JP7031709B2 - 六方晶化合物半導体の製造方法 - Google Patents

六方晶化合物半導体の製造方法 Download PDF

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JP7031709B2
JP7031709B2 JP2020156424A JP2020156424A JP7031709B2 JP 7031709 B2 JP7031709 B2 JP 7031709B2 JP 2020156424 A JP2020156424 A JP 2020156424A JP 2020156424 A JP2020156424 A JP 2020156424A JP 7031709 B2 JP7031709 B2 JP 7031709B2
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substrate
compound semiconductor
light
silicon carbide
phase difference
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JP2021004173A (ja
JP2021004173A5 (https=
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理行 福澤
太郎 西口
智博 川瀬
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Sumitomo Electric Industries Ltd
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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2020156424A 2020-09-17 2020-09-17 六方晶化合物半導体の製造方法 Active JP7031709B2 (ja)

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JP2020156424A JP7031709B2 (ja) 2020-09-17 2020-09-17 六方晶化合物半導体の製造方法
JP2022024778A JP7476915B2 (ja) 2020-09-17 2022-02-21 六方晶化合物半導体の歪評価装置、および炭化珪素エピタキシャル基板の製造方法

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JP7310805B2 (ja) * 2018-05-09 2023-07-19 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2000044398A (ja) 1998-05-29 2000-02-15 Toyota Central Res & Dev Lab Inc 炭化珪素単結晶の製造方法及びそれによって得られた炭化珪素単結晶
WO2015114732A1 (ja) 2014-01-28 2015-08-06 株式会社サイオクス 半導体基板の製造方法

Family Cites Families (5)

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JP2006258594A (ja) 2005-03-17 2006-09-28 Sumitomo Metal Mining Co Ltd 自動複屈折測定装置とこれを用いた複屈折測定方法
JP2013203653A (ja) 2012-03-29 2013-10-07 Mitsubishi Chemicals Corp Ｉｉｉ族窒化物結晶の製造方法、ｉｉｉ族窒化物結晶およびｉｉｉ族窒化物結晶基板
JP5614857B2 (ja) 2012-10-31 2014-10-29 株式会社Sumco シリカガラスルツボの評価方法
WO2016002058A1 (ja) 2014-07-03 2016-01-07 株式会社日立製作所 半導体装置およびその製造方法、パワーモジュール、並びに電力変換装置
WO2017006594A1 (ja) 2015-07-08 2017-01-12 住友電気工業株式会社 炭化珪素半導体基板および炭化珪素半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000044398A (ja) 1998-05-29 2000-02-15 Toyota Central Res & Dev Lab Inc 炭化珪素単結晶の製造方法及びそれによって得られた炭化珪素単結晶
WO2015114732A1 (ja) 2014-01-28 2015-08-06 株式会社サイオクス 半導体基板の製造方法

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JP2022060389A (ja) 2022-04-14
JP2021004173A (ja) 2021-01-14

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