JP6972237B2 - 変性ビスマレイミド樹脂及びその調製方法、プリプレグ、銅箔基板及びプリント基板 - Google Patents
変性ビスマレイミド樹脂及びその調製方法、プリプレグ、銅箔基板及びプリント基板 Download PDFInfo
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/128—Unsaturated polyimide precursors the unsaturated precursors containing heterocyclic moieties in the main chain
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- B32B15/00—Layered products comprising a layer of metal
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- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/121—Preparatory processes from unsaturated precursors and polyamines
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- C—CHEMISTRY; METALLURGY
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
1.変性ビスマレイミド樹脂は、特殊な化学構造を有することにより、靭性が増加し、脆性が減少し、耐熱性が増加する。また、溶媒への溶解量も増加する。アセトンに対する変性ビスマレイミド樹脂の溶解率は少なくとも25%である。
2.変性ビスマレイミド樹脂は、その構造に非極性・疎水性基がより多く含まれ、それによって、電場において分極が発生しにくく、優れた低誘電特性を有する。10GHzにおいて、変性ビスマレイミド樹脂は、誘電率(Dk)が2.6未満であり、誘電正接(Df)が0.003未満である。
3.変性ビスマレイミド樹脂は250oCを上回るガラス転移温度(Tg)を有する。
[実施例1]
[実施例2]
[実施例3]
[実施例4]
[実施例5]
1.ガラス転移温度(oC)
示差走査熱量計(DSC)TA2100でガラス転移温度を測定した。
2.誘電率(Dk)及び誘電正接(Df)
誘電分析装置(Dielectric Analyzer)HP Agilent E4991Aで10GHzにおける誘電率及び誘電正接を測定した。
3.溶媒への溶解性
樹脂をアセトン溶媒に溶解させ、溶解量を測定した。溶媒への溶解性は重量%で表示される。
11:基材
12:樹脂材料
2:銅箔層
2’:回路層
C:銅箔基板
P:プリント基板
ステップS1〜ステップS3:調製方法のステップ
Claims (9)
- 10GHzにおいて、前記変性ビスマレイミド樹脂の誘電率(Dk)は2.6未満であり、前記変性ビスマレイミド樹脂の誘電正接(Df)は0.003未満であり、前記変性ビスマレイミド樹脂のガラス転移温度は250oCを上回る、請求項1に記載の変性ビスマレイミド樹脂。
- 請求項1に記載の変性ビスマレイミド樹脂を基材に施して乾燥させることによって作製される、ことを特徴とするプリプレグ。
- 請求項3に記載のプリプレグ及び前記プリプレグに形成される銅箔層を含む、ことを特徴とする銅箔基板。
- 請求項4に記載の銅箔基板の前記銅箔層をパターン化することによって作製される、ことを特徴とするプリント基板。
- 請求項1に記載の変性ビスマレイミド樹脂の調製方法であって、前記調製方法は、
ミキサーが設置された反応器を提供するステップと、
非極性主鎖を有するジアミン、無水マレイン酸及び溶媒を含む反応液を前記反応器に入れるステップであって、前記非極性主鎖を有するジアミンと前記無水マレイン酸とのモル比は1:2〜1:3であるステップと、
前記ミキサーを起動させることによって前記反応液を均一に混合させ、前記反応液に触媒を入れるステップと、
大気圧下、90oC〜150oCの反応温度において、合成反応を12〜25時間行い、粘稠状樹脂溶液を得るステップと、を含む、ことを特徴とする変性ビスマレイミド樹脂の調製方法。 - 前記粘稠状樹脂溶液から前記変性ビスマレイミド樹脂を析出させ、不純物を除去するステップをさらに含む、請求項6に記載の変性ビスマレイミド樹脂の調製方法。
- 前記反応液の固含量は40wt%〜60wt%である、請求項6に記載の変性ビスマレイミド樹脂の調製方法。
- 前記溶媒は、アセトン、N,N−ジメチルホルムアミド(DMF)又はトルエンであり、前記触媒は酢酸、酢酸ナトリウム及びトリエチルアミンを含む、請求項6に記載の変性ビスマレイミド樹脂の調製方法。
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TW108138990 | 2019-10-29 | ||
TW108138990A TWI718728B (zh) | 2019-10-29 | 2019-10-29 | 改性雙馬來醯亞胺樹脂及其製備方法、預浸材、銅箔基板及印刷電路板 |
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JP2021070807A JP2021070807A (ja) | 2021-05-06 |
JP6972237B2 true JP6972237B2 (ja) | 2021-11-24 |
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US (1) | US11639420B2 (ja) |
JP (1) | JP6972237B2 (ja) |
CN (1) | CN112745503B (ja) |
TW (1) | TWI718728B (ja) |
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TWI819365B (zh) * | 2021-08-30 | 2023-10-21 | 南亞塑膠工業股份有限公司 | 聚苯醚型雙馬來醯亞胺樹脂及其製造方法以及樹脂組合物 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0137750B1 (en) * | 1983-09-14 | 1991-01-09 | Hitachi Chemical Co., Ltd. | Polyamino-bis-maleimide prepolymer, its manufacture, its use in manufacturing laminates |
EP0352868A1 (en) * | 1988-07-29 | 1990-01-31 | Shell Internationale Researchmaatschappij B.V. | Bismaleimide-containing thermosetting composition |
TWI293311B (ja) * | 2000-04-28 | 2008-02-11 | Zeon Corp | |
CN1200970C (zh) * | 2003-08-19 | 2005-05-11 | 梁国正 | 改性双马来酰亚胺树脂与制备方法及在覆铜板中的应用 |
US7314778B2 (en) * | 2005-12-30 | 2008-01-01 | Intel Corporation | Wafer-level processing of chip-packaging compositions including bis-maleimides |
TWI335917B (en) * | 2007-08-22 | 2011-01-11 | Ind Tech Res Inst | Triphenylamine-containing bismaleimide compound and preparation thereof |
TWI437026B (zh) * | 2011-12-29 | 2014-05-11 | Ind Tech Res Inst | 含互穿型網路聚合物之聚醯胺酸樹脂之溶液及其在金屬層積板的應用 |
WO2013110068A1 (en) * | 2012-01-19 | 2013-07-25 | Isola Usa Corp. | Synthesized resins and varnishes, prepregs and laminates made thereform |
JP6423117B2 (ja) * | 2017-01-17 | 2018-11-14 | ユニチカ株式会社 | ビスマレイミドの製造方法 |
-
2019
- 2019-10-29 TW TW108138990A patent/TWI718728B/zh active
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2020
- 2020-02-11 CN CN202010086629.8A patent/CN112745503B/zh active Active
- 2020-06-09 JP JP2020100003A patent/JP6972237B2/ja active Active
- 2020-08-27 US US17/004,206 patent/US11639420B2/en active Active
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TW202116821A (zh) | 2021-05-01 |
CN112745503A (zh) | 2021-05-04 |
CN112745503B (zh) | 2023-04-07 |
TWI718728B (zh) | 2021-02-11 |
JP2021070807A (ja) | 2021-05-06 |
US11639420B2 (en) | 2023-05-02 |
US20210122879A1 (en) | 2021-04-29 |
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