JP6959938B2 - オキシブロミド蛍光体およびその使用 - Google Patents
オキシブロミド蛍光体およびその使用 Download PDFInfo
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- JP6959938B2 JP6959938B2 JP2018550520A JP2018550520A JP6959938B2 JP 6959938 B2 JP6959938 B2 JP 6959938B2 JP 2018550520 A JP2018550520 A JP 2018550520A JP 2018550520 A JP2018550520 A JP 2018550520A JP 6959938 B2 JP6959938 B2 JP 6959938B2
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- 239000000203 mixture Substances 0.000 claims description 46
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical class [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 41
- 229910052712 strontium Inorganic materials 0.000 claims description 24
- 229910052791 calcium Inorganic materials 0.000 claims description 23
- 229910052788 barium Inorganic materials 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000012298 atmosphere Substances 0.000 claims description 12
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 8
- 239000013067 intermediate product Substances 0.000 claims description 5
- 238000001354 calcination Methods 0.000 claims 1
- 239000011575 calcium Substances 0.000 description 32
- 239000000463 material Substances 0.000 description 31
- 239000000843 powder Substances 0.000 description 24
- 239000008393 encapsulating agent Substances 0.000 description 15
- 239000002994 raw material Substances 0.000 description 14
- 239000000047 product Substances 0.000 description 13
- 230000005855 radiation Effects 0.000 description 13
- 238000000295 emission spectrum Methods 0.000 description 12
- 229920001296 polysiloxane Polymers 0.000 description 11
- 229910052727 yttrium Inorganic materials 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- -1 halide ion Chemical class 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 7
- 229910052688 Gadolinium Inorganic materials 0.000 description 7
- 239000002131 composite material Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 6
- 229910001940 europium oxide Inorganic materials 0.000 description 6
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 229910052749 magnesium Inorganic materials 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 238000000746 purification Methods 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 6
- 229910004283 SiO 4 Inorganic materials 0.000 description 5
- 229910052744 lithium Inorganic materials 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000012190 activator Substances 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 229910003564 SiAlON Inorganic materials 0.000 description 3
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 3
