JP6960705B1 - 電気絶縁性エポキシ樹脂硬化物およびそれを用いた電気絶縁性材料 - Google Patents

電気絶縁性エポキシ樹脂硬化物およびそれを用いた電気絶縁性材料 Download PDF

Info

Publication number
JP6960705B1
JP6960705B1 JP2021507541A JP2021507541A JP6960705B1 JP 6960705 B1 JP6960705 B1 JP 6960705B1 JP 2021507541 A JP2021507541 A JP 2021507541A JP 2021507541 A JP2021507541 A JP 2021507541A JP 6960705 B1 JP6960705 B1 JP 6960705B1
Authority
JP
Japan
Prior art keywords
epoxy resin
acid
compound
group
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021507541A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021117686A1 (zh
Inventor
あゆみ 谷中
誠 中井
由紀 田窪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Publication of JPWO2021117686A1 publication Critical patent/JPWO2021117686A1/ja
Priority to JP2021136113A priority Critical patent/JP2021193094A/ja
Application granted granted Critical
Publication of JP6960705B1 publication Critical patent/JP6960705B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D209/00—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D209/02—Heterocyclic compounds containing five-membered rings, condensed with other rings, with one nitrogen atom as the only ring hetero atom condensed with one carbocyclic ring
    • C07D209/44—Iso-indoles; Hydrogenated iso-indoles
    • C07D209/48—Iso-indoles; Hydrogenated iso-indoles with oxygen atoms in positions 1 and 3, e.g. phthalimide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021507541A 2019-12-10 2020-12-07 電気絶縁性エポキシ樹脂硬化物およびそれを用いた電気絶縁性材料 Active JP6960705B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021136113A JP2021193094A (ja) 2019-12-10 2021-08-24 イミド基含有化合物、イミド基含有硬化剤ならびにエポキシ樹脂硬化物およびそれを用いた電気絶縁性材料

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019222849 2019-12-10
JP2019222849 2019-12-10
PCT/JP2020/045513 WO2021117686A1 (ja) 2019-12-10 2020-12-07 イミド基含有化合物、イミド基含有硬化剤ならびにエポキシ樹脂硬化物およびそれを用いた電気絶縁性材料

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021136113A Division JP2021193094A (ja) 2019-12-10 2021-08-24 イミド基含有化合物、イミド基含有硬化剤ならびにエポキシ樹脂硬化物およびそれを用いた電気絶縁性材料

Publications (2)

Publication Number Publication Date
JPWO2021117686A1 JPWO2021117686A1 (zh) 2021-06-17
JP6960705B1 true JP6960705B1 (ja) 2021-11-05

Family

ID=76329374

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021507541A Active JP6960705B1 (ja) 2019-12-10 2020-12-07 電気絶縁性エポキシ樹脂硬化物およびそれを用いた電気絶縁性材料
JP2021136113A Pending JP2021193094A (ja) 2019-12-10 2021-08-24 イミド基含有化合物、イミド基含有硬化剤ならびにエポキシ樹脂硬化物およびそれを用いた電気絶縁性材料

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021136113A Pending JP2021193094A (ja) 2019-12-10 2021-08-24 イミド基含有化合物、イミド基含有硬化剤ならびにエポキシ樹脂硬化物およびそれを用いた電気絶縁性材料

Country Status (5)

