JP6979845B2 - インプリント装置および物品製造方法 - Google Patents

インプリント装置および物品製造方法 Download PDF

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Publication number
JP6979845B2
JP6979845B2 JP2017197769A JP2017197769A JP6979845B2 JP 6979845 B2 JP6979845 B2 JP 6979845B2 JP 2017197769 A JP2017197769 A JP 2017197769A JP 2017197769 A JP2017197769 A JP 2017197769A JP 6979845 B2 JP6979845 B2 JP 6979845B2
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JP
Japan
Prior art keywords
gas supply
substrate
period
supply port
imprint
Prior art date
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JP2017197769A
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English (en)
Japanese (ja)
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JP2019071386A (ja
JP2019071386A5 (enrdf_load_stackoverflow
Inventor
晋太郎 成岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2017197769A priority Critical patent/JP6979845B2/ja
Priority to KR1020180120340A priority patent/KR102422617B1/ko
Publication of JP2019071386A publication Critical patent/JP2019071386A/ja
Publication of JP2019071386A5 publication Critical patent/JP2019071386A5/ja
Application granted granted Critical
Publication of JP6979845B2 publication Critical patent/JP6979845B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72—Repair or correction of mask defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017197769A 2017-10-11 2017-10-11 インプリント装置および物品製造方法 Active JP6979845B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017197769A JP6979845B2 (ja) 2017-10-11 2017-10-11 インプリント装置および物品製造方法
KR1020180120340A KR102422617B1 (ko) 2017-10-11 2018-10-10 임프린트 장치 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017197769A JP6979845B2 (ja) 2017-10-11 2017-10-11 インプリント装置および物品製造方法

Publications (3)

Publication Number Publication Date
JP2019071386A JP2019071386A (ja) 2019-05-09
JP2019071386A5 JP2019071386A5 (enrdf_load_stackoverflow) 2020-11-12
JP6979845B2 true JP6979845B2 (ja) 2021-12-15

Family

ID=66283343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017197769A Active JP6979845B2 (ja) 2017-10-11 2017-10-11 インプリント装置および物品製造方法

Country Status (2)

Country Link
JP (1) JP6979845B2 (enrdf_load_stackoverflow)
KR (1) KR102422617B1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021027107A (ja) 2019-08-01 2021-02-22 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7373334B2 (ja) * 2019-09-17 2023-11-02 キヤノン株式会社 インプリント装置及び物品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100096764A1 (en) * 2008-10-20 2010-04-22 Molecular Imprints, Inc. Gas Environment for Imprint Lithography
JP5864929B2 (ja) * 2011-07-15 2016-02-17 キヤノン株式会社 インプリント装置および物品の製造方法
JP6018405B2 (ja) * 2012-04-25 2016-11-02 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP6064466B2 (ja) * 2012-09-11 2017-01-25 大日本印刷株式会社 インプリント方法およびそれを実施するためのインプリント装置
JP2016009766A (ja) * 2014-06-24 2016-01-18 キヤノン株式会社 インプリント装置および物品製造方法
US10583608B2 (en) * 2015-02-09 2020-03-10 Canon Kabushiki Kaisha Lithography apparatus, control method therefor, and method of manufacturing article
JP6525628B2 (ja) * 2015-02-13 2019-06-05 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6628491B2 (ja) * 2015-04-13 2020-01-08 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Also Published As

Publication number Publication date
JP2019071386A (ja) 2019-05-09
KR102422617B1 (ko) 2022-07-20
KR20190040910A (ko) 2019-04-19

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