JP7027177B2 - 補正情報生成方法、描画方法、補正情報生成装置および描画装置 - Google Patents
補正情報生成方法、描画方法、補正情報生成装置および描画装置 Download PDFInfo
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- JP7027177B2 JP7027177B2 JP2018007939A JP2018007939A JP7027177B2 JP 7027177 B2 JP7027177 B2 JP 7027177B2 JP 2018007939 A JP2018007939 A JP 2018007939A JP 2018007939 A JP2018007939 A JP 2018007939A JP 7027177 B2 JP7027177 B2 JP 7027177B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018007939A JP7027177B2 (ja) | 2018-01-22 | 2018-01-22 | 補正情報生成方法、描画方法、補正情報生成装置および描画装置 |
PCT/JP2018/040860 WO2019142443A1 (fr) | 2018-01-22 | 2018-11-02 | Procédé de génération d'informations de correction, procédé de dessin, dispositif de génération d'informations de correction et dispositif de dessin |
TW107143178A TWI709826B (zh) | 2018-01-22 | 2018-12-03 | 修正資訊產生方法、描繪方法、修正資訊產生裝置及描繪裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018007939A JP7027177B2 (ja) | 2018-01-22 | 2018-01-22 | 補正情報生成方法、描画方法、補正情報生成装置および描画装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019128375A JP2019128375A (ja) | 2019-08-01 |
JP7027177B2 true JP7027177B2 (ja) | 2022-03-01 |
Family
ID=67301408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018007939A Active JP7027177B2 (ja) | 2018-01-22 | 2018-01-22 | 補正情報生成方法、描画方法、補正情報生成装置および描画装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7027177B2 (fr) |
TW (1) | TWI709826B (fr) |
WO (1) | WO2019142443A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008124142A (ja) | 2006-11-09 | 2008-05-29 | Dainippon Screen Mfg Co Ltd | 位置検出方法、位置検出装置、パターン描画装置及び被検出物 |
JP2010212383A (ja) | 2009-03-09 | 2010-09-24 | Nikon Corp | 露光方法、露光システム、及びデバイス製造方法 |
JP2014143335A (ja) | 2013-01-25 | 2014-08-07 | Dainippon Screen Mfg Co Ltd | 描画装置および描画方法 |
JP2017068002A (ja) | 2015-09-30 | 2017-04-06 | 株式会社Screenホールディングス | 補正情報生成装置、描画装置、補正情報生成方法および描画方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6278957B1 (en) * | 1993-01-21 | 2001-08-21 | Nikon Corporation | Alignment method and apparatus therefor |
JP3348918B2 (ja) * | 1993-01-21 | 2002-11-20 | 株式会社ニコン | 位置合わせ方法、該方法を用いた露光方法、及びデバイス製造方法 |
-
2018
- 2018-01-22 JP JP2018007939A patent/JP7027177B2/ja active Active
- 2018-11-02 WO PCT/JP2018/040860 patent/WO2019142443A1/fr active Application Filing
- 2018-12-03 TW TW107143178A patent/TWI709826B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008124142A (ja) | 2006-11-09 | 2008-05-29 | Dainippon Screen Mfg Co Ltd | 位置検出方法、位置検出装置、パターン描画装置及び被検出物 |
JP2010212383A (ja) | 2009-03-09 | 2010-09-24 | Nikon Corp | 露光方法、露光システム、及びデバイス製造方法 |
JP2014143335A (ja) | 2013-01-25 | 2014-08-07 | Dainippon Screen Mfg Co Ltd | 描画装置および描画方法 |
JP2017068002A (ja) | 2015-09-30 | 2017-04-06 | 株式会社Screenホールディングス | 補正情報生成装置、描画装置、補正情報生成方法および描画方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI709826B (zh) | 2020-11-11 |
TW201932990A (zh) | 2019-08-16 |
JP2019128375A (ja) | 2019-08-01 |
WO2019142443A1 (fr) | 2019-07-25 |
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