Country Link
JP (2) JP6960705B1 (zh)
KR (1) KR20220114525A (zh)
CN (1) CN114728903B (zh)
TW (1) TWI829983B (zh)
WO (1) WO2021117686A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI809528B (zh) 2021-10-14 2023-07-21 財團法人工業技術研究院 組成物、封裝結構、與拆解封裝結構的方法
CN113861384A (zh) * 2021-10-28 2021-12-31 北京中科纳通电子技术有限公司 一种新型环氧树脂及其应用
CN114213629A (zh) * 2021-11-04 2022-03-22 道生天合材料科技(上海)股份有限公司 固化剂、固化剂组合物及其制备方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5095399A (zh) * 1973-12-20 1975-07-29
JPS55104345A (en) * 1979-02-05 1980-08-09 Mitsubishi Electric Corp Thermosetting resin composition
JPS58172819A (ja) * 1982-04-02 1983-10-11 日東電工株式会社 電気絶縁用部材
JPS59131673A (ja) * 1983-01-18 1984-07-28 Mitsubishi Electric Corp 電着用塗料の製造法
JP2010195946A (ja) * 2009-02-26 2010-09-09 Kaneka Corp 熱硬化性樹脂組成物及びその利用
JP2015117278A (ja) * 2013-12-17 2015-06-25 株式会社ティ−アンドケイ東華 官能基化ポリイミド樹脂及びそれを含むエポキシ樹脂組成物
JP2018081893A (ja) * 2016-11-18 2018-05-24 アイリスオーヤマ株式会社 照明装置
WO2019188436A1 (ja) * 2018-03-28 2019-10-03 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板
JP2020186208A (ja) * 2019-05-15 2020-11-19 ユニチカ株式会社 ジイミドジカルボン酸およびそれを用いたエポキシ樹脂硬化物
JP2020204014A (ja) * 2019-01-31 2020-12-24 ユニチカ株式会社 エポキシ樹脂溶液

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2264013A1 (en) * 1974-03-12 1975-10-10 Inst Francais Du Petrole Polycarboxylic isoindoline-diones useful in resin prepn. - prepd. from aminoterephthalic acid and aromatic anhydrides or hemiesters
JPH0684473B2 (ja) * 1985-12-26 1994-10-26 ニッポン高度紙工業 株式会社 耐湿耐熱性樹脂組成物
EP1193280B1 (en) * 1999-04-09 2004-11-24 Kaneka Corporation Polyimide resin composition with improved moisture resistance, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these
JP4798749B2 (ja) * 2004-05-06 2011-10-19 Ｊｘ日鉱日石エネルギー株式会社 イミド系エポキシ樹脂硬化剤組成物およびエポキシ樹脂組成物
JP2007305962A (ja) 2006-05-12 2007-11-22 Honda Motor Co Ltd パワー半導体モジュール
JP2012224714A (ja) 2011-04-18 2012-11-15 Sumitomo Electric Ind Ltd 低誘電率用絶縁ワニス及びこれを用いた絶縁電線
CN102295740B (zh) * 2011-07-11 2013-11-27 复旦大学 聚酰胺酰亚胺固化的环氧树脂复合材料及其制备方法
JP5998639B2 (ja) 2012-04-09 2016-09-28 信越化学工業株式会社 高電圧電気絶縁体ポリマー碍子用シリコーンゴム組成物及びポリマー碍子
JP2018058966A (ja) * 2016-10-04 2018-04-12 ユニチカ株式会社 ポリアミドイミドを含有する樹脂溶液およびその使用方法
JP7232521B2 (ja) * 2018-07-05 2023-03-03 ユニチカ株式会社 ポリアミドイミド樹脂の製造方法
WO2020009016A1 (ja) * 2018-07-05 2020-01-09 ユニチカ株式会社 有機化合物の製造方法
JP7178092B2 (ja) * 2019-01-31 2022-11-25 ユニチカ株式会社 イミド基含有樹脂硬化剤