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- BDAGIHXWWSANSR-NJFSPNSNSA-N hydroxyformaldehyde Chemical compound O[14CH]=O BDAGIHXWWSANSR-NJFSPNSNSA-N 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 229910052701 rubidium Inorganic materials 0.000 description 3
- 229910000018 strontium carbonate Inorganic materials 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 102100032047 Alsin Human genes 0.000 description 2
- 101710187109 Alsin Proteins 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 2
- 229910052771 Terbium Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000001045 blue dye Substances 0.000 description 2
- 229910052792 caesium Inorganic materials 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000001046 green dye Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 239000001044 red dye Substances 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- 229910015999 BaAl Inorganic materials 0.000 description 1
- 101100042630 Caenorhabditis elegans sin-3 gene Proteins 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- XPIIDKFHGDPTIY-UHFFFAOYSA-N F.F.F.P Chemical compound F.F.F.P XPIIDKFHGDPTIY-UHFFFAOYSA-N 0.000 description 1
- 229910005793 GeO 2 Inorganic materials 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 229910017639 MgSi Inorganic materials 0.000 description 1
- 101100496858 Mus musculus Colec12 gene Proteins 0.000 description 1
- 229920000291 Poly(9,9-dioctylfluorene) Polymers 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002591 computed tomography Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- NKVDKFWRVDHWGC-UHFFFAOYSA-N iridium(3+);1-phenylisoquinoline Chemical compound [Ir+3].C1=CC=CC=C1C1=NC=CC2=CC=CC=C12.C1=CC=CC=C1C1=NC=CC2=CC=CC=C12.C1=CC=CC=C1C1=NC=CC2=CC=CC=C12 NKVDKFWRVDHWGC-UHFFFAOYSA-N 0.000 description 1
- UEEXRMUCXBPYOV-UHFFFAOYSA-N iridium;2-phenylpyridine Chemical compound [Ir].C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1 UEEXRMUCXBPYOV-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 229910052605 nesosilicate Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000004762 orthosilicates Chemical class 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000012430 stability testing Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/61—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing fluorine, chlorine, bromine, iodine or unspecified halogen elements
- C09K11/611—Chalcogenides
- C09K11/613—Chalcogenides with alkali or alkakine earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Description
A.M3SiO3X4:Eu2+;
B.M5Si3O9X4:Eu2+;
C.M1.64Si0.82O3.1X0.36:Eu2+;
D.M10Si3O9X14:Eu2+;
E.M2SiO3X2:Eu2+;
〔上式で、
Mは、Ba、Ca、Sr、またはその混合物であり;
Xは、ClまたはBr、またはそれらの混合物である〕;
の青色および緑色発光Eu2+活性化オキシハライド蛍光体に関する。
約3.2部〜約3.4部のBaCO3、
