JP2019121724A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019121724A5 JP2019121724A5 JP2018001664A JP2018001664A JP2019121724A5 JP 2019121724 A5 JP2019121724 A5 JP 2019121724A5 JP 2018001664 A JP2018001664 A JP 2018001664A JP 2018001664 A JP2018001664 A JP 2018001664A JP 2019121724 A5 JP2019121724 A5 JP 2019121724A5
- Authority
- JP
- Japan
- Prior art keywords
- tray
- processed
- substrate
- plasma processing
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 238000009832 plasma treatment Methods 0.000 claims 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018001664A JP6981652B2 (ja) | 2018-01-10 | 2018-01-10 | プラズマ処理用基板トレイ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018001664A JP6981652B2 (ja) | 2018-01-10 | 2018-01-10 | プラズマ処理用基板トレイ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019121724A JP2019121724A (ja) | 2019-07-22 |
| JP2019121724A5 true JP2019121724A5 (enExample) | 2020-10-22 |
| JP6981652B2 JP6981652B2 (ja) | 2021-12-15 |
Family
ID=67307440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018001664A Active JP6981652B2 (ja) | 2018-01-10 | 2018-01-10 | プラズマ処理用基板トレイ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6981652B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7349845B2 (ja) * | 2019-08-13 | 2023-09-25 | 東京エレクトロン株式会社 | 基板処理システムにおける搬送方法 |
-
2018
- 2018-01-10 JP JP2018001664A patent/JP6981652B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11437275B2 (en) | Method of processing wafer and protective sheeting for use in this method | |
| JP6320198B2 (ja) | テープ拡張装置 | |
| TWI620262B (zh) | 用於較小晶圓及晶圓片之晶圓載具 | |
| KR102311579B1 (ko) | 이면측에 돌기를 갖는 웨이퍼를 처리하는 방법 | |
| EP3273466A3 (en) | Semiconductor device and method of manufacturing the same | |
| US20190189497A1 (en) | Workpiece processing method | |
| CN105895574A (zh) | 加工装置的卡盘台 | |
| TWI650292B (zh) | 脆性材料基板之分斷方法及分斷裝置 | |
| JP2012033737A (ja) | 半導体ウェーハの取り扱い方法 | |
| US20180144959A1 (en) | Electrostatic chucking force measurement tool for process chamber carriers | |
| CN111418051B (zh) | 用于双面处理的图案化夹盘 | |
| WO2014122151A3 (en) | Lithographic apparatus | |
| JP6604476B2 (ja) | 素子チップの製造方法 | |
| CN106158580A (zh) | 晶圆减薄方法 | |
| EP3078762A3 (en) | Susceptor, vapor deposition apparatus, vapor deposition method and epitaxial silicon wafer | |
| JP2019121724A5 (enExample) | ||
| JP2019207912A5 (ja) | シャワーヘッドの製造方法、上部電極アセンブリ、処理装置、及び上部電極アセンブリの製造方法 | |
| CN104051293A (zh) | 晶圆边缘保护装置 | |
| KR101422449B1 (ko) | 척킹 구간을 한정한 점착제 척 | |
| KR20200074544A (ko) | 웨이퍼 크기 확장 장치 및 이를 포함하는 웨이퍼 정렬 장치 | |
| JP6981652B2 (ja) | プラズマ処理用基板トレイ | |
| JP5798140B2 (ja) | プラズマ処理装置 | |
| JP2018018702A5 (enExample) | ||
| JP6847850B2 (ja) | コーティングデバイス用基板を保持する回転プレート | |
| TWI663136B (zh) | Plate glass and manufacturing method thereof |