコネクタならびに銅合金板材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012162782A (ja) 2011-02-09 2012-08-30 Hitachi Cable Ltd 高強度銅合金材及びその製造方法
JP2013104068A (ja) 2011-11-10 2013-05-30 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP2016176106A (ja) 2015-03-19 2016-10-06 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
WO2020004034A1 (ja) 2018-06-28 2020-01-02 古河電気工業株式会社 銅合金板材及び銅合金板材の製造方法並びに銅合金板材を用いたコネクタ

Also Published As

Publication number Publication date
CN114729422B (zh) 2023-07-11
KR20220155977A (ko) 2022-11-24
WO2021199848A1 (ja) 2021-10-07
TW202140806A (zh) 2021-11-01
CN114729422A (zh) 2022-07-08
JPWO2021199848A1 (ko) 2021-10-07

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