約1.5〜約1.7部のSrCO3、
約0.87〜約0.89部のSiO2、
約0.02〜約0.15部のEu2O3および
約0.54〜約0.62部のNH4Br
を組み合わせることによって製造されてよい。
M1.64Si0.82O3.1Br0.36:Eu2+:(M=60:40 Ba:Sr)として、または
M2SiO4−0.5xBrx(ここでM=60:40 Ba:Srであり、xは0.44である)として、または
(1−x)M2SiO4+xM2SiO3Br2(ここでM=60:40 Ba:Srであり、xは0.22である)として、または
(1−2x)M2SiO4+xMSiO3+xMBr2(ここでM=60:40 Ba:Srであり、xは0.18である)として表すことができる。
((Sr1−z(Ca,Ba,Mg,Zn)z)1−(x+w)(Li,Na,K,Rb)wCex)3(Al1−ySiy)O4+y+3(x−w)F1−y−3(x−w)、0<x≦0.10、0≦y≦0.5、0≦z≦0.5、0≦w≦x;
(Ca,Ce)3Sc2Si3O12(CaSiG);
(Sr,Ca,Ba)3Al1−xSixO4+xF1−x:Ce3+(SASOF));
(Ba,Sr,Ca)5(PO4)3(Cl,F,Br,OH):Eu2+,Mn2+;(Ba,Sr,Ca)BPO5:Eu2+,Mn2+;(Sr,Ca)10(PO4)6 *□B2O3:Eu2+(ここで0<□≦1);Sr2Si3O8 *2SrCl2:Eu2+;
(Ca,Sr,Ba)3MgSi2O8:Eu2+,Mn2+;BaAl8O13:Eu2+;2SrO*0.84P2O5 *0.16B2O3:Eu2+;
(Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+;(Ba,Sr,Ca)Al2O4:Eu2+;(Y,Gd,Lu,Sc,La)BO3:Ce3+,Tb3+;ZnS:Cu+,Cl−;ZnS:Cu+,Al3+;ZnS:Ag+,Cl−;ZnS:Ag+,Al3+;(Ba,Sr,Ca)2Si1−□O4−2□:Eu2+(ここで0≦□≦0.2);(Ba,Sr,Ca)2(Mg,Zn)Si2O7:Eu2+;(Sr,Ca,Ba)(Al,Ga,In)2S4:Eu2+;
(Y,Gd,Tb,La,Sm,Pr,Lu)3(Al,Ga)5−□O12−3/2□:Ce3+(ここで0≦□≦0.5);
(Ca,Sr)8(Mg,Zn)(SiO4)4Cl2:Eu2+,Mn2+;Na2Gd2B2O7:Ce3+,Tb3+;(Sr,Ca,Ba,Mg,Zn)2P2O7:Eu2+,Mn2+;
(Gd,Y,Lu,La)2O3:Eu3+,Bi3+;(Gd,Y,Lu,La)2O2S:Eu3+,Bi3+;(Gd,Y,Lu,La)VO4:Eu3+,Bi3+;
(Ca,Sr)S:Eu2+,Ce3+;SrY2S4:Eu2+;CaLa2S4:Ce3+;(Ba,Sr,Ca)MgP2O7:Eu2+,Mn2+;(Y,Lu)2WO6:Eu3+,Mo6+;(Ba,Sr,Ca)□Si□N□:Eu2+(ここで2□+4□=3□);Ca3(SiO4)Cl2:Eu2+;
(Lu,Sc,Y,Tb)2−u−vCevCa1+uLiwMg2−wPw(Si,Ge)3−wO12−u/2(ここで−0.5≦u≦1、0<v≦0.1、かつ0≦w≦0.2);
(Y,Lu,Gd)2−□Ca□Si4N6+□C1−□:Ce3+、(ここで0≦□≦0.5);(Lu,Ca,Li,Mg,Y)、Eu2+および/またはCe3+をドープしたα−SiAlON;(Ca,Sr,Ba)SiO2N2:Eu2+,Ce3+;β−SiAlON:Eu2+、3.5MgO*0.5MgF2 *GeO2:Mn4+;Ca1−c−fCecEufAl1+cSi1−cN3、(ここで0≦c≦0.2、0≦f≦0.2);Ca1−h−rCehEurAl1−h(Mg,Zn)hSiN3、(ここで0≦h≦0.2、0≦r≦0.2);Ca1−2s−tCes(Li,Na)sEutAlSiN3、(ここで0≦s≦0.2、0≦f≦0.2、s+t>0);(Sr,Ca)AlSiN3:Eu2+、Ce3+;および
Ca1−□−□−φCe□(Li,Na)□Eu□Al1+□−□Si1−□+□N3、(ここで0≦□≦0.2、0≦□≦0.4、0≦□≦0.2)。
一般的手順
シリコーンテープサンプル調製
500mgの被験材料を1.50gのシリコーン(Sylgard 184)と混合することによってサンプルを調製した。混合物を約15分間真空チャンバ内で脱気した。この混合物(0.70g)を円盤状テンプレート(直径28.7mm、厚さ0.79mm)に注ぎ、90℃で30分間焼成した。試験のためにサンプルを約5mm×5mmの大きさの正方形に切断した。
高光束条件
446nmで発光するレーザーダイオードを、その他端にコリメータを有する光ファイバーと接続した。電力出力は310mWであり、サンプルのビーム径は700ミクロンであった。これは、サンプル表面の80W/cm2の束と同等である。レーザーからの散乱線と励起した蛍光体からの発光の組合せである分光分布(SPD)スペクトルは、1メートル(直径)積分球で収集し、データをスペクトロメーターソフトウェア(Specwin)で処理される。2分の間隔で、SPDを400nmから500nm、および550nmから700nmまでそれぞれ積算することによって、レーザーからの積算電力および蛍光体発光を約21時間にわたって記録した。測定の最初の90分は、レーザーの熱安定性による作用を避けるために破棄される。レーザー損傷に起因する強度損失の百分率は、次のように計算される:
高温高湿(HTHH)処理のためのサンプルは、蛍光体粉末を二液型メチルシリコーン結合剤(RTV−615、Momentive Performance Materials)に、0.9gの蛍光体に対して0.825gのシリコーン(パートA+B)という比率で混合することによって作製した。次に、蛍光体/シリコーン混合物をアルミニウムサンプルホルダーに注入し、90℃で20分間硬化させる。対照サンプルを窒素下で貯蔵し、HTHH条件に曝露するサンプルを85℃/85%RH制御雰囲気チャンバに入れた。これらのHTHH試料は定期的に取り出し、450nm励起下での発光強度を対照サンプルと比較した。
