JP6981652B2 - プラズマ処理用基板トレイ - Google Patents

プラズマ処理用基板トレイ Download PDF

Info

Publication number
JP6981652B2
JP6981652B2 JP2018001664A JP2018001664A JP6981652B2 JP 6981652 B2 JP6981652 B2 JP 6981652B2 JP 2018001664 A JP2018001664 A JP 2018001664A JP 2018001664 A JP2018001664 A JP 2018001664A JP 6981652 B2 JP6981652 B2 JP 6981652B2
Authority
JP
Japan
Prior art keywords
tray
substrate
processed
plasma
plasma processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018001664A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019121724A5 (enExample
JP2019121724A (ja
Inventor
浩通 扇谷
博彦 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samco Inc
Original Assignee
Samco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samco Inc filed Critical Samco Inc
Priority to JP2018001664A priority Critical patent/JP6981652B2/ja
Publication of JP2019121724A publication Critical patent/JP2019121724A/ja
Publication of JP2019121724A5 publication Critical patent/JP2019121724A5/ja
Application granted granted Critical
Publication of JP6981652B2 publication Critical patent/JP6981652B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2018001664A 2018-01-10 2018-01-10 プラズマ処理用基板トレイ Active JP6981652B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018001664A JP6981652B2 (ja) 2018-01-10 2018-01-10 プラズマ処理用基板トレイ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018001664A JP6981652B2 (ja) 2018-01-10 2018-01-10 プラズマ処理用基板トレイ

Publications (3)

Publication Number Publication Date
JP2019121724A JP2019121724A (ja) 2019-07-22
JP2019121724A5 JP2019121724A5 (enExample) 2020-10-22
JP6981652B2 true JP6981652B2 (ja) 2021-12-15

Family

ID=67307440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018001664A Active JP6981652B2 (ja) 2018-01-10 2018-01-10 プラズマ処理用基板トレイ

Country Status (1)

Country Link
JP (1) JP6981652B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7349845B2 (ja) * 2019-08-13 2023-09-25 東京エレクトロン株式会社 基板処理システムにおける搬送方法

Also Published As

Publication number Publication date
JP2019121724A (ja) 2019-07-22

Similar Documents

Publication Publication Date Title
JP7454976B2 (ja) 基板支持台、プラズマ処理システム及びエッジリングの交換方法
CN101405857B (zh) 承载基片的装置和方法
JP6858035B2 (ja) 基板固定具及び基板固定装置
JP6377975B2 (ja) 基板固定装置
JP6656153B2 (ja) より小さいウエハおよびウエハ片向けのウエハキャリア
TW202002072A (zh) 載置台及電漿處理裝置
CN110914971B (zh) 有冷却气体区域和相应槽及单极静电夹持电极模式的静电卡盘
JP5595549B2 (ja) プラズマ処理装置用トレイ、プラズマ処理装置、及びプラズマ処理方法
TWI845545B (zh) 基材支持件，電漿處理裝置，及處理基材的方法
JP2006066417A (ja) 静電チャックおよび基板搬送用トレー
JP2010232250A (ja) プラズマ処理装置
JP6981652B2 (ja) プラズマ処理用基板トレイ
JP5539436B2 (ja) プラズマ処理装置及びプラズマ処理方法
JP2003045949A (ja) 静電吸着装置及び真空処理装置
JP5324975B2 (ja) プラズマ処理装置
JP4783094B2 (ja) プラズマ処理用環状部品、プラズマ処理装置、及び外側環状部材
JP6664790B2 (ja) プラズマ処理装置用のトレイ
JP4843731B2 (ja) 真空処理装置
KR20210157876A (ko) 플라스마 처리 시스템, 플라스마 처리 장치 및 에지 링의 교환 방법
JP5351877B2 (ja) 基板のプラズマ処理方法
KR100964132B1 (ko) 전기도금 프로세스용 웨이퍼 지지 장치 및 그것을 사용하는방법
KR101610930B1 (ko) 히터가 장착된 캡형 정전척 및 그 제조방법
KR101583767B1 (ko) 히터가 장착된 캡형 정전척 및 그 제조방법
KR101353041B1 (ko) 플라즈마 식각 장치 및 방법
KR101574779B1 (ko) 히터가 장착된 캡형 정전척 및 그 제조방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200907

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200907

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210730

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210810

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211007

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20211102

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20211111

R150 Certificate of patent or registration of utility model

Ref document number: 6981652

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250