JP2022163121A - 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス - Google Patents
光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス Download PDFInfo
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- 229940096017 silver fluoride Drugs 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- REYHXKZHIMGNSE-UHFFFAOYSA-M silver monofluoride Chemical compound [F-].[Ag+] REYHXKZHIMGNSE-UHFFFAOYSA-M 0.000 description 1
- 229910000367 silver sulfate Inorganic materials 0.000 description 1
- CLDWGXZGFUNWKB-UHFFFAOYSA-M silver;benzoate Chemical compound [Ag+].[O-]C(=O)C1=CC=CC=C1 CLDWGXZGFUNWKB-UHFFFAOYSA-M 0.000 description 1
- FTNNQMMAOFBTNJ-UHFFFAOYSA-M silver;formate Chemical compound [Ag+].[O-]C=O FTNNQMMAOFBTNJ-UHFFFAOYSA-M 0.000 description 1
- ONVGIJBNBDUBCM-UHFFFAOYSA-N silver;silver Chemical compound [Ag].[Ag+] ONVGIJBNBDUBCM-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- VSAISIQCTGDGPU-UHFFFAOYSA-N tetraphosphorus hexaoxide Chemical compound O1P(O2)OP3OP1OP2O3 VSAISIQCTGDGPU-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine group Chemical group C(CCC)N(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- ZFEAYIKULRXTAR-UHFFFAOYSA-M triphenylsulfanium;chloride Chemical compound [Cl-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ZFEAYIKULRXTAR-UHFFFAOYSA-M 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/88—Lidar systems specially adapted for specific applications
- G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
- G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
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- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01S5/00—Semiconductor lasers
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Abstract
Description
本発明の他の目的は、前記光学部材を有するレーザーモジュールを提供することにある。
また、本発明の他の目的は、前記レーザーモジュールを有するレーザーデバイスを提供することにある。
導電性物質を含む配線を有することを特徴とする光学部材を提供する。
印刷方式により導電性物質を含むインクを光学部材に塗布して配線を形成する工程を含むことを特徴とする、前記光学部材の製造方法を提供する。
本発明の光学部材は、面発光レーザー光源を有するレーザーモジュールに用いるための光学部材であって、導電性物質を含む配線を有することを特徴とする。
(i)脂環を構成する隣接する2つの炭素原子と酸素原子とで構成されるエポキシ基(すなわち、脂環エポキシ基)を有する化合物
(ii)脂環に直接単結合で結合したエポキシ基を有する化合物
(iii)脂環とグリシジル基とを有する化合物
等が挙げられる。
(1)成形型に硬化性樹脂組成物を塗布し、その上から基板を押し付け、硬化性樹脂組成物を硬化させた後、成形型を剥離する方法
