TW202140806A - 銅合金板材及其製造方法 - Google Patents

銅合金板材及其製造方法 Download PDF

Info

Publication number
TW202140806A
TW202140806A TW110110993A TW110110993A TW202140806A TW 202140806 A TW202140806 A TW 202140806A TW 110110993 A TW110110993 A TW 110110993A TW 110110993 A TW110110993 A TW 110110993A TW 202140806 A TW202140806 A TW 202140806A
Authority
TW
Taiwan
Prior art keywords
copper alloy
alloy sheet
less
mass
sheet material
Prior art date
Application number
TW110110993A
Other languages
English (en)
Chinese (zh)
Inventor
秋谷俊太
佐佐木宏和
樋口優
川田紳悟
檀上翔一
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW202140806A publication Critical patent/TW202140806A/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
TW110110993A 2020-03-31 2021-03-26 銅合金板材及其製造方法 TW202140806A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-062622 2020-03-31
JP2020062622 2020-03-31

Publications (1)

Publication Number Publication Date
TW202140806A true TW202140806A (zh) 2021-11-01

Family

ID=77930295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110110993A TW202140806A (zh) 2020-03-31 2021-03-26 銅合金板材及其製造方法

Country Status (5)

Country Link
JP (1) JP7042979B2 (ko)
KR (1) KR20220155977A (ko)
CN (1) CN114729422B (ko)
TW (1) TW202140806A (ko)
WO (1) WO2021199848A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115044800B (zh) * 2022-06-02 2023-03-24 浙江大学 一种高强高导铜合金及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006460B1 (ja) * 2006-05-26 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法
JP5261122B2 (ja) * 2008-10-03 2013-08-14 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP6045635B2 (ja) * 2010-04-05 2016-12-14 Ｄｏｗａメタルテック株式会社 銅合金板材の製造方法
JP2012162782A (ja) 2011-02-09 2012-08-30 Hitachi Cable Ltd 高強度銅合金材及びその製造方法
JP6222885B2 (ja) * 2011-11-10 2017-11-01 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP6219070B2 (ja) * 2012-06-15 2017-10-25 古河電気工業株式会社 銅合金板材の製造方法
CN105829556B (zh) * 2013-12-27 2018-02-06 古河电气工业株式会社 铜合金板材、连接器以及铜合金板材的制造方法
JP6317967B2 (ja) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造方法並びに通電部品
JP6821290B2 (ja) * 2015-03-19 2021-01-27 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
JP2016211054A (ja) 2015-05-12 2016-12-15 株式会社神戸製鋼所 銅合金
CN107406915B (zh) * 2015-05-20 2019-07-05 古河电气工业株式会社 铜合金板材及其制造方法
JP6573503B2 (ja) 2015-08-24 2019-09-11 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系高強度銅合金薄板材およびその製造方法並びに導電ばね部材
JP6799933B2 (ja) * 2016-03-28 2020-12-16 古河電気工業株式会社 銅合金板材およびコネクタならびに銅合金板材の製造方法
WO2020004034A1 (ja) * 2018-06-28 2020-01-02 古河電気工業株式会社 銅合金板材及び銅合金板材の製造方法並びに銅合金板材を用いたコネクタ

Also Published As

Publication number Publication date
CN114729422B (zh) 2023-07-11
JP7042979B2 (ja) 2022-03-28
KR20220155977A (ko) 2022-11-24
WO2021199848A1 (ja) 2021-10-07
CN114729422A (zh) 2022-07-08
JPWO2021199848A1 (ko) 2021-10-07

Similar Documents

Publication Publication Date Title
TWI521074B (zh) 電子／電氣機器用銅合金、銅合金薄板及導電構件
EP1630239B1 (en) Copper alloy and method of manufacturing the same
JP5448763B2 (ja) 銅合金材料
TWI465591B (zh) Cu-Ni-Si alloy and its manufacturing method
JP5916418B2 (ja) 銅合金板材およびその製造方法
WO2002053790A1 (fr) Alliage de cuivre haute resistance ayant une excellente aptitude au pliage et son procede de fabrication, terminal et connecteur comportant cet alliage
TW201704489A (zh) 銅合金板材及其製造方法
CN104903478A (zh) 电子电气设备用铜合金、电子电气设备用铜合金薄板、电子电气设备用导电元件及端子
TW202140806A (zh) 銅合金板材及其製造方法
TWI607098B (zh) Copper alloy plate and stamped product with copper alloy plate
CN102317483A (zh) Cu-Zn-Sn系合金板及Cu-Zn-Sn系合金镀Sn条
JP6730784B2 (ja) 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
US11499207B2 (en) Copper alloy strip exhibiting improved dimensional accuracy after press-working
CN110462075B (zh) 改善了冲压加工后的尺寸精度的铜合金条
US10358697B2 (en) Cu—Co—Ni—Si alloy for electronic components
JP6246174B2 (ja) 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
CN105074025A (zh) 电子电气设备用铜合金、电子电气设备用铜合金薄板、电子电气设备用导电元件及端子
KR102499442B1 (ko) 구리 합금 판재 및 그 제조 방법
JP6154996B2 (ja) 高強度銅合金材およびその製造方法
JP2012162782A (ja) 高強度銅合金材及びその製造方法
JP6879971B2 (ja) 銅合金材料、電子部品、電子機器及び銅合金材料の製造方法
WO2023140314A1 (ja) 銅合金板材およびその製造方法
JP6522677B2 (ja) 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
JP6816056B2 (ja) 銅合金材料、電子部品、電子機器及び銅合金材料の製造方法
TW202332785A (zh) 電子材料用銅合金以及電子部件