JP7007816B2 - チャックテーブル - Google Patents

チャックテーブル Download PDF

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Publication number
JP7007816B2
JP7007816B2 JP2017113376A JP2017113376A JP7007816B2 JP 7007816 B2 JP7007816 B2 JP 7007816B2 JP 2017113376 A JP2017113376 A JP 2017113376A JP 2017113376 A JP2017113376 A JP 2017113376A JP 7007816 B2 JP7007816 B2 JP 7007816B2
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JP
Japan
Prior art keywords
plate
holding
shaped work
holding surface
annular seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017113376A
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English (en)
Japanese (ja)
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JP2018207033A (ja
Inventor
聡 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017113376A priority Critical patent/JP7007816B2/ja
Priority to TW107114471A priority patent/TWI733020B/zh
Priority to CN201810562010.2A priority patent/CN109048655B/zh
Priority to KR1020180064232A priority patent/KR102515856B1/ko
Publication of JP2018207033A publication Critical patent/JP2018207033A/ja
Application granted granted Critical
Publication of JP7007816B2 publication Critical patent/JP7007816B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP2017113376A 2017-06-08 2017-06-08 チャックテーブル Active JP7007816B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017113376A JP7007816B2 (ja) 2017-06-08 2017-06-08 チャックテーブル
TW107114471A TWI733020B (zh) 2017-06-08 2018-04-27 工作夾台
CN201810562010.2A CN109048655B (zh) 2017-06-08 2018-06-04 卡盘工作台
KR1020180064232A KR102515856B1 (ko) 2017-06-08 2018-06-04 척테이블

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017113376A JP7007816B2 (ja) 2017-06-08 2017-06-08 チャックテーブル

Publications (2)

Publication Number Publication Date
JP2018207033A JP2018207033A (ja) 2018-12-27
JP7007816B2 true JP7007816B2 (ja) 2022-01-25

Family

ID=64820283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017113376A Active JP7007816B2 (ja) 2017-06-08 2017-06-08 チャックテーブル

Country Status (4)

Country Link
JP (1) JP7007816B2 (ko)
KR (1) KR102515856B1 (ko)
CN (1) CN109048655B (ko)
TW (1) TWI733020B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6880112B2 (ja) * 2019-07-08 2021-06-02 株式会社日本ピスコ 移動装置の吸着機構
CN112792711B (zh) * 2020-12-31 2022-05-17 武汉风帆电化科技股份有限公司 一种晶硅片碱抛光装置及抛光工艺
JP2023061565A (ja) 2021-10-20 2023-05-02 株式会社ディスコ ウェーハの研削方法及び研削装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031979A (ja) 2014-07-28 2016-03-07 株式会社日本セラテック 真空チャック
JP2016111343A (ja) 2014-11-28 2016-06-20 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法
WO2016092700A9 (ja) 2014-12-12 2017-05-04 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2520977A (en) * 1947-05-08 1950-09-05 Lens Block Corp Vacuum lens block
JPH03289154A (ja) * 1990-04-05 1991-12-19 Toshiba Corp 半導体ウエーハチャック装置
JP2768867B2 (ja) * 1991-03-29 1998-06-25 株式会社日立製作所 真空チャック装置
TW200303593A (en) * 2002-02-19 2003-09-01 Olympus Optical Co Substrate sucking apparatus
JP5446662B2 (ja) * 2008-09-26 2014-03-19 Ｎｏｋ株式会社 密封構造
JP5486970B2 (ja) * 2010-03-17 2014-05-07 東京エレクトロン株式会社 基板脱着方法及び基板処理装置
JP2014072510A (ja) * 2012-10-02 2014-04-21 Disco Abrasive Syst Ltd チャックテーブル
CN203529438U (zh) * 2013-07-22 2014-04-09 温州阿尔贝斯气动有限公司 一种真空吸盘
CN105161449A (zh) * 2014-05-30 2015-12-16 盛美半导体设备（上海）有限公司 晶圆固定装置
CN204584958U (zh) * 2015-01-26 2015-08-26 青海青玻实业有限公司 一种玻璃搬运用吸盘装置
JP6486770B2 (ja) * 2015-05-20 2019-03-20 株式会社ディスコ 切削装置
CN207795254U (zh) * 2018-01-15 2018-08-31 廊坊市建科汇峰科技有限公司 盾构机用密封圈

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031979A (ja) 2014-07-28 2016-03-07 株式会社日本セラテック 真空チャック
JP2016111343A (ja) 2014-11-28 2016-06-20 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法
WO2016092700A9 (ja) 2014-12-12 2017-05-04 キヤノン株式会社 基板保持装置、リソグラフィ装置、及び物品の製造方法

Also Published As

Publication number Publication date
CN109048655B (zh) 2022-06-28
KR20180134292A (ko) 2018-12-18
TWI733020B (zh) 2021-07-11
KR102515856B1 (ko) 2023-03-29
CN109048655A (zh) 2018-12-21
JP2018207033A (ja) 2018-12-27
TW201903878A (zh) 2019-01-16

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