(2)成形型の上型と下型の少なくとも一方(好ましくは、下型)に硬化性樹脂組成物を塗布し、上型と下型とを合わせた上で硬化性樹脂組成物を硬化させ、その後、上型と下型を剥離する方法
本発明の光学部材は、導電性物質を含む配線を有することを特徴とする。
導電性物質としては、導電性を有するものである限り特に限定されず、例えば、金属、金属酸化物、導電性ポリマー、導電性炭素系物質などを使用することができる。
錯体生成工程は、金属化合物と有機保護剤とを混合して、金属化合物と有機保護剤を含む錯体を生成する工程である。前記金属化合物として銀化合物を使用することが好ましく、ナノサイズの銀粒子は100℃程度の温度で相互に融着するため、光学部材上に導電性に優れた配線を形成することができる点で好ましく、特に、加熱により容易に分解して、金属銀を生成する銀化合物を使用することが好ましい。このような銀化合物としては、例えば、ギ酸銀、酢酸銀、シュウ酸銀、マロン酸銀、安息香酸銀、フタル酸銀等のカルボン酸銀;フッ化銀、塩化銀、臭化銀、ヨウ化銀等のハロゲン化銀;硫酸銀、硝酸銀、炭酸銀等を挙げることができる。なかでも、銀含有率が高く、且つ、還元剤を使用することなく熱分解することができ、インクに還元剤由来の不純物が混入しにくい点で、シュウ酸銀が好ましい。
モノアミン(1)の含有量:例えば5~65モル%(下限は、好ましくは10モル%、特に好ましくは20モル%、最も好ましくは30モル%である。また、上限は、好ましくは60モル%、特に好ましくは50モル%である)
モノアミン(2)とジアミン(3)の合計含有量:例えば35~95モル%(下限は、好ましくは40モル%、特に好ましくは50モル%である。また、上限は、好ましくは90モル%、特に好ましくは80モル%、最も好ましくは70モル%である)
モノアミン(2)の含有量:例えば5~65モル%(下限は、好ましくは10モル%、特に好ましくは20モル%、最も好ましくは30モル%である。また、上限は、好ましくは60モル%、特に好ましくは50モル%である)
ジアミン(3)の含有量:例えば5~50モル%(下限は、好ましくは10モル%である。また、上限は、好ましくは40モル%、特に好ましくは30モル%である)
熱分解工程は、錯体生成工程を経て得られた金属-有機保護剤の錯体を熱分解させて、表面修飾金属ナノ粒子を形成する工程である。金属-有機保護剤の錯体を加熱することにより、金属原子に対する有機保護剤の配位結合を維持したままで金属化合物が熱分解して金属原子を生成し、次に、有機保護剤が配位した金属原子が凝集して、有機保護膜で被覆された金属ナノ粒子が形成されると考えられる。
金属-有機保護剤の錯体の熱分解反応終了後、過剰の有機保護剤が存在する場合は、これを除去するために、デカンテーションを1回、又は2回以上繰り返して行うことが好ましい。また、デカンテーション終了後の表面修飾金属ナノ粒子は、乾燥・固化することなく、湿潤状態のままで後述の導電性インクの調製工程へ供することが、表面修飾金属ナノ粒子の再凝集を抑制することができ、高分散性を維持することができる点で好ましい。
R11-(O-R13)m-OR12 (b)
(式中、R11、R12は、同一又は異なって、アルキル基又はアシル基を示し、R13は炭素数1~6のアルキレン基を示す。mは1以上の整数を示す)
で表される化合物を挙げることができる。
R14-(O-R15)n-OH (b')
(式中、R14はアルキル基又はアリール基を示し、R15は炭素数1~6のアルキレン基を示す。nは1以上の整数を示す)
で表される化合物(グリコールモノエーテル)を含有していても良い。
本発明の光学部材を有するレーザーモジュールは、光源として面発光レーザー光源を有している。本発明に用いられる面発光レーザー光源としては、特に限定されず、垂直共振器面発光レーザー(Vertical Cavity Surface Emitting Laser:VCSEL)、共振器を外部に持つ外部共振器型垂直面発光レーザー(Vertical External Cavity Surface Emitting Laser:VECSEL)等が挙げられ、3Dセンシングに汎用され、低コストなVCSELが好ましい。
本発明のレーザーモジュールは、本発明の光学部材と、上述の面発光レーザー光源とを有している。本発明のレーザーモジュールの実施形態は、面発光レーザー光源から照射されるレーザー光が光学部材(好ましくは、光学部材に形成された光学素子領域)を通過するように配置されている限り、特に限定されない。光学部材が光学素子を有する場合、光学素子領域を通過したレーザー光は、均一光や構造光などに制御・整形される。
本発明のレーザーデバイスは、本発明のレーザーモジュールを含むことを特徴とする。
