JP7042335B2 - カメラモジュール、感光アセンブリ、感光アセンブリジョイントパネル、並びにその成形金型及び製造方法 - Google Patents

カメラモジュール、感光アセンブリ、感光アセンブリジョイントパネル、並びにその成形金型及び製造方法 Download PDF

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JP7042335B2
JP7042335B2 JP2020517882A JP2020517882A JP7042335B2 JP 7042335 B2 JP7042335 B2 JP 7042335B2 JP 2020517882 A JP2020517882 A JP 2020517882A JP 2020517882 A JP2020517882 A JP 2020517882A JP 7042335 B2 JP7042335 B2 JP 7042335B2
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photosensitive
circuit board
mold
photosensitive element
mold base
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JP2020535041A5 (enExample
JP2020535041A (ja
Inventor
武彦 田中
波杰 ▲趙▼
哲文 梅
楠 郭
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▲寧▼波舜宇光▲電▼信息有限公司
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Priority claimed from CN201721262500.8U external-priority patent/CN207765446U/zh
Priority claimed from CN201710895910.4A external-priority patent/CN109585464B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033—Photosensitive area
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Blocking Light For Cameras (AREA)
JP2020517882A 2017-09-28 2018-09-19 カメラモジュール、感光アセンブリ、感光アセンブリジョイントパネル、並びにその成形金型及び製造方法 Expired - Fee Related JP7042335B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CN201721262500.8U CN207765446U (zh) 2017-09-28 2017-09-28 摄像模组及其感光组件和电子设备
CN201710895910.4 2017-09-28
CN201721262500.8 2017-09-28
CN201710895910.4A CN109585464B (zh) 2017-09-28 2017-09-28 摄像模组及其感光组件和制造方法
PCT/CN2018/106351 WO2019062609A1 (zh) 2017-09-28 2018-09-19 摄像模组、感光组件、感光组件拼板及其成型模具和制造方法

Publications (3)

Publication Number Publication Date
JP2020535041A JP2020535041A (ja) 2020-12-03
JP2020535041A5 JP2020535041A5 (enExample) 2021-01-21
JP7042335B2 true JP7042335B2 (ja) 2022-03-25

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JP2020517882A Expired - Fee Related JP7042335B2 (ja) 2017-09-28 2018-09-19 カメラモジュール、感光アセンブリ、感光アセンブリジョイントパネル、並びにその成形金型及び製造方法

Country Status (6)

Country Link
US (3) US11315967B2 (enExample)
EP (2) EP3691241B1 (enExample)
JP (1) JP7042335B2 (enExample)
KR (1) KR102320910B1 (enExample)
TW (1) TWI734028B (enExample)
WO (1) WO2019062609A1 (enExample)

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CN110412540B (zh) * 2019-07-30 2022-05-13 Oppo广东移动通信有限公司 光发射模组、飞行时间相机和电子装置
CN112600992B (zh) * 2020-05-13 2022-05-17 广州立景创新科技有限公司 影像采集模块及其组装方法
US11808950B2 (en) * 2020-09-24 2023-11-07 Apple Inc. Camera with a multi-material base structure
CN114257714B (zh) * 2020-09-25 2024-08-06 宁波舜宇光电信息有限公司 感光组件、摄像模组和感光组件的制备方法
US12439181B2 (en) * 2020-12-16 2025-10-07 Sony Semiconductor Solutions Corporation Light detection apparatus, light detection system, electronic equipment, and mobile body
CN112954163B (zh) * 2021-02-05 2022-08-23 南昌欧菲光电技术有限公司 光传感模组、摄像模组及电子设备
US12126884B1 (en) * 2021-06-02 2024-10-22 Apple Inc. Substrate to place components for camera size reduction
CN113747021B (zh) * 2021-09-08 2023-06-20 维沃移动通信有限公司 潜望式摄像模组和电子设备

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JP2006180523A (ja) 2005-12-27 2006-07-06 Fujitsu Ltd カメラモジュール及びその製造方法
JP2016092021A (ja) 2014-10-29 2016-05-23 アオイ電子株式会社 半導体デバイスの製造方法
JP2016100573A (ja) 2014-11-26 2016-05-30 株式会社東芝 電子モジュール、及びカメラモジュール
CN205961279U (zh) 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具
WO2017094502A1 (ja) 2015-11-30 2017-06-08 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
US20190089884A1 (en) 2017-09-15 2019-03-21 Nanchang O-Film Optical-Electronic Tech Co., Ltd. Camera module and photosensitive assembly thereof

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EP2016620A2 (en) * 2006-04-17 2009-01-21 Omnivision Cdm Optics, Inc. Arrayed imaging systems and associated methods
US20080203512A1 (en) * 2006-06-07 2008-08-28 Hon Hai Precision Industry Co., Ltd. Image sensor chip package
JP4243810B2 (ja) * 2006-09-05 2009-03-25 ソニー株式会社 手ぶれ補正機構及び撮像装置
JP5047243B2 (ja) 2008-09-26 2012-10-10 シャープ株式会社 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
KR101483386B1 (ko) * 2011-10-24 2015-01-14 아사히 가라스 가부시키가이샤 광학 필터와 그의 제조 방법, 및 촬상 장치
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JP6992163B2 (ja) 2017-08-18 2022-01-13 ▲寧▼波舜宇光▲電▼信息有限公司 感光アセンブリ、イメージングモジュール、スマート端末及び感光アセンブリの製造方法と金型
CN207765446U (zh) 2017-09-28 2018-08-24 宁波舜宇光电信息有限公司 摄像模组及其感光组件和电子设备

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JP2006180523A (ja) 2005-12-27 2006-07-06 Fujitsu Ltd カメラモジュール及びその製造方法
JP2016092021A (ja) 2014-10-29 2016-05-23 アオイ電子株式会社 半導体デバイスの製造方法
JP2016100573A (ja) 2014-11-26 2016-05-30 株式会社東芝 電子モジュール、及びカメラモジュール
WO2017094502A1 (ja) 2015-11-30 2017-06-08 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
CN205961279U (zh) 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具
US20190089884A1 (en) 2017-09-15 2019-03-21 Nanchang O-Film Optical-Electronic Tech Co., Ltd. Camera module and photosensitive assembly thereof

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Publication number Publication date
TW201915586A (zh) 2019-04-16
US20220223633A1 (en) 2022-07-14
WO2019062609A1 (zh) 2019-04-04
EP4220724A3 (en) 2023-09-13
KR102320910B1 (ko) 2021-11-02
TWI734028B (zh) 2021-07-21
KR20200042003A (ko) 2020-04-22
US20230253423A1 (en) 2023-08-10
US11881491B2 (en) 2024-01-23
US11315967B2 (en) 2022-04-26
EP3691241A1 (en) 2020-08-05
EP3691241B1 (en) 2023-05-10
JP2020535041A (ja) 2020-12-03
US20200286933A1 (en) 2020-09-10
US11664397B2 (en) 2023-05-30
EP4220724B1 (en) 2025-04-23
EP4220724A2 (en) 2023-08-02
EP3691241A4 (en) 2020-10-14

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