JP6992797B2 - 貫通電極基板 - Google Patents

貫通電極基板 Download PDF

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Publication number
JP6992797B2
JP6992797B2 JP2019236195A JP2019236195A JP6992797B2 JP 6992797 B2 JP6992797 B2 JP 6992797B2 JP 2019236195 A JP2019236195 A JP 2019236195A JP 2019236195 A JP2019236195 A JP 2019236195A JP 6992797 B2 JP6992797 B2 JP 6992797B2
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Japan
Prior art keywords
opening
hole
substrate
present
filling
Prior art date
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Active
Application number
JP2019236195A
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English (en)
Japanese (ja)
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JP2020074415A (ja
Inventor
悟 倉持
進雄 小岩
英範 吉岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2019236195A priority Critical patent/JP6992797B2/ja
Publication of JP2020074415A publication Critical patent/JP2020074415A/ja
Priority to JP2021199203A priority patent/JP7294394B2/ja
Application granted granted Critical
Publication of JP6992797B2 publication Critical patent/JP6992797B2/ja
Priority to JP2023093944A priority patent/JP7798084B2/ja
Priority to JP2025168488A priority patent/JP2025182074A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/879—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2019236195A 2019-12-26 2019-12-26 貫通電極基板 Active JP6992797B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019236195A JP6992797B2 (ja) 2019-12-26 2019-12-26 貫通電極基板
JP2021199203A JP7294394B2 (ja) 2019-12-26 2021-12-08 貫通電極基板
JP2023093944A JP7798084B2 (ja) 2019-12-26 2023-06-07 貫通電極基板
JP2025168488A JP2025182074A (ja) 2019-12-26 2025-10-06 貫通電極基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019236195A JP6992797B2 (ja) 2019-12-26 2019-12-26 貫通電極基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2018132572A Division JP6642642B2 (ja) 2018-07-12 2018-07-12 貫通電極基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021199203A Division JP7294394B2 (ja) 2019-12-26 2021-12-08 貫通電極基板

Publications (2)

Publication Number Publication Date
JP2020074415A JP2020074415A (ja) 2020-05-14
JP6992797B2 true JP6992797B2 (ja) 2022-01-13

Family

ID=70610276

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2019236195A Active JP6992797B2 (ja) 2019-12-26 2019-12-26 貫通電極基板
JP2021199203A Active JP7294394B2 (ja) 2019-12-26 2021-12-08 貫通電極基板
JP2023093944A Active JP7798084B2 (ja) 2019-12-26 2023-06-07 貫通電極基板
JP2025168488A Pending JP2025182074A (ja) 2019-12-26 2025-10-06 貫通電極基板

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2021199203A Active JP7294394B2 (ja) 2019-12-26 2021-12-08 貫通電極基板
JP2023093944A Active JP7798084B2 (ja) 2019-12-26 2023-06-07 貫通電極基板
JP2025168488A Pending JP2025182074A (ja) 2019-12-26 2025-10-06 貫通電極基板

Country Status (1)

Country Link
JP (4) JP6992797B2 (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022037065A (ja) * 2019-12-26 2022-03-08 大日本印刷株式会社 貫通電極基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171377A (ja) 2008-12-26 2010-08-05 Dainippon Printing Co Ltd 貫通電極基板及びその製造方法
JP2010532562A (ja) 2007-07-05 2010-10-07 オー・アー・セー・マイクロテック・アクチボラゲット 低抵抗のウエハ貫通ビア
WO2011024921A1 (ja) 2009-08-31 2011-03-03 イビデン株式会社 プリント配線板及びその製造方法
JP2011210794A (ja) 2010-03-29 2011-10-20 Sumitomo Bakelite Co Ltd 絶縁基板、絶縁基板の製造方法、プリント配線基板および半導体装置
US20120229990A1 (en) 2011-03-08 2012-09-13 Ibiden Co., Ltd. Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154187A (ja) * 1990-10-18 1992-05-27 Mitsubishi Materials Corp スルーホール配線板の構造及びその製造方法
JP2002232101A (ja) 2001-01-31 2002-08-16 Ngk Spark Plug Co Ltd 配線基板
JP2003197811A (ja) 2001-12-27 2003-07-11 Hitachi Ltd ガラス基板及びその製造方法、並びに配線基板、半導体モジュール
JP3998984B2 (ja) 2002-01-18 2007-10-31 富士通株式会社 回路基板及びその製造方法
JP4287133B2 (ja) 2002-12-11 2009-07-01 大日本印刷株式会社 スルーホール配線基板の製造方法
JP2008124398A (ja) 2006-11-15 2008-05-29 Shinko Electric Ind Co Ltd 半導体パッケージおよびその製造方法
JP4722904B2 (ja) * 2007-12-17 2011-07-13 イビデン株式会社 多層プリント基板の製造法
JP5423020B2 (ja) 2009-02-03 2014-02-19 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法、及び電子機器
US8925192B2 (en) * 2009-06-09 2015-01-06 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP2013229421A (ja) * 2012-04-25 2013-11-07 Kyocer Slc Technologies Corp 配線基板
JP6992797B2 (ja) * 2019-12-26 2022-01-13 大日本印刷株式会社 貫通電極基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010532562A (ja) 2007-07-05 2010-10-07 オー・アー・セー・マイクロテック・アクチボラゲット 低抵抗のウエハ貫通ビア
JP2010171377A (ja) 2008-12-26 2010-08-05 Dainippon Printing Co Ltd 貫通電極基板及びその製造方法
WO2011024921A1 (ja) 2009-08-31 2011-03-03 イビデン株式会社 プリント配線板及びその製造方法
JP2011210794A (ja) 2010-03-29 2011-10-20 Sumitomo Bakelite Co Ltd 絶縁基板、絶縁基板の製造方法、プリント配線基板および半導体装置
US20120229990A1 (en) 2011-03-08 2012-09-13 Ibiden Co., Ltd. Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022037065A (ja) * 2019-12-26 2022-03-08 大日本印刷株式会社 貫通電極基板
JP7294394B2 (ja) 2019-12-26 2023-06-20 大日本印刷株式会社 貫通電極基板

Also Published As

Publication number Publication date
JP2022037065A (ja) 2022-03-08
JP2023120244A (ja) 2023-08-29
JP2025182074A (ja) 2025-12-11
JP2020074415A (ja) 2020-05-14
JP7798084B2 (ja) 2026-01-14
JP7294394B2 (ja) 2023-06-20

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