本発明のレーザーデバイスは本発明のレーザーモジュールを含むため、レーザーモジュールに用いられる光学部材のクラック、剥離などの損傷を簡便に検出することができるので、光学部材の損傷に起因するレーザーモジュールの不具合、誤作動による被害を未然に防止することができる。従って、本発明のレーザーデバイスはそのような特徴に適する3Dセンシングの用途に好適に使用することができ、例えば、スマートフォンの顔認証においては、使用者にエラーメッセージを送ることにより注意喚起を行ったり、レーザー光自体が照射されないようにすることにより、使用者の目に直接レーザー光が照射されることを防止して、失明などのリスクを低減することができる。また、自動車の自動運転においても、レーザーモジュールが搭載された3Dセンシングシステムの不具合を検出して、運転者にエラーメッセージなどを送ることなどにより、誤作動による事故を未然に防ぐことができる。また、3Dマッピングの認識用カメラ、ゲーム機のジェスチャー認識コントローラー、工場のマシンビジョンなどの3Dセンシングを使用するあらゆる用途にも好適に使用することができる。
直径100mmに一区画(縦2.5mm×横2.5mm)に回折光学素子の反転パターンが9×9個配列した円盤状のシリコーン樹脂製基板にエポキシ樹脂(CELVENUS106、(株)ダイセル製)を5g滴下し、同じ大きさの平坦なシリコーン樹脂製基板を厚みが約0.3mmになるように型を閉じ、100mW/cm2×30秒でUV照射を行った。上下のシリコーン樹脂製基板を取り除くと、エポキシ樹脂の硬化物として、円盤状の一区画(縦2.5mm×横2.5mm)に回折光学素子が9×9個配列した光学部材が得られた。
直径100mmに一区画(縦2.5mm×横2.5mm)に回折光学素子の反転パターンが9×9個配列した円盤状のシリコーン樹脂製基板にエポキシ樹脂(CELVENUS106、(株)ダイセル製)を5g滴下し、同じ大きさの平坦なガラス基板を厚みが約0.3mmになるように型を閉じ、100mW/cm2×30秒でUV照射を行った。下型のシリコーン樹脂製基板を取り除くと、ガラス基板上に一区画(縦2.5mm×横2.5mm)に回折光学素子が9×9個配列したエポキシ樹脂の硬化物層が積層した光学部材が得られた。
錯体生成工程
硝酸銀(和光純薬工業(株)製)とシュウ酸二水和物(和光純薬工業(株)製)から、シュウ酸銀(分子量:303.78)を得た。
500mLフラスコに前記シュウ酸銀20.0g(65.8mmol)を仕込み、これに、n-ブタノール30.0gを添加し、シュウ酸銀のn-ブタノールスラリーを調製した。
このスラリーに、30℃で、n-ブチルアミン(分子量:73.14、(株)ダイセル製)57.8g(790.1mmol)、n-ヘキシルアミン(分子量:101.19、東京化成工業(株)製)40.0g(395.0mmol)、n-オクチルアミン(分子量:129.25、商品名「ファーミン08D」、花王(株)製)38.3g(296.3mmol)、n-ドデシルアミン(分子量:185.35、商品名「ファーミン20D」、花王(株)製)18.3g(98.8mmol)、及びN,N-ジメチル-1,3-プロパンジアミン(分子量:102.18、広栄化学工業(株)製)40.4g(395.0mmol)のアミン混合液を滴下した。
滴下後、30℃で2時間撹拌して、シュウ酸銀とアミンの錯形成反応を進行させ、白色物質(シュウ酸銀-アミン錯体)を得た。
シュウ酸銀-アミン錯体の形成後に、反応液温度を30℃から105℃程度(103~108℃)まで昇温し、その後、前記温度を保持した状態で1時間加熱して、シュウ酸銀-アミン錯体を熱分解させて、濃青色の表面修飾銀ナノ粒子がアミン混合液中に懸濁した懸濁液を得た。
冷却後、得られた懸濁液にメタノール200gを加えて撹拌し、その後、遠心分離により表面修飾銀ナノ粒子を沈降させ、上澄み液を除去し、再度、メタノール60gを加えて撹拌し、その後、遠心分離により表面修飾銀ナノ粒子を沈降させ、上澄み液を除去した。このようにして、湿潤状態の表面修飾銀ナノ粒子を得た。
製造例3で得られた表面修飾銀ナノ粒子に、分散媒を混合して、黒茶色のインクジェット印刷用銀インクを得た。
製造例4で得られたインクジェット印刷用銀インクをインクジェットプリンターに充填し、製造例1で得られた円盤状の光学部材の片面に、一区画(縦2.5mm×横2.5mm)が9×9個配列した各回折光学素子の周囲を囲むように配線を印刷した。配線が印刷された光学部材を、ホットプレートを使用して焼結し、およそ1μmの厚み、およそ50μmの幅の配線がアレイ状に配列した光学部材を得た。
得られた配線がアレイ状に配列した光学部材を、厚さ0.1μmのダイシングブレード(DISCO社製)を装着したダイシング装置(DAD3350、DICSO社製)を用いて、各配線を有する光学部材に個片化した。
製造例4で得られたインクジェット印刷用銀インクをインクジェットプリンターに充填し、製造例2で得られた円盤状の光学部材のガラス基板面に、一区画(縦2.5mm×横2.5mm)が9×9個配列した各回折光学素子の周囲を囲むように配線を印刷した。配線が印刷された光学部材を、ホットプレートを使用して焼結し、およそ1μmの厚み、およそ50μmの幅の配線がアレイ状に配列した光学部材を得た。