材料:高純度炭酸バリウム(BaCO3)、酸化ケイ素(SiO2)、酸化ユウロピウム(Eu2O3)(99.9%)およびアンモニウムブロミド(NH4Br)(98%)を、さらに精製することなく使用した。すべての原材料を、325メッシュで篩い分けた。原材料の量を表1に示す。
材料:高純度炭酸バリウム(BaCO3)、酸化ケイ素(SiO2)、酸化ユウロピウム(Eu2O3)(99.9%)およびアンモニウムブロミド(NH4Br)(98%)を、さらに精製することなく使用した。すべての原材料を、325メッシュで篩い分けた。原材料の量を表2に示す。
材料:高純度炭酸カルシウム(CaCO3)、酸化ケイ素(SiO2)、酸化ユウロピウム(Eu2O3)(99.9%)およびアンモニウムブロミド(NH4Br)(98%)を、さらに精製するとなく使用した。すべての原材料を、325メッシュで篩い分けた。原材料の量を表3に示す。
材料:高純度炭酸バリウム(BaCO3)、炭酸ストロンチウム(SrCO3)、酸化ケイ素(SiO2)、酸化ユウロピウム(Eu2O3)(99.9%)および臭化物アンモニウム(NH4Br)(98%)を、さらに精製することなく使用した。すべての原材料を、325メッシュで篩い分けた。原材料の量を表4に示す。
材料:高純度炭酸ストロンチウム(SrCO3)、酸化ケイ素(SiO2)、酸化ユウロピウム(Eu2O3)(99.9%)および臭化物アンモニウム(NH4Br)(98%)を、さらに精製することなく使用した。すべての原材料を、325メッシュで篩い分けた。原材料の量を表5に示す。
材料:高純度炭酸ストロンチウム(SrCO3)、酸化ケイ素(SiO2)、酸化ユウロピウム(Eu2O3)(99.9%)および臭化物アンモニウム(NH4Br)(98%)を、さらに精製することなく使用した。すべての原材料を、325メッシュで篩い分けた。原材料の量を表6に示す。
12 LEDチップ、LED
14 リード
16 リードフレーム
18 シェル
20 封入材
22 蛍光体組成物
24 白色光
112 LEDチップ
120 封入材
122 蛍光体組成物
122 蛍光体
124 白色光
126 矢印
212 LEDチップ
218 エンベロープ
222 蛍光体組成物
224 白色光
226 放射
412 LEDチップ
416 第1のリード、第2のリード
420 封入材
430 反射カップ
432 導線
550 発光ダイオード
552 発光窓
554 導光部材
Claims (14)
- 半導体光源と、前記光源に放射結合されているEu2+活性化蛍光体を備えるデバイスであって;
前記蛍光体が、以下の
A.M3SiO3X4:Eu2+;
B.M5Si3O9X4:Eu2+;
C.M1.64Si0.82O3.1X0.36:Eu2+;
D.M10Si3O9X14:Eu2+ ;
〔上式で、
Mは、Ba、Ca、Sr、またはその混合物であり;
Xは、Br、またはBrとClの混合物である〕;
から選択されるデバイス。 - 前記蛍光体が、M3SiO3X4:Eu2+である、請求項1に記載のデバイス。
- 前記蛍光体が、M5Si3O9X4:Eu2+である、請求項1に記載のデバイス。
- 前記蛍光体が、M1.64Si0.82O3.1X0.36:Eu2+である、請求項1に記載のデバイス。
- 前記蛍光体が、M10Si3O9X14:Eu2+である、請求項1に記載のデバイス。
- 前記蛍光体が、
Ba3SiO3Br4:Eu2+;
Ba5Si3O9Br4:Eu2+;
Ca5Si3O9Br4:Eu2+;
Ba0.984Sr0.656Si0.82O3.1Br0.36:Eu2+;および
Sr10Si3O9Br14:Eu2+ ;
から選択される、請求項1に記載のデバイス。 - A.M3SiO3X4:Eu2+;
B.M5Si3O9X4:Eu2+;
C.M1.64Si0.82O3.1X0.36:Eu2+;
D.M10Si3O9X14:Eu2+ ;
〔上式で、
Mは、Ba、Ca、Sr、またはその混合物であり;
Xは、Br、またはBrとClの混合物である〕;
からなる群から選択されるEu2+活性化蛍光体。 - 式M3SiO3X4:Eu2+の、請求項7に記載のEu2+活性化蛍光体。
- 式M5Si3O9X4:Eu2+の、請求項7に記載のEu2+活性化蛍光体。
- 式M1.64Si0.82O3.1X0.36:Eu2+の、請求項7に記載のEu2+活性化蛍光体。
- M10Si3O9X14:Eu2+の、請求項7に記載のEu2+活性化蛍光体。
- 前記蛍光体が、
Ba3SiO3Br4:Eu2+;
Ba5Si3O9Br4:Eu2+;
Ca5Si3O9Br4:Eu2+;
Ba0.984Sr0.656Si0.82O3.1Br0.36:Eu2+;および
Sr10Si3O9Br14:Eu2+ ;
から選択される、請求項7に記載のEu2+活性化蛍光体。 - 約3.2部〜約3.4部のBaCO3、
約1.5〜約1.7部のSrCO3、
約0.87〜約0.89部のSiO2、約0.02〜約0.15部のEu2O3および約0.54〜約0.62部のNH4Brを組み合わせること;および
1回目の焼成で、前記組合せを還元雰囲気下、約800℃〜約1300℃の範囲の温度で焼成して中間生成物を形成すること;および
2回目の焼成段階で、前記中間生成物を還元雰囲気下、約800℃〜約1300℃の範囲の温度で焼成すること
によって製造されるEu2+活性化蛍光体。 - 前記1回目の焼成段階で、前記組合せを約1100℃で焼成し;前記2回目の焼成段階で、前記中間生成物を約1100℃で焼成する、請求項13に記載のEu2+活性化蛍光体。
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US8906262B2 (en) * | 2005-12-02 | 2014-12-09 | Lightscape Materials, Inc. | Metal silicate halide phosphors and LED lighting devices using the same |
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