JP6966517B2 - 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス - Google Patents
光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス Download PDFInfo
- Publication number
- JP6966517B2 JP6966517B2 JP2019150039A JP2019150039A JP6966517B2 JP 6966517 B2 JP6966517 B2 JP 6966517B2 JP 2019150039 A JP2019150039 A JP 2019150039A JP 2019150039 A JP2019150039 A JP 2019150039A JP 6966517 B2 JP6966517 B2 JP 6966517B2
- Authority
- JP
- Japan
- Prior art keywords
- optical member
- group
- optical
- optical element
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Remote Sensing (AREA)
- Radar, Positioning & Navigation (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Lasers (AREA)
- Optical Elements Other Than Lenses (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311203825.9A CN117214982A (zh) | 2018-11-13 | 2019-11-12 | 光学构件、包含该光学构件的激光模块及激光设备 |
| CN201980050872.XA CN112513684A (zh) | 2018-11-13 | 2019-11-12 | 光学构件、包含该光学构件的激光模块及激光设备 |
| PCT/JP2019/044328 WO2020100890A1 (ja) | 2018-11-13 | 2019-11-12 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
| TW113104755A TW202424124A (zh) | 2018-11-13 | 2019-11-13 | 光學構件,含有該光學構件之雷射模組及雷射裝置 |
| TW108141195A TWI834756B (zh) | 2018-11-13 | 2019-11-13 | 光學構件,含有該光學構件之雷射模組及雷射裝置 |
| US17/133,802 US11404847B2 (en) | 2018-11-13 | 2020-12-24 | Optical member, laser module including said optical member, and laser device |
| JP2021086413A JP7119171B2 (ja) | 2018-11-13 | 2021-05-21 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
| US17/872,259 US11862936B2 (en) | 2018-11-13 | 2022-07-25 | Optical member, laser module including said optical member, and laser device |
| JP2022123551A JP2022163121A (ja) | 2018-11-13 | 2022-08-02 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
| JP2023135760A JP2023164864A (ja) | 2018-11-13 | 2023-08-23 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
| US18/520,457 US20240097402A1 (en) | 2018-11-13 | 2023-11-27 | Optical Member, Laser Module Including Said Optical Member, and Laser Device |
| JP2025120796A JP2025142095A (ja) | 2018-11-13 | 2025-07-17 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018213241 | 2018-11-13 | ||
| JP2018213241 | 2018-11-13 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021086413A Division JP7119171B2 (ja) | 2018-11-13 | 2021-05-21 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020080400A JP2020080400A (ja) | 2020-05-28 |
| JP2020080400A5 JP2020080400A5 (enExample) | 2021-04-15 |
| JP6966517B2 true JP6966517B2 (ja) | 2021-11-17 |
Family
ID=70802501
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019150039A Active JP6966517B2 (ja) | 2018-11-13 | 2019-08-19 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
| JP2021086413A Active JP7119171B2 (ja) | 2018-11-13 | 2021-05-21 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021086413A Active JP7119171B2 (ja) | 2018-11-13 | 2021-05-21 | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11404847B2 (enExample) |
| JP (2) | JP6966517B2 (enExample) |
| CN (1) | CN112513684A (enExample) |
| TW (1) | TWI834756B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020100890A1 (ja) * | 2018-11-13 | 2020-05-22 | 株式会社ダイセル | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
| JP7434710B2 (ja) * | 2019-02-07 | 2024-02-21 | 富士フイルムビジネスイノベーション株式会社 | 光半導体素子、光半導体装置、光伝送システム、および光半導体装置の製造方法 |
| JP7538399B2 (ja) | 2020-04-06 | 2024-08-22 | 日亜化学工業株式会社 | 発光装置、又は、光学部材 |
| GB202009959D0 (en) * | 2020-06-30 | 2020-08-12 | Ams Sensors Singapore Pte Ltd | Proximity sensing for optical emitter safety |
| CN116724092A (zh) * | 2020-12-28 | 2023-09-08 | 花王株式会社 | 含有金属微粒的油墨 |
| WO2023013448A1 (ja) * | 2021-08-03 | 2023-02-09 | 株式会社ダイセル | インクジェットヘッド洗浄液 |
Family Cites Families (35)
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| JPH05134150A (ja) * | 1991-11-11 | 1993-05-28 | Fujitsu Ltd | 発光素子用集光レンズの製造方法 |
| JP3617584B2 (ja) * | 1997-03-27 | 2005-02-09 | コニカミノルタフォトイメージング株式会社 | 回折光学素子 |
| US6859326B2 (en) | 2002-09-20 | 2005-02-22 | Corning Incorporated | Random microlens array for optical beam shaping and homogenization |