得られた配線がアレイ状に配列した光学部材を、厚さ0.1μmのダイシングブレード(DISCO社製)を装着したダイシング装置(DAD3350、DICSO社製)を用いて、各配線を有する光学部材に個片化した。
株式会社ノリタケリミテド製の銀ぺーストインク(製品名:NP-2910D1)を、25℃において、スクリーン印刷装置(ニューロング精密工業(株)製、LS-150TV)を用いて、製造例2で得られた円盤状の光学部材のガラス面に、一区画(縦2.5mm×横2.5mm)が9×9個配列した各回折光学素子の周囲を囲むように配線を印刷した。配線が印刷された光学部材を、ホットプレートを使用して焼結し、およそ1μmの厚み、およそ50μmの幅の配線がアレイ状に配列した光学部材を得た。
得られた配線がアレイ状に配列した光学部材を、厚さ0.1μmのダイシングブレード(DISCO社製)を装着したダイシング装置(DAD3350、DICSO社製)を用いて、各配線を有する光学部材に個片化した。
株式会社ノリタケリミテド製の銀ぺーストインク(製品名:NP-2910D1)を、25℃において、スクリーン印刷装置(ニューロング精密工業(株)製、LS-150TV)を用いて、製造例1で得られた円盤状の光学部材の片面に、一区画(縦2.5mm×横2.5mm)が9×9個配列した各回折光学素子の周囲を囲むように配線を印刷した。配線が印刷された光学部材を、ホットプレートを使用して焼結し、およそ1μmの厚み、およそ50μmの幅の配線がアレイ状に配列した光学部材を得た。
得られた配線がアレイ状に配列した光学部材を、厚さ0.1μmのダイシングブレード(DISCO社製)を装着したダイシング装置(DAD3350、DICSO社製)を用いて、各配線を有する光学部材に個片化した。
実施例1で得られた個片化した光学部材の配線の両端にテスターを接続して通電していることを確認した。抵抗値は4.4Ωであった。その後、光学部材を簡易リフロー炉(シンアペック社製)に入れ、JEDEC規格記載のリフロー温度プロファイル(最高温度260℃)に基づく耐熱試験を連続して3回付与した後リフロー炉による加熱処理後の光学部材の配線について、通電していることを確認した。抵抗値は2.0Ωであった。その結果、実施例1の光学部材は、リフロー炉による加熱処理後においても、クラックなどの損傷が発生していないことが確認された。
11 光学素子領域
12 非光学素子領域
13 導電性物質を含む配線
14 通電検出機構接続部位
30、40 レーザーモジュール
31 基板
32 スペーサー
33 面発光レーザー光源
34 面発光レーザー光源から発光したレーザー光
35 レーザーモジュールから照射されるレーザー光
41 通電検出機構
42 電極
43 光学部材の保持具
Claims (13)
- 面発光レーザー光源を有するレーザーモジュールに用いるための光学部材であって、
導電性物質を含む配線を有し、
前記光学部材は、プラスチック、又はプラスチックと無機ガラスの積層体であり、
前記配線は、前記プラスチックに形成されていることを特徴とする光学部材。 - 前記導電性物質が金属を含む、請求項1に記載の光学部材。
- 前記導電性物質が銀を含む、請求項1又は2に記載の光学部材。
- 前記光学部材が、回折光学素子及びマイクロレンズアレイからなる群から選択される少なくとも1種の光学素子を有する、請求項1~3のいずれか1項に記載の光学部材。
- 前記プラスチックが、硬化性エポキシ樹脂組成物の硬化物である、請求項1~4のいずれか1項に記載の光学部材。
- 請求項1~5のいずれか1項に記載の光学部材と、面発光レーザー光源とを有するレーザーモジュール。
- さらに、前記光学部材が有する導電性物質を含む配線の通電状態を検出する通電検出機構を有する、請求項6に記載のレーザーモジュール。
- 請求項6又は7に記載のレーザーモジュールを有する、レーザーデバイス。
- 請求項1~5のいずれか1項に記載の光学部材の製造方法であって、
印刷方式により導電性物質を含むインクを光学部材のプラスチックに塗布して配線を形成する工程を含むことを特徴とする、前記光学部材の製造方法。 - 前記印刷方式が、インクジェット印刷法又はスクリーン印刷法を含む、請求項9に記載の光学部材の製造方法。
- 請求項1~5のいずれか1項に記載の光学部材の製造方法であって、
スパッタリング法、真空蒸着法、CVD法、MOCVD法、及びレーザーアブレーション法からなる群から選ばれる少なくとも1つの方法により、導電性物質を含む配線を光学部材のプラスチックに形成することを特徴とする、前記光学部材の製造方法。 - 前記光学部材が、2個以上の光学素子が2次元的に配列した光学素子アレイである、請求項9~11のいずれか1項に記載の光学部材の製造方法。
- 前記光学素子アレイを、ダイシングにより2個以上の光学素子を個片化する工程をさらに含む、請求項12に記載の光学部材の製造方法。
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