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5095399A (zh) * 1973-12-20 1975-07-29
JPS55104345A (en) * 1979-02-05 1980-08-09 Mitsubishi Electric Corp Thermosetting resin composition
JPS58172819A (ja) * 1982-04-02 1983-10-11 日東電工株式会社 電気絶縁用部材
JPS59131673A (ja) * 1983-01-18 1984-07-28 Mitsubishi Electric Corp 電着用塗料の製造法
JP2010195946A (ja) * 2009-02-26 2010-09-09 Kaneka Corp 熱硬化性樹脂組成物及びその利用
JP2015117278A (ja) * 2013-12-17 2015-06-25 株式会社ティ−アンドケイ東華 官能基化ポリイミド樹脂及びそれを含むエポキシ樹脂組成物
JP2018081893A (ja) * 2016-11-18 2018-05-24 アイリスオーヤマ株式会社 照明装置
WO2019188436A1 (ja) * 2018-03-28 2019-10-03 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板
JP2020204014A (ja) * 2019-01-31 2020-12-24 ユニチカ株式会社 エポキシ樹脂溶液
JP2020186208A (ja) * 2019-05-15 2020-11-19 ユニチカ株式会社 ジイミドジカルボン酸およびそれを用いたエポキシ樹脂硬化物

Also Published As

Publication number Publication date
TWI829983B (zh) 2024-01-21
TW202128620A (zh) 2021-08-01
KR20220114525A (ko) 2022-08-17
CN114728903A (zh) 2022-07-08
JPWO2021117686A1 (zh) 2021-06-17
WO2021117686A1 (ja) 2021-06-17
JP2021193094A (ja) 2021-12-23
CN114728903B (zh) 2023-04-28

Similar Documents

Publication Publication Date Title
JP6960705B1 (ja) 電気絶縁性エポキシ樹脂硬化物およびそれを用いた電気絶縁性材料
JP5015591B2 (ja) エポキシ樹脂組成物
JP6854505B2 (ja) 樹脂組成物、それを用いた熱硬化性フィルム
EP3919541B1 (en) Epoxy resin solution
CN109923176B (zh) 树脂组合物、使用其的热固性膜、树脂固化物、层叠板、印刷电路板及半导体装置
TW201516089A (zh) 聚醯亞胺樹脂組合物及使用其之熱傳導性接著膜
JP2007246861A (ja) 樹脂組成物、並びにこの樹脂組成物を用いて得たワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
JP7455475B2 (ja) 熱硬化性マレイミド樹脂組成物並びにこれを用いた接着剤、基板材料、プライマー、コーティング材及び半導体装置
JP2021183696A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
TW201307421A (zh) 絕緣調配物
JP7229527B2 (ja) ジイミドジカルボン酸およびそれを用いたエポキシ樹脂硬化物
KR20180001381A (ko) 열경화성 수지 조성물, 이를 이용한 프리프레그 및 기판
JP7253300B1 (ja) アミド化合物およびそれを含む硬化性樹脂組成物
KR20150097439A (ko) 폴리이미드 수지의 제조 방법, 폴리이미드막의 제조 방법, 폴리아믹산 용액의 제조 방법, 폴리이미드막 및 폴리아믹산 용액
TW202317706A (zh) 樹脂組成物及其硬化物以及使用其的積層體、靜電吸盤及電漿處理裝置
WO2023074481A1 (ja) アミド化合物およびそれを含む硬化性樹脂組成物
JP2020200406A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
JP2004315653A (ja) 樹脂組成物とその利用
JP2024032438A (ja) 長鎖脂肪族化合物およびそれを用いた硬化性樹脂組成物
KR101515485B1 (ko) 에폭시용 경화제 및 이의 제조방법
CN118159521A (zh) 酰胺化合物及含有该酰胺化合物的固化性树脂组合物
CN118119667A (zh) 树脂组合物及其固化物以及使用了该固化物的叠层体、静电卡盘和等离子体处理装置
JP2017120879A (ja) 保護素子、保護素子の製造方法、実装基板および電子機器
JPH05262855A (ja) エポキシ樹脂組成物及びその用途
CN115701446A (zh) 热固性树脂组合物

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210210

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210210

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20210210

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20210315

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210323

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210507

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20210525

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210824

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20210824

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20210831

C21 Notice of transfer of a case for reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C21

Effective date: 20210907

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210928

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20211005

R150 Certificate of patent or registration of utility model

Ref document number: 6960705

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250