| CN101123341B (zh) * | 2006-08-11 | 2010-11-03 | 精工爱普生株式会社 | 激光光源装置及具备其的投影机 |
| JP4895206B2 (ja) | 2007-05-08 | 2012-03-14 | シチズン電子株式会社 | 光学部材及びバックライトユニット並び表示装置 |
| DE102008021721A1 (de) | 2007-05-08 | 2008-11-27 | Citizen Electronics Co., Ltd., Fujiyoshida-shi | Optisches Bauteil, Hintergrundbeleuchtungseinheit und Anzeigevorrichtung |
| JP5228171B2 (ja) * | 2008-01-17 | 2013-07-03 | 大日本スクリーン製造株式会社 | 光学素子 |
| JP5549104B2 (ja) * | 2008-05-29 | 2014-07-16 | 株式会社リコー | 発光装置、光走査装置及び画像形成装置 |
| JP5841126B2 (ja) * | 2011-03-15 | 2016-01-13 | シャープ株式会社 | 発光装置、照明装置、前照灯および車両 |
| US20120257292A1 (en) | 2011-04-08 | 2012-10-11 | Himax Technologies Limited | Wafer Level Lens Module and Method for Manufacturing the Wafer Level Lens Module |
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| JP6312412B2 (ja) * | 2013-12-04 | 2018-04-18 | シャープ株式会社 | 窒化物半導体発光装置 |
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| JP6447632B2 (ja) * | 2014-09-30 | 2019-01-09 | Agc株式会社 | 画像光投影用スクリーンおよび表示システム |
| DE102014222920A1 (de) * | 2014-11-11 | 2016-05-12 | Osram Oled Gmbh | Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements |
| US9273846B1 (en) | 2015-01-29 | 2016-03-01 | Heptagon Micro Optics Pte. Ltd. | Apparatus for producing patterned illumination including at least one array of light sources and at least one array of microlenses |
| KR102544297B1 (ko) | 2015-01-29 | 2023-06-15 | 에이엠에스-오스람 아시아 퍼시픽 피티이. 리미티드 | 패턴 조명을 생성하기 위한 장치 |
| US10509147B2 (en) | 2015-01-29 | 2019-12-17 | ams Sensors Singapore Pte. Ltd | Apparatus for producing patterned illumination using arrays of light sources and lenses |
| US10330527B2 (en) * | 2015-04-01 | 2019-06-25 | Osram Gmbh | Device and method for light conversion device monitoring |
| JP6588263B2 (ja) | 2015-07-16 | 2019-10-09 | デクセリアルズ株式会社 | 拡散板、表示装置、投影装置及び照明装置 |
| DE102015213460A1 (de) * | 2015-07-17 | 2017-01-19 | Osram Gmbh | Wellenlängenumwandlung von Primärlicht mittels eines Konversionskörpers |
| CN115746625B (zh) | 2016-04-04 | 2024-11-01 | 株式会社大赛璐 | 网版印刷用油墨 |
| WO2017176213A1 (en) * | 2016-04-08 | 2017-10-12 | Heptagon Micro Optics Pte. Ltd. | Thin optoelectronic modules with apertures and their manufacture |
| JP6823381B2 (ja) * | 2016-05-25 | 2021-02-03 | キヤノン株式会社 | 回折光学素子、回折格子を備えた光学機器及び回折格子を備えたカメラ |
| US10290993B2 (en) * | 2016-06-03 | 2019-05-14 | Princeton Optronics, Inc. | VCSEL illuminator package |
| JP6733586B2 (ja) | 2017-03-23 | 2020-08-05 | コニカミノルタ株式会社 | 透明導電体及び透明導電体の製造方法 |
| US10374387B2 (en) * | 2017-11-10 | 2019-08-06 | Finisar Corporation | High power cavity package for light emitters |
| JP7185123B2 (ja) * | 2017-12-26 | 2022-12-07 | 日亜化学工業株式会社 | 光学部材及び発光装置 |
| JP7263695B2 (ja) * | 2018-01-15 | 2023-04-25 | 大日本印刷株式会社 | 光学素子、光照射装置 |
| DE102018101428A1 (de) * | 2018-01-23 | 2019-07-25 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| WO2019152462A1 (en) * | 2018-01-31 | 2019-08-08 | Lumileds Llc | Transparent conducting film or coating on a lens that serves as an interlock on a semiconductor laser module |
| CN108388064A (zh) * | 2018-02-27 | 2018-08-10 | 广东欧珀移动通信有限公司 | 激光投射模组及其破裂的检测方法、深度相机和电子装置 |
| EP3769057A4 (en) * | 2018-03-20 | 2022-01-12 | Vixar Inc. | EYE SAFE OPTICAL MODULES |
| TWI681424B (zh) * | 2018-06-11 | 2020-01-01 | 海華科技股份有限公司 | 光學元件、光學組件及光學模組 |
| JPWO2020250757A1 (enExample) * | 2019-06-14 | 2020-12-17 |
-
2019
- 2019-08-19 JP JP2019150039A patent/JP6966517B2/ja active Active
- 2019-11-12 CN CN201980050872.XA patent/CN112513684A/zh active Pending
- 2019-11-13 TW TW108141195A patent/TWI834756B/zh active
-
2020
- 2020-12-24 US US17/133,802 patent/US11404847B2/en active Active
-
2021
- 2021-05-21 JP JP2021086413A patent/JP7119171B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112513684A (zh) | 2021-03-16 |
| TW202035592A (zh) | 2020-10-01 |
| JP2021132230A (ja) | 2021-09-09 |
| US20210175686A1 (en) | 2021-06-10 |
| US11404847B2 (en) | 2022-08-02 |
| JP7119171B2 (ja) | 2022-08-16 |
| TWI834756B (zh) | 2024-03-11 |
| JP2020080400A (ja) | 2020-05-28 |
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